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5 mm x 5 mm QFN-40
PWM3H
PWM2L
PWM3L
CAP1
CAP2
VDD
DE2
+5V
FB
LX
40
39
38
37
36
35
34
33
32
31
PWM2H 1 30 +12V
PWM1L 2 29 VBA
PWM1H 3 28 VBB
CE 4 27 VBC
LIN_BUS 5 EP 26 PHA
(41)
RX 6 25 PHB
TX 7 24 PHC
FAULTn/TXE 8 23 HSA
MUX1 9 22 HSB
MUX2 10 21 HSC
11
12
13
14
15
16
17
18
19
20
ZC_OUT
COMP_REF
ILIMIT_OUT
I_OUT1
I_SENSE1-
I_SENSE1+
PGND
LSA
LSB
LSC
7 mm x 7 mm TQFP-48
PWM2H
PWM3H
PWM2L
PWM3L
CAP1
CAP2
VDD
VDD
DE2
+5V
FB
LX
+
48
47
46
45
44
43
42
41
40
39
38
37
PWM1L 1 36 PGND
PWM1H 2 35 PGND
CE 3 34 +12V
NC 4 33 VBA
NC 5 32 VBB
EP
LIN_BUS 6 31 VBC
(49)
PGND 7 30 PHA
RX 8 29 PHB
TX 9 28 PHC
FAULTn/TXE 10 27 HSA
MUX1 11 26 HSB
MUX2 12 25 HSC
23
24
13
14
15
16
17
18
19
20
21
22
ZC_OUT
COMP_REF
ILIMIT_OUT
I_OUT1
I_SENSE1-
I_SENSE1+
PGND
PGND
LSA
LSB
LSC
PGND
5 mm x 5 mm QFN-40
PWM3H
PWM2L
PWM3L
CAP1
CAP2
VDD
DE2
+5V
FB
LX
40
39
38
37
36
35
34
33
32
31
PWM2H 1 30 +12V
PWM1L 2 29 VBA
PWM1H 3 28 VBB
CE 4 27 VBC
EP
HV_IN1 5 (41) 26 PHA
LV_OUT1 6 25 PHB
IOUT3 7 24 PHC
ISENSE3- 8 23 HSA
ISENSE3+ 9 22 HSB
IOUT2 10 21 HSC
11
12
13
14
15
16
17
18
19
20
ISENSE2-
ISENSE2+
ILIMIT_OUT
I_OUT1
I_SENSE1-
I_SENSE1+
PGND
LSA
LSB
LSC
7 mm x 7 mm TQFP-48
PWM2H
PWM3H
PWM2L
PWM3L
CAP1
CAP2
VDD
VDD
DE2
+5V
FB
LX
48
47
46
45
44
43
42
41
40
39
38
37
+
PWM1L 1 36 PGND
PWM1H 2 35 PGND
CE 3 34 +12V
LV_OUT2 4 33 VBA
HV_IN2 5 32 VBB
EP
HV_IN1 6 31 VBC
(49)
PGND 7 30 PHA
LV_OUT1 8 29 PHB
IOUT3 9 28 PHC
ISENSE3- 10 27 HSA
ISENSE3+ 11 26 HSB
IOUT2 12 25 HSC
13
14
15
16
17
18
19
20
21
22
23
24
ISENSE2-
ISENSE2+
ILIMIT_OUT
I_OUT1
I_SENSE1-
I_SENSE1+
PGND
PGND
LSA
LSB
LSC
PGND
MUX1 I MUX I
I
MUX2 I
NEUTRAL_SIM
PHASE DETECT
VBA
VBB
VDD
VBC
O HSA
O HSB
O HSC
PWM1H I I PHA
GATE
PWM1L I CONTROL I PHB
PWM2H I LOGIC I PHC
PWM2L I
+12V
PWM3H I
PWM3L I
O LSA
DRIVER O LSB
FAULT
O O LSC
PGND
+ ILIMIT_REF
ILIMIT_OUT
-
+ I_SENSE1+
I_OUT1
- I_SENSE1-
VDD
HV_IN1 I
LDO +12V
LV_OUT1 O
HV_IN2 I CAP1
LV_OUT2 O LEVEL CHARGE PUMP
TRANSLATOR CAP2
LDO +5V
CE I
LX
BUCK SMPS
FB
SUPERVISOR DE2
VBA
VBB
VDD
VBC
O HSA
O HSB
O HSC
PWM1H I I PHA
GATE
PWM1L I CONTROL I PHB
PWM2H I LOGIC I PHC
PWM2L I
+12V
PWM3H I
PWM3L I
O LSA
DRIVER O LSB
FAULT
O O LSC
PGND
+ ILIMIT_REF
ILIMIT_OUT
-
+ I_SENSE1+
I_OUT1
- I_SENSE1-
+ I_SENSE2+
I_OUT2
- I_SENSE2-
+ I_SENSE3+
I_OUT3
- I_SENSE3-
MCP8025/6
COMMUNICATION PORT BIAS GENERATOR
VDD VDD
+12V
LIN_BUS I/O LDO
CAP1
LIN CHARGE PUMP 100 nF
CAP2
XCVR Ceramic
CE I +5V
FAULTn/TXE I/O LDO
RX LX
O VADJ
TX I BUCK SMPS FB
SUPERVISOR DE2
VBA
VBB
VDD VBC
HSA
O
HSB
O
HSC A
O
PHA
PWM1H I I
GATE PHB
PWM1L I CONTROL I
PHC +
PWM2H I LOGIC I E
B C _
PWM2L I
+12V
PWM3H I
PWM3L I
LSA
O
2016 Microchip Technology Inc.
LSB
DRIVER O
FAULT LSC
O O
PGND
+ ILIMIT_REF
ILIMIT_OUT
-
+
I_SENSE1+
I_OUT1 I_SENSE1-
-
Typical Application Circuit MCP8026
2016 Microchip Technology Inc.
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MCP8025/6
1.0 ELECTRICAL Notice: Stresses above those listed under Maximum
Ratings may cause permanent damage to the device.
CHARACTERISTICS
This is a stress rating only and functional operation of
the device at those or any other conditions above those
Absolute Maximum Ratings indicated in the operational listings of this specification
Input Voltage, VDD .............................(GND 0.3V) to +46.0V is not implied. Exposure to maximum rating conditions
Input Voltage, < 100 ms Transient ...............................+48.0V for extended periods may affect device reliability.
Internal Power Dissipation ...........................Internally-Limited Note 1: The maximum allowable power dissipation
Operating Ambient Temperature Range .......-40C to +150C is a function of ambient temperature, the
Operating Junction Temperature (Note 1) ....-40C to +160C maximum allowable junction temperature
Transient Junction Temperature (Note 2) ................... +170C and the thermal resistance from junction to
Storage Temperature (Note 1) ......................-55C to +150C air (i.e., TA, TJ, JA). Exceeding the maxi-
Digital I/O .......................................................... -0.3V to 5.5V mum allowable power dissipation may
LV Analog I/O .................................................... -0.3V to 5.5V cause the device operating junction tem-
VBx ...................................................(GND 0.3V) to +46.0V perature to exceed the maximum 160C
PHx, HSx ..........................................(GND 5.5V) to +46.0V rating. Sustained junction temperatures
ESD and Latch-Up Protection: above 150C can impact the device reliabil-
VDD, LIN_BUS/HV_IN1 8 kV HBM and 750V CDM ity and ROM data retention.
All other pins ..................... 2 kV HBM and 750V CDM
2: Transient junction temperatures should not
Latch-up protection all pins .............................. > 100 mA
exceed one second in duration. Sustained
junction temperatures above 170C may
impact the device reliability.
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TJ = -40C to +150C, typical values are for +25C, VDD = 13V.
Parameters Symbol Min. Typ. Max. Units Conditions
POWER SUPPLY INPUT
Input Operating Voltage VDD 6.0 19.0 V Operating (MCP8025)
6.0 28.0 Operating (MCP8026)
6.0 40.0 Shutdown
4.0 32.0 Buck Operating Range
Transient Maximum Voltage VDDmax 48.0 V < 100 ms
Input Current (MCP8025) IDD A VDD > 13V
5 15 Sleep mode
175 Standby, CE = 0V, TJ = -45C
175 Standby, CE = 0V, TJ = +25C
195 300 Standby, CE = 0V, TJ = +150C
940 Active, CE > VDIG_HI_TH
1150 Active, VDD = 6V, TJ = +25C
Input Current (MCP8026) IDD A VDD > 13V
5 15 Sleep mode
120 Standby, CE = 0V, TJ = -45C
120 Standby, CE = 0V, TJ = +25C
144 300 Standby, CE = 0V, TJ = +150C
950 Active, CE > VDIG_HI_TH
1090 Active, VDD = 6V, TJ = +25C
Digital Input/Output DIGITALI/O 0 5.5 V
Digital Open-Drain Drive DIGITALIOL 1 mA VDS < 50 mV
Strength
Note 1: 1000 hour cumulative maximum for ROM data retention (typical).
2: Limits are by design, not production tested.
Note: Unless otherwise indicated, TA = +25C; Junction Temperature (TJ) is approximated by soaking the device under
test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the
rise in junction temperature over the ambient temperature is not significant.
0.010 VDD = 6V
0.008 25 HSA
VOUT = 5V 20
Line Regulation (%/V)
0.006 15
0.004 10
5
Volts (V)
0.002
0.000 0
-0.002 VOUT = 12V VBA
20
-0.004 15
-0.006 10
-0.008 5
-0.010 0
-45 -20 5 30 55 80 105 130 155 0 5 10 15 20 25 30 35 40 45 50
Temperature (C) Time (s)
FIGURE 2-1: LDO Line Regulation vs. FIGURE 2-4: Bootstrap Voltage @ 92%
Temperature. Duty Cycle.
0.35 150
VOUT = 5V
0.30 145
140 12V LDO
Load Regulation (%)
0.25 135
Current (mA)
0.20 130
VOUT = 12V 5V LDO
125
0.15
120
0.10 115
110
0.05
105
0.00 100
-45 -20 5 30 55 80 105 130 155 7 10 13 16 19 22 25 28 31
Temperature (C) Voltage (V)
FIGURE 2-2: LDO Load Regulation vs. FIGURE 2-5: LDO Short-Circuit Current
Temperature. vs. Input Voltage.
18 140
VIN = 15V 120
VIN = 14V
ILIMIT_OUT 15
100
CIN = COUT = 10 F
VOUT (mV)
12 80
IOUT = 20 mA
VIN (V)
60
9
40
DE2
6 VOUT (AC) 20
0
3
-20
0 -40
0 1 2 3 4 5 6 7 8 9 10 0 20 40 60 80 100
Time (s) Time (s)
FIGURE 2-3: ILIMIT_OUT Low to DE2 FIGURE 2-6: 5V LDO Dynamic Linestep
Message Delay. Rising VDD.
18 140 100
VIN = 14V
VIN = 15V VIN = 14V 120 80 VOUT = 5V
15 60 CIN = COUT = 10 F
100 IOUT = 1 mA to 20 mA Pulse
CIN = COUT = 10 F 40
VOUT (mV)
VOUT AC (mV)
12 80 1 mA
IOUT = 20 mA 20
VIN (V)
60
9 0
40 20 mA
-20
6 VOUT (AC) 20 -40
0 -60
3
-20 -80
0 -40 -100
0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5
Time (s) Time (ms)
FIGURE 2-7: 5V LDO Dynamic Linestep FIGURE 2-10: 5V LDO Dynamic Loadstep.
Falling VDD.
18 140 100
VIN = 14V VIN = 14V
VIN = 15V 80
120 VOUT = 12V
15 60 CIN = COUT = 10 F
100 IOUT = 1 mA to 20 mA Pulse
40
VOUT AC (mV)
12 80 1 mA
VOUT (mV)
CIN = COUT = 10 F 20
60
VIN (V)
IOUT = 20 mA
9 0
VOUT (AC) 40 20 mA
-20
6 20 -40
0 -60
3
-20 -80
0 -40 -100
0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5
Time (s) Time (ms)
FIGURE 2-8: 12V LDO Dynamic Linestep FIGURE 2-11: 12V LDO Dynamic
Rising VDD. Loadstep.
14.0
16 80
Charge Pump
VIN = 15V 13.0 Switch Point
15 VIN = 14V 60
12.0
14 40
VOUT (mV)
VOUT (V)
11.0
VIN (V)
13 VOUT (AC) 20
10.0
12 0 9.0
CIN = COUT = 10 F
11 -20 8.0 VOUT = 12V
IOUT = 20 mA
CIN = COUT = 10 F
IOUT = 20 mA
10 -40 7.0
0 20 40 60 80 100 6 10 14 18 22 26 30
Time (s) VIN (V)
FIGURE 2-9: 12V LDO Dynamic Linestep FIGURE 2-12: 12V LDO Output Voltage vs.
Falling VDD. Rising Input Voltage.
1200 24
1000 CE High 22
Quiescent Current (A)
20 High-Side
800
18
RDSON ()
600
16
400
14 Low-Side
CE Low
200 12
0 10
-45 -20 5 30 55 80 105 130 155 -45 -20 5 30 55 80 105 130 155
Temperature (C) Temperature(C)
FIGURE 2-13: Quiescent Current vs. FIGURE 2-16: Driver RDSON vs.
Temperature (MCP8025). Temperature.
1200 5.0
2.0
800
1.0
AVERAGE
600 0.0
-1.0
400 MIN
-2.0
CE Low
-3.0
200
-4.0
0 -5.0
-45 -20 5 30 55 80 105 130 155 -45 -20 5 30 55 80 105 130 155
Temperature (C) Temperature (&
FIGURE 2-14: Quiescent Current vs. FIGURE 2-17: Typical Baud Rate
Temperature (MCP8026). Deviation.
PWMxH
Dead Time
PWMxL
Dead Time
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Time (s)
FIGURE 2-15: 500 ns PWM Dead Time
Injection.
3.4 Chip Enable Input (CE) 3.6 LIN Transceiver Bus (LIN_BUS)
Chip Enable input is used to enable/disable the output
The bidirectional LIN_BUS interface pin connects to
driver and on-board functions. When CE is high, all
the LIN Bus network. The LIN_BUS driver is controlled
device functions are enabled. When CE is low, the
by the TX pin. The driver is an open-drain output. The
device operates in Standby or Sleep mode. When
MCP8025 device contains a LIN Bus 30 k pull-up
Standby mode is active, the current amplifiers and the
resistor that may be enabled or disabled by setting the
12V LDO are disabled. The buck regulator, the DE2
PU30K bit in the CFG0 configuration register. The pull
pin, the voltage and temperature sensor functions are
up may only be changed while in Standby mode.
not affected. The 5V LDO is disabled on the MCP8026.
During normal operation, the 30 k pull up is always
The H-bridge driver outputs are all set to a low state
enabled. In Sleep mode, the 30 k pull up is always
within 100 ns of CE = 0. The device transitions to
disabled.
Standby or Sleep mode 1 ms after CE = 0.
The LIN bus may be used to awaken the device from
The CE pin may be used to clear any hardware faults.
the Sleep mode state. When a LIN wake-up event is
When a fault occurs, the CE input may be used to clear
detected on the LIN_BUS pin, the device will wake up.
the fault by setting the pin low and then high again. The
The MCP8025 will awaken on the rising edge of the
fault is cleared by the rising edge of the CE signal if the
bus after detecting a dominant state lasting > 150 s
hardware fault is no longer active.
on the bus. The LIN Bus master must provide the
The CE pin is used to enable Sleep mode when the dominant state for > 250 s to meet the LIN 2.2A
SLEEP bit in the CFG0 configuration register is set specifications.
to 1. CE must be low for a minimum of 1 ms before the
transition to Standby or Sleep mode occurs. This allows 3.7 Power Ground (PGND),
time for CE to be toggled to clear any faults without
Exposed Pad (EP)
going into Sleep mode.
The CE pin is used to awaken the device from the Device ground. The PCB ground traces should be short
Sleep mode state. To awaken the device from a Sleep and wide and should form a STAR pattern to the power
mode state, the CE pin must be set low for a minimum source. The Exposed Pad (EP) must be soldered to the
of 250 s. The device will then wake up with the next PCB. The PCB area below the EP should be a copper
rising edge of the CE pin. pour with thermal vias to help transfer heat away from
the device.
The CE pin has an internal 47 k pull down.
3.8 LIN Transceiver Received Data
Output (RX)
The RX output pin follows the state of the LIN_BUS pin.
The data received from the LIN bus is output on the RX
pin for connection to a host MCU.
The RX pin is an open-drain output.
Fault Detect output and Transmitter Enable input The ILIMIT_OUT pin is able to sink 1 mA of current
bidirectional pin. The FAULTn/TXE pin will be driven while maintaining less than a 50 mV drop across the
low whenever a LIN fault occurs. There is a output.
47 k resistor between the internal fault signal and the
FAULTn/TXE pin to allow the pin to be externally driven 3.15 Operational Amplifier Outputs
high after a fault has occurred. The FAULTn/TXE pin (I_OUT1, I_OUT2, I_OUT3)
must be pulsed high to start a transmit. If there is no
Current sense amplifier outputs. May be used with
fault present when the pin is pulsed, the FAULTn/TXE
feedback resistors to set the current sense gain. The
pin will latch and be driven high by an internal 47 k
amplifiers are disabled when CE = 0.
impedance. The FAULTn/TXE pin may then be
monitored for faults.
3.16 Operational Amplifier Inputs
No external pull up is needed. The microcontroller pin (ISENSE1 +/-, ISENSE2 +/-,
controlling the FAULTn/TXE pin must be able to switch
ISENSE3 +/-)
between output and input modes.
Current sense amplifier inverting and non-inverting
3.11 Zero-Crossing Multiplexer Inputs inputs. Used in conjunction with the I_OUTn pin to set
(MUX1, MUX2) the current sense gain. The amplifiers are disabled
when CE = 0.
The MUX1 and MUX2 multiplexer inputs select the
desired phase winding to be used as the zero-crossing 3.17 Low-Side N-Channel MOSFET
Back EMF phase reference. The output of the Driver Outputs (LSA, LSB, LSC)
multiplexer connects to one input of the zero-crossing
comparator. The other zero-crossing comparator input Low-side N-channel MOSFET drive signal. Connect to
connects to the neutral voltage. The MUX1 and MUX2 the gate of the external MOSFETs. A low-impedance
inputs must be driven by the host processor resistor may be used between these pins and the
synchronously with the motor commutation. MOSFET gates to limit current and slew rate.
Connect VDD to the main supply voltage. This voltage 3.27 Communications Port (DE2)
should be the same as the motor voltage. The driver
overcurrent and overvoltage shutdown features are Open-drain communication node. The DE2
relative to the VDD pin. When the VDD voltage is communication is a half-duplex, 9600 baud, 8-bit, no
separate from the motor voltage, the overcurrent and parity communication link. The open-drain DE2 pin
overvoltage protection features may not be available. must be pulled high by an external pull-up resistor. The
pin has a minimum drive capability of 1 mA resulting in
The VDD voltage must not exceed the maximum
a VDE2 of 50 mV when driven low.
operating limits of the device. Connect a bulk capacitor
close to this pin for good loadstep performance and
transient protection.
The type of capacitor used can be ceramic, tantalum or
aluminum electrolytic. The low ESR characteristics of
the ceramic will yield better noise and PSRR
performance at high frequency.
Power-on Reset
All states
LIN wake-up event or
Brown-out CE wake-up event
Start-up Sleep
Supply > 6V
Supply < 30V
Temp < 145C
CE = 0 Digital
configuration
Supply < 30V
ACK Temp < 145C
Buck
Supply > 32V enabled
Temp>170C
CE = 1 and time<1ms
BK_OFF V5>4.5V
and CE=1
V12
enabled
BK_ACK V12>10.8V
MTC_FAULT
Power-on Reset
All states
HV_IN1 wake-up event
Brown-out or CE wake-up event
Start-up Sleep
Supply > 6V
Supply < 30V
Temp < 145C
CE = 0 Digital
configuration
Supply < 30V
ACK Temp < 145C
Buck
Supply > 32V enabled
Temp>170C
V12
CE = 1 and time<1ms
enabled
BK_ACK V12>10.8V
MTC_FAULT
Internal
5V LDO
Buck
DE2
System State Fault Conditions
Sleep CE = 0, SLEEP = 1 W
Standby CE = 0 A A R A A
(MCP8025) SLEEP = 0
Standby CE = 0 A A A A
(MCP8026) SLEEP = 0
Operating CE = 1, ILIMIT_OUT = 1 A A A A A A A
Faults Driver OTP TJ > 160C A A
CE = 1 VDD UVLO VIN 5.5V A A A
ILIMIT_OUT = 0
Buck Input UVLO VIN 4V A A
Buck Output Brownout VBUCK < 80% (Brownout) A A A
5V LDO UVLO VOUT5 4V A A R A A A
Driver OVLO (MCP8025) VIN 20V A A A A A A
System OVLO VIN 32V A A
MOSFET UVLO VHS[A:C] < 8V, VLS[A:C] < 8V A A A A A A
MOSFET OCP VDrain-Source > EXTOC<1:0> setting A A A A A A
Warnings Buck OCP IBUCK Input > 2.5A Peak A A A A A A A
CE = 1 Buck Output VBUCK < 90% A A A A A A A
ILIMIT_OUT = 1 Undervoltage
Driver Temperature TJ > 72% TSD_MIN A A A A A A A
(115C for 160C Driver OTP)
Config Lost (BORW) Set at initial power-up A A A A A A A
or when VDD < UVLOBK_STOP
Legend: A = ACTIVE (ON), = INACTIVE (OFF), W = WAKEUP (from Sleep), R = RECEIVER ONLY
OCP = Overcurrent Protection
OTP = Overtemperature Protection
UVLO = Undervoltage Lockout
OVLO = Overvoltage Lockout
4.3.3.3 PWM Speed Control The preferred control method employs a chop-chop
PWM for any situation where the motor is being
The inner commutation loop is a phase-lock loop,
accelerated, either positively or negatively. For
which locks to the rotors position. This inner loop does
improved efficiency, chop-coast PWM is employed
not attempt to modify the position of the rotor, but
during steady-state conditions. The chop-chop speed
modifies the commutation times to match whatever
loop is implemented by hysteretic control, fixed off-time
position the rotor has. The outer speed loop changes
control or average current mode control of the motor
the rotor velocity and the inner commutation loop locks
current. This makes for a very robust controller, as the
to the rotors position to commutate the phase at the
motor current is always in instantaneous control.
correct times.
The motor speed presented to the chop-chop loop is
The outer speed loop pulse-width modulates the motor
reduced by approximately 9%. A fixed-frequency PWM
drive inverter to produce the desired wave shape and
that only modulates the high-side switches implements
voltage at the motor. The inductance of the motor then
the chop-coast loop. The chop-coast loop is presented
integrates this pulse-width modulation (PWM) pattern
with the full motor speed, so, if it is able to control the
to produce the desired average current, thus controlling
speed, the chop-chop loop will never be satisfied and
the desired torque and speed of the motor. For a
will remain saturated. The chop-chop remains able to
trapezoidal BLDC motor drive with six-step
assume full control if the motor torque is exceeded,
commutation, the PWM is used to generate the
either through a load change or a change in speed that
average voltage to produce the desired motor current
produces acceleration torque. The chop-coast loop will
and motor speed.
remain saturated, with the chop-chop loop in full
There are two basic methods to pulse-width modulate control, during start-up and acceleration to full speed.
the inverter switches. The first method returns the The bandwidth of the chop-coast loop is set to be
reactive energy in the motor inductance to the source slower than the chop-chop loop so that any transients
by reversing the voltage on the motor winding during will be handled by the chop-chop loop and the
the current decay period. This method is referred to as chop-coast loop will only be active in steady-state
fast decay or chop-chop. The second method operation.
circulates the reactive current in the motor with minimal
voltage applied to the inductance. This method is
referred to as slow decay or chop-coast.
Message Format
DE2 START B0 B1 B2 B3 B4 B5 B6 B7 STOP
START B0 B1 B2 B3 B4 B5 B6 B7 STOP
TSTART TS
4.5.5.4 SET_CFG_1
The SET_CFG_1 message is sent by the host to the
MCP8025/6 devices to configure the motor current limit
reference DAC. The SET_CFG_1 message may be
sent to the device at any time. The host is responsible
for making sure the system is in a state that will not be
compromised by sending the SET_CFG_1 message.
The SET_CFG_1 message format is indicated in
Table 4-7. The response is indicated in Table 4-8.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as 0
-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown
Q1
Cap12V = (n x CapBOOTSTRAP)/(12V/VBOOTCAP 1)
Letting VBOOT = 9V, CapBOOTSTRAP = 470 nF and
OUTPUT L1
CONTROL
VDD-12V LX
charging three caps simultaneously:
LOGIC
+
Letting VBOOT = 9V, CapBOOTSTRAP = 1 F and
BANDGAP
-
+ REFERENCE
FB
R1
charging three caps simultaneously:
- C1
R2 Cap12V = (3 x 1 F)/(12V/9V 1) = 9.0 F
Use a 10 F capacitor for the +12V LDO.
Letting VBOOT = 9V, CapBOOTSTRAP = 1 F and
FIGURE 5-2: Typical Buck Application. charging one cap at a time:
MCP8025/6
+12V
VBA R
VBB R
VBC R
HSA R
R
HSB R
R A
HSC R
R
PHA
PHB
+
PHC VDD
B C _
LSA R
LSB R
LSC R
R R R
S S S
2016 Microchip Technology Inc.
MCP8025
e3
E/MP^^
1606256
MCP8026
EPT1606
256
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
40-Lead Plastic Quad Flat, No Lead Package (MP) - 5x5 mm Body [QFN]
With 3.7x3.7 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D A B
N
1
NOTE 1 2
E
(DATUM B)
(DATUM A)
2X
0.20 C
2X
0.20 C TOP VIEW
0.10 C
C A1
A
SEATING
PLANE
(A3) 0.08 C
SIDE VIEW
0.10 C A B
D2
0.10 C A B
E2
K
2
1
N
L 40X b
e 0.07 C A B
0.05 C
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Terminals N 40
Pitch e 0.40 BSC
Overall Height A 0.80 0.85 0.90
Standoff A1 0.00 0.02 0.05
Terminal Thickness A3 0.20 REF
Overall Width E 5.00 BSC
Exposed Pad Width E2 3.70 BSC
Overall Length D 5.00 BSC
Exposed Pad Length D2 3.70 BSC
Terminal Width b 0.15 0.20 0.25
Terminal Length L 0.30 0.40 0.50
Terminal-to-Exposed-Pad K 0.20 - -
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
40-Lead Plastic Quad Flat, No Lead Package (MP) - 5x5 mm Body [QFN]
With 3.7x3.7 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
C2 Y2
Y1
X1
SILK SCREEN
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.40 BSC
Optional Center Pad Width X2 3.80
Optional Center Pad Length Y2 3.80
Contact Pad Spacing C1 5.00
Contact Pad Spacing C2 5.00
Contact Pad Width (X40) X1 0.20
Contact Pad Length (X40) Y1 0.80
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2047-002A
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
D1/2
D
A B
NOTE 1
E1 E
A A
E1/2
E1/4 N
48X TIPS
12
0.20 C A-B D 4X
D1/4 0.20 H A-B D
A
TOP VIEW
0.10 C H
C
SEATING
PLANE 0.08 C
A1 SIDE VIEW
A2
D2 4X
12 0.20 H A-B D
4X
N
0.20
E2
e 48x b
e/2 0.08 C A-B D
TOP VIEW
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E T
L
(L1)
SECTION A-A
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 48
Lead Pitch e 0.50 BSC
Overall Height A - - 1.20
Standoff A1 0.05 - 0.15
Molded Package Thickness A2 0.95 1.00 1.05
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle I 0 3.5 7
Overall Width E 9.00 BSC
Overall Length D 9.00 BSC
Molded Package Width E1 7.00 BSC
Molded Package Length D1 7.00 BSC
Exposed Pad Width E2 3.50 BSC
Exposed Pad Length D2 3.50 BSC
Lead Thickness c 0.09 - 0.16
Lead Width b 0.17 0.22 0.27
Mold Draft Angle Top D 11 12 13
Mold Draft Angle Bottom E 11 12 13
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Thermal Tab
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
C2 Y2
Y1
X1
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Optional Center Tab Width X2 3.50
Optional Center Tab Length Y2 3.50
Contact Pad Spacing C1 8.40
Contact Pad Spacing C2 8.40
Contact Pad Width (X48) X1 0.30
Contact Pad Length (X48) Y1 1.50
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2183A
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.