RoHS and its Impact on PCB

Manufacturing

Helmut.Kroener@de.multek.com
+49 171 463 5431
February 7 - 2006
Sao Paulo
ABRACI
Why is RoHS such a big deal??

RoHS = Restriction of Hazardous Substances

Why is lead free such a big deal??

becauseit is affecting a

ONE TRILLION + US $

( >1 000 000 000 000 )

worldwide

electronic market and industry

Custer Consulting 2004
PCB world market
GLOBAL DEMAND FOR PCBs
BY APPLICATION SEGMENT
2004 2007

Military/
Industrial/ Aerospace Electronic Data
Military/ 5.4%
Medical Processing/Office
Industrial/ Aerospace 6.9%
5.7% Electronic Data 34.4%
Medical
Processing/Office Automotive
7.2%
34.8% 4.8%
Automotive
5.3% Consumer
CAAGR 04-07
5.0% 13.1%
Consumer
14.5%

IC Packages
Communications Communications
10.1%
22.3% 22.6% IC Packages
S24.044jpp-worldapp02-07
12.6%
Total: $36.1Bn Total: $41.8Bn

Prismark Consulting 2004

MULTEK

NT Limited Consulting 2004

because it is affecting the ENTIRE

ELECTRONIC PRODUCTS

SUPPLY CHAIN
SUPPLY CHAIN

ROHS END USER

COMPONENTS Equipment Supplier

OEM +(PACKAGING)
Material Supplier
Chemistry Supplier

EMS PCB

Equipment Supplier Equipment Supplier

Material Supplier Material Supplier
Chemistry Supplier Chemistry Supplier
 RoHS
A FEW BASICS !
Worldwide Environmental Legislation
European Union (EU) 25 members, 400 Million people

WEEE (Aug. 2005) Waste Electrical & Electronic Equipment

RoHS (July 2006) Restriction of Hazardous Substance

ELV (July 2003) End of Life Vehicle

EUP (under discussion) Energy Using Products (Eco Design)

Japan 120 million people

Home Appliance Recycle Law (2001)

Amendments to disposal law

Walter quality standards re lead
U.S. 290 million people

Federal/State/Local (e.g. CA Prop 605)

CA and Maine enacted laws to comply with EU RoHS

Other States are also passing material restrictions (MA, Vermont)

China - 1.4 billion people

Legislation very similar to RoHS and WEEE (targeted implementation Jan 2007)
: Management Methods for the Prevention and Control of Pollution from
Electronics Information Products Chapter 2, Article 11
RoHS Directive 2002/95/EC January 27 2003

As of July 1, 2006, use of the following

substances in electrical and electronics
equipment sold in the EU are banned:

Lead (Pb)

Cadmium (Cd)

Hexavalent Chromium (Cr+6)

Mercury (Hg)

Poly Brominated Biphenyls (PBB)

Poly Brominated Di-Phenyl Ether (PBDE)
RoHS Directive 2002/95/EC January 27 2003

Product scope is all electronic and electrical

equipment, with specific exemptions

Medical devices

Monitoring and control equipment

Grace period for server, telecom gear, storage equipment

Technical and Scientific Adaptation Committee

Comprised of Member State Officials

Sets Threshold levels of prohibited substances (max concentrations)

Reviews application-related exemptions and scope to determine if
exemptions are still warranted given technological progress and/or
environmental problems

Exemption list is discussed on at least yearly base

Last amendement end of 2005
RoHS Directive 2002/95/EC January 27 2003
Directive on the Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (RoHS)

Maximum allowable impurity level (on a homogeneous material base level)

Mercury 0.1 % by weight 1000 ppm

Cadmium 0.01 % by weight 100 ppm

Lead 0.1 % by weight 1000 ppm

Cr6+ 0.1 % by weight 1000 ppm

PBB, PBDE 0.1 % by weight 1000 ppm
Homogeneous Material

The threshold limit applies for homogenous materials.

Homogenous materials means:

a unit that can not be mechanically disjointed in single

materials, or any material that is not mechanically divisible
(dissassembled, cut or ground) into separate material
constituents. The term homogeneous is understood as
of uniform composition throughout. Examples of HM are
indiviual types of plastics, ceramics, glass metals, alloys,
paper, board, resin, coatings. The term mechanically
disjointed means that the materials can be, in principle,
separated by mechanical actions such as for example
unscrewing, cutting, crushing, grinding and abrasive
processes.
Impact of RoHS on PCB Suppliers

As of July 2006 only lead-free soldering processes to be

used for non exempt product categories

Lead free soldering will require new alloys (Sn Ag Cu most likely)

96.5 Sn, 3 % Ag, 0.5 % Cu for solder balls and solder paste

Lead free soldering temperatures will be as high 270 C (larger

boards predominantly melting point of lead free solder at 217 C
almost 40 C higher than Eutectic Sn Pb solder)

As of July 2006 only lead free surface finishes will be

required for non exempt products

NO eutectic SnPb (HASL) (unless it is lead free)
 Leading Lead Free Solder Alloys

US NEMI: Sn3.9wt%Ag0.6wt%Cu

EURAM: Sn3.8wt%Ag0.7wt%Cu

JEIDA: Sn3.0wt%Ag0.5wt%Cu

Sn(3-4)wt%Ag(0.5-1)wt%Cu
Melting Point: ~ 217 C
Typical Lead Free Assembly Requirements
Criteria Eutectic SnPb Lead free Comment
soldering soldering
(SnAgCu)
Average ramp 0.6 0.9 C/s 0.9 1.1 C/s Steeper ramp
rate 25 150 C
Time between 55 - 60 s 75 85 s Longer time
150 183 C
Peak 215 225 C 235 265 C Higher
Temperature temperature
Time above 45 55 s 30 - 80 s Longer dwell
183 C / 217 C (depending on times at higher
components) temperatures
Average 78C 10 11 C Faster cooling
cooling rate rates
peak T to 100C
Lead Free Requirements Reflow @ 260 C

T 260 C Peak Must: 5 x

Profile : Want: 6-9 x
2 x reflow
1 x wave
1-3 x rework

Conveyor speed used to reach 260C on the board surface: 28 inch/min.

Rising slope from ambient temperature to 200C: 0.7C/s.
Rising time between 25C and 200C: 302 seconds.
Time above 217C: 73 seconds.
Mean peak temperature on surface: 257.9C.
Following are the oven temperatures per zone:
1. 100C
2. 120C
3. 140C
4. 160C
5. 180C
6. 200C
7. 215C
8. 260C
9. 285C
10. 290C
Typical Lead Free Assembly Requirements

Significant more stress on

the PCB (and components)
during PCB assembly and
repair
(potentially multiple times)
High Temperature Solder Reflow

Unknowns for the PCB and PCB materials

Via reliability (via cracking)?

De-Lamination Resistance ?

De Composition Resistance?

Electrical Degradation?
Customer Needs Overview -
Reliability
(from a PCB perspective)
How does RoHS Compliance translate into requirements for
the PCB supplier?
Perspective from about 50 customers

Data Communication Telecommunication

Cisco
Ericsson

Stratus
Nokia

Extreme Networks
Siemens

CNT
Nortel

Flarion
Alcatel

Avici
Lucent...........

Spirent Mobile / Handhelds

Paradyne............
Sony Ericsson
Computer
Siemens / Ben Q

IBM
Alcatel

HP Compaq
Palm

Fujitsu Siemens
Motorola

Sun
Instrumentation

Dell
Tektronix

.
Agilent.
Perspective from about 50 customers & suppliers

EMS Provider Material Supplier

Benchmark
Isola

Jabil
Hitachi

Flextronics
Nelco

Solectron
TUC

Elcoteq
Matsushita

Polyclad
Others


ADIC

River stone Consortia

Vicor
Universal Binghamton


Chemistry Supplier

Atotech

Cookson Electronics

Rohm & Haas

Mac Dermid


Lead Free Critical Issues

Overall cost increase

Impact of PCB finish

Impact of component finish

Forward compatibility

Backward compatibility

PCB Reliability

Impact of multiple heat cycles

Tin whiskers reliability risk

Solder joint reliability

Thermal

Mechanical

Shock and Vibration

Reliability tests and acceleration factors

Electrochemical Reliability

Infrastructure
 Common (reliability) Requirements - Summary
Reflow LLTS IST AATC CAF Electrical 2x@288 C
at 260 C Loss Solder-
Dk shock (10s)

Data Com Yes No No Yes Yes Yes Yes

(exempt (exempti
ion) on)
Telecom Yes No Yes Yes Yes Yes Yes

Computer Yes No Yes Yes Yes Yes Yes

Mobile & No Yes No Yes Some No Yes

Handhelds (small, Yes
thin, Some No
light)
Instruments Yes No Yes Yes No Yes Yes

EMS Yes Yes Yes Yes OEM OEM Yes

Provider dependa dependant
nt
 Finish Map
Organic OSP/ Immersion Immersion Plated Electroless
Surface ENIG Silver Tin Nickel Nickel
Protection I Ag I Sn Gold Immersion
OSP (only) Gold (ENIG)
Data Com Yes No Yes No No Some

Telecom Yes No Yes Yes No Some

Computer Yes No Yes No Yes No

Mobile & Yes Yes No Yes Some In combination

Handhelds with OSP

Instruments No No Yes No No Yes

EMS Yes Yes Yes Yes Some Yes

Provider

Asia Asia
Europe USA EUROPE Europe
US US
Expectations from an EMS - Sanmina
ONLY RoHS compliant materials and products Q1 2005 and onwards
Full Traceability
 Component PN change to reflect transition to RoHS
 Component Identification signifying RoHS Compliance (JEDEC/NEMI
standards)
Warranted Compatibility of pre-RoHS and RoHS compliant
components
 Reasonable sample quantities at supplier expense
 Quality and Reliability of RoHS compliant components =/> than pre RoHS
 No change in terms or conditions, including pricing, for RoHS compliant
components
 Supplier will provide Certificate of RoHS compliance with each shipment by
means of paper, email, web.. (eg. Electronics Industries Alliance Materials
Compositions Declaration Guideline)
 Ongoing communication
 Product Transition Notice (ECN/PCN) last time buy end of life
 Sample Availability
 Revision to supplier RoHS roadmap
General Summary of Requirements

Better or Same Quality & Reliability (short and long term)

Better or Same Delivery

Better or Same Technology

Better Environmental Requirements (additional
substances)

Better Marking and Identification

Better Communication
--------------------------------------------------------------------------------------

AT NO EXPENSE TO THE CUSTOMER

------------------------------------------------------
Multeks Focus
Multek Offers Most Important LF Finishes

OSP
OSP / ENIG
Immersion Ag
Immersion Sn
Plated Ni Au
ENIG
PCB Finishes for LF OSP (0.2-0.6m)
Advantages
 Flat, coplanar pads
 Re-workable by PCB supplier
 Cheap & simple process
 Short and easy to control
process
 Cu-Sn intermetalic (IMC) is
strong for solder joints with
SAC
 High reliability of solder joint
 High temperature OSP
developed
Disadvantages

Limited heat cycle capability

Newer developments better

Assembly line changes (test ..)

Reliability of exposed Cu after
PCBA (ICT)

Test pins cut through copper
leaving exposed copper on PCBA

Potential issue with voids
(organics) in solder joint
PCB Finishes for LF ENIG (3-5m Ni, 0.1 m Au)
Advantages
 Flat, coplanar pads
 Consistent thickness
 Withstands multiple heat
cycles
 Long shelf life
 Easily solder able
 Easy to repair on PCBA
 Multiple repair possible
 Works well for fine pitch
components
 No exposed copper
 High barrel reliability
 Easy to use for ICT
Disadvantages

Expensive (Gold on record high)

Brittle Fracture for BGA type
packages (under mechanical
load)

Black pad potential

May not be suited for high
speed signals

Not possible to do gold wire
bonding

Adjustments necessary for
Press Fit technology
PCB Finishes for LF I Ag (0.15 0.5 m Au)

Advantages
 Flat, coplanar pads
 Consistent thickness
 Withstands multiple heat
cycles
 Long shelf life
 Very easy solder able
 Easy to repair on PCBA
 Multiple repair possible
 Works well for fine pitch
components
 High reliability with Cu Sn IMC
 Easy to for ICT
 Relatively simple process
Disadvantages

Adjustments necessary for
Press Fit technology (high friction
coefficient)

Anti-tarnishing is critical to
control

Likes to build oxides

Issues with process interruptions

Diffuses into the copper

Exposed Cu

Color and look

Potential issues with voids

Thickness control critical
PCB Finishes for LF I Sn (0.5 1.2 m Au)
Advantages
 Flat, coplanar pads
 Consistent thickness
 Very easy solder able
 Works well for fine pitch
components
 High reliability with Cu Sn IMC
 Works well at ICT
 Relatively inexpensive
 Same metal as CuSnAg alloy
(does not change alloy ratio
much)
 Well suited and proven for
press fit technology
Disadvantages

Anti-tarnishing is critical to
control

Rinsing is highly critical

Likes to build oxides

Diffuses into the copper

Exposed Cu

Color and look

Grows inter-metallic with every
heat cycle (0.1m/2 months)

Fewer heat cycles possible than
I Ag

Fear of Sn Whiskers (perception
only)
PCB Finishes for LF Plated Ni Au (5 m Ni, 0.1 m Au)
Advantages
 Flat, coplanar pads
 Consistent thickness
 Very easy solder able
 Works well for fine pitch
components
 Works well at ICT
 Very high barrel reliability PCB
 Easy to rework (PCBA)
Disadvantages

Possibility of lower joint strength
with SnAgCu alloy

Brittle Fracture (comparable to
ENIG)

Limitation is aspect ratio

10:1 max

Limitation in line spacing at
about 4-5 mil (100-125 m)

Not so widely available in the
industry
Conclusion Finish

There is no ONE perfect finish.

Finishes should be selected based
on specific application.
US market tends to favor I Ag (larger
and thicker boards)
EU tends to favor I Sn (smaller and
thinner boards)
Handhelds prefer OSP/ENIG
All other finishes will be niche
Considerations for a lead free PCB material
1. Temperature to decomposition
2. Time to delamination
3. Glass transition temperature
4. Coefficient of thermal expansion (x-, y-, z-axis)
5. Thermal stability
6. Moisture absorption
7. Warpage
8. Ionic contamination (CAF Conductive Anodic Filament)
9. Peel Strength
10. Youngs module
11. Stiffness
12. Soldermask Adhesion
13. Electrical Performance
14. .
What really matters?? Multeks Focus
1. Temperature to decomposition
2. Time to delamination
3. Glass transition temperature
4. Coefficient of thermal expansion (x-, y-, z-axis)
5. Thermal stability
6. Moisture absorption
7. Warpage
8. Ionic contamination
a) Solder Insulation Resistance - (CAF Conductive Anodic Filament)
9. Peel Strength
10. Youngs module
11. Stiffness
12. Soldermask Adhesion
13. Electrical Performance.
 Multek Lead Free Evaluation Strategy
Focus Multek Europe
2002 - 2004
Thick and large PCBs
PHASE I  3mm and up / 26 layer and up
High Performance Laminates
Europe  Tg 130 200
 Phenolic vs. Dicy Cured Systems
 Low loss materials
Results: Reflow simulation
 De-lamination Resistance
Reliability
Study on high performance laminates  IST
 AATC
Studies on AATC Thermal Mechanical Data
 Decomposition
Studies on Repeated Reflow (for high  Tg
layer-count PCB)  CTE
Electrical Performance (bulk
properties)
Short list of lead free material options  Dielectric Constant Dk
 Loss Df
 Multek Evaluation Strategy
Focus Multek Asia
2003 - 2004
 Lead free surface finishes
PHASE I  Immersion Sn
 Immersion Ag
ASIA  OSP Entek 106 AX HT for lead free
 Tamura / Glicoat

Results: Conductive Anodic Filament

 CAF Resistance as a function of
 Materials
Studies on Surface Finishes  Glass Suppliers
 Number of reflow cycles
Studies on CAF Resistance  Reflow profile
 Processing parameters
Studies on Repeated Reflow (12-18layer)
Material Compatibility to Leadfree
Studies on commonly used materials  RCF
 Soldermask (s)
 Nomenclature
Design Guideline Rev A for Asia factories  All other common laminate materials in
production
Multek Evaluation Strategy
Main Testing Attributes
Feb - Dec 2005
PCB Processing
PHASE II
Pressing

Drilling
Multek
etc.

Delamination Resistance

Repeated Reflow at 260 C
Results:
Reliability
Common Material Selection
IST performance
Common Test Vehicle
AATC Performance
Common Test Plan
LLTS Performance
Common Material Set
CAF Performance
Final List of Material Choices
Signal Integrity
Low Tg
Dk over f
High Tg
Df over f
Low Loss
Thermal Mechanical Properties

Design Guideline Rev. B
Tg

Td

CTE

Solder Shock
Multek Evaluation Strategy
Main Testing Attributes
Jan - Dec 2006

PCB Processing
PHASE III
Delamination Resistance

Reliability
Multek
Signal Integrity

Thermal Mechanical Properties

Expected Results:
New Test Vehicles

16 layer China

Additional Material Choices
36 layer Germany

TBD

Answers to more exotic designs
Additional TV features

Mixed Materials

Fine tune selected choices
Multiple Lamination Cycles

via (filled / unfilled/over plated)

Design Guideline Rev. C

Additional Materials

Low End

High End
 TWO EXAMPLES

Lead Free AATC Study (from Phase I)

LF MATERIAL SELECTION STUDY (from Phase II)