Professional Documents
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Features
Providing Galvanic Isolation
Active Miller Clamping Package W(Typ) x D(Typ) x H(Max)
Under-voltage Lockout function SSOP-B10W 3.5mm x10.2mm x 1.9mm
UL1577(pending)
AEC-Q100 Qualified (Note1)
(Note 1:Grade1)
Applications
IGBT Gate Driver
MOSFET Gate Driver
SSOP-B10W
GND1 GND2
UVLO1 UVLO2
VCC1 VCC2
S Pre-
INA Pulse OUT
Q driver
Generator
INB R MC
CVCC1 CVCC2
-
GND1 + 2V GND2
1pin
Figure 1. Application Circuits (IGBT Gate Driver)
GND1 GND2
UVLO1 UVLO2
VCC1 VCC2
S Pre-
INA Pulse OUT
Q driver
Generator
INB R MC
CVCC1 CVCC2
-
GND1 + 2V
GND2
1pin
Figure 2. Application Circuits (MOSFET Gate Driver)
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays
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BM60016FV-C Datasheet
Contents
General Description ...................................................................................................................................................................... 1
Features ......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................. 1
Key Specifications ........................................................................................................................................................................ 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuits ......................................................................................................................................................... 1
Contents ........................................................................................................................................................................................ 2
Recommended Range of External Constants ............................................................................................................................ 3
Pin Configurations ........................................................................................................................................................................ 3
Pin Descriptions ........................................................................................................................................................................... 3
Description of pins and cautions on layout of board ................................................................................................................ 4
Description of functions and examples of constant setting ..................................................................................................... 5
Absolute Maximum Ratings ......................................................................................................................................................... 8
Thermal Resistance ...................................................................................................................................................................... 8
Recommended Operating Ratings .............................................................................................................................................. 9
Insulation Related Characteristics .............................................................................................................................................. 9
Electrical Characteristics ........................................................................................................................................................... 10
Typical Performance Curves ...................................................................................................................................................... 11
Figure 9. Input Side Circuit Current 1 ...................................................................................................................................... 11
Figure 10. Input Side Circuit Current 1 ...................................................................................................................................... 11
Figure 11. input Side Circuit Current 2 (at INA=10kHz, Duty=50%) ....................................................................................... 11
Figure 12. Input Side Circuit Current 2 (at INA=10kHz, Duty=50%) ....................................................................................... 11
Figure 13. Input Side Circuit Current 3 (at INA=20kHz, Duty=50%) ....................................................................................... 12
Figure 14. Input Side Circuit Current 3 (at INA=20kHz, Duty=50%) ....................................................................................... 12
Figure 15. Output Side Circuit Current 1 (at OUT=L) ................................................................................................................ 12
Figure 16. Output Side Circuit Current 1 (at OUT=L .............................................................................................................. 12
Figure 17. Output Side Circuit Current 2 (at OUT=H)................................................................................................................ 13
Figure 18. Output Side Circuit Current 2 (at OUT=H) .............................................................................................................. 13
Figure 19. Logic (INA/INB) High/Low Level Voltage .................................................................................................................. 13
Figure 20. OUT vs Logic (INA) Input Voltage VCC1=5V, VCC2=15V, Ta=25C .................................................................. 13
Figure 21. Logic Pull-down Resistance ..................................................................................................................................... 14
Figure 22. Logic (INA) Input Minimum Pulse Width ................................................................................................................... 14
Figure 23. OUT ON Resistance (Source) .................................................................................................................................. 14
Figure 24. OUT ON Resistance (Sink) ...................................................................................................................................... 14
Figure 25. Turn ON Time INA=PWM, INB=L ....................................................................................................................... 15
Figure 26. Turn OFF Time INA=PWM, INB=L ..................................................................................................................... 15
Figure 27. Turn ON Time INA=H, INB=PWM ...................................................................................................................... 15
Figure 28. Turn OFF Time INA=H, INB=PWM .................................................................................................................... 15
Figure 29. MC ON Resistance .................................................................................................................................................. 16
Figure 30. MC ON Threshold Voltage ....................................................................................................................................... 16
Figure 31. Input Side UVLO ON/OFF Voltage ........................................................................................................................... 16
Figure 32. Input Side UVLO Mask Time .................................................................................................................................... 16
Figure 33. Output Side UVLO ON/OFF voltage ........................................................................................................................ 17
Figure 34. Output Side UVLO Mask Time ................................................................................................................................. 17
Selection of Components Externally Connected ..................................................................................................................... 18
I/O Equivalent Circuits................................................................................................................................................................ 20
Operational Notes ....................................................................................................................................................................... 21
Ordering Information .................................................................................................................................................................. 23
Marking Diagrams ....................................................................................................................................................................... 23
Physical Dimension, Tape and Reel Information ..................................................................................................................... 24
Revision History ......................................................................................................................................................................... 25
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BM60016FV-C Datasheet
Pin Configurations
(TOP VIEW)
GND1 6 5 GND2
VCC1 7 4 VCC2
INA 8 3 OUT
INB 9 2 MC
GND1 10 1 GND2
Pin Descriptions
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BM60016FV-C Datasheet
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BM60016FV-C Datasheet
H X OFF
VCC2
PREDRIVER
OUT GATE
S PREDRIVER
Q
R MC
PREDRIVER
-
+
VMCON GND2
tPOFFA tPONA
H
INA
L
OUT
L
H
GATE VMCON
L
MC Hi-Z
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BM60016FV-C Datasheet
H
INA
L
H
INB
L
VUVLO1H
VCC1 VUVLO1L
H
OUT
L
Figure 5. Input-side UVLO Function Operation Timing Chart
H
INA
L
H
INB
L
VUVLO2H
VCC2 VUVLO2L
H
OUT Hi-Z
L
Figure 6. Output-side UVLO Function Operation Timing Chart
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BM60016FV-C Datasheet
Input Output
No. Status V V
I I O
C C M
N N U
C C C
B A T
1 2
1 VCC1UVLO UVLO X X X L L
2 VCC2UVLO X UVLO X X L L
3 INB Active H X L L
H
OUT Hi-Z
L
MC Hi-Z
L
: Since the VCC2 to GND2 pin voltage is low and the output MOS does not turn ON, the
output pins become Hi-Z.
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BM60016FV-C Datasheet
Thermal Resistance(Note 5)
Thermal Resistance (Typ)
Parameter Symbol Unit
1s(Note 7) 2s2p(Note 8)
SSOP-B10W
Input-side Junction to Ambient JA1 172.1 101.8 C/W
Output-side Junction to Ambient JA2 180.2 108.9 C/W
Input-side Junction to Top Characterization Parameter(Note 6) JT1 32 27 C/W
Input-side Junction to Top Characterization Parameter(Note 6) JT2 82 60 C/W
(Note 5)Based on JESD51-2A(Still-Air)
(Note 6)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 7)Using a PCB board based on JESD51-3.
(Note 8)Using a PCB board based on JESD51-7.
Layer Number of
Material Board Size
Measurement Board
Single FR-4 114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern Thickness
Footprints and Traces 70m
Layer Number of
Material Board Size
Measurement Board
4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt
Top 2 Internal Layers Bottom
Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness
Footprints and Traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m
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BM60016FV-C Datasheet
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BM60016FV-C Datasheet
Electrical Characteristics
Unless otherwise specified Ta=-40C to 125C, V CC1=4.5V to 5.5V, VCC2=10V to 24V
Parameter Symbol Min. Typ. Max. Unit Conditions
General
Input side circuit current 1 ICC11 0.06 0.14 0.22 mA
Input side circuit current 2 ICC12 0.10 0.20 0.30 mA INA =10kHz, Duty=50%
Input side circuit current 3 ICC13 0.15 0.30 0.45 mA INA =20kHz, Duty=50%
Output side circuit current 1 ICC21 0.28 0.46 0.64 mA OUT=L
Output side circuit current 2 ICC22 0.24 0.42 0.60 mA OUT=H
Logic block
Logic high level input voltage VINH 2.0 - VCC1 V INA, INB
Logic low level input voltage VINL 0 - 0.8 V INA, INB
Logic pull-down resistance RIND 25 50 100 k INA, INB
Logic input minimum pulse width tINMIN 60 - - ns INA, INB
Output
OUT ON resistance (Source) RONH 0.4 0.9 2.0 IOUT=-40mA
OUT ON resistance (Sink) RONL 0.2 0.6 1.3 IOUT=40mA
VCC2=15V,
OUT maximum current (Source) IOUTMAXH 3.0 4.5 - A
Guaranteed by design
VCC2=15V,
OUT maximum current (Sink) IOUTMAXL 3.0 3.9 - A
Guaranteed by design
tPONA 35 55 75 ns INA=PWM, INB=L
Turn ON time
tPONB 35 55 75 ns INA=H, INB=PWM
tPOFFA 35 55 75 ns INA=PWM, INB=L
Turn OFF time
tPOFFB 35 55 75 ns INA=H, INB=PWM
tPDISTA -25 0 25 ns tPOFFA tPONA
Propagation distortion
tPDISTB -25 0 25 ns tPOFFB tPONB
Rise time tRISE - 50 - ns 10nF between OUT-GND2
Fall time tFALL - 50 - ns 10nF between OUT-GND2
MC ON resistance RONMC 0.20 0.65 1.40 IMC=40mA
MC ON threshold voltage VMCON 1.8 2 2.2 V
Common Mode Transient Immunity CM 100 - - kV/s Guaranteed by design
Protection functions
VCC1 UVLO OFF voltage VUVLO1H 3.35 3.50 3.65 V
VCC1 UVLO ON voltage VUVLO1L 3.25 3.40 3.55 V
VCC1 UVLO mask time tUVLO1MSK 1.0 2.5 5.0 s
VCC2 UVLO OFF voltage VUVLO2H 9.0 9.5 10.0 V
VCC2 UVLO ON voltage VUVLO2L 8.0 8.5 9.0 V
VCC2 UVLO mask time tUVLO2MSK 1.00 2.9 5.00 s
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BM60016FV-C Datasheet
0.22 0.22
0.20 0.20
0.18 0.18
Ta=125C
0.16 0.16 VCC1=5.0V
ICC11 [mA]
ICC11 [mA]
0.14 0.14
0.12 0.12
VCC1=5.5V
0.10 0.10
Ta=25C VCC1=4.5V
0.08 0.08
Ta=-40C
0.06 0.06
4.50 4.75 5.00 5.25 5.50 -40 -20 0 20 40 60 80 100 120
Ta [C]
VCC1[V]
Figure 9. Input Side Circuit Current 1 Figure 10. Input Side Circuit Current 1
0.30 0.30
Ta=125C
0.26 0.26
0.22 0.22
ICC12 [mA]
ICC12 [mA]
VCC1=5.5V
0.18 0.18
Ta=25C VCC1=5.0V
VCC1=4.5V
Ta=-40C
0.14 0.14
0.10 0.10
4.50 4.75 5.00 5.25 5.50 -40 -20 0 20 40 60 80 100 120
VCC1 [V] Ta [C]
Figure 11. input Side Circuit Current 2 Figure 12. Input Side Circuit Current 2
(at INA=10kHz, Duty=50%) at INA=10kHz, Duty=50%
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BM60016FV-C Datasheet
0.45 0.45
0.35
0.35
ICC13 [mA]
ICC13 [mA]
0.30
0.30
0.25
VCC1=5.5V
Ta=25C 0.25
0.20 Ta=-40C VCC1=5.0V
VCC1=4.5V
0.15 0.20
0.10 0.15
4.50 4.75 5.00 5.25 5.50 -40 -20 0 20 40 60 80 100 120
VCC1 [V] Ta [C]
Figure 13. Input Side Circuit Current 3 Figure 14. Input Side Circuit Current 3
(at INA=20kHz, Duty=50%) at INA=20kHz, Duty=50%
0.64 0.64
0.60 0.60
Ta=125C
0.56 0.56
VCC2=24V
0.52 0.52
ICC21 [mA]
ICC21 [mA]
0.48 0.48
0.44 0.44
Figure 15. Output Side Circuit Current 1 Figure 16. Output Side Circuit Current 1
(at OUT=L) at OUT=L
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BM60016FV-C Datasheet
0.60 0.60
Ta=125C
0.54 0.54
VCC2=24V
0.48 0.48
ICC22 [mA]
ICC22 [mA]
0.42 0.42
0.36 0.36
VCC2=15V
Ta=25C
0.30 0.30
Ta=-40C VCC2=10V
0.24 0.24
10 12 14 16 18 20 22 24 -40 -20 0 20 40 60 80 100 120
VCC2 [V]
Ta [C]
Figure 17. Output Side Circuit Current 2 Figure 18. Output Side Circuit Current 2
(at OUT=H) (at OUT=H)
3.0 24
2.5 20
Ta=-40C
Ta=25C
Ta=125C 16 Vcc1=5V
2.0
VINH / VINL [V]
H level
OUT [V]
1.5 12
L level
Ta=-40C
1.0 8
Ta=25C
Ta=125C
4
0.5
0
0.0 0 1 2 3 4 5
4.50 4.75 5.00 5.25 5.50
VCC1 [V] INA [V]
Figure 19. Logic (INA/INB) High/Low Level Voltage Figure 20. OUT vs Logic (INA) Input Voltage
VCC1=5V, VCC2=15V, Ta=25C
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BM60016FV-C Datasheet
100 50
40
75
Vcc1=4.5V
Vcc1=5.0V
30
Vcc1=5.5V
tINMin [ns]
RIND [k]
50
20
25
10 Vcc1=4.5V
Vcc1=5.0V
Vcc1=5.5V
0 0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
Figure 21. Logic Pull-down Resistance Figure 22. Logic (INA) Input Minimum Pulse Width
2.0 1.2
Vcc2=10V
1.0 Vcc2=15V
1.6
Vcc2=10V Vcc2=24V
Vcc2=15V
Vcc2=24V 0.8
RONH []
RONL []
1.2
0.6
0.8
0.4
0.4 0.2
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
Figure 23. OUT ON Resistance (Source) Figure 24. OUT ON Resistance (Sink)
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BM60016FV-C Datasheet
90 90
80 80
Vcc2=10V
Vcc2=15V Vcc2=10V
70 Vcc2=24V 70 Vcc2=15V
Vcc2=24V
tPOFFA [ns]
tPONA [ns]
60 60
50 50
40 40
30 30
20 20
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
90 90
80 80
Vcc2=10V
Vcc2=15V
Vcc2=10V
70 Vcc2=24V 70 Vcc2=15V
Vcc2=24V
tPOFFB [ns]
tPONB [ns]
60 60
50 50
40 40
30 30
20
20
-40 -20 0 20 40 60 80 100 120
-40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
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BM60016FV-C Datasheet
1.0 2.2
Vcc2=10V
Vcc2=15V
Vcc2=24V 2.1
0.8
RONMC []
VMCON [V]
2.0
0.6
Vcc2=10V
1.9
Vcc2=15V
Vcc2=24V
0.4 1.8
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
3.65 5
3.60
4
3.55
tUVLO1MSK [s]
3.50
VUVLO1H/L [V]
3.45
VUVLO1H
2
3.40
3.35
VUVLO1L 1
3.30
3.25 0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
Figure 31. Input Side UVLO ON/OFF Voltage Figure 32. Input Side UVLO Mask Time
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BM60016FV-C Datasheet
10.0 5
4
9.5
tUVLO2MSK [s]
VUVLO2H/L [V]
3
VUVLO2H
9.0
2
8.5 1
VUVLO2L
0
8.0 -40 -20 0 20 40 60 80 100 120
-40 -20 0 20 40 60 80 100 120
Ta [C] Ta [C]
Figure 33. Output Side UVLO ON/OFF voltage Figure 34. Output Side UVLO Mask Time
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BM60016FV-C Datasheet
GND1 GND2
UVLO1 UVLO2
VCC1 VCC2
Recommended
ROHM
2SCR542P
GND1 GND2
UVLO1
Recommended
UVLO2
VCC1 VCC2 ROHM
MCR100EZP
INA Pre- OUT
S driver
U Pulse U
Q
Generator
INB R MC Recommended
U U
ROHM
GND1 + GND2 MCR100EZP
U - 1pin
Recommended
GND1 GND2 ROHM
UVLO1 UVLO2 MCR100EZP
VCC1 VCC2
Recommended
ROHM
Figure 37. For Driving IGBT with Negative Power Supply TDZTR5.1
Recommended
ROHM
2SCR542P
Recommended
GND1 GND2 ROHM
UVLO1 UVLO2
MCR100EZP
VCC1 VCC2
Figure 38. For Driving IGBT with Buffer Circuits & Negative Power Supply Recommended
Recommended ROHM
ROHM MCR03EZP
TDZTR5.1
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BM60016FV-C Datasheet
GND1 GND2
UVLO1 UVLO2
VCC1 VCC2
Recommended
ROHM
2SCR542P
GND1 GND2
UVLO1
Recommended
UVLO2
VCC1 VCC2 ROHM
MCR100EZP
INA Pre- OUT
S
U Pulse driver U
Q
Generator
INB R MC Recommended
U U
ROHM
GND1 + GND2 MCR100EZP
U - 1pin
Recommended
GND1 GND2 ROHM
UVLO1 UVLO2 MCR100EZP
VCC1 VCC2
Recommended
ROHM
Figure 41. For Driving MOSFET with Negative Power Supply TDZTR5.1
Recommended
ROHM
2SCR542P
Recommended
GND1 GND2 ROHM
UVLO1 UVLO2
MCR100EZP
VCC1 VCC2
Figure 42. For Driving MOSFET with Buffer Circuits & Negative Power Supply Recommended
Recommended ROHM
ROHM MCR03EZP
TDZTR5.1
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BM60016FV-C Datasheet
Name
Pin No I/O equivalence circuits
Function
VCC2
OUT
1 OUT
Output pin
GND2
VCC2
MC
2 MC
VCC1
INA
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BM60016FV-C Datasheet
Operational Notes
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current
may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more
than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring,
width of ground wiring, and routing of connections.
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BM60016FV-C Datasheet
Ordering Information
B M 6 0 0 1 6 F V - CE2
Marking Diagrams
SSOP-B10W(TOP VIEW)
1PIN MARK
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BM60016FV-C Datasheet
Revision History
Date Revision Changes
30.May.2015 001 New Release
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment ,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHMs Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASSb
CLASS CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHMs Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
Notice-PAA-E Rev.003
2015 ROHM Co., Ltd. All rights reserved.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Notice-PAA-E Rev.003
2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHMs Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHMs Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an as is basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice WE Rev.001
2015 ROHM Co., Ltd. All rights reserved.
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