1.

Introduction:
In electronic packaging materials with different coefficient of thermal expansion and
mechanical properties are bonded together to form a laminated structures used in power
electronics, circuit boards and semiconductor devices. Due to coefficient of thermal expansion
mismatch thermal stresses occur during manufacturing, machining and field use resulting in
delamination failure. Therefore an accurate study of the thermal stresses in the interfaces is
required for the design of these devices.

There are considerable amount of research papers available for the prediction of interfacial
stresses in adhesively bonded material subjected to thermal loading but the numerical analysis
procedures are long and consumes more time. Hence, there is a need of quick, simple, accurate
and powerful analytical method to determine interfacial stresses in layered structures

2. Problem Statement:
Development of a closed form solution for a multi-layered composite stack subjected to thermal
loads which can estimate:

Warpage
Interlaminar shear strength
Peel stress

3. Problem Brief Description:

An accurate estimate of thermal stresses in multi-layered microelectronics structures along the
bonded interfaces is crucial for design and prediction of delamination-related failures.
Compared with a numerical method, analytical closed-form solution can offer a more rapid
method to obtain the stresses at the interfaces. For example:

A three-layered beam problem with special orthotropic material properties.

Figure 1: 3D View of Three layered Beam

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 Figure 2: Side View of Three layered Beam

Subjected to a uniform temperature difference of T= 100 .

Figure 3: T applied on a Three layered Beam

The results of analytical model compared with the finite element analysis results, as a
first order approximation.

4. Literature Review:
Analysis of Bi-Metal Thermostats by S. Timoshenko: One of the first investigations dealing
with thermally induced strains in two layered beams was conducted by Timoshenko.
Timoshenko considered a rigid bond between the beam elements.
Elementary beam theory was used to obtain bending and axial stress distributions for
beam sections with free ends.
Interlaminar Thermoelastic Stresses in Layered Beams by P. B. Grimado: lnterlaminar
stresses are evaluated in layered beam composites subjected to differential expansions and
contractions of the individual beam elements.

It is shown that the maximum interlaminar stresses occur at the free ends of the beam
and increase as the effective bond-layer stiffness increases, whereas the stress
distribution is confined to a narrower region.
It is also demonstrated that the stress responsible for delamination failures can be made
to vanish by an appropriate choice of material and beam-section properties.

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Thermal Stress in Bonded Joints by W. T. Chen and C. W. Nelson: This paper considers
the stress distributions in bonded materials induced by differential expansion or contraction of
the materials.

Several simple and typical analytical models are presented to bring out the relative
importance of different geometrical and material parameters and to give some insight
into different modes in which the bonds might fail.

Stresses in Bi-Metal Thermostats by E. Suhir: The magnitude and the distribution of stresses
in bi-metal thermostats subjected to uniform heating or cooling are determined.

The suggested approach enables one to evaluate the normal stresses in the thermostat
plates, as well as the shearing and normal ("peeling") stresses in the interface.
Stresses in Adhesively Bonded Bi-Material Assemblies used in Electronic Packaging by
E. Suhir: The magnitude and the distribution of stresses in elongated adhesively bonded bi-
material assemblies subjected to uniform heating or cooling are determined and discussed.
The suggested approach enables one to evaluate the stresses in the assembly
components themselves, as well as the shearing and normal (peeling) stresses in the
interface, with consideration of the attachment compliance. The case of an epoxy
bonded assembly is used to illustrate the developed theory.
Stresses in Multi-layered Thin Films on a Thick Substrate by E. Suhir: The analysis
contains an engineering method for the prediction of thermally induced stresses in single- and
multi-layered heteroepitaxial structures on a thick substrate.
The examined stresses include:
1. Normal stresses acting in the film layers themselves and responsible for their
ultimate and fatigue strength, and
2. Interfacial stresses responsible for film blistering and peeling.
The obtained results can be utilized as a guidance for an optimal physical design of multi-
layered heteroepitaxial structures used in Microelectronics.
An Approximate Analysis of Stresses in Multi-layered Elastic Thin Films by E. Suhir:
The analysis contains an engineering method for the approximate evaluation of thermally
induced stresses in single and multi-layered heteroepitaxial structures fabricated on thick
substrates, with consideration of the finite size of the structure.

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 The examined stresses include normal stresses, acting in the film layers themselves and
responsible for their ultimate and fatigue strength, as well as interfacial stresses,
responsible for film blistering and peeling.
The obtained results can be utilized as a guidance for physical design of multi-layered
heteroepitaxial structures in microelectronics.
Interfacial Stresses in Bimetal Thermostats by E. Suhir: The magnitude and the distribution
of the interfacial stresses in thermostat-like structures are determined on the basis of an
elementary beam theory, with consideration of both the longitudinal and the transverse
("through-thickness") interfacial compliances of the thermostat strips. The suggested approach
is applicable, to any elongated lap shear assembly, subjected to thermal or external loading.
Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging by Basaran C. and
Zhao Y.: In this paper, it is shown that a damage mechanics based nonlinear analysis not just
leads to a more realistic analysis but also provides more accurate stress distribution.

In this paper these two approaches are compared. Moreover, mesh sensitivity of the
finite element analysis in stack problems is studied.
It is shown that the closed form and elastic finite element analyses can only be used for
preliminary studies and elastic finite element method is highly mesh sensitive for this
problem.

5. Gantt Chart:

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Literature Survey

Problem Identification

Problem Statement

Title Selection

Project Methodology

FEA Model