SHREENIVASA ENGINEERING COLLEGE

(Approved by AICTE and Affiliated to Anna University)

B.Pallipatti, Bommidi, Papppireddipatti(Tk),Dharmapuri Dt, Tamilnadu-635 301

DEPARTMENT OF ELECTRICAL AND ELECTRONICS ENGINEERING

SUBJECT CODE / NAME: EE6303 / LINEAR INTEGRATED CIRCUITS AND APPLICATIONS

INTERNAL ASSESSMENT -I

BRANCH : EEE YEAR / SEM : II/ III

PART-A (2 MARKS)
1. List the advantages of integrated circuits over discrete component circuits. (DEC-14)
2. Give classification of integrated circuits. (DEC-14)
3. Differentiate thick and thin film technology. (DEC-7)
4. What is meant by monolithic process? (DEC-6)
5. List basic planar processes involved in IC fabrication. (DEC-11)
6. What is meant by crystal growth?
7. What is epitaxial growth? (DEC- 6,8)
8. List types of epitaxy and explain.
9. List advantages of MBE over CVD process.
10. What is photolithography? (DEC-10)
11. What material used to etch sio2? (MAY-06)
12. Define an integrated circuit.
13. What is the significance of using buried layer?
14. What is the purpose of masking?
15. Why inductors are difficult to fabricate in ICs?
16. What is meant by parasitic capacitance in an IC?
17. Name different methods used in fabrication of integrated resistors.
18. Draw the fabrication of capacitors and resistors.
19. Draw the fabrication of diodes and transistors.
20. Explain importance of sio2 layer.
21. Define metallization.
22. Name different types of IC packages.
23. What is meant by dielectric isolation? (DEC-3,8,9)
24. What is meant by diffusion?
25. What is ion implantation? Give its advantages. (DEC-12)
 PART-B (8 MARKS)

1. Explain in detail about Epitaxial growth. (DEC-11)

2. Explain in detail about oxidation and etching process.
3. Write a note on metallization process
4. With necessary diagrams explain the fabrication of MOSFET. (MAY-12)
5. Explain in detail about diffusion and ion implantation process in IC fabrication. (DEC-09)

PART-B (16 MARKS)

1. Explain the basic processes used in the fabrication of monolithic IC. (MAY-11)
2. Explain the process of masking, diffusion and photolithography in detail. (DEC-10)
3. Explain in detail the fabrication process of passive component in integrated circuit.
4. With necessary diagrams explain the fabrication of n-channel JFET and
photolithography. (DEC-12)
5. With the help of neat diagram explain the steps involved in the fabrication of the circuit
shown in figure using IC technology. (DEC-10)

SUB IN-CHARGE HOD/EEE VICE-PRINCIPAL DEAN

(M.PRIYA AP/EEE)