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K. Devendra and T.

Rangaswamy / Mechanica Confab ISSN: 2320-2491

THERMAL CONDUCTIVITY AND THERMAL EXPANSION


COEFFICIENT OF GFRP COMPOSITE LAMINATES WITH
FILLERS

K. Devendra$ and T. Rangaswamy&


$
Asst. Professor, Dept. of Mech. Engineering, SKSVMACET, Laxmeshwar, KA, India.
&
Professor, Department of Mechanical Engineering, GEC, Hassan, KA, India
$
Corresponding Author:devenk93@gmail.com

Abstract
This research paper compares the thermal conductivity and thermal expansion coefficients of
glass fiber reinforced epoxy composite laminates (GFRP laminates) made using the Hand
layup technique. The composite laminates were fabricated by filling with varying
concentrations of fly ash, stone powder, aluminium oxide (Al2O3), magnesium hydroxide (Mg
(OH)2), Silicon carbide particles(SiC) and hematite powder. The test results show that fly ash
filled GFRP laminate exhibited low thermal conductivity. GFRP laminates filled with SiC
exhibited maximum thermal conductivity and minimum thermal expansion coefficient.
Keywords: GFRP Laminates, Fillers, Coefficients, Properties

1. Introduction
Polymer matrix composites (PMC) are used in military, automotive, and civil
infrastructure applications because of their overall good thermal, mechanical, electrical
properties, low weight, and low cost compared to conventional materials. The favorable
specific properties of fiber reinforced polymer composites are based on the low density of the
matrix resins used, and the high strength of the embedded fibers. Fibers reinforced polymer
composite (FRP) relatively low cost and ease of fabrication. These composites are considered
as replacements for metal materials. In recent years there have been an increasing number of
applications such as communication, satellites, high density electronics, and advanced aircraft
requiring more effective and light weight thermal management materials [1]. The temperature
fields in composites materials cannot be determined unless the thermal conductivity of the
media is known and for any material a low thermal expansion is ideally required [2, 3]. In
this context the study of thermal properties of composites are desirable. Now-a-days specific
fillers/additives are added to enhance and modify the quality of composites as these are found
to play a major role in determining the mechanical and thermal behavior of the composites.
These fillers will changes the some properties and reduce the processing cost significantly
low. In the present investigation an attempt has been made to utilization of fly ash, stone
powder, aluminium oxide (Al2O3), magnesium hydroxide (Mg (OH)2), Silicon carbide

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K. Devendra and T. Rangaswamy / Mechanica Confab ISSN: 2320-2491

particles (SiC) and hematite powder as filler materials and effect of these filler materials on
thermal properties of E-Glass fiber reinforced epoxy composite laminates was determined

2. Experimentation
2.1. Materials
The matrix material used for the fabrication of GFRP laminates was low temperature
curing epoxy resin (ARALDITE (L-12)) and corresponding hardener (K-6). E-glass fiber (7-
mill) was taken for incorporation as reinforcement in the laminates. Fly ash, stone powder,
aluminium oxide (Al2O3), magnesium hydroxide (Mg (OH)2), Silicon carbide particles (SiC)
and hematite powder were used as filler materials.
2.2. Fabrication of GFRP Composite Laminates
Hand lay-up techniques has been adopted for preparing the E-glass /Epoxy based
composite laminates filled with varying concentrations (0, 10 and 15 Vol. %) of Fly ash,
stone powder, aluminium oxide (Al2O3), magnesium hydroxide (Mg (OH)2), Silicon carbide
particles (SiC) and hematite powder. The volume fraction of fiber, epoxy and filler materials
were determined by considering the density, specific gravity and mass. Fabrication of the
GFRP laminates was done at room temperature and the laminates were cured at room
temperature.
2.3. Specimen Preparation
The prepared GFRP laminates were taken from the mold and specimens were
prepared for thermal conductivity and thermal expansion coefficient tests according to ASTM
standards. The specimens were cut from the GFRP laminates using diamond tipped cutter.
Three identical test specimens were prepared for tests.
2.4.Thermal Conductivity
Thermal conductivity measurements are carried out under steady state condition.
According to ASTM E1530 disc shaped specimens with diameter of 50mm and thickness of
10mm are used in the instrument for thermal conductivity measurements. A known constant
heat is applied from one side of the specimen. When the thermal equilibrium is attained and
the system approaches to steady state situation, the temperature of top and bottom surfaces
were measured by using thermocouples installed on top and bottom surfaces of the specimen.
Knowing the values of heat supplied, temperatures and thickness the thermal conductivity
was determined by employing one-dimensional Fouriers law of conduction. All
measurements are carried out approximately in the similar temperature range, i.e., 25-90 oC
2.5.Thermal Expansion Coefficient Measurement
Thermal expansion coefficient test specimens had length and thickness 90mm and
10mm respectively. The linear thermal expansion test was performed over the temperature
range of 30oC to 90oC using electric furnace. The samples were slowly heated from 30 to 90
0
C in the electric furnace and kept at 900C for 10 min. Thermal Expansion Coefficient is then
given by the relationship

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K. Devendra and T. Rangaswamy / Mechanica Confab ISSN: 2320-2491


= ----------- (1)

Where
=Thermal Expansion coefficient (/oC)
L= Original length of the sample (mm)
L= Change in length of the sample (mm)
T= Temperature change (oC)

Table 1. List of Fabricated GFRP Laminates with Constant 50% E-Glass Fiber Volume
GFRP Filler Materials
Epoxy (%Volume)
Laminates (% Volume)
GE 50 Nil
GEF1 40 10% Fly Ash
GEF2 35 15% Fly ash
GES1 40 10% Stone Powder
GES2 35 15% Stone Powder
GEA1 40 10% Al2O3
GEA2 35 15% Al2O3
GEM1 40 10% Mg(OH)2
GEM2 35 15% Mg(OH)2
GESI1 40 10% SiC
GESI2 35 15% SiC
GEH1 40 10% Hematite
GEH2 35 15% Hematite

3. Results and Discussion


Thermal properties tests were conducted according to ASTM standards. Thermal
properties such as, thermal conductivity and thermal expansion coefficient of GFRP
laminates were determined.
3.1. Thermal Conductivity
Thermal conductivity is the property describing a materials ability to transfer heat. It
is well known that thermal conductivity of the GFRP composite laminates is dependent on
such factors as epoxy-filler interaction and filler characteristics, namely type and shape of
filler.

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K. Devendra and T. Rangaswamy / Mechanica Confab ISSN: 2320-2491

Figure 1. Thermal Conductivity

From the test results, it was observed that the thermal conductivity of GFRP laminates
decreases with increase the addition of fly ash content. GFRP laminate filled with 15%
volume fly ash exhibited the minimum thermal conductivity of 1.23 W/m oC this is due to the
fly ash contains some percentage of silica and phosphate and these two acts as thermal
resistance to heat flow. GFRP laminate filled with 10% volume SiC exhibited maximum
thermal conductivity of 3.515 W/ m oC. From the literature review we can observed that SiC
particles having good thermal conductivity property because better interconnectivity between
the SiC particles due to this reason SiC filled composite laminate exhibiting high thermal
conductivity. Hematite filled GFRP laminates exhibited high thermal conductivities because
the hematite powder contains the iron particles and this particle having capability to conduct
more heat.
3.2. Thermal Expansion Coefficient
The thermal expansion coefficient of GFRP composite laminates is linked to its
crystalline structure [3]. From the results it was observed that increase the adding of fillers to
GFRP laminates leads to decreases in thermal expansion coefficient. GFRP laminates filled
with 15% volume fly ash, Al2O3, Mg (OH)2 and SiC exhibited less thermal expansion
coefficients this may be by adding the more fillers in materials providing good filler matrix
interaction in the system, fine dispersion of particles in the materials and the filler binds the
matrix and obstruct the expansion of polymer chains at high temperature [5]. The many
studies have shown that composites with higher filler content exhibited lower thermal
expansion coefficient. GFRP laminate filled with 15% volume SiC exhibited minimum
thermal expansion coefficient of 3.7010-6 /oC when compared with other filled GFRP
laminates this is due to the SiC particles having high rigidity, good dimensional stability and
fine dispersion of SiC particles in the GFRP laminate [5]. From the test results it was
indicated that when increasing the addition of more stone powder to the GFRP laminates
increases the thermal expansion coefficients because the addition of stone powder decreases
the connectivity between particles and adhesion between filler and matrix [3, 5].

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K. Devendra and T. Rangaswamy / Mechanica Confab ISSN: 2320-2491

Figure 2. Thermal Expansion Coefficients

Table 2. Comparison of Thermal Properties of GFRP Laminates


Thermal
GFRP Thermal Conductivity Expansion
Laminates (W/m oC) Coefficient (/ oC)
GE 2.89 1.9610-5
GEF1 1.69 1.8510-5
GEF2 1.23 1.4810-5
GES1 2.34 1.8510-5
GES2 1.58 2.5910-5
GEA1 1.32 2.4010-5
GEA2 1.72 1.6610-5
GEM1 1.56 2.4410-5
GEM2 2.38 1.1110-5
GESI1 3.51 7.4010-6
GESI2 2.76 3.7010-6
GEH1 2.45 1.8510-5
GEH2 3.06 1.8510-5

4. Conclusions
In the present work, E-Glass/Epoxy based composite laminates filled with varying
concentrations of six various fillers were prepared and the effect of these fillers on thermal
conductivity and thermal expansion coefficient were investigated. Experimental study reveals
the following conclusions.
1. Experimental results show that GFRP laminate filled with 15% volume fly ash
exhibited minimum thermal conductivity of 1.23 W/m oC.
2. GFRP laminate filled by 10% volume SiC exhibited maximum thermal conductivity of
3.51 W/m oC.

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K. Devendra and T. Rangaswamy / Mechanica Confab ISSN: 2320-2491

3. Increase the adding of filler materials to GFRP laminates reduces the thermal
expansion coefficient.
4. GFRP laminates filled with SiC exhibited low thermal expansion coefficients when
compared with other filled GFRP laminates.

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