TK20A60U

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (DTMOS II)

TK20A60U
Switching Regulator Applications
Unit: mm

Low drain-source ON-resistance: RDS (ON) = 0.165 (typ.)

High forward transfer admittance: Yfs = 12 S (typ.)
Low leakage current: IDSS = 100 A (max) (VDS = 600 V)
Enhancement-mode: Vth = 3.0 to 5.0 V (VDS = 10 V, ID = 1 mA)

Absolute Maximum Ratings (Ta = 25C)

Characteristics Symbol Rating Unit

Drain-source voltage VDSS 600 V

Gate-source voltage VGSS 30 V
DC (Note 1) ID 20
Drain current A
Pulse (Note 1) IDP 40
Drain power dissipation (Tc = 25C) PD 45 W 1: Gate
2: Drain
Single pulse avalanche energy 3: Source
EAS 144 mJ
(Note 2)
JEDEC
Avalanche current IAR 20 A
Repetitive avalanche energy (Note 3) EAR 4.5 mJ JEITA SC-67

Channel temperature Tch 150 C TOSHIBA 2-10U1B

Storage temperature range Tstg -55 to 150 C Weight : 1.7 g (typ.)

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).

Internal Connection
Thermal Characteristics

Characteristics Symbol Max Unit

2
Thermal resistance, channel to case Rth (ch-c) 2.78 C/W
Thermal resistance, channel to ambient Rth (ch-a) 62.5 C/W

Note 1: Ensure that the channel temperature does not exceed 150C. 1

Note 2: VDD = 90 V, Tch = 25C (initial), L = 0.63 mH, RG = 25 , IAR = 20 A

Note 3: Repetitive rating: pulse width limited by maximum channel temperature

This transistor is an electrostatic-sensitive device. Handle with care. 3

Start of commercial production

2008-05
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Electrical Characteristics (Ta = 25C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Gate leakage current IGSS VGS = 30 V, VDS = 0 V 1 A

Drain cut-off current IDSS VDS = 600 V, VGS = 0 V 100 A
Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 600 V
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 3.0 5.0 V
Drain-source ON-resistance RDS (ON) VGS = 10 V, ID = 10 A 0.165 0.19
Forward transfer admittance |Yfs| VDS = 10 V, ID = 10 A 3 12 S
Input capacitance Ciss 1470
Reverse transfer capacitance Crss VDS = 10 V, VGS = 0 V, f = 1 MHz 150 pF

Output capacitance Coss 3500

Rise time tr 10 V ID = 10 A VOUT 40

VGS
0V
Turn-on time ton 80
Switching time 50 RL =30 ns
Fall time tf 12
VDD 300 V
Turn-off time toff Duty 1%, tw = 10 s 100

Total gate charge Qg 27

Gate-source charge Qgs VDD 400 V, VGS = 10 V, ID = 20 A 16 nC

Gate-drain charge Qgd 11

Source-Drain Ratings and Characteristics (Ta = 25C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Continuous drain reverse current

IDR 20 A
(Note 1)
Pulse drain reverse current (Note 1) IDRP 40 A
Forward voltage (diode) VDSF IDR = 20 A, VGS = 0 V 1.7 V
Reverse recovery time trr IDR = 20 A, VGS = 0 V, 450 ns
Reverse recovery charge Qrr dIDR/dt = 100 A/s 8.1 C

Marking

Note 4 : A line under a Lot No. identifies the indication of product Labels
[[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]

Please contact your TOSHIBA sales representative for details as to

Part No. environmental matters such as the RoHS compatibility of Product.
(or abbreviation code) The RoHS is Directive 2011/65/EU of the European Parliament and
K20A60U
Lot No. of the Council of 8 June 2011 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment.
Note 4

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ID VDS ID VDS
20 40
Common source 8 Common source
8, 10 7.5 10
Tc = 25C Tc = 25C
7
Pulse test Pulse test
16 32
(A)

(A)
7.5
ID

ID
12 24
6.5 7
Drain current

Drain current
8 16
6
6.5

6
4 8
VGS = 5.5 V
VGS = 5.5 V
0 0
0 1 2 3 4 5 0 10 20 30 40 50

Drainsource voltage VDS (V) Drainsource voltage VDS (V)

ID VGS VDS VGS

40 10
Common source Common source
VDS = 20 V Tc = 25C
VDS (V)

Pulse test Pulse test

32 8
(A)
ID

24 6
Drainsource voltage
Drain current

16 100 4
ID = 20A

25 Tc = 55C
8 2 10
5

0 0
0 2 4 6 8 10 0 4 8 12 16 20

Gatesource voltage VGS (V) Gatesource voltage VGS (V)

Yfs ID RDS (ON) ID

100 1
Common source Common source
VDS = 10 V Tc = 25C
Pulse test
Drainsource ON-resistance
Forward transfer admittance

Pulse test
Tc = 55C

10
RDS (ON) ()

VGS = 10, 15 V
100
Yfs (S)

25
0.1

0.1 0.01
0.1 1 10 100 0.1 1 10 100

Drain current ID (A) Drain current ID (A)

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RDS (ON) Tc IDR VDS

0.5 100
Common source Common source
VGS = 10 V Tc = 25C

(A)
Pulse test Pulse test
Drainsource ON-resistance

0.4

IDR
ID = 20 A
10
RDS (ON) ()

Drain reverse current

0.3 10 10
5
5

0.2
1
3

0.1
1
VGS = 0 V

0 0.1
80 40 0 40 80 120 160 0 -0.4 -0.8 -1.2 -1.6

Case temperature Tc (C) Drainsource voltage VDS (V)

C VDS Vth Tc
100000 5
Vth (V)

10000 4
(pF)

Ciss Ciss
Gate threshold voltage

1000 3
C
Capacitance

Coss Coss

100 2

Common source
10 Common source 1 VDS = 10 V
Crss Crss
VGS = 0 V ID = 1 mA
f = 1 MHz Pulse test
Tc = 25C
1 0
0.1 1 10 100 80 40 0 40 80 120 160

Drainsource voltage VDS (V) Case temperature Tc (C)

Dynamic input/output
PD Tc characteristics
50 500 20
Common source
ID = 20 A
(W)

VDS (V)

Tc = 25C
(V)

VDS Pulse test

40 400 16
PD

VGS

200 V
Drain power dissipation

30 300 12
Drainsource voltage

Gatesource voltage

VDD = 100 V
400 V

20 200 8

VGS

10 100 4

0 0 0
0 40 80 120 160 0 10 20 30 40

Case temperature Tc (C) Total gate charge Qg (nC)

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rth tw
10

Normalized transient thermal impedance

1
Duty = 0.5
rth (t)/Rth (ch-c)

0.2
0.1
0.1
0.05
0.02 PDM

0.01 t
0.01
Single pulse
T

Duty = t/T
Rth (ch-c) = 2.78C/W
0.001
10 100 1m 10 m 100 m 1 10

Pulse width tw (s)

Safe operating area EAS Tch

100 200
ID max (Pulse) *
100 s *
ID max (Continuous)
EAS (mJ)

160
10 1 ms *
(A)

120
ID

1 DC operation
Avalanche energy

Tc = 25C
Drain current

80
0.1

* Single nonrepetitive 40
pulse Tc = 25C
0.01
Curves must be derated
linearly with increase in 0
temperature. 25 50 75 100 125 150
VDSS max
0.001
0.1 1 10 100 1000 Channel temperature (initial) Tch (C)

Drainsource voltage VDS (V)

BVDSS
15 V

15 V IAR

VDD VDS

TEST CIRCUIT WAVEFORM

RG = 25 1 B VDSS
AS = L I2
VDD = 90 V, L = 0.63 mH 2 B
VDSS VDD

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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
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except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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