Moxa Embedded Solution on

IEC 61850

Moxa Systems
August, 2009
Theme

IEC 61850 with Smart Grid

Substation Automation Empowered
By IEC 61850
Moxa Solution
Summary

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Future of Power: Smart Grid

Everything is now based on electricity

Computers, Networks, Telecom, Medical,
Electric grid produces at least 40% of CO2
emissions
Aging electric grid contributes a 20% power
loss while delivering to end user

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 Smart Grid Infrastructure
Substation Automation
Advanced Metering Infrastructure

Power
Generation Customers

Electricity Dispatching Transmission Distribution

Control Center

Distributed Energy Integrated

Source: EPRI Intelligrid

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 Substation Automation in Smart Grid
Electricity consumption, switchboard
operation, information gathering, station
decision making feedback

Electricity Dispatching Substation

Control Center
Grid intelligence strategic decision,
T&D automated management

Source: EPRI Intelligrid

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Current Power Automation Protocols

DNP 3.0

IEC 60870-5

DNP 3.0
ModBus
ModBus

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Protocol Trend for Power Automation
Newton Evans: 2005-2007

IEC 61850 is the

trend

Migrating to
Ethernet-based

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Future Power Automation Protocols

DNP 3.0
LAN
IEC
IEC60870-5
61850

DNP 3.0
ModBus
ModBus/TCP LAN
ModBus
ModBus/TCP

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Substation Automation Empowered
By IEC 61850

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 Benefits of IEC 61850 Power
Substation
Protocol Integration

Easy
Time to Market
Maintenance IEC 61850

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Moxa Offering

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Moxa Embedded Solution

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Lead with IEC61850-3 Certified
Embedded Computer DA-681

PASS!
DA-681-I-DPP-T
IEC 61850-3 Test

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Using DA-681 in IEC61850-3 Substation
Requirements
IEC61850-3 certified hardware
Multiple LANs to connect IED device and communicate
dispatch control center
Requires 100-240 AC/DC power input
19-inch rackmount, fanless design
Benefits
The DA-681 has 6 LANs for network redundancy and
centralized communication
Excellent patented heat dissipation design for use in
-40 ~ 75C environments
Serial port with isolation protection for integrating legacy RTU
into IEC 61850 substation
Dual power design to connect simultaneously to 100 VDC and
240 VAC power sources

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Features Briefing
Intel x86 1GHz CPU with 910GMLE chipset
Built-in DDR2 SDRAM and industrial-grade
DOM
19-inch rackmount installation, 1U high
6 Ethernet ports for network redundancy
2 USB 2.0 Host, supporting system boot up
4 Serial 232 & 8 RS-485 ports (wide baud rate)
CF/SATA interfaces for storage expansion
100 to 240V AC/DC power input
Dual power for redundant application (DP/DPP
model only)
Fanless and low power consumption design

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Challenges to Certify IEC 61850-3

Function Test

EMC Test

Wide Temperature Test

Anti-Vibration Test

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Unique Design to Conquer EMC Test

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Wide Temperature Know-How

Thermal Placement
Optimization of
Components Natural-Convection
Chamber to Test
Wide Temperature
Components Database
Optimal Heat Transfer
Methods

Self Warming System

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Special Heat Dissipation Design

L-Type for Heat Dissipation

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 System Throttling Design

High Temperature Solution: Dynamic Throttling Technique

Sa
User fe
Configurable
inside BIOS

time

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120 hours Uninterrupted Testing

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 Production Quality Management
(Dynamic Burn-in)

High temp. (55~75dc) Room temp. (30~40dc) Wide temp. (-40~85 dc)

Pilot Run 24~48hrs Mass Production 4~24hrs W/T Product screen 24 hrs

Over 80% function test items are covered during burn-in test program.
Monitoring programs control the entire burn-in status,
and show the data for analysis.

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Anti-Vibration Tolerance Test
50 G Anti-Shock
5-500 MHz Anti-Vibration

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Summary

IEC 61850 is the trend in modern power substation

to integrate different standards in
Relay, Control, and Metering equipments

DA-681 is the best solution to fit in

Communication Processor and Back-end Host

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Thanks!

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