1. General Description using metallized through silicon vias (TSV)
Today micro and nano systems could be performed. (MEMS/NEMS) are integrated in almost every high tech or smart product. Miniaturized acceleration sensors help to prevent injuries during accidents or even prevent accidents by car. Other MEMS devices help to monitor medical parameters, allow low cost telecommunication, print crystal sharp colour images and so on. While the devices themselves have matured significantly over the last decade to become commonplace products, packaging of these tiny sensitive components and systems has not been addressed thoroughly. Hence the packaging plays a significant role for the manufacturing Fig. 2: Mechanical & electrical bonded chip costs at least. We develop solutions for exactly these packaging problems starting with zero For packaging levels one and two several level packaging on wafer level up to module or technologies and certain equipment is board level packaging. Different concepts are available within our labs. Surface modification being worked on that imply the covering of the and dicing of different substrate materials as micro mechanical structure by using different well as chip and wire bonding are main topics bonding methods first and the interconnection of our work. Either as single technology step or and wiring of electrical signals as well. One as complex process flow every packaging work main goal of our work is the development of and characterization could be offered as packaging methods for any micro machined service. structures with low temperature approaches, which provides a hermetic protection of these 3. Equipment structures against environmental conditions. Cleanroom labs, class 10 up to 10.000 Mirra and IPEC 472 for CMP (150 mm and 200 mm) Deposition by PVD, CVD, ECD Screen Printer R29 Spectrum Suss Spin Coater RC 8 Suss Spray Coater Gamma Suss Cleaner CL 200 Suss Bondaligner BA 6/8 Suss Substrate Bonders SB 6/8e (100 mm up to 200 mm) Centrotherm High Temperature Horizontal Furnaces Disco DAD-2H6TM and DFD6340 Fig. 1: Multi chip integration to a flexible substrate FEK Delvotec 5450 Wire Bonder Tresky T-3002-M Die Bonder 2. Technologies used Micro Chevron Test, Blade Test Beside anodic or silicon direct bonding, also Tactile and Non-Tactile Profilometry eutectic bonding, glass frit bonding, adhesive Light, IR, SE, and AF Microscopes bonding and laser assisted bonding are applied to package sensor and actuator 3. Contact components as well as electronics at wafer Dr.-Ing. Maik Wiemer level. Together with our Back-End of Line Phone: +49 (0) 371/5397-1474 department also 3D integration technologies Fax: +49 (0) 371/5397-1310 E-Mail: maik.wiemer@enas.fraunhofer.de