Technigraph FLP-1260 Plate Processor Service Manual

FLP-1260 Plate Processor
(for the LUXEL P-9600CTP PLATESETTER)
Service Guide
Date of publication December 2000. Rev. G

Part No. 100 01 92
FLP-1260 Service Guide
General Information
Manufactured by: Technigraph Products Ltd
Howlett Way
Fison Industrial Estate
Thetford
Norfolk IP24 1HZ
England
Telephone No: +44 (01842) 755833/755834

Fax No: +44 (01842) 765617
Certificate No. FM14195
BSENISO 9002:1994 Copyright 2000 Technigraph Products Ltd
This manual is valid for the FLP-1260 Plate Processor
This manual covers the operation and day-to-day Changes, technical inaccuracies and typographical
maintenance for the FLP-1260 Plate Processor. errors will be corrected in subsequent revisions.
It has been written and illustrated using the best
possible information available at the time of As part of our policy for continuous product
publication. The manual should be regarded as development and improvement, Technigraph
part of the equipment and should be kept with Products Ltd reserves the right to make changes
it throughout its working life. in design and specification without notice.
Any differences between the manual and the

equipment reflect improvements introduced after
the publication of the manual. Any amendments
received should be recorded below and incorporated
in the relevant part of the manual.
Amendments issued since publication
Amd. No. Date Section/Sub-section/Page affected
1
Section Sub Section Page

0.0 General Information ......................................................................................................................................................................1
1.0 Safety and Environmental Protection Summary ........................................................................5
1.1 Safety Regulations.......................................................................................................................................................................5
1.2 Safety Summary.............................................................................................................................................................................5
1.3 Environmental Protection Summary ..........................................................................................................................6
1.4 Electromagnetic Compatibility ..........................................................................................................................................6
1.5 Warranty .................................................................................................................................................................................................6
2.0 Machine Characteristics........................................................................................................................................................7

2.1 Introduction ..........................................................................................................................................................................................7
2.2 Controls and Indicators ...........................................................................................................................................................8
3.0 Specifications........................................................................................................................................................................................11
4.0 Installation/Set-Up ........................................................................................................................................................................13
4.1 Unpacking .........................................................................................................................................................................................13
4.2 Set-Up Instructions...................................................................................................................................................................13
5.0 Installation Checkout ...............................................................................................................................................................17

6.0 Operators Guide ..............................................................................................................................................................................19
6.1 General ................................................................................................................................................................................................19
6.2 Shift Start Up ..................................................................................................................................................................................19
6.3 Operating Tips ..............................................................................................................................................................................19
6.4 Plate Processing.........................................................................................................................................................................20
6.5 Re-entry Operation...................................................................................................................................................................20
7.0 Adjustments .............................................................................................................................................................................................21

7.1 Transport Speed .........................................................................................................................................................................21
7.2 Developer Bath Temperature ........................................................................................................................................22
7.2.1 How to Adjust the Developer Temperature Control Set Value........................................................22
7.2.2 How to Calibrate the Developer Temperature Control with the Actual Developer
Bath Temperature .....................................................................................................................................................................25
7.2.3 How to Change the Developer Temperature Control/Display from C to F .................28
7.2.4 How to Change the Developer Temperature Control from PID to ON/OFF .............31
7.2.5 Developer Temperature Control/Display Settings ....................................................................................33
7.3 Pre-Heat Temperature..........................................................................................................................................................35
7.3.1 Checking the Pre-Heat Temperature.....................................................................................................................38
7.4 Pre-Heat Timing ..........................................................................................................................................................................40
7.5 Pre-Wash and Rinse Spray Pressure ...................................................................................................................41
7.6 Drive Roller Pressure ............................................................................................................................................................42
7.7 Scrub Roller Pressure ...........................................................................................................................................................44
7.8 Hold Down Roller Pressure .............................................................................................................................................45
7.9 Pre-Wash Scrub Roller Pressure ..............................................................................................................................46
7.10 Input Sensor Adjustment ....................................................................................................................................................47
7.11 Plate Jam Sensor Adjustment ......................................................................................................................................48
7.12 Process Timing ............................................................................................................................................................................49
7.13 Developer Replenishment Timing .............................................................................................................................50
7.14 Manual Replenishment Timing ....................................................................................................................................51
7.15 Hourly Developer Replenishment Timing..........................................................................................................52
7.16 Cycle Timing ...................................................................................................................................................................................53
7.17 Busy Signal (Interface) Timing .....................................................................................................................................54
7.18 Throughput (Plate Jam) Timing...................................................................................................................................55
2
8.0 Maintenance ...........................................................................................................................................................................................57

8.1 Operator Maintenance Daily/Weekly ................................................................................................................57
8.2 Operator Maintenance Chemistry Changes ..............................................................................................57
8.3 Changing the Scrub Roller Cover .............................................................................................................................58
8.4 Changing the Developer Filter Element ..............................................................................................................58
9.0 Fault Finding ..........................................................................................................................................................................................59

9.1 General ................................................................................................................................................................................................60
9.2 Electrical .............................................................................................................................................................................................63
10 Circuit Breaker and Fuse Schedule ..............................................................................................................65

10.1 Circuit Breaker Schedule ...................................................................................................................................................65
10.2 Fuse Schedule..............................................................................................................................................................................65
11 Illustrated Parts Breakdown...................................................................................................................................11-1
12 Recommended Spare Parts List ...................................................................................................................12-1

12.1 Recommended Dealer/Distributor Spares ..................................................................................................12-1
12.2 Recommended Customer/On-Site Spares .................................................................................................12-2
3 Phase + N Electrical Circuit Diagram Drg. No. 08 02 47

Electrical Interface and Control Circuit Drg. No. 08 02 48
1 Phase + N Electrical Circuit Diagram Drg. No. 08 02 69
3
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4
1.0 Safety and Environmental Protection Summary

All operators and customer maintenance personnel should familiarise themselves
with this manual before using or servicing the processor.
1.1 Safety Regulations

The models fulfil the following regulations:
BSEN 292 Parts 1 and 2 1991.
BSEN 60204-1:1998.
1.2 Safety Summary
Warning
Before handling or using any graphic arts material, be sure to read the Material Safety Data
Sheet for health hazard data, precautionary information, suggested first aid and recommended
waste disposal.
Caution
This processor is designed for use with FUJIFILM LP-D digital plate developer, LP-DR digital
plate replenisher, FN6 finishing gum and LP-NS photopolymer digital plates.
The use of any other chemistry or plates other than as stated above, may cause severe
damage to the processor and/or personal injury and void all warranties implied or expressed.
Always observe the following precautions:

Ensure electrical outlet is dedicated (no other equipment on the same circuit breaker).
Only the voltage indicated on the unit Serial No./Rating Plate (see also section 3.0,
Specifications) is to be connected to the unit.
It is recommended that the mains electrical isolation switch be lockable and located
in a visible position.
Do not operate processor with a damaged power cord until it has been examined
and repaired by an authorised service representative.
Ensure power cord is protected from contact with hot surfaces.
Always have electric box covers in place when processor is plugged in and the
mains isolator switch is ON.
Do not use an extension cord.
Turn OFF processor and ISOLATE main power supply before servicing processor.
Ensure all covers are in place when POWER switch is ON.
Do not defeat or bypass built-in equipment safety features.
Avoid placing hands or loose clothing near moving rollers.
Always wear eye protection, impervious gloves and other protective clothing as
needed to prevent contact when handling developer and finishing gum.
Any maintenance, servicing or adjustments must only be carried out by suitably
skilled or properly instructed/supervised personnel. When self-servicing this processor,
incorrect performance or incorrect re-assembly can cause personal injury.
Shut off water supply and reduce system pressure before disconnecting plumbing fixtures.
The airborne noise emissions from the FLP-1260 Processor when operated is as follows:
a. A weighted sound pressure level at work stations are between 70dB (A) to 85dB (A).
b. C weighted instantaneous sound pressure value at work stations DOES
NOT exceed 63Pa (130dB in relation to 20 Pa).
5
1.3 Environmental Protection Summary

Most chemicals used in plate processing are strong pollutants and must not be
discharged into the sewer system without proper treatment.
The developer overflows on the FLP-1260 plate processors have been designed to be
plumbed to a waste container.
NOTE: The gum system is a closed loop (re-circulating) system which returns all gum
to its own replenishment container, so does not pose any effluent or disposal problems.
Most countries have strict regulations on this subject, and disposal of containers
with waste chemicals must be made according to these regulations.
Contact your plate and chemical representative and/or local water authority for
more information regarding the disposal of waste chemicals.
1.4 Electromagnetic Compatibility

This model fulfils BSEN 50081-2:1994 and BSEN 50082-2:1995.
1.5 Warranty
For details on warranty and liability refer to your purchase contract.
6
2.0 Machine Characteristics

2.1 Introduction
The FLP-1260 Plate Processor automatically bakes, washes, develops, rinses, finishes
and dries FUJIFILM LP-NS photopolymer digital plates.
These are the functional elements of the Processor: (See Fig. 2.1).
1. Drive Rollers (and wheels).

Nine sets of rollers and wheels transport the plate through the processor.
2. Pre-Heat Station.
Heats and sets the image to the plate.
3. Wash Station.
Washes the plate to remove the oxygen barrier overcoat (PVA) by spray agitation
and rotary scrub roller.
4. Developer Station.
Develops away the unexposed coating by immersion, spray agitation and two rotary
scrub rollers. Three sets of hold down rollers ensure that every plate receives even
and constant scrub pressure.
5. Rinse Station.
Rinses both sides and prepares the plate for finishing.
6. Finishing Station.
Applies a thin, even coating of finisher to both sides of the plate.
7. Drying Station.
Removes excess moisture from the plate.
1 2 3 4 5 6 7
Fig. 2.1
7
2.2 Controls and Indicators (See Fig. 2.2)

1. Power On Switch (Green).
When activated, turns On the power and energizes the Infra-Red heaters and the
developer heater when the developer tank is full.
NOTE: The Power On Switch will also energize the drive rollers and the finisher pump
when the Auto/Manual Switch on the electrical chassis is set to the Manual position.
2. Power Off Switch (Red).

Turns the power off.
3. Re-Entry Switch (White).

Turns on the drive rollers, rinse, finish and drying sections for Re-Entry operation.
4. Forward and Reverse Switch (Amber).

Controls the direction of the drive rollers.
NOTE: The switch is illuminated when in the reverse mode.
5. Developer Fill Switch (White).

Activates the developer fill pump.
NOTE: The switch is a non-latching type and therefore must be held in to operate.
6. Manual Replen Switch.

Activates the developer replenishment pump (for the time set on the
Manual Replen Timer T9).
7. Power Lamp (Green).

This indicator lights when the Power On Switch is activated.
8. Drive Lamp (Green).

This indicator lights when the drive motor and rollers are moving.
9. Replenishment Lamp (Green).

This indicator lights when the developer replenishment pump is on
i.e. have been activated by the input sensor for per plate replenishment.
10. Process Lamp (Green).

This indicator lights when a plate enters the processor.
11. Plate Counter.

Keeps count of the number of plates processed. Can be reset to zero.
12. Pre-Heat Controllers.

Controls and displays the temperature of the Pre-Heat Section.
13. Developer Temperature Control/Display.

PV (Green) Displays the measured value
SV (Orange) Displays the set value.
14. Ready Lamp (Green).

When illuminated the processor is ready to process a plate.
15. Busy Lamp (Amber).

Illuminates when a plate is being processed.
8
16. Fault Lamp (Red).

Illuminates when fault condition exists.
NOTE: The Ready, Busy and Fault lamps are visual indications of the electrical/
electronic signals sent to the platesetter via the electrical interface.
17. Emergency Stop Buttons (x 4).

Stops all moving parts when pressed.
NOTE: Pull red knob upwards to reset.
18. Input Sensor.

When activated by a plate, the sensor energizes the drive rollers, developer pump,
finisher pump, scrub rollers, water spray bars, dev and finisher replenishment pumps
and the dryers.
NOTE: The sensor will only energize all of the above when the Auto/Manual Switch
on the electrical chassis is set to the Auto position.
19. Exit Sensor.

When activated by a plate, the sensor resets the Throughput (Plate Jam) Timer (T7).
20. Service Switch (Key Switch) Located in the Electrical Cabinet.

This switch is used for maintenance by trained personnel only. This allows processor
operation with the top covers (interlocks open) removed.
NOTE: After use, the key must be returned to the normal operating (horizontal)
position to allow the main electrical box cover to be refitted. Alternatively, the key
should be removed from the switch and retained by an authorized member of staff.
13 8 10 9 7 2 6 4
PV
ALM1
PV PV
ALM2
SV
OUT
SV MV SV MV
AT
COMP COMP
AT AT
D
AREA AREA SET
E
REM MAN EXT REM MAN EXT
V
ALM1 ALM2 FAIL ALM1 ALM2 FAIL RKC REX-C100
OUT1 OUT1
OUT2 OUT2
MODE MONI AREA MODE MONI AREA
SET SET 000002
RKC REX-F400 RKC REX-F400
12 12 11
14 15 16 1 5 3
17 E
RG
ENC
Y
EM
OP
TS
19
20
18
Fig. 2.2
9
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10
3.0 Specifications
1960 1650
1175
998 965
Weight (Uncrated): Finishing Gum

700 kg (1568 lbs) Type: FUJIFILM FN6 (mixed 1:1 with water)
or as recommended by FUJIFILM
Plate Sizes representative.
Max. plate width: 1250mm (49 in.) Capacity: 5 litres (1.3 US gallons)
Min. plate length: 393mm (15.5 in.) Overflow: To replenisher bottle.
Plate thickness: 0.15mm (0.006 in.) Replenishment: Continuous when processing.
0.20mm (0.008 in.)
0.24mm (0.010 in.) Pre-wash
0.30mm (0.012 in.) Capacity: 40 litres (10.5 US gallons)
Overflow: Closed Loop
Plate Types
FUJIFILM LP-NS Photopolymer digital plates. Rinse
Capacity: 35 litres (9.25 US gallons)
Plate Processing Speed Overflow: Closed Loop
1.00m (39.37 in.)/min. @ 17 second dev. dwell.
Pre-Heat
Scrub Roller Speed, Fixed Temperature setting: 100C (212F) adjustable.
Pre-wash 136rpm @ 50Hz & 163rpm @ 60Hz Plate temperature tolerance: 6C ( 11F)
1st dev. 136rpm @ 50Hz & 163rpm @ 60Hz B.T.U. output: 13648.56 B.T.U./hour
2nd dev. 93rpm @ 50Hz & 112rpm @ 60Hz
Electrical Requirements
Developer 380/415 VAC 3 Phase + Neutral + PE
Type: FUJIFILM LP-D (mixed 1:9 with water) 50/60 Hz 16A/Phase
or:
representative.
Capacity: 45 litres (11.89 US gallons) 200-240 VAC 1 Phase + Neutral + PE
50/60 Hz 40A
Overflow: To waste bottle.
Temperature: 28C 2C (82F 2F) adjustable
Temperature maintained within tolerance when used in
conjunction with chiller unit.
Developer Replenisher
Type: FUJIFILM LP-DR (mixed 1:4 with water)
representative.
Replenishment Rates:
Per plate 100ml/sq. mtr of plate
adjustable 0-60 seconds (0-200ml).
Per hour
adjustable 0-3 minutes (0-200ml)
representative.
11
4.a
4.b
Fig. 4.1
12
4.0 Installation/Set-Up
4.1 Unpacking
1. Remove the packing material from the processor.
2. Ensure the following items are included with the processor.
Description Qty
100 02 08 Operators Guide ..............................................1

06 00 63 Filter Element (1 inside filter)............................3
06 00 66 Filter O Ring....................................................3
05 02 01 10 mm Nut Runner ..........................................1
05 07 55 Parallel Sided Screwdriver ..............................1
05 05 05 2.5 mm Allen Wrench ......................................1
05 03 13 3 mm Allen Wrench ..........................................1
05 05 09 1
8" Allen Wrench................................................1
05 05 29 4 mm Allen Wrench ..........................................1
or 05 05 10 5
32" Allen Wrench ..............................................1
04 01 34 4 Amp Fuse, 20 mm x 5 mm............................2
06 00 93 25 Litre Container ............................................2
05 00 36 6" Funnel ..........................................................1
05 05 46 Torque disc ......................................................2
05 00 99 Lifter Hooks ......................................................2
05 08 48 Actuation Tool ..................................................1
4.2 Set-Up Instructions
1. Check the source voltage of the outlet using a voltmeter. Only the voltage indicated
on the unit Serial No./Rating Plate (see also section 3.0, Specifications) is to be
connected to the unit. Ensure electrical outlet is dedicated (no other equipment on the
same circuit breaker).
2. Set the processor in place.
3. Remove the top covers.
4. Ensure the processor is level using a spirit level. Adjust the four feet as necessary:
a. Place level on the upper drive (finisher) roller for right to left levelling (see Fig. 4.1,
page 12).
b. Place level across the top of the tank side plate for front to back levelling
(see Fig. 4.1).
5. Install the developer filter, O ring and filter housing (see Fig. 4.1).
13
GUM REPLEN
DEV REPLEN
DEV HOURLY REPLEN
DEVELOPER FILL
PRE-WASH DRAIN
DEV OVERFLOW
DEVELOPER DRAIN
RINSE DRAIN
GUM DRAIN
GUM OVERFLOW
Fig. 4.2
14
6. Connect the chiller unit to the processor as follows:
a. Chiller Inlet. Connect the 12" hose from the Chiller to the 12" hose connector
labelled CHILLER IN.
b. Chiller Outlet. Connect the 12" hose from the Chiller to the 12" hose connector
labelled CHILLER OUT.
c. Plug the chiller into a separate switched power supply.
d. Connect chiller signal cable to underside of electrical enclosure.
7. Make electrical connections as follows:
Caution
All electrical services must comply with local regulations and should only be performed by
properly licensed/qualified personnel.
The processor must be connected via a dedicated circuit breaker rated no less than
the requirement as specified in 3.0 Specifications. Pay particular attention to routing the
electrical supply cable clear of the front area of the processor in order to avoid possible
contact with developer. The use of a protective conduit is strongly recommended.
8. Fill the developer tank (1 part developer to 9 parts water):
Warning
Before handling or using any graphic arts material, be sure to read the Material Safety
Data Sheet for health hazard data, precautionary information, suggested first aid and
recommended waste disposal.
NOTE: Before filling developer tank, ensure filter element and O ring are installed
correctly in the filter housing and that the developer drain valves are closed.
The developer tank can be filled to the required level either manually or by use of the
Auto-Fill System.
Manual Fill Method:

a. Remove the top covers.
b. Install the developer replenisher probe into an empty container.
c. Remove the developer tank lid.
d. Fill the main developer tank until developer overflows into the second smaller
tank and reaches the bottom of the overflow holes in the back wall of the
developer tank.
Caution
To prevent spillage, do not fill above the level as stated.
e. Replace the developer lid and replace the top covers.

f. Install the developer replenisher probe into a fresh container of developer or
replenisher as recommended.
15
Auto-Fill Method:
a. Install the developer replenisher probe into an empty container.
b. Switch ON power to the processor.
c. Switch ON power switch located on the control panel.
d. Insert developer fill hose into a fresh container of developer.
e. Open the developer fill input valve.
f. Press and hold the fill pump push button. When the developer tank is full
(the developer should be at the level of the overflow holes in the
second dev tank) release the push button.
Caution
g. Close the developer fill inlet valve.

h. Install the developer replenisher probe into a fresh container of developer or
replenisher as recommended.
9. Fill the finisher tank:
Warning
NOTE: Before filling the finisher tank ensure the finisher drain valve is closed.
a. Remove rear top cover.

b. Install the finisher replenisher and return probes into an empty container.
c. Position the funnel provided between the finisher spreader blade and the
rollers in the finisher section and pour in sufficient finisher to reach the bottom
of the overflow hole at the side of the tank.
Caution
d. Install the finisher replenisher and return probes into a fresh container of
50% finisher and 50% water or as recommended.
16
5.0 Installation Checkout
(For use by an authorized equipment service technician only)
Warning
Turning on processor exposes the operator to moving parts and electrically live components.
Although the processor has been factory set, the following pre-operational checks should
be made:
1. Switch ON main power supply to the processor.
2. Switch On Mains Isolator on the side of the processor and the following should operate:
a. Hourly developer replenishment timer (T8) will energise (the green LED on the
timer will operate).
NOTE: The hourly developer replen pump will operate when the time set on T8
has elapsed.
3. Turn the power switch On and the following should operate:

a. Power On (green LED) will illuminate.
b. Main drive motor and transport rollers will run (the green Drive LED will illuminate).
NOTE: The processor is factory set in the Manual mode (recommended). i.e. drive
motor and rollers operate with the Power On switch and not the input sensors
(Auto mode).
c. Pre-heat temperature controllers, infra-red heaters and cooling fans will operate.
d. Developer circulation pump will operate.
e. Developer temperature controller and developer heater will operate.
NOTE: The developer circulation pump, temperature controller and heater will only
operate when the float switch is closed i.e. the developer tank is full.
f. Ready lamp (green LED) will illuminate when pre-heaters and dev have
reached set temperatures.
g. Gum/Finisher pump will operate.
4. Feed a plate into the processor and the following should operate:
a. Process Timer (T2) will energise and the Process lamp (green) will illuminate
(The red LED on the timer will also illuminate).
NOTE: The process timer starts to time when the tail edge of the plate uncovers
the input sensor.
b. Busy lamp (amber) will illuminate.
c. Pre-wash and developer scrub rollers will run.
d. Water rinse spray bars will operate.
e. Developer replenishment pump (will run for time set on T1 Replen timer)
and replen lamp (green LED) will illuminate.
f. Gum/Finisher replen pump will operate.
g. Fan dryers will operate.
17
5. Check the following while the processor is working:

a. Hoses and pumps for any leaks.
b. All spray bars for properly adjusted spray. The water and finisher pressure can
be adjusted via control valves situated beneath the top covers on the right hand
side of the processor.
The finisher should spread evenly across the width of the spreader blade.
6. When the developer temperature and the Pre-Heat is at the required temperature
the processor is then ready to process plates.
7. Process an unexposed plate and check plate for buckling, or scratching.

If a problem is detected, refer to section 7.6 Drive Roller Pressure, section 7.7 Scrub
Roller Pressure, 7.9 Pre-Wash Scrub Roller Pressure and section 9.0 Fault Finding.
8. Process an exposed plate and check the plate for development quality.
If a problem is detected, refer to section 7.7 Scrub Roller Pressure and 7.9 Pre-Wash
Scrub Roller Pressure.
9. Inspect the plate for uniform dryness. Refer to section 7.6 Drive Roller Pressure.
10. Turn the power switch OFF.
11. It is recommended that the Auto/Manual switch is left in the manual position.
This ensures that the input rollers do not overheat.
12. Refit all covers.
18
6.0 Operators Guide

6.1 General
1. Refer to Section 1.2 Safety Summary.
2. Do not activate the Power On Switch when chemistry tanks are empty.
3. If the processor is to be inoperative for more than 24 hours, tilt the finisher spreader
blade away from the roller, and flush with hot water.
Before re-starting processor, soak finisher rollers in hot water and ensure that they
are not stuck together.
6.2 Shift Start Up

1. Ensure that all covers and guards are in place before operating the processor.
2. Check the chemistry levels in the processor, developer replenishment and the
finisher top up bottles.
3. Check the water levels in the processor.
4. Turn power ON switch and allow the developer and pre-heat to warm to their set
temperatures.
5. Ensure that the Forward and Reverse switch is positioned to the Forward position
(not illuminated).
6. When the developer and pre-heat have reached their set temperatures plate
processing can begin.
6.3 Operating Tips

1. Always work under red safe light when manually feeding plates.
2. Keep the developer tank lid and top cover in place to prevent splashing and
evaporation of chemistry.
3. Always carry plates by diagonally opposing corners to avoid fingerprints, kinks and
scratches.
4. Ensure corners of plates are not bent before processing.
5. Do not process plates shorter or wider than specified.
19
6.4 Plate Processing

1. Perform shift start up procedure (see Section 6.2) if the processor has been off for
8 hours or more.
2. Feed the plate gently and squarely into the processor ensuring the sensor has
been activated.
3. Inspect the finished plate for correct exposure, development and uniform dryness etc.
6.5 Re-entry Operation

1. Press the Re-entry switch and feed the plate gently and squarely into the Re-entry
opening.
2. The plate automatically feeds through the rinse, finishing and drying sections and is
then deposited onto either a delivery table or plate stacker.
20
7.0 Adjustments
Attention
Any adjustments must only be performed by suitably instructed/trained/authorized personnel.
This section provides adjustment procedures for the FLP-1260 plate processor.
These procedures are intended for use to:
Adjust a component to within specifications during installation as required.

Correct a detected fault as determined by Fault Finding, see Section 9.0.
Complete re-assembly after replacement of a defective part.
When making adjustment to the timers and transport speed, the following order
of adjustment must be adhered to:
1. Transport Speed
2. T5 Pre-Heat Timing
3. T2 Process Timing
4. T6 Busy Signal (Interface) Timing
5. T7 Throughput (Plate Jam) Timing
Failure to do this could result in misinformation at the plate setter and on the control
panel or incorrect development of the plate.
7.1 Transport Speed

Specification
This adjustment sets the rate of speed at which the plate travels through the processor.
The speed affects the development soak time of the plate. This speed is factory set at 39.37
in./min. (1 mtr/min.) but is fully adjustable according to the plate development requirements.
Procedure
1. Switch isolator on side of processor to off and remove side panel.
2. Adjust potentiometer to the required speed (see Fig. 7.1).
Turn clockwise to increase the speed and counter clockwise to decrease the speed.
3. Refit side panel and switch isolator to the on position.
CYC
LIN
G
Transport Speed Pot.
CYC
LIN
G
Fig. 7.1
21
7.2 Developer Bath Temperature
Specification
The developer bath temperature must be set to 28C 2C (82F 2F) for
consistent proper plate development.
7.2.1 How to Adjust the Developer Temperature Control Set Value
PV
ALM1
Displays the measured value (PV) (Green)

ALM2
SV
OUT
Displays the set value (SV) (Orange)

AT
SET
RKC REX-C100
Fig. 7.2.1
Before any adjustments or changes can be made to any of the settings, the Set
Data Lock (LCK) must be disabled. This is done as follows:
1. Disabling the set data lock (LCK)
1.1 Press the (SET) key for 5 + seconds to enter the parameter set mode.
AL 1 will appear on the measured-value (PV) display unit.
1.2 Press the (SET) key a number of times until the set data locking parameter
symbol (LCK) appears on the measured-value (PV) display unit.
At this time, the least significant digit on the set-value (SV) display unit
lights brightly. The digit which lights brightly is settable.
1.3 Using the q,u and w keys, change the set data lock setting to 0000.
An example on how to change the setting from 0100 is shown below;
Press the w key to shift the digit which lights brightly up to the hundreds
digit. The digit which lights brightly shifts as follows every time the w key
is pressed (see Fig. 7.2.2).
0 1 0 0
Fig. 7.2.2
1.4 Press the u key to set the hundreds digit to 0. Pressing the q key
increases the number, and pressing the u decreases the number.
0000 = No initial set mode locked (All settings accessible and changeable)
NOTE: In order to enter the initial set mode, always set the set data lock (LCK)
to 0000. Any setting other than 0000 cannot enter the initial set mode.
22
1.5 Press the (SET) key for 5 + seconds to exit the parameter set mode.
The set data lock has now been disabled.
2. Changing the set-value (SV)
2.1 Press and release the (Set) key.

At this time, the least significant digit on the set-value (SV) display lights
brightly. The digit which lights brightly is settable.
2.2 Using the q,u and w keys, change the set-value to the new required
temperature.
NOTE: It will only be possible to adjust the set-value + or - 2 degrees
because of the SLH and SLL settings in the initial set mode.
These are the high and low limit settings for the set-value (SV).
To change these settings refer to Item 4.
Once the new temperature has been set, press and release the (SET) key.
NOTE: When a new temperature setting is used, the AL1 first alarm
setting must be changed to 2 degrees below the new set-value i.e.
Set-Value = 29C (0029) or 84F (0084)
AL1 = 27C (0027) or 82F (0082)
This is the low alarm window setting for the Ready signal.
3. Changing the first alarm setting (AL1)
AL1 will appear on the measured-value (PV) display, and its current
setting will appear in the set-value (SV) display.
3.2 Using the q,u and w keys, change the first alarm setting to 2 degrees
below the new temperature set-value.
Once the first alarm setting has been changed, press the (Set) key once
to register the change.
4. Changing the set-value high (SLH) and low (SLL) limit settings
4.1 Press both the w and (SET) keys simultaneously for more than 5 seconds
to enter the initial set mode. SL 1 will appear on the measured-value (PV)
display unit.
NOTE: If the controller is set to the initial set mode, all outputs are
turned OFF.
4.2 Press the (SET) key a number of times until the high limit setting parameter
symbol (SLH) appears on the measured-value (PV) display.
4.3 Using the q,u and w keys, change the high limit setting to 2 degrees
above the new set-value i.e.
Set-Value = 29C (0029) or 84F (0084)
SLH = 31C (0031) or 86F (0086)
NOTE: The high limit setting can be set to any value above the Temperature
set-value.
23
4.4 Once the high limit setting has been changed, press the (SET) key once
SLL will appear on the measured-value (PV) display unit.
4.5 Using the q,u and w keys, change the low limit setting to 2 degrees
below the new set-value i.e.
Set-Value = 29C (0029) or 84F (0084)
SLL = 27C (0027) or 82F (0082)
NOTE: The low limit setting can be set to any value below the Temperature
set-value.
4.6 Once the low limit setting has been changed, press the (SET) key once
to exit the initial set mode. The controller will return to the normal PV/SV
display mode.
NOTE: After exiting the initial set mode and all changes to the temperature
controller have been made, it is recommended that the set data lock is
enabled.
5. Enabling the set data lock (LCK)
At this time the least significant digit on the set-value (SV) display unit
5.3 Press the w key to shift the digit which lights brightly. The display shifts
as follows every time the w key is pressed (see Fig. 7.2.3).
0 0 0 0
Fig. 7.2.3
5.4 Using the q,u and w keys, change the set data lock setting to one of
the following:-
0100 = No set data locked (All parameters changeable)

0101 = Set data locked (All parameters not changeable)
0110 = Only the set-value (SV) is changeable with the
set data locked
NOTE: The 0101 setting is recommended.
The controller will return to the normal PV/SV display mode.
24
7.2.2 How to Calibrate the Developer Temperature Control with the Actual
Developer Bath Temperature
PV
ALM1

ALM2
SV
OUT

AT
SET
RKC REX-C100
Fig. 7.2.4
If the reading on the PV (Green) display is different from the actual developer bath
temperature, it can be calibrated as described below:
1. Checking the developer bath temperature
1.1 Check the developer bath temperature using a calibrated thermometer and
note the difference between the actual temperature and the temperature
displayed on the measured-value (PV) display unit.
NOTE: It is best to check the developer bath temperature after it has been
recirculated for a few minutes. This ensures that the bath temperature is even.
2. Entering the initial set mode
At this time, the least significant digit on the set-value (SV) display unit lights
0 1 0 0
Fig. 7.2.5
25
0000 = No initial set mode locked.
NOTE: In order to enter the initial set mode, always set the set data locking
(LCK) to 0000. Any setting other than 0000 cannot enter the initial set
mode.
to enter the initial set mode. SL 1 will appear on the measured-value (PV)
display unit.
NOTE: If the controller is set to the initial set mode, all outputs are turned
OFF.
2.6 Press the (SET) key a number of times until the PV bias setting parameter
symbol (Pb) appears on the measured-value (PV) display.
Note the setting displayed before any changes are made.
2.7 To adjust the PV bias setting, follow the examples shown below;
1. To increase the actual developer bath temperature, decrease the PV

bias setting, ie
PV (Pb) bias setting 0001

PV measured value displayed 28C
Actual developer bath temperature 24C
Decrease the PV (Pb) bias setting from 0001 to -003.

This will compensate for the 4C difference between the PV temperature
displayed and the actual developer bath temperature.
To change the PV (Pb) bias setting, Press the u key a number of times
until -003 is displayed. Press the (SET) key once to register the change.
2. To decrease the actual developer bath temperature, increase the PV

bias setting, ie
PV (Pb) bias setting 0001

PV measured value displayed 28C
Actual developer bath temperature 31C
Increase the the PV (Pb) bias setting from 0001 to 0004.

This will compensate for the 3C difference between the PV temperature
displayed and the actual developer bath temperature.
To change the PV (Pb) bias setting, Press the q key a number of times
until 0004 is displayed. Press the (SET) key once to register the change.
NOTE: The above procedure should be followed the same for F.
Any changes made to the PV bias setting are done in units of 1 whether
set to F or C.
26
3. Exiting the initial set mode
display mode.
NOTE: After exiting the initial set mode, it is recommended that the set
data lock is enabled.
0 0 0 0
Fig. 7.2.6
the following:-

set data locked
27
7.2.3 How to Change the Developer Temperature Control/Display from C to F
PV
ALM1

ALM2
SV
OUT

AT
SET
RKC REX-C100
Fig. 7.2.7
Before any adjustments or changes can be made to any of the settings, the Set
Data Lock (LCK) must be disabled. This is done as follows:
0 1 0 0
Fig. 7.2.8
NOTE: In order to enter the initial set mode, always set the set data lock
mode.
28
2. Entering the initial set mode
to enter the initial set mode. SL 1 will appear on the measured-value
(PV) display unit.
NOTE: If the controller is set to the initial set mode, all outputs are turned
OFF.
2.2 Press the (SET) key once. The engineering unit parameter symbol (SL2)
will appear on the measured-value display unit.
2.3 Using the u key, change the engineering unit from 0000 (=C) to 0001 (=F).
2.4 Press the (SET) key a number of times until the low limit setting parameter
symbol (SLL) appears on the measured-value (PV) display.
2.5 Using the q,u and w keys, change the low limit setting to 0080 (80F)
unless otherwise required.
2.6 Once the low limit setting has been changed, press the (Set) key a number
of times until the high limit setting parameter (SLH) appears on the
measured-value (PV) display unit.
2.7 Using the q,u and w keys, change the high limit setting to 0084 (84F)
unless otherwise required.
3. Exiting the initial set mode
display mode.
4. Changing the set-value (SV)
4.1 Press and release the (Set) key.

At this time, the least significant digit on the set-value (SV) display lights
4.2 Using the q,u and w keys, change the set-value to 0082 (82F) unless
otherwise required.
NOTE: It will only be possible to adjust the set-value to within the high
(SLH) and low (SLL) limit settings in the initial set mode.
Once the new temperature has been set, press and release the (SET) key.
29
5. Entering the parameter set mode
The first alarm parameter symbol AL1 will appear on the measured-value
(PV) display unit.
5.2 Using the q,u and w keys, change the first alarm to 0080 (80F) unless
otherwise required. Once the first alarm setting has been changed, press
the (SET) key once to register the change.
NOTE: Once all of the above changes have been made, it is recommended
that the set data lock is enabled.
0 0 0 0
Fig. 7.2.9
the following:-

set data locked
30
7.2.4 How to Change the Developer Temperature Control from PID to ON/OFF
PV
ALM1

ALM2
SV
OUT

AT
SET
RKC REX-C100
Fig. 7.2.10
Before any adjustments or changes can be made to any of the settings, the Set Data
Lock (LCK) must be disabled. This is done as follows:
0 1 0 0
Fig. 7.2.11
NOTE: In order to enter the initial set mode, always set the set data lock
mode.
1.5 Press the (SET) key for 5+ seconds to exit the parameter set mode.
The set data lock has now been disabled.
31
2. Changing the P, I and D settings to ON/OFF control
2.1 Press the (SET) key for 5 + seconds to enter the parameter set mode. The first
alarm parameter symbol AL1 will appear on the measured value (PV) display unit.
2.2 Press the (SET) key a number of times until the Proportional band parameter
symbol (P) appears on the measured-value (PV) display. At this time, the least
significant digit on the set-value (SV) display lights brightly. The digit which
lights brightly is settable.
2.3 Using the q,u and w keys, change the Proportional band (P) setting to 0000.
2.4 Press the (SET) key once and the Integral time (I) parameter symbol will appear
on the measured-value (PV) display.
2.5 Using the q,u and w keys, change the Integral time (I) setting to 0000.
2.6 Press the (SET) key once and the Derivative time (d) parameter symbol will
appear on the measured-value (PV) display.
2.7 Using the q,u and w keys, change the Derivative time (d) setting to 0000.
Once the Derivative time setting has been changed, press the (SET) key once
NOTE: Once all of the above changes have been made, it is recommended that
the set data lock is enabled.
0 0 0 0
Fig. 7.2.12
the following:-

set data locked
32
7.2.5 Developer Temperature Control/Display Settings
On power-up the controller will enter the PV/SV display mode. The actual developer
temperature is displayed on the measured-value PV (Green) display, and the
set-value 0028 (C) or 0082 (F) is displayed on the set-value SV (Orange) display.
Unless otherwise specified, the controller will always be factory set to C.
To access the parameter set mode, press the (Set) key for 5 + seconds.
The following parameter symbols and settings are displayed one by one every
time the (Set) key is pressed:
Symbol Name Setting

AL1 First alarm 0026 (for C) or 0080 (for F)
AL2 Second alarm 0002 (See note)
ArU Auto-tuning 0000
P Proportional band 0004 (= PID control). 0000 (= ON/OFF control).
I Integral time 1002 (= PID control). 0000 (= ON/OFF control).
d Derivative time 0250 (= PID control). 0000 (= ON/OFF control).
Ar Anti-reset windup 0100
r Proportional cycle 0002
Pc 0052
db 0000
t 0020
LCK Set data lock 0101
NOTE: The AL2 Second Alarm setting 0002 controls the temperature at which
the on-line chiller unit will switch on i.e. 2 degrees above the set-value.
To access the initial set mode, press both the w and (Set) keys simultaneously for
more than 5 seconds.
NOTE: In order to enter the initial set mode, always set the set data lock (LCK) in
the parameter set mode to 0000. Any setting other than 0000 cannot enter the
initial set mode.
The following parameter symbols and settings are displayed one by one every
time the (Set) key is pressed:
Symbol Name Setting

SL1 Input type selection 0000
SL2 Engineering unit 0000 (= C) or 0001 (=F)
SL3 Heater break alarm 0000
SL4 First alarm type 0111
SL5 Second alarm type 0001
SL6 Control output 0010
SL7 Energise/de-energise
alarm selection 0000
33
SL8 0000
Pb PV bias setting 0001 (See note)
oH Differential gap setting
of ON/OFF action 0001
AH1 Differential gap setting
of first alarm 0001
AH2 Differential gap setting
of second alarm 0001
SLH High limit setting for
set-value (SV) 0030 (for C) or 0084 (for F)
SLL Low limit setting for
set-value (SV) 0026 (for C) or 0080 (for F)
NOTE: The PV bias setting should be set to compensate for the difference between
the measured-value (PV) display and the actual developer bath temperature.
For full details on how to adjust this setting, please refer to section 7.2.2 How
to Calibrate the Developer Temperature Control with the Actual Developer Bath
Temperature.
34
7.3 Pre-Heat Temperature
Measured value (PV) Display

-Displays measured value
PV
Set value (SV) Display

-Displays set value SV MV
COMP
Auto tuning (AT) Lamp AT

External mode (EXT) lamp
-flashes during Auto tuning AREA - lights when image setter
REM MAN EXT
is connected
Memory (Area D) Display ALM1 ALM2 FAIL
First alarm (ALM 1) lamp
-Displays memory area OUT1
- lights when Measured value
no. in use OUT2
is outside alarm parameters

Mode (Mode) Key MODE MONI AREA
Monitoring (Moni) Key Area (Area K) Key

SET
Set (Set) Key

RKC REX-F400
Setting digit (shift) Key

Set value decrement (Down) Key
Fig. 7.3.1
Set value increment (Up) Key
The pre-heat temperature controllers are factory set and locked.

The plate setter controls their applied temperatures according to the plate size being used.
1. How to change the temperature controllers set values:

a. Depress the (Mode) key repeatedly until LCK is visible in the (SV) display,
then highlight ULCY in the (PV) display with the (Up) key.
NOTE: This unlocks and allows adjustment of the settings.
b. Depress the (Moni) key to return to the home screen.
c. Depress the (Set) key to access adjustment facility of the Area selected.
d. Use the (Up), (Down) and (Shift) keys to set the temperature required and the
Area selected for adjustment.
e. When adjustments are completed, depress the (Mode) key, select EvR with
the (Down) key and then depress the (Moni) key to return to the default screen
and interface control.
2. How to enter Operator Level 1 mode:

a. Depress the (Mode) key, highlight LOC in the (PV) display by depressing
the (Up) key.
NOTE: This gives you local control over the Temperature controller.
b. Depress the (Mode) key twice, highlight ULCY in the (PV) display with the (Up) key.
NOTE: This unlocks and allows adjustment of the settings.
c. Depress the (Mode) key, highlight Stop in the (SV) display with the (Down) key.
NOTE: This stops the heaters from operating to eliminate the possibility of their
overheating while settings are being adjusted.
35
It is now possible to make adjustments to the Operator Level 2 and Engineer Levels.
3. How to enter Operator Level 2 mode:

a. Depress and hold the (Set) key for 5 seconds.
b. AL1 will appear in the (PV) display, use the (Set) key to scroll through this level
and the (Up, Down and Shift) keys to adjust figures.
NOTE: Any adjustments made in Operator Level 2 mode will have to be made
individually across all 4 areas.
4. How to enter Engineer Level mode:

a. Depress and hold the (Set) key for a further 5 seconds.
b. PG 10 will appear in the (PV) display, use the (Up/Down) keys to scroll through
each PG level in turn i.e. PG 10 - PG 11- PG 12 etc.
c. Use the (Set) key to scroll through the parameters of your selected PG level.
d. Use the (Up, Down and Shift) keys to make changes to the parameter selected.
NOTE: Any adjustments made in Engineer level will automatically be configured
across all 4 areas.
e. Depress the (Moni) key to return to the default screen.
NOTE: When all adjustments have been made, Operator Level 1 must be returned
to its original state using the method described below.
5. How to return Operator Level 1 to its original state (Quick Method):

a. Depress the (Mode) key, highlight rUn in the (PV) display with the (Up) key
and wait 3+ seconds for the controller to restart.
b. Depress the (Mode) key, highlight Eur in the (SV) display with the (Down) key.
c. Depress the (Mode) key twice, highlight LCY in the (SV) display with the
(Down) key.
d. Depress the (Moni) key to return to the default screen.
6. Factory Settings:
Factory settings are shown in Fig. 7.3.2.
These are for reference purposes only and should never need adjusting after the
processor has left the factory except in the case of perhaps changing the readout from
Fahrenheit (F) to Centigrade (C).
7. How to change the readout from Fahrenheit (F) to Centigrade (C):

a. Enter the Engineer level as described above.
b. Scroll through the PG levels till PG 20 is highlighted in the (PV) display.
c. Use the (Set) key to scroll through the parameters until 1nP is displayed.
d. Use the (Up) key to increase the set figure from 2 to 4.
e. Depress the (Moni) key to return to the default screen, making sure that any
adjustments made in Operator level 1 have been returned to their original settings.
36
Area
a 1 Area
a 2 Area
a 3 Area
a 4
Plate
Thickness O.5
5 mm O.2 mm O.24
4 mm O.3 mm
Set Inner Outer Inner Outer Inner Outer Inner Outer
Points Heater Heater Heater Heater Heater Heater Heater Heater
Temp C 34O 32O 37O 35O 41O 38O 43O 41O
AL1 O1O.O O1O.O O1O.O O1O.O O1O.O O1O.O O1O.O O1O.O
P OO3.O OO3.O OO3.O OO3.O OO3.O OO3.O OO3.O OO3.O
I OO24 OO24 OO24 OO24 OO24 OO24 OO24 OO24
d OOO6 OOO6 OOO6 OOO6 OOO6 OOO6 OOO6 OOO6
rPR OOOO OOOO OOOO OOOO OOOO OOOO OOOO OOOO
SArL OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O
PG 10
P6 OO.OO OO.OO OO.OO OO.OO OO.OO OO.OO OO.OO OO.OO
dF1 OO.OO OO.OO OO.OO OO.OO OO.OO OO.OO OO.OO OO.OO
PG 11 N/A N/A N/A N/A N/A N/A N/A N/A
PG 12
oLH 1O5.O 1O5.O 1O5.O 1O5.O 1O5.O 1O5.O 1O5.O 1O5.O
oLL -O5.O -O5.O -O5.O -O5.O -O5.O -O5.O -O5.O -O5.O
orU OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O
ord OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O
PSn OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O
PG 13
AR6 OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O
PG 14
AH1 OO.1O OO.1O OO.1O OO.1O OO.1O OO.1O OO.1O OO.1O
ALR1 OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O OOO.O
PG 17
dE OOOO OOOO OOOO OOOO OOOO OOOO OOOO OOOO
PG 20
1nP 2 2 2 2 2 2 2 2
PoA 8OO.O 8OO.O 8OO.O 8OO.O 8OO.O 8OO.O 8OO.O 8OO.O
PUn O.O O.O O.O O.O O.O O.O O.O O.O
AoAE O O O O O O O O
AUnE O O O O O O O O
PG 21
SLH 5OO.O 5OO.O 5OO.O 5OO.O 5OO.O 5OO.O 5OO.O 5OO.O
SLL O.O O.O O.O O.O O.O O.O O.O O.O
PG 22
CY1 2 2 2 2 2 2 2 2
oS1 1 1 1 1 1 1 1 1
Pd O O O O O O O O
PdA 3.O 3.O 3.O 3.O 3.O 3.O 3.O 3.O
PG 23
AS1 4 4 4 4 4 4 4 4
EuC1 O O O O O O O O
AEo1 O O O O O O O O
Aho1 O O O O O O O O
A52 6 6 6 6 6 6 6 6
PG 40
LCY OOOO OOOO OOOO OOOO OOOO OOOO OOOO OOOO
ArE OOO1 OOO1 OOO1 OOO1 OOO1 OOO1 OOO1 OOO1
SToP OOO1 OOO1 OOO1 OOO1 OOO1 OOO1 OOO1 OOO1 Fig. 7.3.2
37
7.3.1 Checking the Pre-Heat Temperature
Specification
The post heating temperature of a one sided Photopolymer laser plate, measured
on the underside of the plate with thermo strips, should be 100 6C (94 - 106C).
Procedure
1. Ensure that all the covers are on the processor.
2. Switch on the processor and check that the CAL Temperature Controller(s)
is/are set to 100C.
Allow the pre-heat station to warm up and stabilise at the set point for
approximately 10-15 minutes.
3. Check the processor throughput speed is set to 1m/minute.
4. Using a new (full width if available), fully coated 0.30mm thick plate that
has been exposed to daylight, stick a number of thermo strips on the underside
of the plate in the positions as shown in Fig. 7.3.3.
NOTE: In order to prevent misreading, please ensure that the thermo strips
are firmly adhered to the plate and a new plate used on each test.
5. Feed the plate through the processor and record the results.
Thermo Strips (Temperature Sensitive Labels)

The recommended types, manufacturers and suppliers of thermo strips are listed
below in order of preference:
1. R.S. 285-942 6 level strip (Irreversible) Self Adhesive

Scale 4 99-104-110-116-121-127C and 210-220-230-240-250-260F
Accuracy 1C below 100C 1% above 100C
2. Farnell 522-960 (Thermindex Series 8) Self Adhesive

Scale/Range B 77-82-88-93-99-104-110-116C and 170-180-190-200
-210-220-230-240F
38
In certain cases it may not be possible to obtain the labels in the correct temperature
range. It may therefore be necessary to use two types of labels together as
described below.

Scale B 71-77-82-88-93-99-104-110C
NOTE: To be used in conjunction with Scale C labels, item no.4 below.

Scale C 116-121-127-132-138-143-149-154C
NOTE: To be used in conjunction with Scale B labels, item no.3 above.
CL
25mm
(1") TYP
Minimum recommended
(1") TYP
25mm
thermo strip positions

Position of higher scale
Direction thermo strips if required
of travel Additional thermo strip
positions recommended
for full temperature check
CL
Fig. 7.3.3
39
7.4 Pre-Heat Timing
Specification
The Pre-Heat timer controls the length of time that the ceramic heaters are off, after the tail
edge of the plate has left the sensor. Pre-heating resumes when that period has elapsed.
Procedure
1. Switch isolator on side of processor to off and remove side panel.
2. Adjust the potentiometer (T5) to the required time for the heaters to switch on
(see Fig. 7.4).
3. Refit side panel and switch isolator to the on position.
CYC
LIN
G
Fig. 7.4
CYC
LIN
T5 Pre-Heat Timer G
40
7.5 Pre-Wash and Rinse Spray Pressure

Specification
Adjusts the pre-wash and rinse spray pressures for an even flow across the plate path
without excess splash.
Procedure
1. Turn the processor ON.
Warning
Turning on the processor exposes the operator to moving parts and electrically live
components.
2. Remove the plumbing side cover to gain access to the rinse valves located on the
right hand side of the processor.
3. Adjust both the main rinse and pre-wash control valves for an even spray
across the plate surface without unnecessary splash (see Fig 7.5).
PRE-WASH PRESSURE RINSE PRESSURE

ADJUSTMENT VALVES ADJUSTMENT VALVES
Fig. 7.5
41
7.6 Drive Roller Pressure
Specification
The drive roller adjustment ensures the plate travels through the processor evenly without
skewing or buckling. This also ensures the correct squeegee of the plate. Adjust the
bearing block heights for the roller assemblies as follows:
The measurement should be taken from the top of the TOP BEARING BLOCK to the
bottom of the BOTTOM BEARING BLOCK (see Fig. 7.6).
Stations 1, 2, 4, 5, 8, 9 and 11:

4.31" (109.5 mm)
Station 12:
4.29" (109 mm)
Fig. 7.6
Procedure
Warning
Turning on the processor exposes the operator to moving parts and electrically live
components. This operation must only be performed by a suitably instructed/trained/
authorized personnel.
1. Switch mains isolator to the OFF position and remove the side panel.
2. Switch the Auto/Manual toggle to the Manual position and refit side panel.
3. Switch the mains isolator to the ON position.
4. Turn the Service Key Switch on the control panel to the vertical position.
5. Remove all top covers.
6. Turn the processor ON.
42
7. Feed a plate through the processor. Observe how each set of drive rollers pull
the plate out of the preceding set. Check for skewing or buckling (noting how
each side of the roller affects the plate). If this happens isolate the roller set
causing the problem.
8. Turn the processor OFF.
9. To adjust the roller pressures, remove the roller sets from the tank.
10. Loosen the locknuts on the bottom bearing block.
11. Adjust the screws as required making sure that the adjustment is the same on each
end of the roller for even pressure.
NOTE: The finisher roller setting is CRITICAL to ensure consistent and evenly
finished and dried plates. Fine limit adjustment of the screws is required
until the top roller is running dry.
Over tightening will cause a wet section in the centre of the top roller.
Under tightening will cause a wet section on the ends of the top roller.
12. Re-tighten lock nuts and refit rollers into tank.
13. Re-test with a new plate. Re-adjust as necessary.
15. Turn the Service Key Switch back to its normal operating position (Horizontal).
NOTE: After use the keys must be removed from the switch and should be
retained by an authorised member of staff.
16. Return the Auto/Manual toggle switch to the Auto position.
43
7.7 Scrub Roller Pressure

Specification
The scrub roller adjustment ensures correct scrub pressure for optimum plate development.
Procedure
1. Turn the processor OFF at the main power supply.
3. Remove the developer tank lid.
4. Using a strip of litho plate approximately 50 mm wide, slide it under each scrub
roller and move it from side to side to check the pressure.
5. To adjust the pressure, slacken the two spring retaining screws on the retaining latch
(A) swivel the retaining latch back so that the scrub roller assemblies can be adjusted.
Turning the screws clockwise, decreases the pressure.
Turning the screws counter-clockwise, increases the pressure.
NOTE: Care should be taken not to over adjust the 2nd scrub roller, as this could
result in mis-alignment of the gearbox drive coupling.
6. Reposition the retaining latch (A) and tighten the spring retaining screws
(finger tight is sufficient).
7. Repeat No. 5 above until a uniform light pressure is obtained across the width
of scrub roller (see Fig. 7.7).
8. Refit the developer tank lid.
9. Replace the top covers.
Fig. 7.7
44
7.8 Hold Down Roller Pressure
Specification
The three hold down rollers ensure the plate is directed on to the mesh through the dev
section and into the nip of the drive rollers in the next section.
Procedure
1. Turn the processor OFF at the main power supply.
3. Remove the developer tank lid.
4. Using a 4mm allen key, undo both M5x20mm socket set screws and adjust hold
down roller support brackets until each roller in turn is set parallel to the mesh
at the distance described below.
NOTE: Setting the hold down rollers closer to the mesh than described below could
result in damaged or scratched plates.
Roller Distance
Entry 5mm
Middle 1mm
Exit 5mm
5. Re-tighten M5x20mm socket set screws.

6. Refit the developer tank lid.
7. Replace the top covers.
45
7.9 Pre-Wash Scrub Roller Pressure
Specification
The Scrub Roller adjustment ensures correct scrub pressure on the top of the plate
to give optimum plate development.
Procedure
2. Remove the front top cover.
3. Using a strip of plate approximately 50 mm (2") wide, slide the plate between the
1st set of scrub rollers and move it from side to side to check the pressure.
(See Fig. 7.8).
Fig. 7.8
4. To adjust the scrub roller pressure, remove the set from the tank.
5. Adjust the two screws as required making sure that the adjustment is the same
on each end of the scrub roller for even pressure.
6. Refit scrub rollers.
7. Re-test with strip of plate. Re-adjust as necessary.
8. Refit front top cover.
46
7.10 Input Sensor Adjustment
Specification
The plate sensor must be set so as to start the processor when a plate is placed in the
first input rollers.
The plate sensor is factory set but is fully adjustable depending on plate type requirements.
Procedure
3. Remove the input rollers to gain access to the plate sensor.
4. Adjust the potentiometer on the bottom or side of the sensor so that the
processor starts when the plate is approximately 1 inch (25 mm) above the
surface of the plate sensor. (See Fig. 7.9).
5. Refit the input roller to test for sensitivity.
6. Refit all covers when setting has been reached.
Fig. 7.9
47
7.11 Plate Jam Sensor Adjustment

Specification
When a plate enters the processor passing the input sensor, (T7) Plate Jam timer is
activated. The plate Jam sensor at the rear of the machine must be activated by the
exiting plate to reset (T7) Plate Jam timer before the set time has elapsed in order to
prevent the Fault Lamp (red LED) on the control panel from illuminating indicating a
possible plate jam.
Procedure
3. Remove the final drive rollers (Roller station No. 12).
4. Adjust the potentiometer on the bottom or side of the sensor so that the green LED
on (T7) Plate Jam timer which illuminates when a plate enters the processor,
extinguishes when the plate is approximately 1 inch (25 mm) above the surface of
the plate sensor (see Fig. 7.9, page 47).
5. Refit the final drive rollers and test for sensitivity.
6. Refit all covers when setting has been reached.
48
7.12 Process Timing
Specification
Adjustable 0-5 minutes.
The process timer controls the length of time that the processor is on during plate
processing. When the photo sensor on the input table senses the plate, the processor
starts. After the tail end of the plate passes the photo sensor, the processor must remain
on until the plate has passed the dryers and has been deposited onto the delivery table
or plate stacker.
Process timing is dependent on transport speed. Perform this procedure in conjunction

with the transport speed adjustment.
Procedure
1. Switch isolator to the OFF position and remove the side panel.
2. Adjust the potentiometer (T2) so that the processor remains on for approximately
10 seconds after the plate stops on the delivery table. (See Fig. 7.10).
3. Refit side panel and switch isolator to the ON position.
T2 Process Timer
CYC
LIN
G
CYC
LIN
G
Fig. 7.10
49
7.13 Developer Replenishment Timing
Specification
Adjustable 0-60 seconds.
The developer replenishment timing, controls the length of time the replenishment pump
is on during plate processing. When the sensor on the input table senses the plate, the
replenishment pump starts to work and continues to run for the length of time set on the
replenishment timer, or the length of time the sensor is covered, whichever is shorter.
The replenishment timer should be set so as to keep the developer tank topped up.
Developer replenishment timing is dependent on the square footage of plates being

processed and the amount of developer used during processing.
Procedure
1. Switch the isolator to the off position and remove the side panel.
2. Adjust the potentiometer (T1) to the required time. (See Fig. 7.11).
3. Refit the side panel and switch the isolator to the on position.
NOTE: Finisher replenishment will run on the process timer (T2) and is separate
from the developer replenishment.
T1 Replen
Timer T2 Process Timer
CYC
LIN
G
Fig. 7.11
CYC
LIN
G
50
7.14 Manual Replenishment Timing
Specification
The manual replen timer controls the amount of time the Developer replenishment pump
runs for when the Manual Replen Switch has been pressed.
Procedure
1. Switch isolator to the OFF position and remove the side panel.
2. Adjust the potentiometer (T9) to the required time, recommended at 45 seconds

(see Fig. 7.12).
CYC
LIN
G
T9 Manual Replen Timer
CYC
LIN
G
Fig. 7.12
51
7.15 Hourly Developer Replenishment Timing
Specification
60 minute off adjustable between 0 and 3 minutes on.
The hourly developer replenishment timer, controls the length of time the replenishment
pump runs each hourly period.
Developer replenishment timing is dependent on the square footage of plates being

processed and the amount of developer used during processing.
Procedure
1. Switch the isolator to the OFF position and remove the side panel.
2. Adjust the potentiometer (T8) to the required time, (see Fig. 7.13).
NOTE: Further adjustment of output volume can be achieved by adjusting the cam
on the replenishment pump, (see Fig. 7.14). (The pumps are located above the
drain taps on the left hand side of the processor.)
3. Refit side panel and switch the isolator to the ON position.
T8 Replen Timer
OFF ON
60M 3min
Fig. 7.13
0%
30
10
30% 100%
60ml/min 200ml/min Fig. 7.14
52
7.16 Cycle Timing
Specification
The optional Auto Start Alarm Timer (T3) should be fitted when the Auto/Manual toggle
switch is in the auto (Energy Saving) position. The timer should be set to cycle the
processor every 15 minutes for the length of time set on the process timer (T2). This
protects the finisher from hardening on the rollers and circulates the developer to keep
it at a constant temperature. The timer has a warning beeper which gives an audible
warning prior to commencement of auto cycle.
Procedure
1. Switch isolator to OFF position and remove side panel.
2. To adjust the timer potentiometer insert the small plastic tool provided into the
hole in the front of the timer and locate into socket, (see Fig 7.15). To decrease
the time, turn counter-clockwise. To increase the time, turn clockwise.
T2 Process Timer T3 Auto Start

Alarm Timer
CYC
LIN
G
Fig. 7.15
CYC
LIN
G
53
7.17 Busy Signal (Interface) Timing
Specification
The timer controls the length of time that the busy signal is active. The busy signal indicates
to the platesetter that the processor is currently processing a plate. The signal and timer
are activated when the input sensor detects a plate. The timer starts timing when the tail
of the plate leaves the input sensor. Busy timer should be set to allow the pre-heaters to
regain temperature before the next plate is fed.
NOTE: Typically the platesetter will not send a plate until the busy signal has been
de-activated.
Procedure
1. Switch isolator to the OFF position and remove side panel.
2. Adjust the potentiometer (T6) to the required time (see Fig. 7.16).
CYC
LIN
G
T6 Busy Signal
CYC
LIN
G
Fig. 7.16
(Interface) Timer
54
7.18 Throughput (Plate Jam) Timing
Specification
The throughput timer is energised when the input sensor detects a plate.
The timer should be set to approximately ten seconds longer than it takes a plate to travel
through the processor and activate the rear (exit) sensor. If the plate does not activate
the rear (exit) sensor (i.e. jams inside) by the time set on the throughput timer, a fault
signal is sent to the platesetter.
NOTE: The throughput timer will only operate if the time set on the busy signal (interface)
timer (T6) exceeds the time set on the throughput timer.
Procedure
1. Switch isolator to the OFF position and remove side panel.
2. Adjust the potentiometer (T7) to the required time (see Fig. 7.17).
CYC
LIN
G
T7 Throughput
(Plate Jam) Timing
CYC
LIN
G
Fig. 7.17
55
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56
8.0 Maintenance
Attention
Any maintenance must only be carried out by suitably skilled or properly instructed/supervised
personnel.
Warning
8.1 Operator Maintenance Daily/Weekly

1. Check the chemistry levels in the processor, developer replenishment bottle
and finisher replenishment bottle. Make sure that all tanks are full.
2. Keep processor free from dust and dirt.
3. Weekly, check the scrub roller covers for wear and replace if necessary.
(See section 8.3).
4. Check the developer PH level with PH Metre.
5. Check level and cleanliness of pre-wash bath, top-up or change if PVA has
accumulated.
6. Clean/check overflows.
8.2 Operator Maintenance Chemistry Changes
Warning
Do not perform this procedure without disconnecting the processor from the main power
supply. If power is not disconnected the operator may be exposed to moving parts and
electrically live components.
1. Press the Power Off Switch, then turn the Isolator Switch on the side of the machine
off (O).
3. Remove all drive rollers, scrub rollers, hold down rollers and tank mesh
(scrub covers should be changed monthly).
4. Open the drain valves on the side of the machine and drain the contents.
5. Open the valves on the bottom of the filter housings and drain their contents.
6. Remove the filter housings.
7. Inspect the O ring and replace if necessary. Be sure that the O ring is properly seated.
8. Refit the filter housing; make certain the drain valve is closed.
9. Thoroughly clean all tank sections with warm water and drain.
10. Wipe interior surfaces with cheesecloth or other suitable material.
11. Drain contents from filter by opening drain valve.
12. Remove the filter housing, install a new filter element and refit the housing ensuring
that the O ring is properly seated and the drain valve is closed.
13. Refit tank mesh.
14. Rotate all rollers in their bearings and clean.
57
15. Clean and check scrub roller cover for damage, replace if necessary.
(See Section 8.3, Changing the Scrub Roller Cover).
16. Refit all rollers and scrub rollers into processor making sure that they are kept in
numerical sequence from front to back.
17. Ensure all drain valves are closed.
18. Refill processor with fresh chemistry.
19. Refit top covers.
8.3 Changing the Scrub Roller Cover
1. Remove the scrub rollers from the tank.

2. Remove the gearbox and bearing block.
3. Cut the tie wraps securing the cover to the roller and remove the old cover.
4. Clean the roller with warm water.
5. Wet the new cover and slide onto the roller.
6. Fix one end with tie wrap.
7. Pull cover tight over roller and ensure it is smooth and wrinkle free.
8. Fix other end with tie wrap.
9. Cut off the excess cover and both the tie wrap ends.
8.4 Changing the Developer Filter Element
1. Place an empty container under the filter housing.

2. Close the valve on the head of the filter unit.
3. Open the valve on the bottom of the filter unit.
4. When the contents have drained, unscrew the filter housing and discard the old element.
5. Clean filter housing and install a new filter element.
6. Inspect the O ring and replace if necessary. Ensure the O Ring is properly seated.
7. Refit the filter housing.
8. Close the valve on the bottom of filter unit.
9. Open the valves on the head of the filter unit.
58
9.0 Fault Finding
Attention
Any corrective maintenance must only be carried out by suitably skilled or properly instructed/
supervised personnel.
The Fault Finding section is a table which lists some possible problems, causes and
remedies for processor malfunctions.
Use the Fault Finding table to locate and solve any specific processor malfunctions.
To correct a processor problem, do the following:
Find the symptom which best describes your problem.
Match the symptom with a probable cause and solution.
Correct the problems by trying each solution.
NOTE: Fault Finding cannot be performed in a thorough manner unless the processor
is operated under recommended specifications.
59
9.1 General
Problem Possible Cause Solution
Inconsistent
Scrub Roller Fault. Scrub motor circuit Re-set circuit
or poor plate
Due to: breaker tripped breaker
development
Badly wrinkled
Replace covers
covers
Bald patches
Replace covers
on covers
High pigmentation Clean or

build up on covers replace covers
Split covers Replace covers
Developer pump
Developer System Re-set circuit
circuit breaker
Fault. Due to: breaker
tripped
Blocked spray bar Clean with suitable

on tank lid pointed tool
Clogged filter Replace filter

element element
Kinked pipe(s) on Position developer

replen probe drum to give pipe(s)
assembly unrestricted flow
Insufficient Replace with

developer in drum full drum and
or empty drum reprime system
Blocked tank inlet Remove tank lid.

leading from probe Remove blockage.
assembly Replace tank lid
Valve on filter left

closed after Open valve
developer change
Exhausted, Clean machine and

Chemical.
contaminated or replace with fresh
Due to:
incorrect developer drum of developer
Fogged, badly stored,

Faulty Plates.
excessively old or Replace plates
Due to:
faulty preparation
60

Grit particle in Clean covers with
Scratched or
developer scrub fresh machine
damaged plate
cover(s) developer
Seized final Free wheel(s)

drive wheel(s)
Damaged surface Replace roller(s)

on drive roller(s)
Hold down Re-adjust

roller misaligned hold down roller
Inconsistent Damaged
Replace roller
finishing applicator blade
Hardened finisher Clean roller(s) with

deposits on roller(s) warm water
Damaged
Replace rollers
squeegee rollers
Replenisher Fill replenisher

bottle empty bottle
Drain clean
Contaminated
and replace with
finisher
fresh finisher
Realign blade to contact

Spreader blade
entire width of finisher
misaligned
applicator roller
Finisher viscosity Change finisher

too high or low
NOTE: Ensure machine drive is allowed to run for 10 minutes

after initial start up to allow dispersion of hardened finisher.
61
Water recirculation
Water section
pump circuit Reset circuit breaker
inoperative
breaker tripped
Regulating valve on
processor partially Open regulating valve
or fully closed
Blocked spray bars Clean with suitable pointed tool
NOTE: This section is designed to operate only when the sensor is activated.
62
9.2 Electrical
Problem Condition Possible Cause Solution
Machine will not

start when Electrical supply Isolator
Switch on isolator
Power On switch lamp off switched off
is activated
Fuse blown or circuit

breaker tripped Replace fuse/re-set
in power supply circuit breaker
distribution box
Electrical supply Emergency stop Re-set emergency

lamp on switch activated stop switch
Top covers open Close covers
M.C.B. tripped Reset circuit

in processor breaker
Faulty Power On
Replace switch
switch
Loose electrical
Check wiring
connections
63
Brush drive, pump,

water sprays and Adjust detection
Sensor requires
heaters do not come height as described
adjustment
into operation when in Section 7.10
plate is inserted
Sensor unit faulty Replace sensor
R4 relay faulty Replace relay
Insufficient Heat controller Adjust

Pre-Heat set too low controller
Damaged Infra-Red
Replace heater(s)
heater(s)
64
10 Circuit Breaker and Fuse Schedule
10.1 Circuit Breaker Schedule
CB No. Circuit Protected Rating

1 Transformer, NW001 (TX630) 1A
2 Tank Heater (Developer) 3A
3 Drive Motor/PCB 3A
4 Gum Pump 3A
5 Developer Pump 3A
6 Water Recirculation Pumps 3A
7 Developer Replen Pump 3A
8 Plate Counter 1A
9 Fan Heater 7A
10 Scrub Motor & Gum Replen Pump 3A
11 24V D.C. Control 1A
12 Fan Heater 7A
13 Fan Heater 7A
14 Fill Pump 3A
15 Pre-Heat Cooling Fans 3A
16 Pre-Heat Temperature Controllers 3A
17 Hourly Replen Pump 3A
18 Electrical Interface 3A
10.2 Fuse Schedule
Warning
Disconnect power supply before removing fuses. Only replace with same rating, size and
type of fuse.
NOTE: All fuses are UL and CSA approved.
Circuit Protected Rating Size Type

Speed Control P.C.B 4A 20 x 5 mm Glass, Quick Blow
65
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66
12 Recommended Spare Parts List

12.1 Recommended Dealer/Distributor Spares
Part No. Description Qty

04 05 61 Timer, 0-30 seconds IA 24D (Pre-Heat/T5) 1
04 01 37 Timer, 0-60 seconds IA 24D (Replen/T1) 1
04 07 38 Timer, 0-3 minutes IAX2 24D (Busy Signal/T6) 1
04 10 58 Timer, 0-3 minutes N24D (Throughput/T7) 1
04 01 89 Timer, 0-5 minutes IAX2 24D (Process/T2) 1
04 15 99 Timer, 0-5 minutes IA 24D (Manual Replen/T9) 1
04 12 03 Timer, Hourly Dev. Replen C24DC (T8) 1
04 03 05 Timer, Auto Start Alarm ASAT 24D (T3) 1
04 00 86 Relay, 11-pin 1
04 00 98 Relay, 14-pin miniature 1
04 11 86 Relay, 25A 1
04 07 86 Relay, 25A Solid State 1
04 08 70 01 Gum Pump, AC-2CP-MD 1
04 07 11 02 Dev Pump, AC-5P-MD 1
04 12 02 Bellows Replen Pump 1
04 01 12 01 Tank Heater 1
04 01 24 Float Switch 1
04 10 52 Heater Element (ceramic) 1
04 10 53 Heater Element with Sensor (ceramic) 1
04 02 03 01 Plate Sensor 1
04 00 36 PCB, Speed Control 1
04 07 82 Temperature Probe, K Type 1
04 12 27 Temperature Controller, REX C-100 1
04 12 40 Temperature Controller, REX D-100 1
04 10 19 01 Scrub Motor 1
04 12 26 01 Drive Motor 1
04 07 49 Fan Heater 12" UL 1
04 08 88 Recirculation Pump 1
12-1
12.2 Recommended Customer/On-Site Spares
Part No. Description Qty

85 03 07 Bearing Block, Top 4
85 03 08 Bearing Block, Bottom 4
05 05 46 Torque Disc 4
05 08 35 Dev. Scrub Cover, 2" x 1.8 Mtrs 2
04 00 18 Cable Tie, Medium 4
85 04 06 01 Gearbox Bush, 6mm 4
85 04 06 02 Gearbox Bush, 12mm 8
04 08 45 Drive Motor Brush, SD12C LIS (S234) 2 pairs
06 00 41 O Ring, 12" Safi Tap (Viton) 4
06 00 40 O Ring, 34" Safi Tap (Viton) 4
06 03 63 Safi Tap 12" BSP 1
06 03 64 Safi Tap 34" BSP 1
06 00 66 O Ring, PP10/15 Filter (Viton) 1
06 03 09 Ball Valve, 12" PVC 2
06 00 63 Filter Element, 10" x 75 micron 1
04 01 34 Fuse 4A, 20 x 5mm 3
05 07 65 Connecting Gears (Drive Rollers) 2
12-2

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Technigraph FLP-1260 Plate Processor Service Manual

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FLP-1260 Plate Processor

(for the LUXEL P-9600CTP PLATESETTER)

Date of publication December 2000. Rev. G

Telephone No: +44 (01842) 755833/755834

This manual is valid for the FLP-1260 Plate Processor

Any differences between the manual and the

Amendments issued since publication

Amd. No. Date Section/Sub-section/Page affected

Section Sub Section Page

2.0 Machine Characteristics........................................................................................................................................................7

5.0 Installation Checkout ...............................................................................................................................................................17

7.0 Adjustments .............................................................................................................................................................................................21

8.0 Maintenance ...........................................................................................................................................................................................57

9.0 Fault Finding ..........................................................................................................................................................................................59

10 Circuit Breaker and Fuse Schedule ..............................................................................................................65

11 Illustrated Parts Breakdown...................................................................................................................................11-1

12 Recommended Spare Parts List ...................................................................................................................12-1

3 Phase + N Electrical Circuit Diagram Drg. No. 08 02 47

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1.0 Safety and Environmental Protection Summary

1.1 Safety Regulations

1.2 Safety Summary

Always observe the following precautions:

1.3 Environmental Protection Summary

1.4 Electromagnetic Compatibility

2.0 Machine Characteristics

1. Drive Rollers (and wheels).

2.2 Controls and Indicators (See Fig. 2.2)

2. Power Off Switch (Red).

3. Re-Entry Switch (White).

4. Forward and Reverse Switch (Amber).

5. Developer Fill Switch (White).

6. Manual Replen Switch.

7. Power Lamp (Green).

8. Drive Lamp (Green).

9. Replenishment Lamp (Green).

10. Process Lamp (Green).

11. Plate Counter.

12. Pre-Heat Controllers.

13. Developer Temperature Control/Display.

14. Ready Lamp (Green).

15. Busy Lamp (Amber).

16. Fault Lamp (Red).

17. Emergency Stop Buttons (x 4).

18. Input Sensor.

19. Exit Sensor.

20. Service Switch (Key Switch) Located in the Electrical Cabinet.

MODE MONI AREA MODE MONI AREA

SET SET 000002

RKC REX-F400 RKC REX-F400

This page has

Weight (Uncrated): Finishing Gum

1. Remove the packing material from the processor.

2. Ensure the following items are included with the processor.

100 02 08 Operators Guide ..............................................1

4.2 Set-Up Instructions

2. Set the processor in place.

3. Remove the top covers.

DEV HOURLY REPLEN

6. Connect the chiller unit to the processor as follows:

c. Plug the chiller into a separate switched power supply.

d. Connect chiller signal cable to underside of electrical enclosure.

7. Make electrical connections as follows:

8. Fill the developer tank (1 part developer to 9 parts water):