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PCF8574A
SCPS069F JULY 2001 REVISED NOVEMBER 2015
1 Features
Low Standby-Current Consumption of 10 A Max 3 Description
I2C to Parallel-Port Expander This 8-bit input/output (I/O) expander for the two-line
Open-Drain Interrupt Output bidirectional bus (I2C) is designed for 2.5-V to 6-V
VCC operation.
Compatible With Most Microcontrollers
Latched Outputs With High-Current Drive The PCF8574A device provides general-purpose
remote I/O expansion for most microcontroller
Capability for Directly Driving LEDs
families via the I2C interface [serial clock (SCL), serial
Latch-Up Performance Exceeds 100 mA Per data (SDA)].
JESD 78, Class II
The device features an 8-bit quasi-bidirectional I/O
port (P0P7), including latched outputs with high-
2 Applications current drive capability for directly driving LEDs. Each
Telecom Shelters: Filter Units quasi-bidirectional I/O can be used as an input or
Servers output without the use of a data-direction control
signal. At power on, the I/Os are high. In this mode,
Routers (Telecom Switching Equipment) only a current source to VCC is active.
Personal Computers
Personal Electronics Device Information (1)
PART NUMBER PACKAGE (PIN) BODY SIZE (NOM)
Industrial Automation
VQFN (20) 4.50 mm 3.50 mm
Products with GPIO-Limited Processors
PDIP (16) 19.30 mm 6.35 mm
PCF8574A SOIC (16) 10.30 mm 7.50 mm
TSSOP (20) 6.50 mm 4.40 mm
TVSOP (20) 5.00 mm 4.40 mm
VCC
SDA
I2C or SMBus Master
SCL P0
(e.g. Processor)
INT P1 Peripheral Devices
P2 RESET, ENABLE,
P3 or control inputs
PCF8574A
P4 INT or status
A0 P5 outputs
A1 P6 LEDs
A2 P7
GND
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PCF8574A
SCPS069F JULY 2001 REVISED NOVEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ....................................... 11
2 Applications ........................................................... 1 8.3 Feature Description................................................. 12
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 13
4 Revision History..................................................... 2 9 Application and Implementation ........................ 15
9.1 Application Information............................................ 15
5 Pin Configuration and Functions ......................... 3
9.2 Typical Application ................................................. 15
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings .................................... 4 10 Power Supply Recommendations ..................... 18
10.1 Power-On Reset Requirements ........................... 18
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4 11 Layout................................................................... 20
6.4 Thermal Information .................................................. 4 11.1 Layout Guidelines ................................................. 20
6.5 Electrical Characteristics........................................... 5 11.2 Layout Example .................................................... 20
6.6 I2C Interface Timing Requirements........................... 5 12 Device and Documentation Support ................. 21
6.7 Switching Characteristics .......................................... 5 12.1 Trademarks ........................................................... 21
6.8 Typical Characteristics .............................................. 6 12.2 Electrostatic Discharge Caution ............................ 21
7 Parameter Measurement Information .................. 8 12.3 Glossary ................................................................ 21
8 Detailed Description ............................................ 11 13 Mechanical, Packaging, and Orderable
8.1 Overview ................................................................. 11
Information ........................................................... 21
4 Revision History
Changes from Revision E (January 2015) to Revision F Page
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Deleted Ordering Information table. ....................................................................................................................................... 1
INT
P7
A0 1 16 VCC INT 1 20 P7
1 20
A1 2 15 SDA SCL 2 19 P6
SCL 2 19 P6
A2 3 14 SCL NC 3 18 NC
NC 3 18 NC
4
P0 4 13 INT SDA 17 P5
SDA 4 17 P5
5
P1 5 12 P7 VCC 16 P4
VCC 5 16 P4
P2 6 11 P6 A0 6 15 GND
A0 6 15 GND
P3 7 10 P5 A1 7 14 P3
A1 7 14 P3
GND 8 9 P4 NC 8 13 NC
NC 8 13 NC
A2 9 12 P2
A2 9 12 P2
P0 10 11 P1
10 11
P0
P1
Pin Functions
PIN
TYPE DESCRIPTION
NAME RGY DGV or PW DW or N
Address inputs 0 through 2. Connect directly to VCC or ground. Pullup
A[0..2] 6, 7, 9 6, 7, 9 1, 2, 3 I
resistors are not needed.
GND 15 15 8 Ground
INT 1 1 13 O Interrupt output. Connect to VCC through a pullup resistor.
NC 3, 8, 13, 18 3, 8, 13, 18 - Do not connect
4, 5, 6, 7,
10, 11, 12, 14, 10, 11, 12, 14,
P[0..7] 9, 10, 11, I/O P-port input/output. Push-pull design structure.
16, 17, 19, 20 16, 17, 19, 20
12
SCL 2 2 14 I Serial clock line. Connect to VCC through a pullup resistor
SDA 4 4 15 I/O Serial data line. Connect to VCC through a pullup resistor.
VCC 5 5 16 Voltage supply
6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range 0.5 7 V
(2)
VI Input voltage range 0.5 VCC + 0.5 V
VO Output voltage range (2) 0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 20 mA
IOK Output clamp current VO < 0 20 mA
IOK Input/output clamp current VO < 0 or VO > VCC 400 A
IOL Continuous output low current VO = 0 to VCC 50 mA
IOH Continuous output high current VO = 0 to VCC 4 mA
Continuous current through VCC or GND 100 mA
TJ Junction temperature 150 C
Tstg Storage temperature range 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
120 90
fSCL = 100 kHz SCL = VCC
All I/Os unloaded 80 All I/Os unloaded
100
VCC = 5 V 70
Supply Current (mA)
70 ISINK (mA) 14
60 12 TA = 25C
50 10
40 8
30 6
20 4 TA = 85C
10 2
0 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.1 0.2 0.3 0.4 0.5 0.6
Supply Voltage (V) Vol (V)
Figure 3. Supply Current vs Supply Voltage Figure 4. I/O Sink Current vs Output Low Voltage
25 35
VCC = 3.3 V VCC = 5 V
30 TA = 40C
20 TA = 40C
25 TA = 25C
ISINK (mA)
TA = 25C
15
ISINK (mA)
20
10 15
10
TA = 85C TA = 85C
5
5
0 0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.1 0.2 0.3 0.4 0.5 0.6
VOL (V) VOL (V)
Figure 5. I/O Sink Current vs Output Low Voltage Figure 6. I/O Sink Current vs Output Low Voltage
ISOURCE (mA)
VOL (mV)
Figure 7. I/O Output Low Voltage vs Temperature Figure 8. I/O Source Current vs Output High Voltage
45 45
VCC = 3.3 V VCC = 5 V
40 TA = 25C 40 TA = 40C
35 TA = 40C 35
TA = 25C
30 ISOURCE (mA) 30
ISOURCE (mA)
25 25
20 20
15 15
TA = 85C
10 TA = 85C 10
5 5
0 0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VCC VOH (V) VCC VOH (V)
Figure 9. I/O Source Current vs Output High Voltage Figure 10. I/O Source Current vs Output High Voltage
350
300 VCC = 5 V
250
VCC VOH (V)
VCC = 3.3 V
150
100
50
0
50 25 0 25 50 75 100 125
Temperature (C)
RL = 1 k
Pn
DUT
CL = 10 pF to 400 pF
LOAD CIRCUIT
tscl tsch
0.7 VCC
SCL
0.3 VCC
ticr tPHL tsts
tbuf ticf
tsp tPLH
0.7 VCC
SDA
0.3 VCC
ticf ticr tsdh tsps
tsth tsds Repeat
Start Stop
Start or
Condition Condition
Repeat
Start
Condition VOLTAGE WAVEFORMS
S 0 1 0 0 A2 A1 A0 1 A Data 1 A Data 3 1 P
1 2 3 4 5 6 7 8 A A
tir B
tir
B
INT
A
tiv tsps
A
Data
Into Data 1 Data 2 Data 3
Port
tiv tir
View AA View BB
0.7 VCC
SCL W A D
0.3 VCC
Slave
Acknowledge
SDA
tpv
Pn
RL = 1 k RL = 4.7 k
CL = 10 pF to 400 pF CL = 10 pF to 400 pF
GND GND
SDA LOAD CONFIGURATION INTERRUPT LOAD CONFIGURATION
8 Detailed Description
8.1 Overview
The PCF8574A device provides general-purpose remote I/O expansion for most microcontroller families via the
I2C interface [serial clock (SCL), serial data (SDA)].
The device features an 8-bit quasi-bidirectional I/O port (P0P7), including latched outputs with high-current drive
capability for directly driving LEDs. Each quasi-bidirectional I/O can be used as an input or output without the use
of a data-direction control signal. At power on, the I/Os are high. In this mode, only a current source to VCC is
active. An additional strong pullup to VCC allows fast rising edges into heavily loaded outputs. This device turns
on when an output is written high and is switched off by the negative edge of SCL. The I/Os should be high
before being used as inputs.
The PCF8574A device provides an open-drain output (INT) that can be connected to the interrupt input of a
microcontroller. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After
time, tiv, INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed
to the original setting or data is read from, or written to, the port that generated the interrupt. Resetting occurs in
the read mode at the acknowledge bit after the rising edge of the SCL signal, or in the write mode at the
acknowledge bit after the high-to-low transition of the SCL signal. Interrupts that occur during the acknowledge
clock pulse can be lost (or be very short) due to the resetting of the interrupt during this pulse. Each change of
the I/Os after resetting is detected and, after the next rising clock edge, is transmitted as INT. Reading from, or
writing to, another device does not affect the interrupt circuit.
By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data
on its ports without having to communicate via the I2C bus. Therefore, the PCF8574A device can remain a
simple slave device.
PCF8574A
13 Interrupt
INT LP Filter
Logic
1 4
A0 P0
2
A1 5
3 P1
A2 6
P2
14
SCL 7
Input I2C Bus P3
Shift I/O
15 Filter Control 8 Bit
SDA Register Port 9
P4
10
P5
11
P6
12
P7
Write Pulse
16 Read Pulse
VCC Power-On
8 Reset
GND
100 A
Data From
D Q
Shift Register
FF
CI P0P7
S
Power-On
Reset
D Q
GND
FF
CI
Read Pulse S
To Interrupt
Data to Logic
Shift Register
BIT
BYTE
7 (MSB) 6 5 4 3 2 1 0 (LSB)
I2C slave address L H H H A2 A1 A0 R/W
I/O data bus P7 P6 P5 P4 P3 P2 P1 P0
SCL 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
ACK
Start From Slave
ACK ACK
Condition From Slave From Slave
R/W
Slave Address Data Data
SDA S 0 1 1 1 A2 A1 A0 0 A P7 P6 1 P0 A P7 P0 A
P5
Write to
Port
P5 Output
Voltage
P5 Pullup IOH
Output IOHT
Current
INT
tir
SCL 1 2 3 4 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
5
SDA S 0 1 1 1 A2 A1 A0 1 A P7 P6 P5 P4 P3 P2 P1 P0 A P7 P6 P5 P4 P3 P2 P1 P0 A P7 P6
Read From
Port
Data Into
Port
P7 to P0 P7 to P0
th tsu
INT
A. A low-to-high transition of SDA while SCL is high is defined as the stop condition (P). The transfer of data can be
stopped at any moment bya stop condition. When this occurs, data present at the latest ACK phase is valid (output
mode). Input data is lost.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
3
A2 P6 11 Controlled Device
2 (e.g., CBT device)
ENABLE
A1
P7 12
1
A0 B
GND ALARM
8
Subsystem 3
(e.g., alarm system)
VCC
(1) The SCL and SDA pins must be pulled up to VCC because if SCL and SDA are pulled up to an auxiliary power supply
that could be powered on while VCC is powered off, then the supply current, ICC, will increase as a result.
A. Device address is configured as 0100000 for this example.
B. P0, P2, and P3 are configured as outputs.
C. P1, P4, and P5 are configured as inputs.
D. P6 and P7 are not used and must be configured as outputs.
LED 100 k
VCC
LEDx
3.3 V 5V
VCC LED
LEDx
25 1.8
Standard-mode
Fast-mode 1.6
20 1.4
1.2
Rp(max) (kOhm)
Rp(min) (kOhm)
15
1
0.8
10
0.6
5 0.4
VCC_TRR_GND
Time
Time to Re-Ramp
VCC_RT VCC_FT VCC_RT
Figure 23. VCC is Lowered Below 0.2 V or 0 V and Then Ramped Up to VCC
VCC
Ramp-Down Ramp-Up
VCC_TRR_VPOR50
Time
Time to Re-Ramp
VCC_FT VCC_RT
Figure 24. VCC is Lowered Below the POR Threshold, Then Ramped Back Up to VCC
Table 1 specifies the performance of the power-on reset feature for PCF8574A for both types of power-on reset.
Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width
(VCC_GW) and height (VCC_GH) are dependent on each other. The bypass capacitance, source impedance, and
device impedance are factors that affect power-on reset performance. Figure 25 and Table 1 provide more
information on how to measure these specifications.
VCC
VCC_GH
Time
VCC_GW
VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the
registers and the I2C/SMBus state machine are initialized to their default states. The value of VPOR differs based
on the VCC being lowered to or from 0. Figure 26 and Table 1 provide more details on this specification.
VCC
VPOR
VPORF
Time
POR
Time
11 Layout
LEGEND
xxxxxxxx
Power or GND Plane
x
To I2C Master
VIA to Power Plane
xxxxxxxx
VCC
VIA to GND Plane
xxxx xxxxxxxx
By-pass/De-coupling
capacitors
xxxx xxxxxxxx
xxxx
xxxx
1 A0 VCC 16
xxxx
2 A1 SDA 15
PCF8574A
xxxx
3 A2 SCL 14
4 P0 INT 13
xxxx
5 P1 P7 12
xxxx
To I/Os
6 P2 P6 11
To I/Os
7 P3 P5 10
xxxx
8 GND P4 9
xxxx
GND
12.3 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
www.ti.com 30-Apr-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
PCF8574ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF574A
& no Sb/Br)
PCF8574ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF574A
& no Sb/Br)
PCF8574ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PF574A
& no Sb/Br)
PCF8574ADW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8574A
& no Sb/Br)
PCF8574ADWE4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8574A
& no Sb/Br)
PCF8574ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8574A
& no Sb/Br)
PCF8574ADWR ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 PCF8574A
& no Sb/Br)
PCF8574ADWRE4 ACTIVE SOIC DW 16 TBD Call TI Call TI -40 to 85
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 30-Apr-2016
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
PCF8574ARGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PF574A
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Nov-2015
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Nov-2015
Pack Materials-Page 2
MECHANICAL DATA
0,23
0,40 0,07 M
0,13
24 13
0,16 NOM
4,50 6,60
4,30 6,20
Gage Plane
0,25
08
0,75
1 12
0,50
A
Seating Plane
0,15
1,20 MAX 0,08
0,05
PINS **
14 16 20 24 38 48 56
DIM
4073251/E 08/00
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