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Journal of Chemical Engineering of Japan, Vol. 37, No. 6, pp. 804807, 2004
Keywords: Adsorbent, Heavy Metal Ion, Molecular Imprinting, Thermosensitive Gel, Polymerizable Surfactant
A thermosensitive microgel adsorbent, which adsorbs and desorbs a specific heavy metal ion by the
temperature swing, was developed. The microgels was prepared by the emulsion polymerization using
anionic polymerizable surfactant. N-Isopropylacrylamide (NIPA) and N-(4-vinyl)benzyl ethylenediamine
were used as the primary monomer and the chelating monomer, respectively. In the preparation, the
molecular imprinting technique using Cu(II) ions as a target heavy metal ion was adopted. The
thermosensitive microgel adsorbents were dispersed stably even if the temperature of the suspension
exceeded the transition temperature of poly(NIPA), and Cu(II) ions were adsorbed quickly in response
to the temperature change.
Introduction
In the previous paper (Kanazawa et al., 2003b),
we proposed a novel gel adsorbent, which adsorbs and
desorbs heavy metal ions repeatedly by the temperature swing. Such a gel adsorbent was prepared by
copolymerizing N-isopropylacrylamide (NIPA) with
the chelating monomer using the molecular imprinting technique. NIPA is well known as a representative
monomer for the preparation of thermosensitive gels.
Thermosensitive gels swell below the transition temperature in water, while shrink above the transition temperature because of the transition to the hydrophobicity.
The transition temperature of NIPA gel is about 32C
(Ito, 1989). In the previous work, N-(4-vinyl)benzyl
ethylenediamine (Vb-EDA) was prepared as a chelating
monomer, and was copolymerized with NIPA in the
presence of Cu(II) ions as a target heavy metal ion.
The adsorption amount of Cu(II) ions on the imprinted
gel depended on the temperature and the maximum adsorption amount was observed at a specific temperature where the size of gel network corresponds to that
memorized in the preparation of gel. The gel adsorbed
and desorbed repeatedly by the temperature swing.
Furthermore, the gel adsorbed Cu(II) ions selectively.
Figure 1 shows schematically the mechanism of adsorption and desorption by the temperature change.
In the separation process, the adsorption rate is
Received on November 14, 2003. Correspondence concerning
this article should be addressed to S. Sakohara (E-mail address:
sakohara@hiroshima-u.ac.jp).
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Table 1
Monomer
N-Isopropylacrylamide (NIPA)
Chelate (complex of Vb-EDA and Cu(II)
250500
03.6
Cross-linker
N,N-Methylenebisacrylamide (MBAA)
12.525
Surfactant
SE-10
0.951.8
Accelerator
N,N,N,N-Tetramethylethylenediamine
2.55
Initiator
Ammonium peroxodisulfate
2.55
Fig. 1
Fig. 2
Experimental
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Fig. 3
Fig. 5
25 mol/m3 and Cu(Vb-EDA) 2 of various concentrations. Where Cu(Vb-EDA) 2 represents the complex of
the chelating monomers, Vb-EDA, and a Cu(II) ion.
The average diameter of microgels increased with an
increasing concentration of chelating monomers and
approached to a constant value. The increase in the average diameter of microgels is probably due to the aggregation of microgels caused by neutralization of
the electric charge of the polymerizable surfactant with
the chelating complex. By increasing the concentration of the chelating complex above 2.4 mol/m3 the
formation of precipitate was observed. The result
shown in Figure 3 was obtained by removing such precipitates.
The inset in Figure 3 shows an example of the
particle size distributions. The distribution was obtained with a sample which did not contain the precipitates mentioned above. It is known that the size
distribution of particles prepared by emulsion polymerization using the polymerizable surfactant was relatively wide (Kanazawa et al., 2003a).
2.2 Temperature dependence of particle size
Figure 4 shows the temperature dependence of
the number base average diameter of imprinted
microgels. The sample microgels were prepared with
NIPA of 250 mol/m 3, MBAA of 12.5 mol/m 3 and
Cu(Vb-EDA)2 of 3.0 mol/m3. It was observed that the
microgels were suspended stably even if the temperature of the suspension exceeded the transition temperature of poly(NIPA), about 32C. The average diameter
of the microgel decreased with an increasing suspension temperature, and was kept constant above 35C
which is very close to the transition temperature of
poly(NIPA). The gel diameter in such a shrunk state
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Fig. 4
corresponds to that prepared by the emulsion polymerization at 50C. From this result and our previous
work (Kanazawa et al., 2003b), it can be considered
that the complex structure of Vb-EDA and Cu(II) ions
engraved in the microgels appears above 35C. In other
words, the maximum adsorption amount of Cu(II) ions
can be obtained above 35C.
2.3 Temperature dependence of the adsorption
amount of Cu(II) ions and the adsorption rate
Figure 5 shows the time course of the adsorption
amount of Cu(II) ions on the imprinted microgels. The
sample microgels were prepared with NIPA of 500
mol/m 3, MBAA of 25 mol/m 3 and Cu(Vb-EDA) 2 of
3.4 mol/m3. This preparation condition was selected to
synthesize relatively large gel particles.
The microgels were swollen previously at 10C
in the solution containing Cu(II) ions, and then the temperature of the solution was increased to 50C as mentioned in Section 1.2. At the swelling state of 10C,
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