Journal Paper Critique #4

An Overview and Comparison of Various Refrigeration Methods for Microelectronics

Cooling

SCITECH

David, Gichelle B.
BSECE-4B

Instructor: ENGR. Christopher C. Fujimoto

February 29, 2016

http://www.ieee.org

An Overview and Comparison of Various Refrigeration Methods for

Microelectronics Cooling
Victor Chiriac and Florea Chiriac
ABSTRACT
Small-scale refrigerators, termed mesoscale refrigerators, are possible cooling
solutions for high-power microelectronics. The performance of mesoscale refrigerators
has not yet been experimentally demonstrated, although a recent theoretical model
indicated that at temperatures near room temperature and above, a vapor compression
refrigerator may compete successfully with a thermoelectric cooler having extremely
high efficiency.
The present study proposes an overview and comparison between several
alternative refrigeration methods used to actively cool the electronic components in a
Power Microelectronics System. Three systems are evaluated, namely a miniaturized
classical mechanical vapor compression system using an off-the-shelf compressor, a
miniaturized system with ejector used for vapor compression, and finally a miniaturized
refrigeration system with absorption, designed for similar cooling powers. The efficiency
and COP of each system will be evaluated, together with associated reliability and cost
related issues.
The specifics of all proposed systems are based on the optimized performance of
the miniaturized components of the various refrigeration systems, designed to fit the
smaller scale power electronics populating a Printed Circuit Board (PCB) in a HighPower Microelectronics System. For all designs, an array of micro-channels is used for
vaporizer/condenser units. Several components of the refrigeration system are
thermally evaluated for cooling powers ranging from 20- 100W, with direct application to
high power telecom units. Several advantages and/or disadvantages of these
refrigeration-based cooling methods are highlighted. The study is concluded by
identifying the pros and cons of implementing such systems to real-life microelectronics
applications.
CRITIQUE
System of issue being investigated
The research problem being addressed is the increased heat flux reached by
the individual components which is leading to failure or faulty operation. It also
determined the large size of the typical compression refrigeration system.

Synopsis of questions being investigated

There are no questions that were asked in this study. All process and
investigations that are given is explained very well and it was clear to the reader.
Objectives of the research work or investigation
The authors enumerated the objectives of their study and it was clearly
explained for the reader. The objectives of the study is to provide a review of several
refrigeration techniques with application to microelectronics cooling, identify the pros
and cons of each of the methods, in terms of their efficiency, reliability and cost and
establish performance vs. size comparison, to serve as the basis for the enhanced
cooling of future miniaturized refrigeration applications.
Experiment Environment
The authors had an experiment to compare the microelectronics cooling in terms
of size, efficiency, reliability, performance and cost. This is done by incorporating the
proposed miniaturized refrigeration system in direct contact with the heat dissipating
components (packages) populating the PCB.
Details of system being developed
The study used a formulas that will determine the property and characteristics of
the microelectronics cooling. It is detailed and had a figures to be able to understand by
the reader.

CONCLUSION AND RECOMMENDATION

The present study proposes an overview and comparison between several
alternative refrigeration methods used to actively cool the electronic components in a
Power Microelectronics System. The specifics of all proposed systems are based on the
optimized performance of the miniaturized components of the various refrigeration
systems, designed to fit the smaller scale power electronics populating a Printed Circuit
Board (PCB) in a High-Power Microelectronics System.
The absorption refrigeration system leads to a COP of ~ 0.45 0.5, lower than
for the mechanical compression system (COP ~ 4.24) but higher than the ejector
compressor system (~ 0.12). However, the absorption system has several advantages
over the previous two: the cost is lower, and has better reliability (no moving parts, and
easier to manufacture, build and develop).

Overall, the study establishes a baseline performance for various types of

refrigerating designs, to serve as comparison basis for future miniaturized refrigeration
systems.

RELEVANCE TO SOCIETY
The microelectronic cooling is very relevant to the society. The system or device
can be minimized its sized and at the same time increasing the quality of its
performance using microelectronics.