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Atmel-42181DSSAM-D21_Summary09/2014
SMART
Features
z Processor
z ARM Cortex-M0+ CPU running at up to 48MHz
z Single-cycle hardware multiplier
z Micro Trace Buffer (MTB)
z Memories
z 32/64/128/256KB in-system self-programmable Flash
z 4/8/16/32KB SRAM Memory
z System
z Power-on reset (POR) and brown-out detection (BOD)
z Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M) and 48MHz to 96MHz Fractional
Digital Phase Locked Loop (FDPLL96M)
z External Interrupt Controller (EIC)
z 16 external interrupts
z One non-maskable interrupt
z Two-pin Serial Wire Debug (SWD) programming, test and debugging interface
z Low Power
z Idle and standby sleep modes
z SleepWalking peripherals
z Peripherals
z 12-channel Direct Memory Access Controller (DMAC)
z 12-channel Event System
z Up to five 16-bit Timer/Counters (TC), configurable as either:
z One 16-bit TC with compare/capture channels
z One 8-bit TC with compare/capture channels
z One 32-bit TC with compare/capture channels, by using two TCs
z Three 24-bit Timer/Counters for Control (TCC), with extended functions:
z Up to four compare channels with optional complementary output
z Generation of synchronized pulse width modulation (PWM) pattern across port pins
z Deterministic fault protection, fast decay and configurable dead-time between complementary output
z Dithering that increase resolution with up to 5 bit and reduce quantization error
z 32-bit Real Time Counter (RTC) with clock/calendar function
z Watchdog Timer (WDT)
z CRC-32 generator
z One full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface
z Embedded host and device function
z Eight endpoints
z Up to six Serial Communication Interfaces (SERCOM), each configurable to operate as either:
z USART with full-duplex and single-wire half-duplex configuration
z I2C up to 3.4MHz
z SPI
z LIN slave
z One two-channel Inter-IC Sound (I2S) interface
z One 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 20 channels
z Differential and single-ended input
z 1/2x to 16x programmable gain stage
z Automatic offset and gain error compensation
z Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution
z 10-bit, 350ksps Digital-to-Analog Converter (DAC)
z Two Analog Comparators (AC) with window compare function
z Peripheral Touch Controller (PTC)
z 256-Channel capacitive touch and proximity sensing
z I/O
z Up to 52 programmable I/O pins
z Drop in compatible with SAM D20
z Packages
z 64-pin TQFP, QFN
z 48-pin TQFP, QFN
z 32-pin TQFP, QFN
z Operating Voltage
z 1.62V 3.63V
1.
Configuration Summary
SAM D21J
SAM D21G
SAM D21E
Pins
64
48
32
52
38
26
Flash
256/128/64/32KB
256/128/64/32KB
256/128/64/32KB
SRAM
32/16/8/4KB
32/16/8/4KB
32/16/8/4KB
8/4/2
8/4/2
6/4/2
DMA channels
12
12
12
USB interface
20
14
10
Yes
Yes
Yes
1 32-bit value or
2 16-bit values
1 32-bit value or
2 16-bit values
1 32-bit value or
2 16-bit values
16
16
16
16x16
12x10
10x6
Packages
Oscillators
48MHz
QFN
TQFP
QFN
TQFP
QFN
TQFP
SAM D21J
SAM D21G
SAM D21E
12
12
12
SW Debug Interface
Yes
Yes
Yes
Yes
Yes
Yes
2.
Ordering Information
SAMD 21 E 15 A - M U T
Product Family
Package Carrier
Product Series
21 = Cortex M0 + CPU, Basic Feature Set
+ DMA + USB
Package Grade
O
Pin Count
U = 40 - 85 C Matte Sn Plating
E = 32 Pins
G = 48 Pins
J = 64 Pins
Package Type
A = TQFP
M = QFN
18 = 256KB
17 = 128KB
16 = 64KB
15 = 32KB
Device Variant
A = Default Variant
2.1
SAM D21E
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
TQFP32
Tray
TQFP32
QFN32
Tray
ATSAMD21E15A-MUT
QFN32
ATSAMD21E16A-AU
TQFP32
Tray
TQFP32
QFN32
Tray
ATSAMD21E16A-MUT
QFN32
ATSAMD21E17A-AU
TQFP32
Tray
TQFP32
QFN32
Tray
QFN32
ATSAMD21E15A-AU
ATSAMD21E15A-AUT
ATSAMD21E15A-MU
ATSAMD21E16A-AUT
ATSAMD21E16A-MU
ATSAMD21E17A-AUT
ATSAMD21E17A-MU
ATSAMD21E17A-MUT
32K
64K
128K
4K
8K
16K
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
TQFP32
Tray
TQFP32
QFN32
Tray
QFN32
Package
Carrier Type
TQFP48
Tray
TQFP48
QFN48
Tray
ATSAMD21G15A-MUT
QFN48
ATSAMD21G16A-AU
TQFP48
Tray
TQFP48
QFN48
Tray
ATSAMD21G16A-MUT
QFN48
ATSAMD21G17A-AU
TQFP48
Tray
TQFP48
QFN48
Tray
ATSAMD21G17A-MUT
QFN48
ATSAMD21G18A-AU
TQFP48
Tray
TQFP48
QFN48
Tray
QFN48
Package
Carrier Type
TQFP64
Tray
TQFP64
QFN64
Tray
QFN64
ATSAMD21E18A-AU
ATSAMD21E18A-AUT
ATSAMD21E18A-MU
256K
32K
ATSAMD21E18A-MUT
2.2
SAM D21G
Ordering Code
FLASH (bytes)
SRAM (bytes)
ATSAMD21G15A-AU
ATSAMD21G15A-AUT
ATSAMD21G15A-MU
ATSAMD21G16A-AUT
ATSAMD21G16A-MU
ATSAMD21G17A-AUT
ATSAMD21G17A-MU
ATSAMD21G18A-AUT
ATSAMD21G18A-MU
32K
64K
128K
256K
4K
8K
16K
32K
ATSAMD21G18A-MUT
2.3
SAM D21J
Ordering Code
FLASH (bytes)
SRAM (bytes)
ATSAMD21J15A-AU
ATSAMD21J15A-AUT
ATSAMD21J15A-MU
ATSAMD21J15A-MUT
32K
4K
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
TQFP64
Tray
TQFP64
QFN64
Tray
ATSAMD21J16A-MUT
QFN64
ATSAMD21J17A-AU
TQFP64
Tray
TQFP64
QFN64
Tray
ATSAMD21J17A-MUT
QFN64
ATSAMD21J18A-AU
TQFP64
Tray
TQFP64
QFN64
Tray
QFN64
ATSAMD21J16A-AU
ATSAMD21J16A-AUT
ATSAMD21J16A-MU
ATSAMD21J17A-AUT
ATSAMD21J17A-MU
ATSAMD21J18A-AUT
ATSAMD21J18A-MU
ATSAMD21J18A-MUT
64K
128K
256K
8K
16K
32K
Block Diagram
SWCLK
CORTEX-M0+
PROCESSOR
Fmax 48 MHz
SERIAL
WIRE
SWDIO
MEMORY
TRACE BUFFER
IOBUS
DEVICE
SERVICE
UNIT
256/128/64/32KB
NVM
32/16/8/4KB
RAM
NVM
CONTROLLER
Cache
SRAM
CONTROLLER
PERIPHERAL
ACCESS CONTROLLER
AHB-APB
BRIDGE B
AHB-APB
BRIDGE A
USB FS
DEVICE
MINI-HOST
DP
DM
SOF 1KHZ
AHB-APB
BRIDGE C
PERIPHERAL
ACCESS CONTROLLER
SYSTEM CONTROLLER
DMA
PAD0
PAD1
PAD2
PAD3
66xxSERCOM
SERCOM
VREF
OSCULP32K
OSC32K
XIN32
XOUT32
DMA
PERIPHERAL
ACCESS CONTROLLER
BOD33
HIGH SPEED
BUS MATRIX
PORT
XOSC32K
DMA
OSC8M
5 x TIMER / COUNTER
8 x Timer Counter
WO0
WO1
XOSC
FDPLL96M
DMA
POWER MANAGER
CLOCK
CONTROLLER
RESETN
RESET
CONTROLLER
SLEEP
CONTROLLER
3x TIMER / COUNTER
FOR CONTROL
WO0
WO1
PORT
DFLL48M
XIN
XOUT
EVENT SYSTEM
3.
(2)
WOn
AIN[19..0]
DMA
20-CHANNEL
12-bit ADC 350KSPS
VREFA
VREFB
CMP[1..0]
GCLK_IO[7..0]
2 ANALOG
COMPARATORS
GENERIC CLOCK
CONTROLLER
REAL TIME
COUNTER
DMA
VOUT
10-bit DAC
WATCHDOG
TIMER
EXTINT[15..0]
NMI
AIN[3..0]
VREFA
EXTERNAL INTERRUPT
CONTROLLER
PERIPHERAL
TOUCH
CONTROLLER
DMA
INTER-IC
SOUND
CONTROLLER
X[15..0]
Y[15..0]
MCK[1..0]
SCK[1..0]
SD[1..0]
FS[1..0]
1. Some products have different number of SERCOM instances, Timer/Counter instances, PTC signals and ADC
signals.
2. The three TCC instances have different configurations, including the number of Waveform Output (WO) lines.
Pinout
4.1
SAM D21J
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PB03
PB02
PB01
PB00
PB31
PB30
PA31
PA30
VDDIN
VDDCORE
GND
PA28
RESETN
PA27
PB23
PB22
4.
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDIO
GND
PA25
PA24
PA23
PA22
PA21
PA20
PB17
PB16
PA19
PA18
PA17
PA16
VDDIO
GND
25
26
27
28
29
30
31
32
24
17
18
19
20
21
22
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PA08
PA09
PA10
PA11
VDDIO
GND
PB10
PB11
PB12
PB13
PB14
PB15
PA12
PA13
PA14
PA15
PA00
PA01
PA02
PA03
PB04
PB05
GNDANA
VDDANA
PB06
PB07
PB08
PB09
PA04
PA05
PA06
PA07
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED OUTPUT SUPPLY
RESET PIN
Atmel | SMART SAM D21 [DATASHEET SUMMARY]
Atmel-42181DSSAM-D21_Summary09/2014
48
47
46
45
44
43
42
41
40
39
38
37
PB03
PB02
PA31
PA30
VDDIN
VDDCORE
GND
PA28
RESETN
PA27
PB23
PB22
SAM D21G
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
VDDIO
GND
PA25
PA24
PA23
PA22
PA21
PA20
PA19
PA18
PA17
PA16
13
14
15
16
17
18
19
20
21
22
23
24
PA00
PA01
PA02
PA03
GNDANA
VDDANA
PB08
PB09
PA04
PA05
PA06
PA07
PA08
PA09
PA10
PA11
VDDIO
GND
PB10
PB11
PA12
PA13
PA14
PA15
4.2
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED OUTPUT SUPPLY
RESET PIN
10
32
31
30
29
28
27
26
25
PA31
PA30
VDDIN
VDDCORE
GND
PA28
RESETN
PA27
SAM D21E
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
PA25
PA24
PA23
PA22
PA19
PA18
PA17
PA16
9
10
11
12
13
14
15
16
PA00
PA01
PA02
PA03
PA04
PA05
PA06
PA07
VDDANA
GND
PA08
PA09
PA10
PA11
PA14
PA15
4.3
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED OUTPUT SUPPLY
RESET PIN
11
5.
Product Mapping
Code
0x00000000
0x00000000
Internal Flash
Code
0x00400000
Reserved
0x1FFFFFFF
0x20000000
SRAM
0x20008000
AHB-APB Bridge C
SRAM
0x42000000
Internal SRAM
0x42000400
AHB-APB
0x42000800
AHB-APB
Bridge A
0x42000C00
PAC2
0x20000000
0x20007FFF
Undefined
EVSYS
SERCOM0
0x40000000
0x40000000
Peripherals
AHB-APB
Bridge B
0x43000000
Reserved
0x60000000
SERCOM1
0x42001000
0x41000000
SERCOM2
0x42001400
SERCOM3
0x42000000
AHB-APB
Bridge C
0x42FFFFFF
0x42001800
SERCOM4
0x42001C00
SERCOM5
System
Undefined
0xE0000000
0x42002000
Reserved
0x60000200
Reserved
0xE000E000
TCC0
0x42002400
SCS
0xE0000000
0xE000F000
System
Reserved
0xE00FF000
0xFFFFFFFF
TCC1
0x42002800
TCC2
0x42002C00
ROMTable
0xE0100000
TC3
0x42003000
Reserved
0xFFFFFFFF
AHB-APB Bridge A
0x41002000
0x41004000
0x41004400
0x41004800
0x41005000
0x41006000
PTC
0x42005000
MTB
EIC
0x41007000
0x40001C00
DAC
0x42004C00
USB
RTC
0x40001800
AC
0x42004800
DMAC
WDT
0x40001400
ADC
0x42004400
PORT
GCLK
0x40001000
TC7
0x42004000
NVMCTRL
SYSCTRL
0x40000C00
TC6
0x42003C00
DSU
PM
0x40000800
Reserved
0x40FFFFFF
0x42003800
PAC1
PAC0
0x40000400
TC5
AHB-APB Bridge B
0x41000000
0x40000000
TC4
0x42003400
I2S
0x42005400
Reserved
0x41FFFFFF
Reserved
0x42FFFFFF
This figure represents the full configuration of the Atmel SAM D21 with maximum flash and SRAM capabilities and a full
set of peripherals. Refer to the Configuration Summary on page 3 for details.
12
6.
6.1
6.1.1
Features
Configuration option
Interrupts
32
Data endianness
Little-endian or big-endian
Little-endian
SysTick timer
Present or absent
Present
0, 1, 2
0, 1, 2, 3, 4
Present or absent
Present
Multiplier
Fast or small
Present or absent
Present
Not supported
Present or absent
Present
Unprivileged/Privileged support
Present or absent
Absent(1)
Not present
Present or absent
Absent
32-bit
Note:
1.
Single 32-bit AMBA-3 AHB-Lite system interface that provides connections to peripherals and all system
memory, including flash and RAM
Single 32-bit I/O port bus interfacing to the PORT with one-cycle loads and stores
13
7.
Packaging Information
7.1
Thermal Considerations
7.1.1
7.1.2
Package Type
JA
JC
32-pin TQFP
68 C/W
25.8 C/W
48-pin TQFP
78.8 C/W
12.3 C/W
64-pin TQFP
66.7 C/W
11.9 C/W
32-pin QFN
37.2 C/W
3.1 C/W
48-pin QFN
33 C/W
11.4 C/W
64-pin QFN
33.5 C/W
11.2 C/W
Junction Temperature
The average chip-junction temperature, TJ, in C can be obtained from the following:
where:
z
JC = package thermal resistance, Junction-to-case thermal resistance (C/W), provided in Table 7-1.
HEATSINK = cooling device thermal resistance (C/W), provided in the device datasheet.
From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary
or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average
chip-junction temperature TJ in C.
14
7.2
Package Drawings
7.2.1
64-pin TQFP
Table 7-2.
300
Table 7-3.
mg
Package Characteristics
MSL3
Package Reference
MS-026
JESD97 Classification
E3
15
7.2.2
64-pin QFN
Table 7-5.
200
Table 7-6.
mg
Package Characteristics
MSL3
Package Reference
MO-220
JESD97 Classification
E3
16
7.2.3
48-pin TQFP
Table 7-8.
140
Table 7-9.
mg
Package Characteristics
MSL3
MS-026
JESD97 Classification
E3
17
7.2.4
48-pin QFN
mg
MSL3
MO-220
JESD97 Classification
E3
18
7.2.5
32-pin TQFP
mg
MSL3
MS-026
JESD97 Classification
E3
19
7.2.6
32-pin QFN
mg
MSL3
MO-220
JESD97 Classification
E3
20
7.3
Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Profile Feature
Green Package
3C/s max
150-200C
60-150s
30s
260C
Ramp-down Rate
6C/s max
8 minutes max
21
Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1. Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
2.2
2.3
SAM D21E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SAM D21G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SAM D21J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1
4.2
4.3
SAM D21J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SAM D21G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SAM D21E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5. Product Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6. Processor And Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1
7. Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.1
7.2
7.3
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
22
Atmel Corporation
T: (+1)(408) 441.0311
F: (+1)(408) 436.4200
www.atmel.com