CHAPTER 1:

INTRODUCTION
1.1GENERAL
General Requirements for Temporary Sanitary Facilities for
Trade Fairs
1.
All used water discharged from the Trade Fair operation must
be collected and disposed of via the temporary sanitary facilities.
No used water shall be discharged into drains, soil and surrounding
environment.
2.
Approval from PUB(WRN) on the design of the temporary
sanitary facilities must be obtained prior to commencement of Trade
Fair Operation. The design shall be in accordance with the General
Requirements for temporary sanitary facilities for Trade Fairs. The
design submission to PUB(WRN) shall include the detailed design
and layout plan of the temporary sanitary facilities and NEA's Trade
Fair license permit.
3
The used water from the Trade Fair operations shall be either
collected in holding tank(s) and be disposed of by tankering by a
NEAs Licensed Waste Collector (LWC) or be discharged into the
existing public sewers if available via a pumped system or other
means subject to the site condition and approval of WRN(PUB). In
addition, the following requirements shall be complied with:
(a) If holding tank is proposed for collection and disposal of
used water, the holding tank shall be made of reinforced
concrete (RC), steel or GRP and provided either under or above
ground.
(b) The design calculation on the capacity of all holding tank(s)
shall be based on the parameters given in the Code of Practice
on Sewerage and Sanitary Works and the flow rates of the
water fittings given in the Code of Practice for Water Services.
In addition, if disposal of used water is by tankering by LWC,
the total capacity of holding tank(s) incorporated in the design
shall be at least 10m3.
[For information, above ground portable holding tanks of
various capacities can be rented from contractors or some
LWCs]
1

(c) For any pumped system installed, the pumping mechanism

shall be automated to start up the pump based on a preset
water level in the holding tank(s) to ensure there is no used
water overflow. The pumped system shall consist of at least
two pumps one duty pump and one standby pump. Each of
the duty and standby pumps shall be sized to handle the full
capacity discharge from the holding tank.

1.2

USE OF INDUSTRY

We'll travel to your Location and deploy mobile and/or

stationary Industrial loT packages and solutions that fit your
needs.
We can help you decide which sensors and connector devices
to use
If have existing sensors already deployed in the flew, well help
you connect them to the cloud for cost-effective, real.-time
telemetry.
Configure and connect your remote monitoring equipment to
Valarm Tools Cloud.

1.3

AIM OF THE PROJECT

The main objectives of the project are identical with those of

support area 2.2. The project expectant endeavours to increase the
university's

quality

in

order

to

diversify

and

deepen

the

correspondence with the economy knowledge requirements. The

project aspires to increase competencies of future graduates and
improve their chances at the labour market through improved
quality of the educational syllabi.
The project objective is to contribute to meeting the priorities set in
the strategic documents at the national, university and faculty
levels. The areas of priority are especially increased internalisation
of the faculty and the studies as well as better placement of the
graduates at the labour market.
Further ambition of the project is to contribute to educate such
graduates who would exercise the scholarly interships, increase
their practical experience and language knowledge and thus
become competitive at the Czech and international labour markets.
With respect to focus of the curricula the graduates aim to
international

labour

markets

(international

institutions

and

companies). The project thus aims to increase attractiveness of the

studies at FRDIS MENDELU and offer the future students, in
comparison with other universities offering the same programs,
better start of their future professional life.
3

Another

project

objective

in

the

area

of

internalisation

is

strengthening the existing relations with foreign universities in

developing countries and continue in co-operation not only in the
academic area but also in education, scientific, research and project
activities.
The project implementation arises from needs to react to priorities
set by strategic documents for development of the Czech university
education as well as effort to reflect the requirements and
educational needs of the applying organization's students. First of
all, the project responds to the strategic document "Long-Term
Intention of the Educational and Scientific, Research, Development
and Innovative, Artistic and Other Creative Activities for the Area of
Universities in the Period of 2011 -- 2015" which defines the main
principles of modern universities and makes a number of specific
recommendations for the universities. The project hereby submitted
is a reaction to the recommendations and conformably with them
tries to intensify cooperation with international universities and
further strenghten the existing internationalisation studies at
FRRMS. The submitted project also responses to the strategic
document

recommendations

by

involving

experts

with

work

experience to educational process (a partner in the project is an

enterpreneurial subject) or utilizing modern teaching methods
(creation and presentation or projects as part of the studies).
Foreign experts will also be engaged in the project which is one of
the Ministry of Education, Youth and Sports's priorities.

1.4 BLOCK DIAGRAM OF BOILER FEEDING CONTROLLER

WITH THE HELP OF TEMP.

POWER SUPPLY

CONTROLLING CARD

RELAY

TEMPERATURE SENSOR

FEEDING
MOTOR

BOILER
STRUCTURE

1.5 CIRCUIT DIAGRAM

1.6 COMPONENTS LIST

CHAPTER 2
LITERATURE REVIEW

2.1 GENERAL
General Requirements for Temporary Sanitary Facilities for
Trade Fairs
1.
All used water discharged from the Trade Fair operation must
be collected and disposed of via the temporary sanitary facilities.
No used water shall be discharged into drains, soil and surrounding
environment.
2.
Approval from PUB(WRN) on the design of the temporary
sanitary facilities must be obtained prior to commencement of Trade
Fair Operation. The design shall be in accordance with the General
Requirements for temporary sanitary facilities for Trade Fairs. The
design submission to PUB(WRN) shall include the detailed design
and layout plan of the temporary sanitary facilities and NEA's Trade
Fair license permit.
3
The used water from the Trade Fair operations shall be either
collected in holding tank(s) and be disposed of by tankering by a
NEAs Licensed Waste Collector (LWC) or be discharged into the
existing public sewers if available via a pumped system or other
means subject to the site condition and approval of WRN(PUB). In
addition, the following requirements shall be complied with:
(a) If holding tank is proposed for collection and disposal of
used water, the holding tank shall be made of reinforced
concrete (RC), steel or GRP and provided either under or above
ground.
(b) The design calculation on the capacity of all holding tank(s)
shall be based on the parameters given in the Code of Practice
on Sewerage and Sanitary Works and the flow rates of the
water fittings given in the Code of Practice for Water Services.
In addition, if disposal of used water is by tankering by LWC,
the total capacity of holding tank(s) incorporated in the design
shall be at least 10m3.
8

[For information, above ground portable holding tanks of

various capacities can be rented from contractors or some
LWCs]
(c) For any pumped system installed, the pumping mechanism
shall be automated to start up the pump based on a preset
water level in the holding tank(s) to ensure there is no used
water overflow. The pumped system shall consist of at least
two pumps one duty pump and one standby pump. Each of
the duty and standby pumps shall be sized to handle the full
capacity discharge from the holding tank.

2.1.1 CIRCUIT DESCRIPTION

POWER SUPPLY SECTION

CONSISTS OF:

RLMT CONNECTOR
1. It is a connector used to connect the step down transformer to the bridge rectifier.
2. Bridge Rectifier --- It is a full wave rectifier used to convert ac into dc , 9-15v ac made
by transformer is converted into dc with the help of rectifier.
3. Capacitor:
-----It is an electrolytic capacitor of rating 1000M/35V used to remove
the ripples. Capacitor is the component used to pass the ac and block the dc.
4. Regulator: ----LM7805 is used to give a fixed 5v regulated supply.
5. Capacitor:
-----It is again an electrolytic capacitor 10M/65v used for filtering to give
pure dc.
6. Capacitor:

----- It is an ceramic capacitor used to remove the spikes generated when

frequency is high(spikes).
So the output of supply section is 5v regulated dc.

WORKING
Water over flow from a tank or reservoir is detected using this simple project
circuit. Fistly close the switch SW to turn on the device.
Initially the potential at point A in the circuit is Vcc, so the transistor Q1
remains in ON state ( Read transistor act as a digiyal switch) and its collector
9

voltage at Vce sat (0.02V).

The collector voltage of Q1 is fed to the base terminal of transistor Q2 via
100OM Resistor.
0.02V is not sufficient to turn ON the transistor Q2, Hence it remains in OFF
state and the buzzer will not produce and sound.

2.1.2 MICRO CONTROLLER SECTION

Requires three connections to be successfully done for its operation to begin.

1. +5V SUPPLY:
This +5v supply is required for the controller to get start which is provided from the power
supply section.

2. Crystal OSCILLATOR:
A crystal oscillator of 4 MHz is connected at pin no.10, x1 and pin no.9, x2 to generate the
frequency for the controller. The crystal oscillator works on piezoelectric effect. The clock
generated is used to determine the processing speed of the controller. Two capacitors are also
connected one end with the oscillator while the other end is connected with the ground. As it is
recommended in the book to connect two ceramic capacitor of 20 pf40pf to stabilize the clock
generated.

3. RESET SECTION:
It consists of an rc network consisting of 10M/35V capacitor and one resistance of 1k. This
section is used to reset the controller .

10

2.1.3 DISPLAY SECTION :

FND is similar to the seven segment display but it has one more segment db for decimal. It
has eight leds. The current specification for an led is 5MA-25MA. The safe range for the
current to select is the mid value that is12MA and voltage required is 5v so the resistance
required to limit the current in led is calculated by the ohms law i.e. V=IR, R=V/I and hence
R comes to about
470ohm.

2.1.4 RELAY SECTION :

RELAY is an isolator and an electrical switch. The relay used is 12V-5A.To control the
operation of relay an NPN transistor BC547 has been used. Whenever high signal comes at
the base of NPN transistor it is switched on and whenever low arrives it is switched off. Base
of the transistor is connected with the I/O pin of the

microcontroller. Base resistance of 1k5 is connected at the base of the transistor. Whenever
low is sensed at the pin of microcontroller transistor gets off and the output of the collector
becomes high and the relay which is connected at the output of the collector becomes off.
The reverse action of it takes place when high is sensed at the pin of microcontroller.

This section also consists of pull up & pull down resistance. A 2k2 resistance is used as pull
up. In any case when more than 5v comes then pull up resistance sinks the excess voltage &
maintains 5v. If pull up is not used then the 12v of relay can damage the processor when the
transistor BC547 is on. A pull down resistor of value 2k2 is also used.
11

2.2

ALTERNATE AFFREGRATES :

PRINTED CIRCUIT BOARDS

In electronics, printed circuit boards, or PCBs, are used to mechanically support and electrically
connect electronic components using conductive pathways, or traces, etched from copper sheets
laminated onto a non-conductive substrate. Alternative names are printed wiring board (PWB),and
etched wiring board. Populating the board with electronic components forms a printed circuit
assembly (PCA), also known as a printed circuit board assembly (PCBA). PCBs are rugged,
inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost
than either wire-wrapped or point-to-point constructed circuits, but are much cheaper, faster, and
consistent in high volume production.

Printed circuit boards fall into the following categories:

Motherboard : The principal board that has connectors for attaching devices to the bus. Typically,
the mother board contains the CPU, memory, and basic controllers for the system. On PCs, the
motherboard is often called the system board or mainboard.

Expansion board : Any board that plugs into one of the computer's expansion slots. Expansion
boards include controller boards, LAN cards, and video adapters.

Daughter card : Any board that attaches directly to another board.

Controller board: A special type of expansion board that contains a controller for a peripheral
device. When you attach new devices, such as a disk drive or graphics monitor, to a computer, you
often need to add a controller board.

12

Network Interface Card (NIC) : An expansion board that enables a PC to be connected to a localarea network (LAN).

Video adapter: An expansion board that contains a controller for a graphics monitor.

Printed circuit boards are also called cards.

2.7.1 MANUFACTURING
PATTERNING (ETCHING)
The vast majority of printed circuit boards are made by adhering a layer of copper over the entire
substrate, sometimes on both sides, (creating a "blank PCB") then removing unwanted copper after
applying a temporary mask (eg. by etching), leaving only the desired copper traces. A few PCBs are
made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually
by a complex process of multiple electroplating steps.
There are three common "subtractive" methods (methods that remove copper) used for the
production of printed circuit boards:
1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching
removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank
(non-conductive) board. The latter technique is also used in the manufacture of hybrid
circuits.
2. Photoengraving uses a photomask and chemical etching to remove the copper foil from the
substrate. The photomask is usually prepared with a photoplotter from data produced by a
technician using CAM, or computer-aided manufacturing software. Laser-printed
transparencies are typically employed for phototools; however, direct laser imaging
techniques are being employed to replace phototools for high-resolution requirements.
3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil
from the substrate. A PCB milling machine (referred to as a 'PCB Prototyper') operates in a
similar way to a plotter, receiving commands from the host software that control the position
of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is
extracted from files generated in PCB design software and stored in HPGL or Gerber file
format.
"Additive" processes also exist. The most common is the "semi-additive process. In this version, the
unpatterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a
subtractive process mask, this mask exposes those parts of the substrate that will eventually become
the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be
plated to any desired weight. Tin-lead or other surface platings are then applied. The mask is
13

stripped away and a brief etching step removes the now-exposed original copper laminate from the
board, isolating the individual traces.The additive process is commonly used for multi-layer boards
as it facilitates the plating-through of the holes (vias) in the circuit board.

Lamination
Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by
bonding together separately etched thin boards.

Drilling
Holes, or vias, through a PCB are typically drilled with tiny drill bits made of solid tungsten
carbide. The drilling is performed by automated drilling machines with placement controlled by a
drill tape or drill file. These computer-generated files are also called numerically controlled drill
(NCD) files or "Excellon files". The drill file describes the location and size of each drilled hole.
When very small vias are required, drilling with mechanical bits is costly because of high rates of
wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically
have an inferior surface finish inside the hole. These holes are called micro vias. It is also possible
with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB
before lamination, to produce holes that connect only some of the copper layers, rather than passing
through the entire board. These holes are called blind vias when they connect an internal copper
layer to an outer layer, or buried vias when they connect two or more internal copper layers.

The walls of the holes, for boards with 2 or more layers, are plated with copper to form platedthrough holes that electrically connect the conducting layers of the PCB. For multilayer boards,
those with 4 layers or more, drilling typically produces a smear comprised of the bonding agent in
the laminate system. Before the holes can be plated through, this smear must be removed by a
chemical de-smear process, or by plasma-etch.

EXPOSED CONDUCTOR PLATING AND COATING

The pads and lands to which components will be mounted are typically plated, because bare copper
oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was
plated with solder. This solder was a tin-lead alloy, however new solder compounds are now used to
achieve compliance with the RoHS directive in the EU, which restricts the use of lead. Other
platings used are OSP (organic surface protectant), immersion silver, electroless nickel with
immersion gold coating (ENIG), and direct gold. Edge connectors, placed along one edge of some
boards, are often gold plated.

SOLDER RESIST
Areas that should not be soldered to may be covered with a polymer solder resist (solder mask)
coating. The solder resist prevents solder from bridging between conductors and thereby creating
short circuits. Solder resist also provides some protection from the environment.
14

SCREEN PRINTING
Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space
permits, the screen print text can indicate component designators, switch setting requirements, test
points, and other features helpful in assembling, testing, and servicing the circuit board.Screen print
is also known as the silk screen, or, in one sided PCBs, the red print.

TEST
Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined
in a netlist) is verified as correct on the finished board. For high-volume production, a Bed of nails
tester or fixture is used to make contact with copper lands or holes on one or both sides of the board
to facilitate testing. A computer will instruct the electrical test unit to send a small amount of current
through each contact point on the bed-of-nails as required, and verify that such current can be seen
on the other appropriate contact points. For small- or medium-volume boards, flying-probe testers
use moving test heads to make contact with the copper lands or holes to verify the electrical
connectivity of the board under test.

POPULATING
After the PCB is completed, electronic components must be attached to form a functional printed
circuit assembly, or PCA. In through-hole construction, component leads may be inserted in holes
and electrically and mechanically fixed to the board with a molten metal solder, while in surfacemount construction, the components are simply soldered to pads or lands on the outer surfaces of
the PCB.Often, through-hole and surface-mount construction must be combined in a single PCA
because some required components are available only in surface-mount packages, while others are
available only in through-hole packages.

PROTECTION AND PACKAGING

PCBs intended for extreme environments often have a conformal coat, which is applied by dipping
or spraying after the components have been soldered. The coat prevents corrosion and leakage
currents or shorting due to condensation. The earliest conformal coats were wax. Modern conformal
coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Some
are engineering plastics sputtered onto the PCB in a vacuum chamber. Many assembled PCBs are
static sensitive, and therefore must be placed in antistatic bags during transport. When handling
these boards, the user must be earthed; failure to do this might transmit an accumulated static charge
through the board, damaging or destroying it. Even bare boards are sometimes static sensitive.
Traces have gotten so fine that it's quite possible to blow an etch off the board (or change its
characteristics) with a static charge. This is especially true on non-traditional PCBs such as MCMs
and microwave PCBs.

15

2.3

FUNCTIONAL DISCRIPTION :

The sensor has a sensitivity of 10mV / oC.

The output of LM35 is amplified using a single power supply (+5V) op-amp.

The op-amp is designed to have a gain of 5.

The circuitry measures temperatures with a resolution of up to 0.5 degree Celsius.

The output voltage is converted to temperature by a simple conversion factor.

The general equation used to convert output voltage to temperature is:

Temperature ( oC) = (Vout * 100 ) / 5 oC (4.4)

So if Vout is 5V, then, Temperature = 100 oC

The output voltage varies linearly with temperature.

Temperature sensor readings

FORMULA:

16

Temperature ( Oc ) = (Vout/5) *100( Oc/V)

Temperature Sensor Readings

17

2.3.1 MICROCONTROLLER (PIC16F72)

A microcontroller (or MCU, short for microcontroller unit) is a small
computer (SoC) on a single integrated circuit containing a processor core,
memory, and programmable input/output peripherals. Program memory in the
form of Ferroelectric RAM, NOR flash or OTP ROM is also often included on chip,
as well as a typically small amount of RAM. Microcontrollers are designed for
embedded applications, in contrast to the microprocessors used in personal
computers or other general purpose applications consisting of various discrete
chips.
Microcontrollers are used in automatically controlled products and devices,
such as automobile engine control systems, implantable medical devices,
remote controls, office machines, appliances, power tools, toys and other
embedded systems. By reducing the size and cost compared to a design that
uses

separate

microprocessor,

memory,

and

input/output

devices,

microcontrollers make it economical to digitally control even more devices and

processes. Mixed signal microcontrollers are common, integrating analog
components needed to control non-digital electronic systems.
Some microcontrollers may use four-bit words and operate at clock rate
frequencies as low as 4 kHz, for low power consumption (single-digit milliwatts
or microwatts). They will generally have the ability to retain functionality while
waiting for an event such as a button press or other interrupt; power
consumption while sleeping (CPU clock and most peripherals off) may be just
nanowatts, making many of them well suited for long lasting battery
applications. Other microcontrollers may serve performance-critical roles,
where they may need to act more like a digital signal processor (DSP), with
higher clock speeds and power consumption.

18

2.3.2 CRITERIA FOR CHOOSING A MICROCONTROLLER

The basic criteria for choosing a microcontroller suitable for the application are:

1) The first and foremost criterion is that it must meet the task at hand efficiently and cost effectively. In
analyzing the needs of a microcontroller-based project, it is seen whether an 8- bit, 16-bit or 32-bit
microcontroller can best handle the computing needs of the task most effectively. Among the other
considerations in this category are:

(a) Speed:
The highest speed that the microcontroller supports.

(b) Packaging:
It may be a 28-pin DIP (dual inline package) or a QFP (quad flat package), or some other packaging
format. This is important in terms of space, assembling, and prototyping the end product.

(c) Power consumption:

This is especially critical for battery-powered products.

(d) The number of I/O pins and the timer on the chip.

(f) How easy it is to upgrade to higher performance or lower consumption versions.

(g) Cost per unit:

This is important in terms of the final cost of the product in which a microcontroller is used.

2) The second criterion in choosing a microcontroller is how easy it is to develop products around it. Key
considerations include the availability of an assembler, debugger, compiler, technical support.

19

3) The third criterion in choosing a microcontroller is its ready availability in needed quantities both now
and in the future.

POPULATING:
After the PCB is completed, electronic components must be attached to form a functional printed
circuit assembly, or PCA. In through-hole construction, component leads may be inserted in holes
and electrically and mechanically fixed to the board with a molten metal solder, while in surfacemount construction, the components are simply soldered to pads or lands on the outer surfaces of
the PCB.Often, through-hole and surface-mount construction must be combined in a single PCA
because some required components are available only in surface-mount packages, while others are
available only in through-hole packages.
Again, JEDEC guidelines for PCB component placement, soldering, and inspection are commonly
used to maintain quality control in this stage of PCB manufacturing. After the board is populated,
the populated board may be tested with an in-circuit test system. To facilitate this test, PCBs may be
designed with extra pads to make temporary connections. Sometimes these pads must be isolated
with resistors. The in-circuit test may also exercise boundary scan test features of some components.
In-circuit test systems may also be used to program nonvolatile memory components on the board.
In boundary scan testing, test circuits integrated into various ICs on the board form temporary
connections between the pcb traces to test that the ICs are mounted correctly. Boundary scan testing
requires that all the ICs to be tested use a standard test configuration procedure, the most common
one being the Joint Test Action Group (JTAG) standard.

20

PROTECTION AND PACKAGING:

PCBs intended for extreme environments often have a conformal coat, which is applied by dipping
or spraying after the components have been soldered. The coat prevents corrosion and leakage
currents or shorting due to condensation. The earliest conformal coats were wax. Modern conformal
coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Some
are engineering plastics sputtered onto the PCB in a vacuum chamber. Many assembled PCBs are
static sensitive, and therefore must be placed in antistatic bags during transport. When handling
these boards, the user must be earthed; failure to do this might transmit an

21

CHAPTER-3

CONCLUSION

This Project We Conclude That The Temperature Of The Boiler Can Control Automatically
Using Temperature Sensor And Microcontroller.
Microcontroller Successfully Control the Feeding Of Fuel for Boiler And Thus Save Fuel As
Well As Control Its Temperature

22