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2016.10.31
A10-OVERVIEW
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The Arria 10 device family consists of high-performance and power-efficient 20 nm mid-range FPGAs
and SoCs.
Arria 10 device family delivers:
Higher performance than the previous generation of mid-range and high-end FPGAs.
Power efficiency attained through a comprehensive set of power-saving technologies.
The Arria 10 devices are ideal for high performance, power-sensitive, midrange applications in diverse
markets.
Table 1: Sample Markets and Ideal Applications for Arria 10 Devices
Market
Applications
Wireless
Wireline
Broadcast
Studio switches
Servers and transport
Videoconferencing
Professional audio and video
Flash cache
Cloud computing servers
Server acceleration
Medical
Diagnostic scanners
Diagnostic imaging
2016 Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, Arria, Cyclone, Enpirion, MAX, Megacore, NIOS, Quartus and Stratix words and logos
are trademarks of Intel Corporation in the US and/or other countries. Other marks and brands may be claimed as the property of others. Intel warrants
performance of its FPGA and semiconductor products to current specifications in accordance with Intel's standard warranty, but reserves the right to make
changes to any products and services at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Intel. Intel customers are advised to obtain the latest version of
device specifications before relying on any published information and before placing orders for products or services.
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9001:2008
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Market
Applications
Military
Related Information
Supporting Feature
High-bandwidth integrated
transceivers
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A10-OVERVIEW
2016.10.31
Advantage
Supporting Feature
Technology
Packaging
High-performance FPGA
fabric
(1)
Description
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A10-OVERVIEW
2016.10.31
Feature
Description
PCI Express (PCIe) Gen3 (x1, x2, x4, or x8), Gen2 (x1,
x2, x4, or x8) and Gen1 (x1, x2, x4, or x8) hard IP with
complete protocol stack, endpoint, and root port
Transceiver I/O
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Feature
Description
FPGA General-purpose I/Os 1.6 Gbps LVDSevery pair can be configured as receiver or transmitter
(GPIOs)
On-chip termination (OCT)
1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfacing
External Memory Interface
(2)
Arria 10 devices support this external memory interface using hard PHY with soft memory controller.
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Feature
Description
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Feature
Description
Processor and
system
HPS
(Arria 10 SX devices only)
Send Feedback
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Feature
Configuration
Description
Power management
SmartVID
Low static power device options
Programmable Power Technology
Quartus Prime integrated PowerPlay power analysis
Related Information
Description
Arria 10 GX
FPGA featuring 17.4 Gbps transceivers for short reach applications with
16.0 Gbps backplane driving capability.
Arria 10 GT
FPGA featuring:
17.4 Gbps transceivers for short reach applications with 17.4 Gbps
backplane driving capability.
25.8 Gbps transceivers for supporting CAUI-4 and CEI-25G applications
with CFP2 and CFP4 modules.
Arria 10 SX
Altera Corporation
SoC integrating ARM-based HPS and FPGA featuring 17.4 Gbps transceivers
for short reach applications with 16.0 Gbps backplane driving capability.
A10-OVERVIEW
2016.10.31
Arria 10 GX
Arria 10 GX
This section provides the available options, maximum resource counts, and package plan for the
Arria 10 GX devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Available Options
Figure 1: Sample Ordering Code and Available Options for Arria 10 GX DevicesPreliminary
Package Type
F : FineLine BGA (FBGA), 1.0 mm pitch
U : Ultra FineLine BGA (UBGA), 0.8 mm pitch
Transceiver Count
C : 6
N :
E : 12
R :
H : 24
S :
K : 36
U :
Family Signature
10A :
Arria 10
10A
Family Variant
X : GX variant
17.4 Gbps transceivers
Logic Density
016 : 160K logic elements
022 : 220K logic elements
027 : 270K logic elements
032 : 320K logic elements
048 : 480K logic elements
057 : 570K logic elements
066 : 660K logic elements
090 : 900K logic elements
115 : 1,150K logic elements
Operating Temperature
I : Industrial (TJ = -40 C to 100 C)
E : Extended (TJ = 0 C to 100 C)
M : Military (TJ = -55 C to 125 C)
Power Option
S : Standard
L : Low
V : SmartVID (Speed Grade -2 and -3 only)
48
66
72
96
066
Transceiver
Speed Grade
1 (fastest)
2
3
4
35
Package Code
FBGA Package Type
27 : 672 pins, 27 mm x 27 mm
29 : 780 pins, 29 mm x 29 mm
34 : 1,152 pins, 35 mm x 35 mm
35 : 1,152 pins, 35 mm x 35 mm
40 : 1,517 pins, 40 mm x 40 mm
45 : 1,932 pins, 45 mm x 45 mm
UBGA Package Type
19 : 484 pins, 19 mm x 19 mm
ES
Optional Suffix
Indicates specific device
options
or shipment method
RoHS
ES : Engineering sample
G : RoHS6
N : RoHS5 Contact Altera
P : Leaded for availability
FPGA Fabric
Speed Grade
1 (fastest)
2
3
Related Information
Altera Corporation
10
A10-OVERVIEW
2016.10.31
Maximum Resources
Maximum Resources
Table 5: Maximum Resource Counts for Arria 10 GX Devices (GX 160, GX 220, GX 270, GX 320, and GX 480)
Preliminary
Product Line
Resource
GX 160
GX 220
GX 270
GX 320
GX 480
160
220
270
320
480
ALM
61,510
80,330
101,620
119,900
183,590
Register
246,040
321,320
406,480
479,600
734,360
M20K
8,800
11,740
15,000
17,820
28,620
MLAB
1,050
1,690
2,452
2,727
4,164
Variable-precision DSP
Block
156
192
830
985
1,368
18 x 19 Multiplier
312
384
1,660
1,970
2,736
Fractional
Synthesis
12
I/O
12
12
12
24
24
36
GPIO (3)
288
288
384
384
492
120
120
168
168
222
Hard Memory
Controller
12
Memory
(Kb)
PLL
(3)
(4)
The number of GPIOs does not include transceiver I/Os. In the Quartus Prime software, the number of user
I/Os includes transceiver I/Os.
Each LVDS I/O pair can be used as differential input or output.
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Package Plan
Table 6: Maximum Resource Counts for Arria 10 GX Devices (GX 570, GX 660, GX 900, and GX 1150)
Preliminary
Product Line
Resource
GX 570
GX 660
GX 900
GX 1150
570
660
900
1,150
ALM
217,080
251,680
339,620
427,200
Register
868,320
1,006,720
1,358,480
1,708,800
M20K
36,000
42,620
48,460
54,260
MLAB
5,096
5,788
9,386
12,984
Variable-precision DSP
Block
1,523
1,687
1,518
1,518
18 x 19 Multiplier
3,046
3,374
3,036
3,036
Fractional
Synthesis
16
16
32
32
I/O
16
16
16
16
48
48
96
96
GPIO (3)
696
696
768
768
324
324
384
384
16
16
16
16
Memory
(Kb)
PLL
Package Plan
Table 7: Package Plan for Arria 10 GX Devices (U19, F27, and F29) Preliminary
Refer to I/O and High Speed I/O in Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line
U19
F27
F29
(19 mm 19 mm,
484-pin UBGA)
(27 mm 27 mm,
672-pin FBGA)
3 V I/O
LVDS I/O
XCVR
3 V I/O
LVDS I/O
XCVR
3 V I/O
LVDS I/O
XCVR
GX 160
48
192
48
192
12
48
240
12
GX 220
48
192
48
192
12
48
240
12
GX 270
48
192
12
48
312
12
GX 320
48
192
12
48
312
12
GX 480
48
312
12
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A10-OVERVIEW
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Arria 10 GT
Table 8: Package Plan for Arria 10 GX Devices (F34, F35, NF40, and KF40) Preliminary
Refer to I/O and High Speed I/O in Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line
F34
F35
KF40
NF40
(35 mm 35 mm,
1152-pin FBGA)
(35 mm 35 mm,
1152-pin FBGA)
(40 mm 40 mm,
1517-pin FBGA)
(40 mm 40 mm,
1517-pin FBGA)
3V
I/O
LVDS
I/O
XCVR
GX 270
48
336
24
GX 320
48
336
GX 480
48
GX 570
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
48
336
24
24
48
336
24
444
24
48
348
36
48
444
24
48
348
36
96
600
36
48
540
48
GX 660
48
444
24
48
348
36
96
600
36
48
540
48
GX 900
504
24
600
48
GX 1150
504
24
600
48
Table 9: Package Plan for Arria 10 GX Devices (RF40, NF45, SF45, and UF45) Preliminary
Refer to I/O and High Speed I/O in Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line
RF40
NF45
SF45
UF45
(40 mm 40 mm,
1517-pin FBGA)
(45 mm 45 mm)
1932-pin FBGA)
(45 mm 45 mm)
1932-pin FBGA)
(45 mm 45 mm)
1932-pin FBGA)
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
GX 900
342
66
768
48
624
72
480
96
GX 1150
342
66
768
48
624
72
480
96
Related Information
I/O and High-Speed Differential I/O Interfaces in Arria 10 Devices chapter, Arria 10 Device
Handbook
Provides the number of 3 V and LVDS I/Os, and LVDS channels for each Arria 10 device package.
Arria 10 GT
This section provides the available options, maximum resource counts, and package plan for the
Arria 10 GT devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Altera Corporation
A10-OVERVIEW
2016.10.31
Available Options
13
Related Information
Available Options
Figure 2: Sample Ordering Code and Available Options for Arria 10 GT DevicesPreliminary
Operating Temperature
I : Industrial (TJ = -40 C to 100 C)
E : Extended (TJ = 0 C to 100 C)
M : Military (TJ = -55 C to 125 C)
Power Option
S : Standard
L : Low
V : SmartVID (Speed Grade -2 and -3 only)
Package Type
F : FineLine BGA (FBGA), 1.0 mm pitch
Transceiver Count
S : 72
Family Signature
10A :
Arria 10
10A
115
Family Variant
T : GT variant
28.3 Gbps transceivers
Logic Density
090 : 900K logic elements Transceiver
115 : 1,150K logic elements Speed Grade
2 (fastest)
3
4
40
ES
Optional Suffix
Indicates specific device
options or shipment method
ES : Engineering sample
RoHS
G : RoHS6
N : RoHS5 Contact Altera
P : Leaded for availability
Package Code
40 : 1,517 pins, 40 mm x 40 mm
45 : 1,932 pins, 45 mm x 45 mm
FPGA Fabric
Speed Grade
1 (fastest)
2
3
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A10-OVERVIEW
2016.10.31
Maximum Resources
Maximum Resources
Table 10: Maximum Resource Counts for Arria 10 GT DevicesPreliminary
Product Line
Resource
GT 900
GT 1150
900
1,150
339,620
427,200
1,358,480
1,708,800
M20K
48,460
54,260
MLAB
9,386
12,984
1,518
1,518
18 x 19 Multiplier
3,036
3,036
Fractional Synthesis
32
32
I/O
16
16
PLL
17.4 Gbps
72
25.8 Gbps
624
624
312
312
16
16
Transceiver
GPIO(6)
LVDS Pair
(7)
(5)
72 (5)
Related Information
Package Plan
Table 11: Package Plan for Arria 10 GT Devices Preliminary
Refer to I/O and High Speed I/O in Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
(5)
(6)
(7)
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A10-OVERVIEW
2016.10.31
Arria 10 SX
15
SF45
(45 mm 45 mm, 1932-pin FBGA)
Product Line
3 V I/O
LVDS I/O
XCVR
GT 900
624
72
GT 1150
624
72
Related Information
I/O and High-Speed Differential I/O Interfaces in Arria 10 Devices chapter, Arria 10 Device
Handbook
Provides the number of 3 V and LVDS I/Os, and LVDS channels for each Arria 10 device package.
Arria 10 SX
This section provides the available options, maximum resource counts, and package plan for the
Arria 10 SX devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Altera Corporation
16
A10-OVERVIEW
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Available Options
Available Options
Figure 3: Sample Ordering Code and Available Options for Arria 10 SX DevicesPreliminary
Package Type
F : FineLine BGA (FBGA), 1.0 mm pitch
U : Ultra FineLine BGA (UBGA), 0.8 mm pitch
Operating Temperature
I : Industrial (TJ = -40 C to 100 C)
E : Extended (TJ = 0 C to 100 C)
M : Military (TJ = -55 C to 125 C)
Power Option
S : Standard
L : Low
V : SmartVID (Speed Grade -2 and -3 only)
Transceiver Count
C : 6
K : 36
E : 12
N : 48
H : 24
Family Signature
10A :
Arria 10
10A
066
Family Variant
S : SX variant
(SoC with 17.4 Gbps transceivers)
Logic Density
016 : 160K logic elements Transceiver
022 : 220K logic elements Speed Grade
027 : 270K logic elements
032 : 320K logic elements 1 (fastest)
048 : 480K logic elements 2
057 : 570K logic elements 3
066 : 660K logic elements 4
35
Package Code
FBGA Package Type
27 : 672 pins, 27 mm x 27 mm
29 : 780 pins, 29 mm x 29 mm
34 : 1,152 pins, 35 mm x 35 mm
35 : 1,152 pins, 35 mm x 35 mm
40 : 1,517 pins, 40 mm x 40 mm
ES
Optional Suffix
Indicates specific device
options or shipment method
RoHS
ES : Engineering sample
G : RoHS6
N : RoHS5 Contact Altera
P : Leaded for availability
FPGA Fabric
Speed Grade
1 (fastest)
2
3
Related Information
Altera Corporation
A10-OVERVIEW
2016.10.31
17
Maximum Resources
Maximum Resources
Table 12: Maximum Resource Counts for Arria 10 SX DevicesPreliminary
Resource
Product Line
SX 160
SX 220
SX 270
SX 320
SX 480
SX 570
SX 660
160
220
270
320
480
570
660
ALM
61,510
80,330
101,620
119,900
183,590
217,080
251,680
Register
246,040
321,320
406,480
479,600
734,360
868,320
1,006,720
M20K
8,800
11,740
15,000
17,820
28,620
36,000
42,620
MLAB
1,050
1,690
2,452
2,727
4,164
5,096
5,788
Variable-precision
DSP Block
156
192
830
985
1,368
1,523
1,687
18 x 19 Multiplier
312
384
1,660
1,970
2,736
3,046
3,374
Fractional
Synthesis
12
16
16
I/O
12
16
16
12
12
24
24
36
48
48
GPIO (8)
288
288
384
384
492
696
696
120
120
168
168
174
324
324
Hard Memory
Controller
12
16
16
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Memory
(Kb)
PLL
ARM Cortex-A9
MPCore Processor
Package Plan
Table 13: Package Plan for Arria 10 SX Devices (U19, F27, F29, and F34) Preliminary
Refer to I/O and High Speed I/O in Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
(8)
(9)
The number of GPIOs does not include transceiver I/Os. In the Quartus Prime software, the number of user
I/Os includes transceiver I/Os.
Each LVDS I/O pair can be used as differential input or output.
Altera Corporation
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A10-OVERVIEW
2016.10.31
Package Plan
Product Line
U19
F27
F29
F34
(19 mm 19 mm,
484-pin UBGA)
(27 mm 27 mm,
672-pin FBGA)
(29 mm 29 mm,
780-pin FBGA)
(35 mm 35 mm,
1152-pin FBGA)
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
3V
I/O
LVDS
I/O
XCVR
SX 160
48
144
48
192
12
48
240
12
SX 220
48
144
48
192
12
48
240
12
SX 270
48
192
12
48
312
12
48
336
24
SX 320
48
192
12
48
312
12
48
336
24
SX 480
48
312
12
48
444
24
SX 570
48
444
24
SX 660
48
444
24
Table 14: Package Plan for Arria 10 SX Devices (F35, KF40, and NF40) Preliminary
Refer to I/O and High Speed I/O in Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line
F35
KF40
NF40
(35 mm 35 mm,
1152-pin FBGA)
(40 mm 40 mm,
1517-pin FBGA)
(40 mm 40 mm,
1517-pin FBGA)
3 V I/O
LVDS
I/O
XCVR
3 V I/O
LVDS
I/O
XCVR
3 V I/O
LVDS
I/O
XCVR
SX 270
48
336
24
SX 320
48
336
24
SX 480
48
348
36
SX 570
48
348
36
96
600
36
48
540
48
SX 660
48
348
36
96
600
36
48
540
48
Related Information
I/O and High-Speed Differential I/O Interfaces in Arria 10 Devices chapter, Arria 10 Device
Handbook
Provides the number of 3 V and LVDS I/Os, and LVDS channels for each Arria 10 device package.
Altera Corporation
A10-OVERVIEW
2016.10.31
19
Variant
Arria 10 GX
Arria 10 GT
Arria 10 SX
Product
Line
U19
F27
F29
F34
Package
F35 KF40 NF40 RF40 NF45 SF45 UF45
GX 160
GX 220
GX 270
GX 320
GX 480
GX 570
GX 660
GX 900
GX 1150
GT 900
GT 1150
SX 160
SX 220
SX 270
SX 320
SX 480
SX 570
SX 660
Note: To verify the pin migration compatibility, use the Pin Migration View window in the Quartus
Prime software Pin Planner.
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A10-OVERVIEW
2016.10.31
FPGA Device
1
2
3
4
5
6
7
8
Reg
Full
Adder
Reg
Adaptive
LUT
Reg
Full
Adder
Reg
The Quartus Prime software optimizes your design according to the ALM logic structure and automati
cally maps legacy designs into the Arria 10 ALM architecture.
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A10-OVERVIEW
2016.10.31
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Two 18 x 19
One 27 x 27
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Arria 10
GX
Arria 10
GT
Arria 10
SX
Product Line
Variableprecision
Multiplications Operator
DSP Block
18 x 19
27 x 27
Multiplier
Multiplier
18 x 19
18 x 18
Multiplier
Adder Sum
Mode
Multiplier Adder
Summed with 36 bit
Input
GX 160
156
312
156
156
156
GX 220
192
384
192
192
192
GX 270
830
1,660
830
830
830
GX 320
984
1,968
984
984
984
GX 480
1,368
2,736
1,368
1,368
1,368
GX 570
1,523
3,046
1,523
1,523
1,523
GX 660
1,687
3,374
1,687
1,687
1,687
GX 900
1,518
3,036
1,518
1,518
1,518
GX 1150
1,518
3,036
1,518
1,518
1,518
GT 900
1,518
3,036
1,518
1,518
1,518
GT 1150
1,518
3,036
1,518
1,518
1,518
SX 160
156
312
156
156
156
SX 220
192
384
192
192
192
SX 270
830
1,660
830
830
830
SX 320
984
1,968
984
984
984
SX 480
1,368
2,736
1,368
1,368
1,368
SX 570
1,523
3,046
1,523
1,523
1,523
SX 660
1,687
3,374
1,687
1,687
1,687
Altera Corporation
A10-OVERVIEW
2016.10.31
Variant
Product Line
Variableprecision
DSP Block
Arria 10
GX
Arria 10
GT
Arria 10
SX
Single
Precision
FloatingPoint
Multiplica
tion Mode
Single-Precision
Floating-Point
Adder Mode
SinglePrecision
FloatingPoint
Multiply
Accumulate
Mode
23
Peak
Giga Floating-Point
Operations per
Second (GFLOPs)
GX 160
156
156
156
156
140
GX 220
192
192
192
192
173
GX 270
830
830
830
830
747
GX 320
984
984
984
984
886
GX 480
1,369
1,368
1,368
1,368
1,231
GX 570
1,523
1,523
1,523
1,523
1,371
GX 660
1,687
1,687
1,687
1,687
1,518
GX 900
1,518
1,518
1,518
1,518
1,366
GX 1150
1,518
1,518
1,518
1,518
1,366
GT 900
1,518
1,518
1,518
1,518
1,366
GT 1150
1,518
1,518
1,518
1,518
1,366
SX 160
156
156
156
156
140
SX 220
192
192
192
192
173
SX 270
830
830
830
830
747
SX 320
984
984
984
984
886
SX 480
1,369
1,368
1,368
1,368
1,231
SX 570
1,523
1,523
1,523
1,523
1,371
SX 660
1,687
1,687
1,687
1,687
1,518
Altera Corporation
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A10-OVERVIEW
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Arria 10 GX
Arria 10 GT
Arria 10 SX
Altera Corporation
M20K
MLAB
Product
Line
Block
Block
GX 160
440
8,800
1,680
1,050
9,850
GX 220
587
11,740
2,703
1,690
13,430
GX 270
750
15,000
3,922
2,452
17,452
GX 320
891
17,820
4,363
2,727
20,547
GX 480
1,431
28,620
6,662
4,164
32,784
GX 570
1,800
36,000
8,153
5,096
41,096
GX 660
2,131
42,620
9,260
5,788
48,408
GX 900
2,423
48,460
15,017
9,386
57,846
GX 1150
2,713
54,260
20,774
12,984
67,244
GT 900
2,423
48,460
15,017
9,386
57,846
GT 1150
2,713
54,260
20,774
12,984
67,244
SX 160
440
8,800
1,680
1,050
9,850
SX 220
587
11,740
2,703
1,690
13,430
SX 270
750
15,000
3,922
2,452
17,452
SX 320
891
17,820
4,363
2,727
20,547
SX 480
1,431
28,620
6,662
4,164
32,784
SX 570
1,800
36,000
8,153
5,096
41,096
SX 660
2,131
42,620
9,260
5,788
48,408
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25
Depth (bits)
Programmable Width
32
MLAB
M20K
64
(10)
512
x40, x32
1K
x20, x16
2K
x10, x8
4K
x5, x4
8K
x2
16K
x1
Altera Corporation
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Reference clock frequency synthesis for transceiver CMU and Advanced Transmit (ATX) PLLs
Clock network delay compensation
Zero-delay buffering
Direct transmit clocking for transceivers
Independently configurable into two modes:
Consist of 3 V I/Os for high-voltage application and LVDS I/Os for differential signaling
Support a wide range of single-ended and differential I/O interfaces
LVDS speeds up to 1.6 Gbps
Each LVDS pair of pins has differential input and output buffers, allowing you to configure the LVDS
direction for each pair.
Programmable bus hold and weak pull-up
Programmable differential output voltage (VOD) and programmable pre-emphasis
Series (RS) and parallel (RT) on-chip termination (OCT) for all I/O banks with OCT calibration to
limit the termination impedance variation
On-chip dynamic termination that has the ability to swap between series and parallel termination,
depending on whether there is read or write on a common bus for signal integrity
Easy timing closure support using the hard read FIFO in the input register path, and delay-locked loop
(DLL) delay chain with fine and coarse architecture
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A10-OVERVIEW
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27
The memory interface within Arria 10 FPGAs and SoCs delivers the highest performance and ease of use.
You can configure up to a maximum width of 144 bits when using the hard or soft memory controllers. If
required, you can bypass the hard memory controller and use a soft controller implemented in the user
logic.
Each I/O contains a hardened DDR read/write path (PHY) capable of performing key memory interface
functionality such as read/write leveling, FIFO buffering to lower latency and improve margin, timing
calibration, and on-chip termination.
The timing calibration is aided by the inclusion of hard microcontrollers based on Alteras Nios II
technology, specifically tailored to control the calibration of multiple memory interfaces. This calibration
allows the Arria 10 device to compensate for any changes in process, voltage, or temperature either within
the Arria 10 device itself, or within the external memory device. The advanced calibration algorithms
ensure maximum bandwidth and robust timing margin across all operating conditions.
In addition to parallel memory interfaces, Arria 10 devices support serial memory technologies such as the
Hybrid Memory Cube (HMC). The HMC is supported by the Arria 10 high-speed serial transceivers
which connect up to four HMC links, with each link running at data rates up to 15 Gbps.
Related Information
DDR4 SDRAM
Rate Support
Quarter rate
Half rate
DDR3 SDRAM
Quarter rate
Half rate
DDR3L SDRAM
Quarter rate
Maximum Frequency
Yes
1,067
1,200
Yes
533
667
Yes
1,067
1,067
Yes
533
667
Yes
933
933
(MHz)
Altera Corporation
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Memory Standard
LPDDR3 SDRAM
Rate Support
Maximum Frequency
Half rate
533
Quarter rate
800
(MHz)
Rate Support
Maximum Frequency
(MHz)
RLDRAM 3 (11)
Quarter rate
1,200
QDR IV SRAM(11)
Quarter rate
1,067
Full rate
333
Half rate
333
Full rate
333
Half rate
550
Full rate
333
Half rate
633
QDR II SRAM
QDR II+ SRAM
QDR II+ Xtreme SRAM
Table 22: Memory Standards Supported by the HPS Hard Memory Controller
The hard processor system (HPS) is available in Arria 10 SoC devices only.
Memory Standard
Rate Support
Maximum Frequency
(MHz)
DDR4 SDRAM
Half rate
1,200
DDR3 SDRAM
Half rate
1,067
DDR3L SDRAM
Half rate
933
Related Information
(11)
Arria 10 devices support this external memory interface using hard PHY with soft memory controller.
Altera Corporation
A10-OVERVIEW
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29
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Related Information
Altera Corporation
A10-OVERVIEW
2016.10.31
Transceiver Channels
31
PCS
PCS
fPLL
PCS
FPGA
Fabric
PCS
ATX
PLL
ATX
PLL
PCS
PCS
fPLL
Transceiver Channels
All transceiver channels feature a dedicated Physical Medium Attachment (PMA) and a hardened Physical
Coding Sublayer (PCS).
The PMA provides primary interfacing capabilities to physical channels.
The PCS typically handles encoding/decoding, word alignment, and other pre-processing functions
before transferring data to the FPGA core fabric.
A transceiver channel consists of a PMA and a PCS block. Most transceiver banks have 6 channels. There
are some transceiver banks which contain only 3 channels.
A wide variety of bonded and non-bonded data rate configurations is possible using a highly configurable
clock distribution network. Up to 80 independent transceiver data rates can be configured.
The following figures are graphical representations of a top view of the silicon die, which corresponds to a
reverse view for flip chip packages. Different Arria 10 devices may have different floorplans than the ones
shown in the figures.
Altera Corporation
Altera Corporation
Transceiver Channels
I/O PLLs
I/O PLLs
Hard Memory Controllers, General-Purpose I/O Cells, LVDS
Transceiver Channels
Hard IP Per Transceiver: Standard PCS and Enhanced PCS Hard IPs
Fractional PLLs
PCI Express Gen3 Hard IP
PCI Express Gen3 Hard IP
fPLL
Hard PCS
Transceiver PMA
ATX (LC)
Transmit
PLL
Hard PCS
Transceiver PMA
Hard PCS
Transceiver PMA
fPLL
Hard PCS
ATX (LC)
Transmit
PLL
Hard PCS
Transceiver PMA
fPLL
Hard PCS
ATX (LC)
Transmit
PLL
Hard PCS
Hard PCS
Hard PCS
32
Transceiver Channels
A10-OVERVIEW
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Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Send Feedback
A10-OVERVIEW
2016.10.31
PMA Features
33
Hard PCS
Transceiver PMA
Hard PCS
Transceiver PMA
Hard PCS
Transceiver PMA
Transceiver PMA
fPLL
Hard PCS
ATX (LC)
Transmit
PLL
Hard PCS
fPLL
Hard PCS
ATX (LC)
Transmit
PLL
Hard PCS
Hard PCS
Hard PCS
Transceiver Channels
fPLL
ATX (LC)
Transmit
PLL
I/O PLLs
I/O PLLs
Hard Memory Controllers, General-Purpose I/O Cells, LVDS
Transceiver Channels
Hard IP Per Transceiver: Standard PCS and Enhanced PCS Hard IPs
Fractional PLLs
PCI Express Gen3 Hard IP
PCI Express Gen3 Hard IP
Hard Processor
Subsystem, Dual-Core
ARM Cortex A9
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
PMA Features
Arria 10 transceivers provide exceptional signal integrity at data rates up to 25.8 Gbps. Clocking options
include ultra-low jitter ATX PLLs (LC tank based), clock multiplier unit (CMU) PLLs, and fractional
PLLs.
Each transceiver channel contains a channel PLL that can be used as the CMU PLL or clock data recovery
(CDR) PLL. In CDR mode, the channel PLL recovers the receiver clock and data in the transceiver
channel. Up to 80 independent data rates can be configured on a single Arria 10 device.
Table 23: PMA Features of the Transceivers in Arria 10 Devices
Feature
Capability
Chip-to-Chip Data
Rates
Backplane Support
Optical Module
Support
Altera Corporation
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PMA Features
Feature
Capability
Transmit Pre-Emphasis 4-tap transmit pre-emphasis and de-emphasis to compensate for system channel
loss
Continuous Time
Linear Equalizer
(CTLE)
Decision Feedback
Equalizer (DFE)
7-fixed and 4-floating tap DFE to equalize backplane channel loss in the presence
of crosstalk and noisy environments
Variable Gain
Amplifier
Optimizes the signal amplitude prior to the CDR sampling and operates in fixed
and adaptive modes
Altera Digital Adaptive Fully digital adaptation engine to automatically adjust all link equalization
Parametric Tuning
parametersincluding CTLE, DFE, and variable gain amplifier blocksthat
(ADAPT)
provide optimal link margin without intervention from user logic
Precision Signal
Integrity Calibration
Engine (PreSICE)
Advanced Transmit
(ATX) PLL
Low jitter ATX (LC tank based) PLLs with continuous tuning range to cover a
wide range of standard and proprietary protocols
Fractional PLLs
Digitally Assisted
Analog CDR
On-Die Instrumenta
tion EyeQ and Jitter
Margin Tool
Simplifies board bring-up, debug, and diagnostics with non-intrusive, highresolution eye monitoring (EyeQ). Also injects jitter from transmitter to test link
margin in system.
Dynamic Partial
Reconfiguration
Multiple PCS-PMA
8-, 10-, 16-, 20-, 32-, 40-, or 64-bit interface widths for flexibility of deserializa
and PCS-PLD interface tion width, encoding, and reduced latency
widths
Altera Corporation
A10-OVERVIEW
2016.10.31
PCS Features
35
PCS Features
This table summarizes the Arria 10 transceiver PCS features. You can use the transceiver PCS to support a
wide range of protocols ranging from 125 Mbps to 25.8 Gbps.
PCS
Description
Standard PCS
Enhanced PCS
Supports the seamless switching of Data and Clock between the Gen1, Gen2,
and Gen3 data rates
Provides support for PIPE 3.0 features
Supports the PIPE interface with the Hard IP enabled, as well as with the
Hard IP bypassed
Related Information
Data Rate
(Gbps)
Transceiver IP
PCS Support
8.0
5.0
Standard PCS
2.5
Standard PCS
Altera Corporation
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A10-OVERVIEW
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Protocol
Data Rate
(Gbps)
Transceiver IP
PCS Support
1.25
Native PHY
Standard PCS
Native PHY
Standard PCS
10GBASE-R
10.3125
Native PHY
Enhanced PCS
10GBASE-R 1588
10.3125
Native PHY
Enhanced PCS
10.3125
Native PHY
Enhanced PCS
10.3125
1G/10GbE and
10GBASE-KR PHY
Interlaken (CEI-6G/11G)
3.125 to
17.4
Native PHY
Enhanced PCS
SFI-S/SFI-5.2
11.2
Native PHY
Enhanced PCS
10G SDI
10.692
Native PHY
Enhanced PCS
0.6144 to
10.1376
Native PHY
Enhanced PCS
0.6144 to
9.8304
Native PHY
Standard PCS
0.6144 to
6.144
Native PHY
Standard PCS
SD-SDI/HD-SDI/3G-SDI
0.143(12) to
2.97
Native PHY
Standard PCS
Related Information
(12)
The 0.143 Gbps data rate is supported using oversampling of user logic that you must implement in the
FPGA fabric.
Altera Corporation
A10-OVERVIEW
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37
ARM Cortex-A9
FPU
NEON
32 KB L1 Cache
QSPI Flash
Control
SD/SDIO/
MMC
USB OTG
(x2)
DMA
(8 Channels)
UART
(x2)
Dedicated
HPS I/O
I2 C
(x5)
NAND Flash
with ECC
FPU
32 KB L1 Cache
512 KB L2 Cache
JTAG Debug/
Trace
256 KB
RAM
LW HPS to
Core Bridge
HPS to Core
Bridge
Core to HPS
Bridge
AXI 32
AXI 32/64/128
AXI 32/64/128
Timers
(x11)
A
C
P
EMAC (x3)
SPI
(x2)
MPFE
FPGA
Configuration
To hard memory
controller
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38
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The 20-nm HPS strikes a balance between enabling maximum software compatibility with 28-nm SoCs
while still improving upon the 28-nm HPS architecture. These improvements address the requirements of
the next generation target markets such as wireless and wireline communications, compute and storage
equipment, broadcast and military in terms of performance, memory bandwidth, connectivity via
backplane and security.
Table 24: Improvements in 20 nm HPS
This table lists the key improvements of the 20 nm HPS compared to the 28 nm HPS.
Advantages/Improvements
Description
EMAC core
Altera Corporation
Three EMAC cores are available in the HPS. The EMAC cores enable
an application to support two redundant Ethernet connections; for
example, backplane, or two EMAC cores for managing IEEE 1588 time
stamp information while allowing a third EMAC core for debug and
configuration. All three EMACs can potentially share the same time
stamps, simplifying the 1588 time stamping implementation. A new
serial time stamp interface allows core logic to access and read the time
stamp values. The integrated EMAC controllers can be connected to
external Ethernet PHY through the provided MDIO or I2C interface.
A10-OVERVIEW
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Advantages/Improvements
39
Description
On-chip memory
ECC enhancements
Although the HPS and the Logic Core can operate independently, they
are tightly coupled via a high-bandwidth system interconnect built
from high-performance ARM AMBA AXI bus bridges. IP bus masters
in the FPGA fabric have access to HPS bus slaves via the FPGA-to-HPS
interconnect. Similarly, HPS bus masters have access to bus slaves in
the core fabric via the HPS-to-FPGA bridge. Both bridges are AMBA
AXI-3 compliant and support simultaneous read and write transac
tions. Up to three masters within the core fabric can share the HPS
SDRAM controller with the processor. Additionally, the processor can
be used to configure the core fabric under program control via a
dedicated 32-bit configuration port.
The FPGA fabric and HPS in the SoCs are powered independently. You
can reduce the clock frequencies or gate the clocks to reduce dynamic
power.
You can configure the FPGA fabric and boot the HPS independently, in
any order, providing you with more design flexibility.
Security
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41
The HPSFPGA bridges, which support the Advanced Microcontroller Bus Architecture (AMBA)
Advanced eXtensible Interface (AXI) specifications, consist of the following bridges:
FPGA-to-HPS AMBA AXI bridgea high-performance bus supporting 32, 64, and 128 bit data widths
that allows the FPGA fabric to issue transactions to slaves in the HPS.
HPS-to-FPGA Avalon/AMBA AXI bridgea high-performance bus supporting 32, 64, and 128 bit
data widths that allows the HPS to issue transactions to slaves in the FPGA fabric.
Lightweight HPS-to-FPGA AXI bridgea lower latency 32 bit width bus that allows the HPS to issue
transactions to soft peripherals in the FPGA fabric. This bridge is primarily used for control and status
register (CSR) accesses to peripherals in the FPGA fabric.
The HPSFPGA AXI bridges allow masters in the FPGA fabric to communicate with slaves in the HPS
logic, and vice versa. For example, the HPS-to-FPGA AXI bridge allows you to share memories instanti
ated in the FPGA fabric with one or both microprocessors in the HPS, while the FPGA-to-HPS AXI
bridge allows logic in the FPGA fabric to access the memory and peripherals in the HPS.
Each HPSFPGA bridge also provides asynchronous clock crossing for data transferred between the
FPGA fabric and the HPS.
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Altera SoC FPGAs follows the same steps as those for other SoC devices from other manufacturers.
Support for Linux, VxWorks, and other operating systems will be available for the SoC FPGAs. For more
information on the operating systems support availability, contact the Altera sales team.
You can begin device-specific firmware and software development on the Altera SoC FPGA Virtual Target.
The Virtual Target is a fast PC-based functional simulation of a target development systema model of a
complete development board. The Virtual Target enables the development of device-specific production
software that can run unmodified on actual hardware.
Dynamic Reconfiguration
You can reconfigure the PMA and PCS blocks while the device continues to operate. This feature allows
you to change the data rates, protocol, and analog settings of a channel in a transceiver bank without
affecting on-going data transfer in other transceiver banks. This feature is ideal for applications that
require dynamic multiprotocol or multirate support.
Partial Reconfiguration
Using partial reconfiguration, you can reconfigure some parts of the device while keeping the device in
operation.
Instead of placing all device functions in the FPGA fabric, you can store some functions that do not run
simultaneously in external memory and load them only when required. This capability increases the
effective logic density of the device, and lowers cost and power consumption.
In the Altera solution, you do not have to worry about intricate device architecture to perform a partial
reconfiguration. The partial reconfiguration capability is built into the Quartus Prime design software,
making such time-intensive task simple.
Arria 10 devices support partial reconfiguration in the following configuration options:
Using an internal host:
All supported configuration modes where the FPGA has access to external memory devices such as
serial and parallel flash memory.
Configuration via Protocol [CvP (PCIe)]
Using an external hostpassive serial (PS), fast passive parallel (FPP) x8, FPP x16, and FPP x32 I/O
interface.
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A10-OVERVIEW
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Scheme
Data
Width
Max Clock
Max Data
Decompression
Design
Partial
Rate
Rate (Mbps)
Security (1 Reconfiguration
(13)
4)
(15)
(MHz)
43
Remote
System
Update
JTAG
1 bit
33
33
Yes(16)
Active Serial
(AS) through
the EPCQ-L
configuration
device
1 bit,
100
400
Yes
Yes
Yes(16)
Yes
100
100
Yes
Yes
Yes(16)
Parallel
Flash
Loader
(PFL) IP
core
4 bits
Passive serial
(PS) through
CPLD or
external
microcon
troller
1 bit
Fast passive
parallel (FPP)
through
CPLD or
external
microcon
troller
8 bits
Yes
Yes
16 bits
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Configuration
via HPS
32 bits
16 bits
32 bits
100
3200
100
3200
8000
Yes(17)
PFL IP
core
Yes(17)
Yes(16)
x8 lanes
You can configure Arria 10 devices through PCIe using Configuration via Protocol (CvP). The Arria 10
CvP implementation conforms to the PCIe 100 ms power-up-to-active time requirement.
(13)
(14)
(15)
(16)
(17)
Enabling either compression or design security features affects the maximum data rate. Refer to the Arria 10
Device Datasheet for more information.
Encryption and compression cannot be used simultaneously.
Partial reconfiguration is an advanced feature of the device family. If you are interested in using partial
reconfiguration, contact Altera for support.
Partial configuration can be performed only when it is configured as internal host.
Supported at a maximum clock rate of 100 MHz.
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Power Management
Arria 10 devices leverage the advanced 20 nm process technology, a low 0.9 V core power supply, an
enhanced core architecture, and several optional power reduction techniques to reduce total power
consumption by as much as 40% compared to Arria V devices and as much as 60% compared to Stratix V
devices.
The optional power reduction techniques in Arria 10 devices include:
SmartVIDa code is programmed into each device during manufacturing that allows a smart
regulator to operate the device at lower core VCC while maintaining performance
Programmable Power Technologynon-critical timing paths are identified by the Quartus Prime
software and the logic in these paths is biased for low power instead of high performance
Low Static Power Optionsdevices are available with either standard static power or low static power
while maintaining performance
Furthermore, Arria 10 devices feature Alteras industry-leading low power transceivers and include a
number of hard IP blocks that not only reduce logic resources but also deliver substantial power savings
compared to soft implementations. In general, hard IP blocks consume up to 90% less power than the
equivalent soft logic implementations.
Incremental Compilation
The Quartus Prime software incremental compilation feature reduces compilation time and helps preserve
performance to ease timing closure. The incremental compilation feature enables the partial
reconfiguration flow for Arria 10 devices.
Incremental compilation supports top-down, bottom-up, and team-based design flows. This feature
facilitates modular, hierarchical, and team-based design flows where different designers compile their
respective design sections in parallel. Furthermore, different designers or IP providers can develop and
optimize different blocks of the design independently. These blocks can then be imported into the top level
project.
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A10-OVERVIEW
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45
Version
October 2016
2016.10.31
May 2016
2016.05.02
February 2016
2016.02.11
Changes
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46
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Date
Version
December 2015
2015.12.14
November 2015
2015.11.02
June 2015
2015.06.15
May 2015
2015.05.15
Corrected the DDR3 half rate and quarter rate maximum frequencies
in the table that lists the memory standards supported by the Arria 10
hard memory controller.
May 2015
2015.05.04
Altera Corporation
Changes
A10-OVERVIEW
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47
Date
Version
January 2015
2015.01.23
September 2014
2014.09.30
Corrected the 3 V I/O and LVDS I/O counts for F35 and F36
packages of Arria 10 GX.
Corrected the 3 V I/O, LVDS I/O, and transceiver counts for the
NF40 package of the Arria GX 570 and 660.
Removed 3 V I/O, LVDS I/O, and transceiver counts for the NF40
package of the Arria GX 900 and 1150. The NF40 package is not
available for Arria 10 GX 900 and 1150.
August 2014
2014.08.18
June 2014
2014.06.19
February 2014
2014.02.21
February 2014
2014.02.06
Changes
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Date
Version
December 2013
2013.12.10
December 2013
2013.12.02
Initial release.
Altera Corporation
Changes