1

Introduction

A basic power semiconductor module consists of a stack of four main (or

rst-order) parts (see Figure 1.1):1

Power semiconductor chips

Insulating substrate with metallization (circuit conductor)
Baseplate
Bonding material

Each of these parts is of a different material:

Power semiconductor chips Si (IGBT, FRED, MOSFET, Thyristor,
Rectier)
Insulating substrate Usually ceramic or Si-based substrate with
Au, Ag, or Cu with metallization (metallizations deposited on top
or both surfaces)
Baseplate Cu metal, Cu composites, carbon-reinforced composites, AlSiC, etc.
Bonding material Typically Pb-based soft solder, Pb-free solder,
etc.
In addition, there are also three second-order materials involved:
Encapsulant Typically conformal coating for environmental and
mechanical protection
Power interconnections Large Al wire for interconnections, pressure-type contact, and metal terminals
Plastic case and cover Thermoset and thermoplastic material
These materials are in intimate contact with each other because they are
all bonded together. Since the materials behave differently under various
environmental electrical and thermal stresses, proper selection is vital to the
success of the module.

2005 by CRC Press LLC

FIGURE 1.1
Structure of an IGBT power module.

Selection is based on the thermal, electrical, mechanical, and chemical

properties of the materials. To these one must also add the elements of cost
and degree of maturity. These are often the determining factors in the nal
selection of materials.
By adding control circuitry, the basic power module can be converted into
an intelligent power module (IPM). A typical IPM consists of two sections:
Power section (Figure 1.1) With semiconductor components that
provide the power for switching high-current and high-voltage load
Control (or intelligent) section With low-voltage, low-power
ASIC components, which provide the control for gate drive, thermal
shutdown, short-circuit protection, etc.
The power section is assembled using hybrid microelectronics technology
on an expansive metallized ceramic substrate and a metal base plate. In order
to reduce cost and to avoid heat-generating, high-temperature power components, the control section is usually built on a separate substrate (such as
low-cost PCB), using standard surface-mount technology. The integration of
these two sections is then performed, using one of the following two
approaches:

2005 by CRC Press LLC

FIGURE 1.2
Conventional two-level power module.

Conventional approach1,2 (Figure 1.2) This is a single power

module (30 mm in height) accommodating two or more separate
levels: the power section occupies the lower level next to the heat
sink, and the control section is on the upper level. The two levels
are connected by electrical terminals.
Econo-pack approach3,4 (Figure 1.3) This is a low-prole package
(12 mm in height) containing only the power section with pins
provided on the exterior for connection to the PCB of the control
section.
Production techniques for assembling these two sections are the same in
either approach. The control section is application specic and varies greatly
with usage. The power section, on the other hand, with standard circuit
congurations and a series of voltage/current ratings, forms the fundamental building block of power conversion. The cost of the power module is
primarily in the power section.
This book focuses on the design and manufacture of the power section (or
simply the basic power module).
The contents are divided into these three main topics:
Chapter 3 Materials
Chapter 4 Manufacturing processes and quality control
Chapter 5 Design and results
2005 by CRC Press LLC

FIGURE 1.3
Econo-pack power module.

In Chapter 3, the discussion centers on the materials used and their key
properties specically electrical, mechanical, thermal, and chemical
presented in detailed table format. The materials here include both the popular old workhorses and the latest developments. (In solder, for example,
one has the workhorse 63Sn/37Pb vs. the latest Pb-free 96Sn/3.5Ag/0.5Cu.)
Materials properties are compared with a list of criteria established as necessary requirements for the building of a high-performance, high-quality,
and cost-effective power module. Selections are made. Pros and cons of each
selection are analyzed. Some of these selections may be of interest to OEMs
because they have the potential to offer a superior product to those currently
available in the same market.
In Chapter 4, the discussion shifts to manufacturing processes and quality
control. An overview of the key manufacturing processes used by most IGBT
module OEMs is presented. These include:

IGBT chip sorting/grouping

Cleaning technology
Soldering
Al wire bonding/solder bumping
Electrical, thermalelectrical, and thermalmechanical testing

These are mature but dynamic technologies. This overview not only covers
the fundamentals but also attempts to include as many of the latest advances
in these areas as possible. In addition, an innovative all-solder approach is
2005 by CRC Press LLC

described. This new approach may be of interest to OEMs, due to its superior
performance in certain characteristics.
Next, the subject of quality control is dealt with in two parts:
Process control Advanced inspection techniques, powerful tools,
SPC, etc.
Long-term reliability DFR, HALT/HASS, failure analysis
Each key manufacturing operation and its corresponding inspection techniques are outlined. Inspection sites are positioned strategically along the
production line to monitor the processes. Advanced techniques and powerful tools are required to provide valuable data on both the macroscopic and
the microscopic levels. Examples are nondestructive thermal-mechanical
characterization of the module stack, cleanliness of the surface, and SAM
inspection of the solder attachments. These and other data can be displayed
statistically.
The modules are designed for reliability (DFR) based on good design
practices, promoting high performance and reliability. The nished modules
are screened for infant mortality and life-tested for long-term reliability.
Here, the screens are performed using HASS (highly accelerated stress
screen) techniques. The life-tests rely on the concept of logarithmic time
compression, designed to determine whether the modules still meet the longterm reliability goal established during the design phase, when HALT
(highly accelerated life testing) was performed. Failure analyses are carried
out and corrective action is implemented promptly to maintain the high level
of reliability.
Chapter 4 ends with two detailed manufacturing ow charts: one for the
standard approach and one for the all-solder approach.
All pertinent information about such modules (manufacturing lot and
date, electrical and thermal characteristics) can be stored in a barcode or in
a 2D data matrix symbol, which is attached as a label to the case. With a
simple scan, the user will have the complete biography of the module.
Finally, in Chapter 5 the design of a power IGBT is presented, using the
200 A, 1200 V dual module in a half-bridge conguration as the vehicle. This
is a three-step process. The rst step is thermal management, in which
thermal analyses on conduction and stress are performed on proposed stack
structures. The next two steps deal with the physical layout of the module:
step 2 deals with circuit partitioning and step 3 with design guidelines and
considerations. Four different sample groups are built, based on the materials
and processes presented in Chapter 3 and Chapter 4 and by following the
manufacturing ow charts outlined in Chapter 5. The characteristics of these
samples are analyzed and compared. Detailed measured data are presented
in the expectation that they may serve as useful design aids.

2005 by CRC Press LLC

Although this book focuses on the design and manufacture of power IGBT
modules, most of the discussions and results are general enough to be applicable to other types of power semiconductor modules as well.

References
1. Powerex, Inc., Power Transistor Module and Accessory Product Guide, 7th edition,
2000.
2. Advance Power Technology, Inc., Application Specic Power Modules
ASPM, APT Catalog, 1997.
3. Minzer, M. and Hamkamp, M., Econo pack a new IGBT module for optimized inverter solutions, Eupec Report, Aug. 2000.
4. Richard, J. and Haase, F., Improved IGBT structure allows P.C. board-mounted
modules, Power Conversion & Intelligent Motion, Aug. 1997.

2005 by CRC Press LLC