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COATING TECHNOLOGY
Surface engineering
designer's guide
Dr ALLAN
MATTHEWS:
Lecturer, Department
of Engineering
Design and
Manufacture,
University of Hull.
A. Matthews
The latest techniques to become widely available
commercially to design engineers and others who
specify surface coatings are those for ionization
assisted physical vapour deposition; titanium nitride
being the main coating material at this time. The
background to this new technology is outlined and
information is provided about the main commercial
processes. An indication is given of potential problems
which can arise, leading to performance variability.
sooac
Evaporative processes
The common
feature
of all the commercial
techniques, and the breakthrough
which has allowed
their recent introduction,
is that they incorporate
ionization
of the depositing
species - imparting
greater
energy
and enabling
lower deposition
temperatures
to be used. These processes
are
therefore sometimes known as plasma (or ionization)
assisted techniques - signifying the presence of a
discharge
plasma
within
the
system.
Early
researchers in the field coined the title 'ion plating' 1
but this term is now less widely used. As process
developments
occurred
in both sputtering
and
evaporation,
researchers
have
invented
new
ionization enhancing techniques and terminologies.
Professor
Bunshah
of UCLA
has contributed
significantly to the contemporary
move towards
ionization
assistance
in ceramic deposition.
He
termed his process Activated Reaction Evaporation (ARE), and incorporated
a positive 'probe'
electrode to draw electrons emitted from the vapour
source, thereby increasing ionization of the reacting
species (Fig. 1).2 Unlike other 'ion plating' methods,
the components
are not biased negatively
in
ARE, and it might therefore be assumed that they
do not receive ions. This is not the case, however; the
Surface Engineering
93
94
Matthews
substratC2
positive
el~rode
negative bIas
vapour
source
vapour
source
negativ<abias
substrate
substrate
negative bias
positive el ectrode
vapour
vapour
source
2
Surface Engineering
source
4
Matthews
6
5
Balzers
Balzers
source
coating
plant:
courtesy
95
Tecvac
The thermionically
assisted triode arrangement
was first used for ion plating by Baum 11 in 1967. He
saw the attraction
of this technique as fourfold.
Firstly,
greater
control
over the discharge
is
obtained.
Secondly,
comparatively
low negative
voltages (e.g. < 400 V) need to be applied to the
sample, improving stability. Thirdly, the process can
Supplier
Unit
Type
Evaporation method (typical
no. of sources)
Independent ionization
enhancement
Substrate preheat?
Substrate temperature during
deposition, C
Substrate bias
voltage, - V
Substrate rotation?
Deposition pressure, )lbar
Cycle time
Typical coating thickness,
)lm
Maximum effective working
volume:J:,m3
Maximum load, kg
Approximate plant cost
Total power consumed per
cycle, kVAh
No. of 6 mm drills/batch
No. of 100 mm dia. x 100 mm
hobs/batch
Balzers,
Liechtenstein
Multi-Arc, USA
Vac-Tec, USA
Ulvac, Japan
Tecvac, UK
BAI730
Single chamber
Electron beam (1)
MAV 40
Single chamber
Electric arc (4)
ATC 400
Single chamber
Electric arc (4)
IP 35L
Single chamber
Electron beam (1)
Yes
No
No
IPB 45
Single chamber
HCD* electron
beam (1)
No
Yes: electron
beam
Yes: Ti ion
bombardment
Yes: radiant
heating?
450
Yes: Ti ion
bombardment
(200-485C)
350-500
450
500
350-500
<1000
Unknown
Unknown
<400
Yes
1-4
2 h 20 min
15-4
Yes
4-8
2 ht
3-6
450 (preclean)
150 (coating)
Optional
4-8
1 h 10 mint
3-5
Yes
4-8
2 h 20 min
2-6
Yes
4-8
2 h 20 min
2-4
01
02
0102
0072
014
600
500000-660 000
100
225
250000- 300 000
50
Unknown
400000
120
Unknown
250000- 300 000
90
300
150000-170000
50
700-800
Unknown
600
40
Unknown
Unknown
Unknown
16
1000-1600
30
Yes
* HCD =
96
Matthews
nQgativQbias
substrate
----
.........
"7
vapour
sou rca
substrate
magn~tic coil
vapour
source
Surface
Engineering
1985
Vol. 1
NO.2
Matthews
97
/8lectrodQ5
v substrate
vh~at~r
I..-----~
p...
o
P
vsource
jr'"
p
b
g
'"'"
10
TI-Abar,
Z 700 P2/2
dc magnetron sputtering, single chamber
DSC 91
RF sputtering,
double in-line chamber
with air lock
Glo- Tine 24 x 36
dc sputtering,
single chamber
Multiple
300-1000
Unknown
Yes, 300-600C
Optional
2000 RF
Yes: discharge
heating
No
06 m dia. x 1 m
cylinder
Unknown
Yes: radiant
heating
Yes: indirect
radiant heating
300-500
250
Optional
25
40 min to 1 h
2-3
50-300
Unknown
Yes
Unknown
Ih
0'3-05
250 max.
0-1000
Yes
Unknown
1 h 40 min to 3 h
0'2-3'0
450-500
::::;1000
No
15-28
8h
2-4
041
400000
015
170000
004
Unknown
017
275000
Unknown
6000
40
800
Unknown
4200
10-20
1200
Supplier
Leybold-Heraeus,
Unit
Type
ZV 1200
dc magnetron sputtering, 3 chamber in-line
Target
Geometry
Applied voltage, - V
Auxiliary heating?
Substrate
preheat?
FRG
Leybold-Heraeus,
FRG
rod
UK
supplied by companies.
Surface
Engineering
1985
Vol. I
NO.2
98
Matthews
nQgativQ bias
source
cold coating plasma
substrate
magnat
hot coati n9 plasma
11 Leybold-Heraeus
double magnetron
layout30
Surface Engineering
12
Leybold-Heraeus
Leybold- H eraeus
sputter
source
coating
plant:
courtesy
Matthews
99
100 Matthews
13
of
important
practical
Matthews
Dia. x depth, in
05312 x 225
0,2656 x 10
Copper
bronze
Hastelloy,
101
Work material
Aluminium
BHN 240-310
0,6562 x 150
0,5625 x 350
04062 x 325
04062 x 30
02812 x 025
0375 x 550
0375 x 175
03125 x 088
01875 x 10
Uncoated is
cobalt HSS
0-2188 x 10
Uncoated is
cobalt HSS
0125 x 10
0125 x 10
0250 x 20
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min -1 jsurface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
feed, in rev - 1
rev min - l/surface
in min-1
no. holes
ft min -
ft min -
ft min -
ft min -
ft min -
ft min -
ft min -
ft min -
ft min -
ft min -
ft min -
ft min-1
ft min -
ft min -
ft min -
Uncoated
TiN coated
0010
300/41
30
185
0-008
1200/83
96
200
manual
1100/188
manual
2
0005
350/52
175
9
0008
800/85
64
800
0006
900/95
54
380-400
0004
430/30
17
36
0008
500/48
40
6
0010
425/41
42
7
0008
500/41
4
100
00045
1400/69
63
230
0-005
1200/69
60
230
0002
1200/39
24
30
0002
1200/39
24
45
0002
600/40
12
36
0010
429/60
42
405
0009
1748/121
157
300
manual
1100/188
manual
51
0005
350/52
175
36
0008
800/85
64
3000
0-000
900/95
81
900
0004
430/30
17
186
0008
500/48
40
130
0010
425/41
42
172
0005
1200/98
6
300
00045
2000/98
90
312
0005
1800/103
90
588
0002
1550/51
31
152+
0-002
1700/56
34
180
0002
600/40
12
293
Surface
Engineering
1985
Vol. 1
NO.2
102 Matthews
150
150
100
:-.."
"
Lt..
:J
....J
.-.
t \.~
50
10
\'
'~
02
FEED,mmrav-1
~~ :\
-, ,,-
~~
,,
008
\\
\\
\,,
(a)
~r\
\\
~'
'\ :\
10
'\.
\ '\ \.
'\
'"0
\)".
"\
~
E..50
100
.\
1\\
\..'
t~
05
\
(b)
40
80
020
CUTTING SPEED, m min-1
~ uncoated drill
Balinit coated drill (new)
~ nitrided drill
Balinit coated drill (reground)
Workpiece: plates made of 42CrMo4 (AISI 4140), tempered to
1000 MN m-2, blind hole, 16 mmdrilling depth.
Test tool: Balinit coated drill, DIN 338, dia. 8 mm.
Cooling by emulsion 1: 20.
Criterium for determining toollife: constant squeal.
14 Improvements in drill life by TiN coating for a constant cutting
speed of 25 m min - 1 showing improvement in life for indicated
feed rates; b constant feed rate of 0] mm rev- 1, showing
improvement in life for indicated cutting speeds; courtesy
Balzers
Matthews
15
CONCLUSIONS
The purpose of this paper has been to provide an
introduction
to PVD coating technology for those
interested in making use of the new commercial TiN
deposition processes. Information
has been given
about the main techniques, some of their potential
problems, and applications.
The objective has not
been to identify an optimum technique, since each
one has strengths and weaknesses which may make it
more or less appropriate
for certain applications.
Some processes, for example, may be more suitable
for repetitive production
of similar items, while
others are inherently more flexible both for different
sizes and shapes of component and also for changes
103
ACKNOWLEDGMENTS
The author is indebted to several individuals and
organizations for help in the production of this guide,
which is based in part on a report produced by the
author for the National Centre of Tribology PACT
(Plasma Assisted Coating Technology) programme.
Special thanks go to Dr Peter Dearnley of the
Wolfson Institute
for Surface Engineering
who
helped in the compilation of Tables 1 and 2.
REFERENCES
1.
2.
3.
4.
5.
6.
7.
R.
F.
BUNSHAH
Surface
Engineering
1985
Vol. 1
NO.2
104 Matthews
8.
Surface
Engineering
1985
Vol. 1
NO.2
51.
52.
53.
54.
55.
56.
TI Abar,
TI Reynolds Ltd,
PO Box 232,
Hay Hall,
Redfern Road,
Tyseley,
Birmingham B11 2BG,
UK.
Ulvac Corporation,
1-10-3 Kyobashi,
Chuo-ku,
Tokyo 104,
Japan.
Vac-Tec Systems Inc.,
2590 Central Avenue,
Boulder,
CO 80301,
USA.