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Solutions for Fundamentals of Modern Manufacturing, 3/e (published by Wiley) MPGroover 2007

37 MICROFABRICATION TECHNOLOGIES
Review Questions
37.1

Define microelectromechanical system.


Answer: A microelectromechanical system (MEMS) is a miniaturized system consisting of both
electronic and mechanical components.

37.2 What is the approximate size scale in microsystem technology?


Answer: Product features in MST are measured in microns.
37.3

Why is it reasonable to believe that microsystem products would be available at lower costs than
products of larger, more conventional size?
Answer: Because less material is used in microsystem products.

37.4 What is a hybrid microsensor?


Answer: A hybrid microsensor is a sensing element (transducer) combined with electronic
components in the same device.
37.5 What are some of the basic types of microsystem devices?
Answer: The text indicates four classifications: (1) microsensors, (2) microactuators, (3)
microstructures and microcomponents, and (4) microsystems and micro-instruments.
37.6 Name some products that represent microsystem technology.
Answer: The text discusses ink-jet printing heads, thin-film magnetic heads, compact discs
(CDs), digital versatile discs (DVDs), and various automotive sensors.
37.7 Why is silicon a desirable work material in microsystem technology?
Answer: Reasons given in the text are (1) the microdevices in MST often include electronic
circuits, so both the circuit and the microdevice can be fabricated in combination on the same
substrate; (2) in addition to its desirable electronic properties, silicon also possesses useful
mechanical properties, such as high strength and elasticity, good hardness, and relatively low
density; (3) the technologies for processing silicon are well-established, owing to their
widespread use in microelectronics; and (4) use of single-crystal silicon permits the production of
physical features to very close tolerances.
37.8 What is meant by the term aspect ratio in microsystem technology?
Answer: The aspect ratio is the height-to-width ratio of the features produced in the MST device.
37.9 What is the difference between bulk micromachining and surface micromachining?
Answer: Bulk micromachining refers to a relatively deep wet etching process into a single-crystal
silicon substrate (Si wafer). Surface micromachining refers to the planar structuring of the
substrate surface using much more shallow layering processes.
37.10 What are the three steps in the LIGA process?
Answer: The three steps in the LIGA process are (1) lithography, specifically X-ray lithography,
(2) electroforming or electrodeposition, and (3) plastic molding.

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students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted
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Solutions for Fundamentals of Modern Manufacturing, 3/e (published by Wiley) MPGroover 2007

Multiple Choice Quiz


There is a total of 14 correct answers in the following multiple-choice questions (some questions have
multiple answers that are correct). To attain a perfect score on the quiz, all correct answers must be given.
Each correct answer is worth 1 point. Each omitted answer or wrong answer reduces the score by 1 point,
and each additional answer beyond the correct number of answers reduces the score by 1 point. Percentage
score on the quiz is based on the total number of correct answers.
37.1

Microsystem technology includes which of the following (three best answers): (a) LIGA
technology, (b) microelectromechanical systems, (c) micromachines, (d) nanotechnology, (e)
precision engineering?
Answer: (a), (b), and (c).

37.2

Which of the following are current applications of microsystem technology in modern


automobiles (three best answers): (a) air-bag release sensors, (b) alcohol blood level sensors, (c)
driver identification sensors for theft prevention, (d) oil pressure sensors, (e) temperature sensors
for cabin climate control?
Answer: (a), (d), and (e).

37.3

The polymer used to make compact discs (CDs) and digital versatile discs (DVDs) is which one
of the following: (a) amino resin, (b) epoxy resin, (c) polyamides, (d) polycarbonate, (e)
polyethylene, or (f) polypropylene?
Answer: (d).

37.4

The most common work material used in microsystem technology is which one of the following:
(a) boron, (b) gold, (c) nickel, (d) potassium hydroxide, (e) silicon?
Answer: (e).

37.5

The aspect ratio in microsystem technology is best defined by which one of the following: (a)
degree of anisotropy in etched features, (b) height-to-width ratio of the fabricated features, (c)
height-to-width ratio of the MST device, (d) length-to-width ratio of the fabricated features, (e)
thickness-to-length ratio of the MST device?
Answer: (b).

37.6

Which of the following forms of radiation have wavelengths shorter than the wavelength of
ultraviolet light used in photolithography (two correct answers): (a) electron beam radiation, (b)
natural light, (c) X-ray radiation?
Answer: (a) and (c).

37.7

Bulk micromachining refers to a relatively deep wet etching process into a single-crystal silicon
substrate: (a) true or (b) false?
Answer: (a).

37.8

In the LIGA process, the letters LIGA stand for which one of the following: (a) let it go already,
(b) little grinding apparatus, (c) lithographic applications, (d) lithography, electrodeposition, and
plastic molding, (e) lithography, grinding, and alteration?
Answer: (d).

37.9

Photofabrication is the same process as photolithography. (a) true or (b) false?


Answer: (b). Photofabrication is an industrial process in which ultraviolet exposure through a
pattern mask causes a significant increase in the chemical solubility of an optically clear material,

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to
students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted
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Solutions for Fundamentals of Modern Manufacturing, 3/e (published by Wiley) MPGroover 2007

thus permitting a suitable etchant to remove the exposed regions much more rapidly. This is not
the same as photolithography, in which resists are used to determine the regions to be etched.

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to
students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted
by Sections 107 or 108 of the 1976 United States Copyright Act without the permission of the copyright owner is unlawful.

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