Investigation of The Some Physical Properties of The Directionally PDF

Trans Indian Inst Met (2015) 68(5):817827
DOI 10.1007/s12666-015-0515-y
TECHNICAL PAPER
TP 2907
Investigation of the Some Physical Properties of the Directionally

Solidified AlCuCo Ternary Eutectic Alloy
Emin C
adrl Izzettin Ylmazer Mevlut S ahin
Hasan Kaya
Received: 22 November 2014 / Accepted: 13 January 2015 / Published online: 28 February 2015
The Indian Institute of Metals - IIM 2015
Abstract The Al23.9% Cu1.2% Co (wt%) ternary

eutectic alloy was prepared using a vacuum melting furnace
and a casting furnace. The samples were directionally
solidified upwards at a constant growth velocity (18.8 lm/s)
under different temperature gradients (1.235.66 K/mm)
and at a constant temperature gradient (5.66 K/mm) under
different growth velocities (8.3166 lm/s) in a Bridgmantype directional solidification furnace. The dependence of
the eutectic spacing on the solidification parameters (temperature gradient and growth rate) and that of the microhardness and compressive strength on the eutectic spacing
and solidification parameters were investigated. The electrical resistivity measurements of the studied alloy were
performed and the temperature coefficient of the resistivity
was calculated from the curve of the resulting qS plot. The
thermal conductivities of the sample grown at a constant
temperature gradient and growth rate were obtained using
the WiedemannFranz and SmithPalmer equations.
Keywords Directional solidification
Ternary eutectic alloy Microhardness
Compressive strength Electrical resistivity
Thermal conductivity
E. Cadrl (&)
Department of Physics, Faculty of Arts and Sciences,
Nigde University, Nigde, Turkey
e-mail: ecadirli@gmail.com
I. Ylmazer H. Kaya
Department of Science Education, Faculty of Education,
Erciyes University, Kayseri, Turkey
M. S ahin
Technical Vocational School of Sciences, Nigde University,
Nigde, Turkey
1 Introduction
Pure aluminum is soft and lacks strength, but alloyed with small
amounts of nickel, silicon, copper or other elements impart a
variety of useful properties [16]. These alloys are of vital
importance in the construction of modern aircraft and rockets.
Aluminumnickel alloy is one of the most important from these
alloys. Research initially focused on materials for high temperature structural applications, but it was soon broadened to
non-structural. These properties have also led to the association
of aluminum and its alloys with transportation, particularly with
aircraft and space vehicles, construction and building, containers and packaging and electrical transmission lines [1]. The
mechanical properties of directional solidified Al-based alloys,
which are important commercial materials, have been reported
in several investigations [15]. The temperature gradient (G),
growth velocity (V) and addition of the alloying elements (Co)
directly affect the microstructure of the alloy systems. Thus, the
microstructure plays crucial role on the mechanical, electrical
and thermal properties of the metallic alloys.
The effects of applied solidification parameters on
mechanical behavior have been studied intensively [620].
The investigations of mechanical, electrical and thermal
properties of AlCuCo ternary alloys are crucial for many
industrial applications. However, the effects of G and V on
the microstructure, mechanical, electrical and thermal
properties of the Al23.9% Cu1.2% Co (wt%) ternary
eutectic alloy have not been investigated in a systematic
manner. Therefore, the purposes of the present work was to
investigate the microstructural, mechanical, electrical and
thermal properties of Al23.9% Cu1.2% Co (wt%) ternary
eutectic alloy and to compare the results with the previous
experimental results for different alloy systems. For this
purpose, the dependency of eutectic spacing (k), microhardness (HV), compressive strength (rc) and electrical
123
818
resistivity (q) on the solidification parameters (G and V) for

directionally solidified Al23.9% Cu1.2% Co (wt%) alloy
was investigated. Furthermore, the temperature dependence
of electrical resistivity (q) and thermal conductivity (K) in
the range of 300625 K was performed.
This has been performed in five steps. In the first step,
AlCuCo eutectic alloy was directionally solidified under
certain solidification conditions in the Bridgman-type furnace. In the second step, effects of the temperature gradient
and growth velocity on the eutectic spacing (k), microhardness (HV), and compressive strength (rc) of the studied
alloy were characterized by linear regression analysis. In
the third step, the temperature dependence of the electrical
resistivity (q) of the AlCuCo alloy was measured by the
d.c. four-point-probe method [21]. In the fourth step, the
variations of thermal conductivity (K) with temperature
were determined from the WiedemannFranz (WF) [22]
and the SmithPalmer (SP) [23] equations by using the
measured values of the electrical conductivity. Finally, the
enthalpy of fusion and the specific heat change of the
studied alloy were determined from heating curve during
the transformation from eutectic solid to eutectic liquid by
means of differential scanning calorimeter (DSC).
The high hardness and high strength are reported to arise
from eutectic matrix due to HallPetch-type mechanism [24,
25]. The HallPetch-type relationships among the microstructure parameters (k1, k), solidification parameters (G, V)
and physical properties (HV, r, q), can be expressed as follows,
k1 ; kE ki Ga ; V b
c
HV; r; q ki G ; V ;
1
ke
1 ;
f
where a, b, c, d, e and f are the exponent values relating to

the G, V, k1, k and ki is the HallPetch slope, which can be
experimentally determined.
2 Experimental Procedures
2.1 Alloy Preparation, Directional Solidification
and Metallographic Processes
Weighed quantities of Al, Cu, and Co metals in a graphite
crucible (170 mm in length, 30 mm inner diameter, and
40 mm outer diameter) were placed in a vacuum melting

furnace, and the metals were completely melted. After
allowing time for the melt to become homogeneous, we
poured the molten alloy through a funnel into 11 graphite
crucibles (200 mm in length, 4 mm ID, and 6.35 mm OD)
in a casting furnace which has lower and upper heater
temperatures of approximately 50 and 100150 C,
respectively, above the melting point of the alloy. The
molten alloy solidified from bottom to top in the casting
furnace.
The directional solidification of the produced master
alloy was performed in Bridgman-type directional solidification furnace. For directional solidification, the sample
containing a thin alumina tube was first placed in the
sample holder. K-type thermocouples with spacings of
13 mm were inserted into the thin alumina tube. The
thermocouples were connected to the data logger and
computer. The sample was then placed into the hot region
of the furnace. After the furnace reached the desired
temperature and thermally stabilized, the sample was
withdrawn from the hot region to the cold region of the
furnace using different synchronizer motors. The alloy
was directionally solidified at a constant growth velocity
under different temperature gradients and at a constant
temperature gradient under different growth velocities.
After 10 cm of the sample had solidified, it was quenched
in water. Details of the furnace equipment, alloy preparation, and directional solidification are described elsewhere [4].
For metallographic processes, the longitudinal and the
transverse sections of the samples were mounted on a coldsetting epoxy resin. The samples were then ground with
3204,000 grit SiC paper and polished with 30.05 lm
diamond pastes. After finishing the polishing process, the
microstructure was revealed with chemical etching process
(the samples was etched 15 s with 92 mL H2O, 2 mL HF,
6 mL HNO3 solution). The micrographs of the samples
were taken with an Olympus BX-51 optical microscope
using different objectives. The eutectic spacing (k) was
calculated with the Adobe Photoshop CS3 program, with
the magnification factor taken into account. The details of
the eutectic spacing measurements are described elsewhere
[4].
Table 1 The identification of elements from the WDXRF spectra, done by using a qualitative scanning mode
Compositions (wt%)
Error (wt%)
Al (74.60)
0.3
Cu (24.17)
Co (1.23)
123
0.1
0.05
Crystal
Line
Start at 2h
Finish at 2h
LiF220
Kb
14.0
18.6
PX10
Ka, Kb
11.6
19.0
LiF220
Lb
26.2
42.0
Ge111
Mb
92.0
146.0
LiF220
Ka, Kb
36.4
42.0
2.2 Measurement of Microhardness (HV)

and Compressive Tensile Strength (rc)
Microhardness measurements in the present work were made
with a Future-Tech FM-700 model hardness measuring test
device using a (11,000) g load and a dwell time of 10 s. An
average of 20 measurements were taken from longitudinal
and transverse sections of the each sample. The average
values were taken for the microhardness value. Some errors
were inevitable during the microhardness measurements.
These errors are due to factors such as surface quality,
inhomogeneities in the microstructure and the ambiguity of
the traces. The error in the microhardness measurements has
been calculated to be approximately 5 %.
The measurements of the compressive tensile strength
were made at room temperature with a Shimadzu AG-IS
universal testing machine. Cylindrical compressive test
samples with a diameter of 4 mm and gauge length of
40 mm were prepared from the directionally solidified rod
samples under different solidification parameters. The
compressive axis was chosen parallel to the growth direction of the sample. The compressive tests were repeated
three times and the average value was taken. It has been
found that a standard deviation was approximately 5 %.
2.3 Measurement of Electrical Resistivity
The electrical resistivity measurements of the alloy were
performed using the standard four-point-probe method
[21]. A four-point-probe measurement is performed by
making four electrical contacts to the sample surface [26].
The outer contacts are used to supply current, whereas the
inner contacts are used to measure the voltage. The electrical resistivity q of the sample is given as,

V
q 2p s
3
I
where 2ps is the resistivity correction factor, V is the
potential difference between the inner probes, and I is the
current through the probes.
A Keithley 2400 Sourcemeter was used to provide constant current in the sample. The potential drop that occurred
in the sample was measured with a Keithley 2700 multimeter connected to a computer. The probes were platinum
wires with a diameter of 0.5 mm used for measurements. In
this study, the dependence of the electrical resistivity on
temperature was investigated. The temperature of the
sample in a Nabertherm P320 muffle furnace was controlled
with the accuracy of 0.5 K. The temperature of the sample
was measured with a K-type thermocouple.
The temperature coefficient of resistivity a is calculated
from the slope of the resistivitytemperature plot and is
given as,
819
q qo
1 Dq
qo T To qo DT
where q is the resistivity at temperature T, qo is the resistivity at room temperature (300 K), and a is the temperature coefficient of resistivity.
2.4 Calculation of Thermal Conductivity
The thermal conductivity of a material describes its heat
conduction ability. Thermal conductivity depends on the
structure and the temperature of the material. The relationship between the thermal conductivity and the electrical conductivity is established by the WiedemannFranz
equation [22], which is based on the fact that heat and
electrical transport both involve free electrons in the metal,
and by the SmithPalmer equation [23], which is a modified form of the WiedemannFranz equation [22]:
K
LT
r
K 0:909LrT 10:5
where K is the thermal conductivity, r is the electrical

conductivity, and L is the Lorenz number. The theoretical
value of L is 2.45 9 10-8 WX/K2. However, the Lorenz
number is known to slightly change with temperature and
to not be the same value for all materials [27]. The variation of thermal conductivity with temperature was determined using the r and L values.
2.5 Measurement of Enthalpy and Specific Heat
Differential scanning calorimeter (DSC) is used for the
thermophysical characterization of materials. In particular,
melting, crystallization, phase transition, and glassy transition properties are measured directly. The enthalpy (DH)
and the specific heat (Cp) are calculated from the obtained
curves. The enthalpy is calculated as follows:
DH A =m
As evident from the equation, the enthalpy is the

required energy for melting of the unit mass (m). The mass
has a unit of mg. The A is the area that is restricted by the
forming peak and has a unit of mJ; Thus, the specific heat
is calculated as follows,
Cp
dQ 1
dH
DH
dt m bo dT Tpeak
where b = dT/dt = 10 K/min (heating rate), dQ/dt = heat

flow (J/s or watts), A = the area of a triangle = 0.5
base 9 height = 0.5 9 power (the energy required for the
melting of the sample). The DSC (Perkin Elmer Diamond
model) thermal analysis of the alloy was performed using a
123
820
(a)
Dark bulk phase

Elmt
Elmt (at.%) Elmt (wt.%)
Al
Cu
Co
Total
66.37
33.63
0.0
100
(b)
Dark rod phase (Al7Cu2Co)

Elmt
45.59
54.41
0.0
100
Al
Cu
Co
Total
Elmt (at.%)
Elmt (wt.%)
68.76
22.03
9.21
100
48.85
36.85
14.30
100
Al7Cu2Co
-Al
(c)
Gray matrix phase (-Al)

Elmt
Al
Cu
Co
Total
Elmt (at.%) Elmt (wt.%)

90.12
9.64
0.24
100
79.50
20.02
0.48
100
(d)
Al2Cu
Light eutecc phase (Al2Cu)

Elmt
Elmt (at.%)
Al
Cu
Co
Total
69.28
30.53
0.19
100
Elmt (wt.%)
48.93
50.77
0.30
100
Fig. 1 The chemical composition analysis of the Al23.9% Cu1.2% Co (wt%) eutectic alloy a Dark bulk phase b Dark rod phase (Al7Cu2Co)
c Gray matrix phase (a-Al) d eutectic phase (Al2Cu)
123
heating rate of 10 K/min and under a constant stream of

nitrogen at atmospheric pressure.
In pure metals, enthalpy variation occurs suddenly at the
melting temperature. However, in alloys, the transition
from liquid to solid occurs in a temperature interval called
the mushy zone. Therefore, the enthalpy varies from the
liquidus temperature to the solidus temperature [28].
3 Results and Discussion

3.1 Composition Analysis of the Phases (WDXRF
and EDX Analysis)
A composition analysis of the samples was made using a
wavelength-dispersive X-ray fluorescence (WDXRF)
spectrometry (PANalytical Axios advanced model). As
seen in Table 1, the nominal composition quantities of Al,
Cu and Co were found to be 74.60, 24.17 and 1.23 (wt%),
respectively. EDX analysis was performed to determine the
composition of the phases in the AlCuCo eutectic alloy
at 20 keV using the X-ray lines. According to the EDX
analysis results shown in Fig. 1, three different the solid
phases (dark gray bulk phase, dark gray rod phase and light
gray eutectic phase) grew on the dark gray matrix phase.
The composition of the matrix phase (a-Al) was Al9.64
Cu0.24 Co (at%), and that of the dark gray bulk phase
(Al2Cu) was Al30.53 Cu (at%). Also, the dark gray rod
phase (Al7Cu2Co intermetallic phase) was Al22.03 Cu
9.21 Co (at%).
The constituent phases of the sample were identified by
X-ray diffraction (XRD) analysis using a Siemens X-ray
diffractometer (Model D500) with Cu Ka (k = 1.79 Ao )
radiation at room temperature. Sample was cut from the
ingots and polished to a mirror finish. Measurements were
Fig. 2 X-ray diffraction patterns obtained from the AlCuCo

ternary alloy (cast sample)
821
performed by step scanning 2h from 20 to 90 with a 0.02

step size. A count time of 1 s per step was used, giving a
total scan time of *1.5 h. Figure 2 shows peaks obtained
in the analysis compared with the JCPDS data and a-Al
phase (red circles), Al2Cu (blue squares) and Al7Cu2Co
(yellow triangles) intermetallic phases have been detected.
Dominant phases in the microstructure were a-Al and
Al2Cu phases. Al2Cu was present in a heterogeneous
microstructural constituent resembling binary (Al2Cu ? aAl) eutectic. The fraction of Al2Cu phase was rather high,
but volume fraction of the Al7Cu2Co intermetallic phase
was very small. All these phases were also confirmed in the
corresponding microstructure (Fig. 1). Both EDX analysis
(Fig. 1) and XRD pattern (Fig. 2) strongly indicate that
only three phases (a-Al, Al2Cu and Al7Cu2Co) are present
in microstructure of the cast sample.
3.2 The Effect of Solidification Parameters
on Lamellar Spacing
The Al23.9% Cu1.2% Co (wt%) ternary eutectic alloy
was directionally solidified at a constant growth velocity
(V = 18.8 lm/s) with different temperature gradients
(G = 1.235.66 K/mm) and at a constant temperature
gradient (G = 5.66 K/mm) with different growth velocities
(V = 8.3166 lm/s). The SEM micrographs of longitudinal and transverse sections of directionally solidified
AlCuCo ternary eutectic alloy prepared under different
solidification parameters are given in Fig. 3. As seen from
Fig. 3, microstructure is usually regular lamellar form, but
broken lamellar (Fig. 3f) and fishbone-type (Figs. 3d and
2e) eutectic microstructures were frequently observed in
the microstructure of the studied alloy. The lamellar
eutectic spacings were measured from the longitudinal and
transverse sections of the samples grown at different G and
V. As seen in Figs. 4 and 5, an increase in the temperature
gradient caused a decrease of the rod spacings at a constant
growth velocity (18.8 lm/s). When the temperature gradient was increased from 1.23 to 5.66 K/mm, the kL value
decreased from 6.33 to 3.93 lm and the kT value decreased
from 6.00 to 3.07 lm. An increase of the growth velocity
caused a decrease of the rod spacings at a constant temperature gradient (5.66 K/mm). When the growth velocity
was increased from 8.3 to 166 lm/s, the kL value decreased
from 5.35 to 1.31 lm and the kT value decreased from 4.79
to 1.20 lm.
The exponent values of the G parameter obtained from
this study as a function of k are in the range of 0.320.43.
These values are slightly lower than 0.48 value reported by
Boyuk et al. [29] for SnAgZn ternary eutectic alloy.
Also, the exponent values of the V parameter are in the
range of 0.440.46. These values are substantially slightly
lower than the 0.50 value predicted on the basis of the
123
822
Fig. 3 Micrographs of the directionally solidified Al23.9% Cu1.2% Co (wt%) eutectic alloy: a longitudinal section; b transverse section
(G = 1.23 K/mm, V = 8.3 lm/s); c longitudinal section; d transverse section (G = 5.66 K/mm, V = 8.3 lm/s); e longitudinal section; and
f transverse section (G = 5.66 K/mm, V = 166 lm/s)
JacksonHunt [30] eutectic theory. This situation may be

due to the properties of the studied ternary alloy. No
accepted theoretical model for the exponent values of ternary alloys exists. The average exponent value of the
V parameter (0.45) as a function of k is in good agreement
with the value of 0.44 reported by Fan et al. [31] for TiAl
Si ternary eutectic alloy.
123
3.3 The Effect of Eutectic Spacing and Solidification

Parameters on Microhardness and Compressive
Strength
The dependencies of microhardness on the solidification
parameters and eutectic spacing are given in Figs. 6, 7, 8,
and the relationships between these parameters are given in
823
250
V= 18.8 m/s (constant)
Eutectic spacing, (m)
V= 18.8 m/s (constant)
Micohardness, HV (kg/mm2)
10
9
HVL
HVT
200
150
1
Temperature gradient, G (K/mm)
Fig. 4 The variation of eutectic spacing with temperature gradient at

a constant growth velocity
Fig. 6 The variation of microhardness with temperature gradient at a

constant growth velocity
300
G= 5.66 K/mm (constant)
HVL
G= 5.66 K/mm (constant)
Microhardness, HV (kg/mm2)
4
3
HVT
250
200
1
150
6
10
30
50
70
100
300
10
30
50 60
100
300
Growth velocity, V (m/s)
Fig. 5 The variation of eutectic spacing with growth velocity at a

constant temperature gradient
Table 2. As seen in Fig. 6, at a constant growth velocity

(18.8 lm/s), an increase of the temperature gradient
resulted in increased microhardness. When the temperature
gradient was increased from 1.23 to 5.66 K/mm, the HVL
increased from 196.84 to 207.44 kg/mm2 and HVT
increased from 201.03 to 211.43 kg/mm2. At a constant
temperature gradient (5.66 K/mm), an increase of the
growth velocity resulted in increased microhardness
(Fig. 7). When the growth velocity was increased from 8.3
to 166 lm/s, the HVL increased from 199.40 to 228.09 kg/
mm2 and the HVT increased from 201.78 to 231.49 kg/mm2.
As evident from Fig. 8, a decrease of the eutectic spacing
resulted in increased microhardness. When the kL was
decreased from 6.33 to 1.31 lm, the HVL increased from
196.84 to 228.09 kg/mm2; when the kT was decreased from
Fig. 7 The variation of microhardness with growth velocity at a

constant temperature gradient
6.00 to 1.20 lm, the HVT increased from 201.03 to

231.49 kg/mm2.
The exponent value of G (0.07) obtained in this study as
a function of the HV is in good agreement with 0.08
reported by Boyuk et al. [32] for ZnCu peritectic alloy.
But, this exponent value is lower than the values of 0.13,
0.16, and 0.16 reported by Boyuk et al. [33] for Al17.6
Cu42.2 Ag (wt%) eutectic alloy, by Fan et al. [34] for Ti49 at% Al alloy, and by Cadrl et al. [35] for Sn-23Bi-5Zn
(wt%) alloy, respectively. The exponent value of V (0.05)
obtained from this study as a function of HV is good
agreement with the values of 0.06, 0.06, 0.04, 0.07, 0.07,
and 0.09 values reported by Cadrl et al. [35] for Sn-23Bi5Zn (wt%) alloy, Hu et al. [36] for Sn-58 wt% Bi eutectic
alloy, by Guo et al. [37] for NiAl-28Cr-5Mo-1Hf (at%)
alloy, by Vnuk et al. [38] for SnZn eutectic alloy, by
123
824
the microstructural properties of the studied AlCuCo

ternary alloy.
As seen in Figs. 9 and 10, compressive strength (rc)
values increased with the increasing G and V, but strain (%)
values decreased. The maximum compressive strength of
studied alloy reaches to 467.4 MPa. The factor responsible
for higher compressive strength in the investigated alloys is
fineness of the eutectic. Similar trends were observed by
some researchers for different multicomponent alloys [18
20]. It can be seen from these Figures, the rc values
increased by approximately 43 and 92 % with increasing
G and V for the studied alloy, respectively. The exponent
values of G and V are equal to 0.27 and 0.22, respectively.
These exponent values are smaller than the value of 0.50
obtained by Osorio and Garcia [13] for Zn-3 Al alloy and
the value of 0.50 obtained by Santos et al. [14] for Zn-27 Al
alloy. The average exponent value is 0.24. This exponent
value is in good agreement with the values of 0.20 and 0.23
obtained by Siewert et al. [46, 47] for the soldering alloys,
respectively.
Lapin and Marecek [39] for Ni-21.9Al-8.1Cr-4.2Ta0.9Mo-0.3Zr alloy (at%), and by Boyuk and Maras l [40]
for Sn-3.5Ag-0.9Cu (wt%) eutectic alloy, respectively. The
exponent value of V (0.05) is slightly lower than the values
of 0.11, 0.14, and 0.15 reported by Hu et al. [41] for Sn-1.0
wt% Cu, by Lapin et al. [42] for Ti-46Al-2W-0.5Si (at%)
alloy, and by Fan et al. [43] for Ti-46Al-0.5 W-0.5Si alloy
(at%), respectively.
The average exponent value of k (0.12) obtained in this
study as a function of the HV is lower than the values of
0.22, 0.24, 0.21, and 0.20 reported by Boyuk et al. [33] for
Al17.6 Cu42.2 Ag (wt%) eutectic alloy, by Engin et al.
[44] for Zn-5 wt% Al, by Hu et al. [41] for Sn-1.0 wt% Cu
alloy, and by Hu et al. [45] for Sn-40.5Pb-2.6Sb (wt%)
eutectic alloy, respectively. This situation may be due to
250
HVL
Micohardness, HV (kg/mm2)
HVT
3.4 Electrical Properties of the AlCuCo Ternary

Eutectic Alloy
Figure 11 shows the variation of the electrical resistivity
values with growth velocity. The dependence of q on the
V can be represented by Eq. (2) (q = k Vd), where k is a
constant, d is the exponent value relating to the growth
velocity. As seen in Fig. 11 and Table 2, the relationships
between q and V was found to be q = 0.086 V 0.09 by using
linear regression analysis and also it can be seen that values
of the electrical resistivity increase with increasing growth
velocity.
200
Fig. 8 The variation of microhardness with eutectic spacing
Table 2 The ralationships between the eutectic spacing, the solidification parameter, and the physical properties (HV, rc, q)
Relationship
kL = k1G
-0.32
kT = k2G-0.43
kL = k3V
-0.46
Constant (k)
k1 = 0.736 (lm
Correlation coefficient (r)

1.32
r1 = -0.994
k2 = 0.325 (lm1.43 K-0.43)
r2 = -0.998
k3 = 14.989(lm
0.54
-0.32
-0.46
r3 = -0.987
kT = k4V-0.44
k4 = 12.021(lm0.56 s-0.44)
r4 = -0.989
HVL = k5G0.07
k5 = 186.21 (kg K-0.07mm-1.93)
r5 = 0.978
HVT = k6G0.07
k6 = 189.67 (kg K-0.07mm-1.93)
r6 = 0.990
HVL = k7V0.05
k7 = 180.30 (kg mm-2.05s0.05)
r7 = 0.996
HVT = k8V0.05
k8 = 184.07 (kg mm-2.05s0.05)
r8 = 0.992
HVL = k9k-0.12
L
HVT = k10k-0.12
T
rc = k11G0.27
rc = k12V0.22
q = k13V0.09
k9 = 240.43 (kg mm-1.88)
r9 = 0.994
k10 = 238.23 (kg mm-1.88)
r10 = 0.995
k11 = 159.26 (MPa K-0.27 mm0.27)
r11 = 0.998
k12 = 6.75 (MPa mm-0.22 s0.22)
r12 = 0.998
k13 = 0.086 (Xlm0.91 s0.09)
r13 = 0.988
kL, HVL the values of the eutectic spacing and microhardness measured from the longitudinal section of the samples, respectively
kT, HVT the values of the eutectic spacing and microhardness measured from the transverse section of the samples, respectively
123
825
1e-6
300
G=5.66 K/mm (constant)
250
Resistivity, (m)
Compressive strength, (MPa)
V=18.8 m/s (constant)
200
1e-7
150
1e-8
1
10
Fig. 9 The variation of compressive strength with temperature

gradient at a constant growth velocity
6e-7
500
Resistivity, ( m)
Compressive strength, c (MPa)
300
50
70
100
200
Fig. 11 The variation of electrical resistivity with growth velocity at

a constant temperature gradient
600
400
20

-3 -1
V=8.3 m/s
=7.73x10 K
-3 -1
V=41.5 m/s
=7.02x10 K
-3 -1
V=166 m/s
=6.74x10 K
4e-7
2e-7
200
300
8
10
20
30
40 50 60
80 100
200
Fig. 10 The variation of compressive strength with growth velocity

at a constant temperature gradient
The variation of electrical resistivity of the AlCuCo

samples grown at three different V with temperature is
given in Fig. 12. As evident from Fig. 12, the resistivity
increases with increasing temperature for each growth
velocity. It was measured in the range of 1.20 9 10-7 5.95 9 10-7 X m at temperatures in the range 295627 K.
The temperature coefficient of resistivity (a) were
calculated as 7.73 9 10-3 K-1, 7.02 9 10-3 K-1 and
6.74 9 10-3 K-1 with increasing growth velocity,
respectively.
3.5 The Variation of Thermal Conductivity of the Al
CuCo Alloy with Temperature
The variation of thermal conductivity of the Al23.9% Cu
1.2% Co (wt%) alloy with temperature was determined
400
500
600
Temperature (K)
Fig. 12 The variation of electrical resistivity with temperature
using the electrical conductivity (r) and Lorenz (L) values

from the WiedemannFranz [22] and SmithPalmer [23]
equations, respectively. The r values were measured
experimentally. The values of L are given as 2.46 9 10-8,
2.40 9 10-8, 2.52 9 10-8 WX/K2, and for Al, Cu, and Co,
respectively, in the literature [27].
The thermal conductivity values calculated from the
WiedemannFranz and SmithPalmer equations using
experimentally measured electrical conductivities are given
in Fig. 13. In the range of 295627 K, the thermal conductivities were observed to be in the range of 1283 W/Km.
As evident from these previously described data, the thermal
conductivities decreased with increasing temperature. This
result indicates that the thermal conductivity values
(2283 W/Km) obtained using the SmithPalmer equation
for studied alloy are slightly higher than those (1280 W/
123
826
4 Conclusions
Thermal conductivity, K (W/Km)
120
V=166 m/s
G=5.66 K/mm
100
Weidemann-Franz
Smith-Palmer
In this work, the mechanical, electrical, and thermal

properties of the directionally solidified AlCuCo ternary
eutectic alloy were investigated. The results are summarized as follows:
80
60
(1)
40
20
(2)
0
300
400
500
600
Temperature, T (K)
Fig. 13 The variations of thermal conductivity with temperature

determined using the WiedemannFranz and SmithPalmer equations
(3)
5
Heat flow (mW)
-5
(4)
Tpeak=820.5 K
Area=1901.0 mJ
-1
H=204.8 J g
-1 -1
Cp=0.374 J g K
-10
(5)
-15
The effects of G and V on k, HV and rc were

investigated. Increases of the solidification parameters were observed to result in finer microstructures,
thereby resulting in increased microhardness and
compressive strength.
Also, the effect of growth velocity on q was
investigated. The values of electrical resistivity
increase with increasing values of growth velocity.
The establishment of the relationship between electrical resistivity and growth velocity can be given as:
q = 0.086 V0.09
The measured resistivity was in the range of 1.20 9
10-7 - 5.95 9 10-7 X m in the investigated temperature range of 295627 K. The temperature
coefficient of resistivity (a) were calculated as
7.73 9 10-3 K-1, 7.02 9 10-3 K-1 and 6.74 9
10-3 K-1 with increasing growth velocity,
respectively.
The thermal conductivity values obtained using the
SmithPalmer equation are slightly higher than those
obtained using the WiedemannFranz equation
The measured melting temperature was 820.5 K, and
the DH and the CP were calculated as 204.8 J/g and
0.374 J/gK, respectively.
-20
200
400
600
800
1000
Temperature (K)
Fig. 14 The heat flow-temperature curve of the Al23.9% Cu1.2%

Co (wt%) eutectic alloy
Acknowledgments This project was supported by the Nigde University Scientific Research Project Unit under contract No: FEB
2011/08. The authors are grateful for this financial support.
References
Km) obtained using the WiedemannFranz equation. Aksoz
et al. have reported a similar conclusion [48, 49].
3.6 The DSC Analysis of the AlCuCo Ternary
Eutectic Alloy
The thermal properties of the Al23.9% Cu1.2% Co (wt%)
alloy were investigated using a heating rate of 10 K/min
in the range 330780 K with DSC analysis. The variation
of the heat flow with temperature is given in Fig. 14. A
sharp peak occurred during melting. The melting temperature of the Al23.9 % Cu1.2 % Co (wt%) alloy was
determined to be 820.5 K, and the melting enthalpy (DH)
and the specific heat (CP) were calculated as 204.8 J/g and
0.374 J/gK, respectively.
123
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Trans Indian Inst Met (2015) 68(5):817827