ASM Equipment 2 PDF

SEMICONDUCTOREQUIPMENT
http://www.asmpacific.com
ASM Semiconductor Equipment Products

Index
Materials
Handling
Model
AD9212 /
AD9210
IS9012TS
Materials
Handling
Process
Harrier Xtreme
AD8312
AD8312R
Wire
Bonding
Equipment
Eagle Xtreme
Gold Ball
WB
Epoxy DA
AD838R
Epoxy DA
AD908
Stud
Bumping
Equipment
AD211 / AD212
Hummingbird
Gold / Copper
Stud Bumping
AL501
Aluminium Wire
Wire
Bonding
AB559A Series
Fine
Equipment Aluminium Wire
AB530
Eutectic DA
Materials
Handling
AD220
SD890A
AD880
AD881 Series
Strip Form
Substrate
Soft Solder DA
AD100
6 Wafer
Handling
12 Wafer
Handling
Ultrasonic Wedge
Wire Bond
15
AD830U
AD830UR
Die
Attach
Equipment
13
14
Eagle60AP-LD
Heavy
AD830 / AD830R
8 Wafer
Handling
iHawk-V
Thermosonic
Gold Ball Wire Bond
iHawk-02
AD838
AD838P
iHawk Xtreme
Eagle Xtreme X2L
IS8912DA
AD838L
12
TwinEagle Xtreme
Flip Chip
IS9012LA
LinDA
Process
ASM GoCu
IS9012TC
12 Wafer
Handling
Model
Curing
Oven
Epoxy DA
Strip / Reel
Form
Substrate
Model
SR902 / SR902L
COE139 /
COE139R
PC139 /
PC139R2R
Process
Reflow Oven
Snap Curing Oven
AD819-PD
AD819-LD
Eutectic DA
MCM12
Multi-Chip DA
COG900 /
COG930
FOG900 /
FOG930
Misc.
IS898GA
IRGA868
IS868LA2
IS600
Materials
Handling
AOI, Map
Sorting /
Die Sorting
Equipment
4 Wafer
Handling
6 Wafer
Handling
Model
Materials
Handling
ACF D/A
Glass Attach
10
Process
ES100
Advanced Optical
Inspection (AOI)
MS100 Plus
Map Sorting
AS899
Die Sorting
Molding
Equipment
11
Model
Strip Form
Substrate
IDEALmold
80/120/170t
Reel Form
Substrate
IDEALmold
R2R
Strip Form
Substrate
OSPREY
Strip Form
Substrate
Lens Holder Attach

Solder Paste DA /
Clip Attach
eClip
12 Wafer
Materials
Handling
Strip / Reel
16
Transfer Molding
IDEALab
17
IDEALcompress
WLP300
Compression Molding
IDEALab-WLP
Model
Dispensing/ Form Substrate DS500 Series

Jetting
Strip Form
System
DS520 / M
Substrate
Process
Process
Glob-top, Dam & Fill
Jetting
18
ASM Semiconductor Equipment Products

Index
Materials
Handling
DPAK,
DPAK,
TO220, QFN,
DFN, SOP,
Trim/Form/ TQFP, TSOP,
Singulation TSSOP & etc.
System
Model
18
MP209
MP-TAB
Discrete Package
SD Card
MP-SDS
SD Card Singulation
All kinds of
Laser Mark
IC and
Handling Power Device
Matrix
Equipment
Leadframes
Materials
Handling
Model
Process
LS1000
Model
FT2030
SC59, SC70,
SOT23,
SOD923,
SOT113,
SOT223, etc.
FT2018
TO220, TO3P,
TO264,
DPAK, etc.
FT-Power
Laser Mark Handler
Process
21
BP2000
Ball Placement
BCC,
CSBGA,
MLP, QFN,
SiP & etc.
CS900
High Speed Tape

Sorting
Measuring
Electrical /
Optical
Characteristics
for Die /
Package
Model
TLB203
SLS230 / S
LED (SMD) SMD type

Sorting & Chip LED,
Top LED &
Taping
System Sideview LED
Process
SLS230T Plus
Process
LED Tester
SMD LED Testing and

Sorting
SLT400
SMD LED Taping
IP360 Series
High Power LED

Testing & Sorting
22
Turret Based Test

Handler
20
FV2030
Complete Quality
Inspection Handler
M-CAN,
S-CAN, SOP,
TSOP,
TSSOP & etc.
FET-CLUSTER
Singulation and
Finishing Integrated
System
M-BGA, QFN,
SOIC, QFP,
TSOP, etc.
FT1000
Carrier Based Test
FT1000-HD
Hot Test
SO, TSOP,
QFN, MLF,
BCC, BGA,
CSP, etc.
Testing
System
Model
CSBGA /
PBGA,
flex BGA
& etc.
Materials
Handling
19
TSSOP,
QFN / MLP,
MBGA, etc.
SC59, SC70,
SOT23,
SOT89,
SOT113,
SOT223,
Test and
SOIC,
TSSOP,
Finish
QFN/MLP,
Handling
MBGA,
Equipment
DPAK,
TO220,
TO3P,
TO264,
SIP9, etc.
Ball
Placement
and CSP
Handling
Equipment
Mechanical Press
Trim / Form
SOT, SOD,
QFN, DFN
& etc.
Materials
Handling
Materials
Handling
Process
12 Flip Chip Bonding Equipment
Dual Head Flip Chip Bonder
Thermosonic Flip Chip Bonder
AD9212 / AD9210
(for Image Sensor Application)
Applications: Flip chip bonding on SBGA, BGA, ceramic panels,

singulated units on carrier, lead frames, etc.
High productivity with individual dual flip chip bonding systems
Extra wide substrate handling
Precise placement with latest linear motorizing systems
Up to 12 wafer handling capability
Supporting flux dipping flip chip process
SMEMA standard compatible
Convertible flip chip and direct die bonding processes (option)
AD9210
Up to 210 mm track width handling capability
Tape feeder handling capability (option)
IS9012TS
Applications: Thermosonic flip chip bonding on SBGA, BGA, ceramic

panels, singulated units on carrier, lead frames, etc.
High precision thermosonic flip chip bonding process
Excellent foreign material control for image sensor application
HEPA fan filter unit providing clean air flow
Blow & suck cleaning for housing wafer
And more
Large range of die sizes handling
Intelligent self-compensated bond force control
Patented transducer design
Consistent and independent heating controls
Workholder with rigid clamping system to hold substrate during
bonding
Thermocompression Flip Chip Bonder
12 Flip Chip Bonder
IS9012TC
IS9012LA
Applications: Thermocompression flip chip bonding on e.g. CLCC,

PLCC, BGA, PCB, singulated units on carrier, etc.
Excellent thermocompression (TC) bonding performance
Blow & suck cleaning for housing wafer
And more
Flexible indexing system for substrate or boat carrier design
Real time dispensing pattern inspection and position alignment
Supporting both flip chip and direct die attach processes (option)
*Remark: All performance is package dependent
Applications: Image sensor flip chip bonding on e.g. CLCC, PLCC,

BGA, PCB, singulated units on carrier, etc.

Blow & suck cleaning for housing substrate
Workholder with clean cell feature
And more
Flexible indexing system for substrate or boat carrier design

Real time epoxy pattern inspection and position alignment
Supporting both flip chip and direct die attach processes
12 FLIP CHIP / DIE ATTACH

BONDING EQUIPMENT
12 Die Attach Equipment
US PATENTED
US PATENTED
12 Automatic High Speed Die Bonder
12 Automatic Die Bonder
AD8312
(for Stacked Dice Application)
Applications: Mini-BGA, flex BGA, CSPBGA, MLP/QFN, QFP,

TQFP, PLCC, TSSOP, TSOP, SOIC, MEMS, PDIP, etc.
Worlds first 12 dual dispensing die bonding series
Implementing patented double decoupling bond head system
Universal workholder design for various packages
In-line capability with curing oven or machine cascade
LinDA
Applications: Stacked dice application on Mini-BGA, flex BGA,

CSPBGA, QFN, QFP, TQFP, PLCC, TSSOP, TSOP, etc.
Design for all-round stacked dice and thin die bonding process
Panel bonding capability
Excellent substrate warpage control
Remarkable thin die handling capability with various patented designs
(option)
Individual pick and bond system
High precision bonding with high resolution vision system
US PATENTED
(Reel Form Materials Handling)
AD8312R
IS8912DA
Applications: Reel form materials handling e.g. smartcard

substrates, metal lead frames or flex substrates, etc.
Implementing patented double decoupling bond head system
Strategic module designs suitable for handling backside plated
substrates
In-line capability with other equipment, e.g.
Curing oven PC139R2R
Buffer station
And more......
Applications: Image sensor die bonding on e.g. CLCC, PLCC, BGA,

PCB, singulated units, etc.

Blow & suck cleaning for housing substrate and wafer
And more
Flexible indexing system for substrate or boat carrier

Up to 12 robotic wafer handling capability
US PATENTED
US PATENTED
Automatic High Speed Epoxy Die Bonder
AD838
(Reel Form Materials Handling)
Applications: High density lead frames, e.g. QFN, TQFP, PLCC,

TSSOP, TSOP, SOIC, SOT, etc.
High speed performance
Implementing patented bond head design
Supporting dual dispensing system
Excellent accuracy with full range of inspection algorithms
Extra large bonding area: up to 4 width substrate handling
capability
Graphical user interface with multi-language support
Providing graphical SPC data with latest IQC system
AD838R
Applications: Reel form materials handling, e.g. metal lead frames

or flex substrates, top LED, etc.
capability
Automatic input reel system
In-line capability (option) with
Lead frame cutting system LFC130 or
Curing oven COE139R / PC139R2R
US PATENTED
Automatic High Precision Epoxy Die Bonder
AD838L
AD838P
Applications: Direct substrate indexing, e.g. ceramic substrates for

high power LED, etc.
Strategic direct indexing algorithm suitable for direct ceramic
indexing or other materials handling
Implementing excellent precision with
Various inspection systems during bonding process
Patented bond head design
capability
Excellent substrate warpage control
Implementing latest global substrate alignment
US PATENTED
Applications: High precision bonding performance on, e.g. QFN,

TQFP, PLCC, TSOP, SOIC, SOT, etc.
Excellent accuracy with full range of inspection algorithms
capability
Providing graphical SPC data with latest IQC system

8 DIE ATTACH
EQUIPMENT
PATENT PENDING
US PATENTED
Automatic High Speed Die Bonder
AD830 / AD830R
AD908
Applications: High density substrates, e.g. chip LED, top LED,

side view LED, SOIC, SOD, etc.
Widely implementing linear motor systems
AD830R for reel form materials handling
Up to 8 wafer handling capability (option)
Applications: Large aspect ratio die handling, suitable for linear

scanner application, etc.
High precision placement with special PR alignment
Implementing patent pending bond head design
Extra long dispensing area for large aspect ratio die handling
Supporting epoxy writing and dotting capability
Excellent substrate warpage control with moving bond workholder
table design
US PATENTED
US PATENTED
Automatic High Speed Eutectic Die Bonder
Automatic High Speed Eutectic Die Bonder
AD830U
AD830UR
Applications: High density substrates, e.g. SOIC, SOT, SOD, SOJ,

high power LED, etc.
High throughput by
Applications: Reel form materials handling, e.g. metal lead frames,

top LED, etc. for eutectic die attach process
High throughput by
Providing excellent oxidation control with forming gas supply
Providing excellent oxidation control with forming gas supply
Supporting flux eutectic or epoxy die attach process by equipping
Supporting flux eutectic or epoxy die attach process by equipping
with dispensing or stamping system (option)

In-line capability with gold ball wire bonding system
iHawk Xtreme series (option)
In-line capability with gold ball wire bonding system
with dispensing or stamping system (option)

iHawk Xtreme series (option)
US PATENTED
US PATENTED
Automatic Eutectic Die Bonder
Automatic Eutectic Die Bonder
AD211 / AD212
AD220
Applications: Panel form of high power LED packages, e.g.

ceramic/wafer submount for direct eutectic process
Implementing patented technologies
Double decoupling bond head system
Heated collet die attach process
Extra large bonding area:
AD211: up to 4 x 4 bonding area
AD212: up to 8 x 8 bonding area
Providing excellent oxygen level control
Excellent void control with proven heat tunnel design and mature
process know-how
Anti-thermal shock by equipping with pre-heat and post-heat stations
Automatic materials handling
Automatic Soft Solder Die Bonder
SD890A
Applications: High power devices, discrete units, e.g. TO-220,

SOT, DPAK, DPAK matrix, PowerSO, etc.
Implementing flexibility with
Matrix lead frame handling with XY shuttling bond head system
AB dice handling with rotary collet bond arm design
Up to 8 independently controlled heating zones suitable for various
temperature profile requirements
Precision solder volume and pattern control with
Precise solder wire feeding and spanking system
Providing excellent oxygen level control with forming gas supply
Patented solder writing technology for excellent solder control
(option)
Applications: Strip form of high power LED lead frames for direct
eutectic die attach process
Implementing patented technologies
Double decoupling bond head system
Heated collet die attach process
Providing excellent oxygen level control
Excellent void control with proven heat tunnel design and mature
process know-how
Automatic die theta alignment with precision stage
Automatic lead frame input and output handling capability
8 / 6 DIE ATTACH
EQUIPMENT
PATENT PENDING
High Speed Epoxy Die Bonder
Automatic Die Bonder
(for Vertical LED Application)
AD880
AD100
Applications: Vertical LED, photo transistors, infrared diodes, etc.

Worlds fastest epoxy die bonding system with patent pending
technologies dual shuttling system
Pro-longing MTBA with new inputting / outputting systems
Inputting system: dual stack loading inputting system / multi-magazine
inputting elevator system
Outputting system: multi-magazine outputting elevator system
Precise epoxy stamping capability with pre-bond inspection
Applications: Suitable for large area epoxy die bonding process

Extra large bonding area: 8 x 8 substrate handling
Providing high speed die attach with DDR bond head system
Implementing excellent flexibility capability of handling various
substrates with corresponding carrier design
6 mil small die handling capability
Graphical user friendly interface with MS Windows based
operating system
Getting advantages between quality control and bonding speed
with latest post-bond inspection system
Automatic Die Bonder
AD881 Series
(for Photo Diode Application)
Applications: Flexible of handling various substrates, e.g. metal

cans, bent lead frames, etc.
Wide range of substrates handling capability
Excellent flexibility
AD881M: up to 3 wafers handling capability (with similar die sizes)
AD881H: automatic materials handling
AD881MH: up to 3 wafers and automatic substrate handling capability
Providing extremely high speed die attach with DDR bond head
system
Powerful inspection system providing excellent bonding quality
AD819-PD
Applications: Metal can packages, e.g. photo diodes on stem, etc.

High precision epoxy die bonding with
2-in-1 stamping and bonding system
Full range of PR inspection at various stages for precision bonding
Carrier free metal cans handling design
Supporting various configurations to fit different applications
Programmable tilting workchuck for PD application
Rotary workchuck for VCSEL application (option)
Wafer PRS with PR look ahead capability

Advanced die surface defect inspection at wafer stage
Other Die Attach Equipment
US PATENTED
Automatic High Precision Eutectic Die Bonder
(for Laser Diode Application)
AD819-LD
Applications: Metal can packages, e.g. one pass LD and submount

on stem
Precision placement with
Full range of PR inspection at various stages for precision bonding
Carrier free metal cans handling design
Individual bonding system for submount and LD attach
Providing consistent eutectic environment
Excellent oxygen level control with nitrogen gas supply
Programmable temperature profile on various stations
Anti-thermal shock with pre-heating and post-heating stations
Multi-chip Module Bonder
MCM12
Applications: Various multi-chip packages on, e.g. BGA, singulated

unit, metal can, wafer submount, etc.
High speed die attach process with patented technologies
Precision placement with latest inspection system
Implementing excellent flexibility by supporting

Up to 14 types of picking tools handling capability
Up to 5 types of ejecting kits installation
Extra large substrate handling
SMD bonding capability
Direct die attach / flip chip bonding capability
Auxiliary dispensing system
And more
Supporting automatic wafer exchanging system
Automatic COG Bonder
Automatic FOG Bonder
COG900 / COG930
FOG900 / FOG930
Applications: Various types of glass and LSI, e.g. STN, CSTN, TFT,
etc.
High speed and precision performance
Full range of inspection system at each process
4D (XYZ-theta) workholder system driven by precise linear and DDR
actuating system
Applications: Various types of glass and flex, e.g. STN, CSTN,

TFT, etc.
High speed and precision performance
Full range of inspection system at each process
4D (XYZ-theta) workholder system driven by precise linear and DDR
actuating system
Supporting various inputting and outputting configurations

Belt inputting / outputting system
Tray handling capability (option)
Supporting various inputting and outputting configurations

Belt inputting / outputting system
Tray handling capability (option)
Advanced inspection system with programmable LED illumination
Advanced inspection system with programmable LED illumination
system
Up to 13.4 glass substrate handling COG930
In-line capability with FOG900 / FOG930 (option)
Up to 13.4 glass substrate handling FOG930
system
In-line capability with COG900 / COG930 (option)
6 DIE ATTACH
EQUIPMENT
Automatic IR-Cut Filter Bonder
IS898GA
IRGA868
Applications: IR glass bonding on substrates, e.g. BT, CLCC, PLCC,

or singulated lens holders, etc.

And more...
Flexible indexing system for substrate or boat carrier

Supporting glass presentation on mylar / waffle pack
Dual glue writing capability further enhances productivity
Capable of integrating various UV snap cure systems (option)
Applications: IR glass bonding on lens holder

Flexible materials handling capabilities
Tape & reel input / output lens holder handling

Vacuum / mechanical picking system to fit different lens holder

And more...
Excellent cover tape sealing performance for protecting bonded
units in pocket tape
Automatic Lens Holder Bonder
High Mega Pixel Lens Holder Bonder
IS868LA2
IS600
Applications: Lens holder bonding on e.g. CLCC, PLCC, BGA, PCB,

singulated units, etc.
Versatile lens holder input handling system adapts for:
JEDEC standard tray / waffle tray

And more...
Supporting automatic lens orientation check
OTHER DIE ATTACH

EQUIPMENT
Automatic Glass Bonder
Applications: Lens holder bonding on e.g. CLCC, PLCC, etc. for high
mega pixel application
Improving focusing quality of high resolution camera
Active feedback algorithm to compensate die tilt, substrate and lens
variation
High flexibility
Suitable for more compact and threadless design of lens holder
Enhancing yield by instant tracking of lens holder

One pass solution for lens holder bonding and focusing processes
Dual glue writing capability further enhances productivity

Individual pick and bond arm system further enhance bonding
speed
Capable of integrating various UV snap cure systems and post
bond heater (option)

10
AOI, Map Sorting / Die Sorting Equipment
US PATENTED
Total Clip Bonding Solution
Automatic AOI System
eClip
ES100
Applications: High power discrete units, e.g. DPAK matrix,

PowerSO, etc.
All-in-one bonding solution from die bonding, clip bonding to
reflowing process
High throughput by
Array clip bonding capability
Applications: Automatic advanced optical inspection system for

die, e.g. LED die
High speed and precision inspection performance
True color inspection capability
Supporting pre-scan capability
Picking No-Good (NG) die capability (option)
Supporting independent temperature controlling regions

8 heating zones + 1 cooling zone
Consistent reflow environment
Excellent oxygen level control with low level of forming gas consumption
Programmable temperature profile on various stations
Map Sorter
Die Sorter
MS100 Plus
AS899
Applications: Sorting die, e.g. blue LED, white LED, laser diode, etc.
based on wafer map information
High speed sorting driven by
Dual heads sorting system
Direct drive rotary (DDR) motor and linear motor system
User-friendly interface with Windows based operation system

Extra large sorting area
Supporting pre-scan capability
Applications: Individual LED dice testing and sorting solution

High speed die testing and sorting system with rotary testing station
design
Dual individual linear bond heads for pick and place processes
Parallel pick, test and sort processes
Sorting good die only with advanced die surface defect detection at wafer
stage
Excellent flexibilities
Supporting various types of testers integration
Flexible bin block arrangement
Up to 56 bin blocks can be installed once (option)
Precision probing performance with XYZ testing stage motions
User-friendly interface with Windows based operation system
11 *Remark: All performance is package dependent
Gold Ball Wire Bonding System
ASM GoCu
TwinEagle Xtreme
Applications: Ultra lowk wire bonding, stacked & thin die

overhang wire bonding, ultra low loop wire bonding
High performance gold wire bonder
Highest output per square foot area
Ultra fine pitch machine
Excellent vibration suppression technology to eliminate vibration
coupling
Capable to handle high pin count package
Supporting ultra low loop bonding
Dual wire size & wire types application
AOI, MAP SORTING /

DIE SORTING EQUIPMENT
A capability enabling faster and easy conversion from Gold to Cu/CuPd

wire bonding
With GoCu capability, CuPd UPH/productivity is higher than gold
wire bonding
Converting to Cu/CuPd from gold wire bonding in simple clicks
Breakthrough in wire threading with auto self rethreading feature
Revolutionary auto PR & auto loop definition
Extreme High Speed Wire Bonder
OTHER DIE ATTACH

EQUIPMENT
GOLD BALL WIRE

BONDING SYSTEM
Ultra Fine Pitch Wire Bonder
Harrier Xtreme
Eagle Xtreme
Applications: QFN, SMD LED, HP LED, high density discrete

packages, etc.
Dual high speed wire bond heads system
Highest output per square foot area
User-friendly, intelligent Windows based interface
Innovative algorithm for high speed PR
Supporting copper wire bonding & copper BSOB (option)
Applications: Ultra lowk wire bonding, stacked & thin die

overhang wire bonding, ultra low loop wire bonding
Wider bonding area
Ultra small BPP bonding capability
Precision placement with nano-scale resolution
12
High Speed Wire Bonder
Automatic Gold Ball Wire Bonder
(for Discrete/Opto Applications)
(for Vertical Lead Frame Application)
iHawk Xtreme
iHawk-V
Ultra High Speed Wire Bonder
Automatic Gold Ball Wire Bonder
(for Hybrid Application)
(for Bent Lead Frame Application)
Eagle Xtreme-X2L
iHawk-02
Applications: Gold ball wire bonding, QFN, SMD LED, HP LED, high
density discrete packages, etc.
Innovation in optics & PR system for smaller dice
Advanced PR algorithm with PR look ahead capability
Faster package conversion with fully motorized material handling
system
Applications: One pass solution for large bond area packages, e.g.
multi-chip modules, SiP, etc.
High speed wire bonding capability
Implementing patented design concept
Extremely large bonding area
Applications: Gold ball wire bonding on vertical lead frames

Innovative dual track design enhancing bonding speed
Pro-longing MTBA with latest input / output magazine handling
Innovation in optics & PR system especially for smaller LED dice
Applications: Bent lead frame handling capability for piranha LED

application
High speed wire bonding capability
Pro-longing MTBA with latest input / output magazine handling
Saving cost of ownership by direct bent lead frame indexing
Stud Bumping System
Automatic Gold Wire Bonder
Wafer Level Stud Bumping System
(for Laser Diode Application)
Hummingbird
Eagle60AP-LD
Applications: Metal can packages with three dimensional bonding,

e.g. LD assembly, etc.
Rotary workholder system for multi-plane bonding
0 to 90 programmable rotation
One pass LD and submount bonding
Specially designed for photonics and optoelectronic application
Custom-made top plate and carrier for large range of laser diode
products
Applications: Gold / copper stud bumping on wafer

High speed bumping performance
Excellent bumping control
Fine pitch bumping capability
Stack bumping capability
Implementing flexibility
Large bumping area: up to 12 wafer handling capability
Supporting gold / copper stud bumping
Automatic wafer loading system (option)
Equipping with pre-heat / post-heat system (option)
GOLD BALL WIRE
BONDING SYSTEM
Aluminium Wire Wedge Bonding System
Heavy Aluminium Wire Bonder
Rotary Bondhead Wedge Bonder
AL501
AB559A Series
STUD BUMPING
SYSTEM
Heavy Aluminium Wire Bonding System
Saving cost of ownership by widely implementing linear motor and
DDR systems
Intelligent Smart BQM system supervising bonding quality
AL WIRE WEDGE
BONDING SYSTEM
Dual light & compact bond head systems

Hybrid wire bonding capability
Excellent motion control
Applications: Chip-on-board, multi-die, LED display, chip-on-flex,

chip-on-glass, ceramic, etc.
Fine pitch capability for advanced packages
Large effective bonding area
Vision Lead Locator (VLL) to adapt lead width variation
Dual colour (red-blue) LED lighting for different substrates
surface reflection
Gold wire wedge bonding application (option)
60 wire feeding angle capability (option)
HEAVY AL WIRE
BONDING SYSTEM
Applications: Heavy aluminium wire bonding on power discrete

packages, including TO-220, DPAK matrix, etc.
High speed, reliable and flexible heavy aluminium wire bonding
14
Aluminium Wire Wedge Bonding System
Curing System
PATENTED
Automatic Ultrasonic Wedge Bonder
Reflow Oven
AB530
SR902 / SR902L
Applications: Chip-on-board, multi-die / multi-PCB, high lead count,

etc.
High speed bonding
Fine pitch capability for advanced packages
Cost saving by widely implementing linear and DDR motor systems
Multi-unit / multi-PCB bonding capabilities
Applications: Reflowing process for high lead (>85% Pb) solder,

lead free solder, flux reflow, etc.
Up to 8 independent temperature controlling regions
6 heating zones with 2 cooling zones
Combination of convection and radiation heating modes
Built-in reflow temperature profiler
Sophisticated oxidation level control
Automatic nitrogen cut-off function during idle state
SR902Ls in-line capability with AD9212 / AD9210 or other die
attach system (option)
Snap Curing Oven
Snap Curing Oven
COE139 / COE139R
PC139 / PC139R2R
Applications: Curing process for die attached substrates in either

strip or reel form, e.g. SOT, top LED, etc.
Excellent oxygen level control with
N2 curtains at ovens input and output sides
Consistent curing temperature control with 6 temperature control
zones
Applications: Curing process for die attached substrates in either

strip or reel form, e.g. smartcards, SOT, etc.
Stable and repeatable temperature control
Sophisticated oxidation level control
5 independent temperature controlling zones
Built-in dynamic temperature profiling software
Selectable for various substrates handling

COE139: strip form substrate handling
COE139R: reel form substrate handling
Selectable for various substrates handling

PC139: strip form substrate handling
PC139R2R: reel form substrate handling
In-line capability, e.g. AD830 or other die attach system (option)
In-line capability, e.g. AD8312R, AD838R or other die attach
system (option)
Transfer Molding System
IDEALmold 80/120/170 ton

Applications: Mini-BGA, flex BGA, CSPBGA, QFN, QFP, TQFP,
PLCC, TSSOP, TSOP, SOIC, SOT, PDIP, singulated
units, power devices, POP, etc.
Suitable for standalone or inline configuration
Simple and flexible operation
Flexible press configuration of 1 to 4 presses
Input and output pattern recognition features
Vacuum and wedge molding capability
High pre-heat temperature capability
Windows operating system
Pinnacle Gating System (PGS) molding capability (option)
OSPREY
Ultra high density molding

POP capability
Minimum tooling cost and shortest lead time
IDEALab
Applications: Mini-BGA, flex BGA, CSPBGA, QFN, QFP, TQFP,

PLCC, TSSOP, TSOP, SOIC, SOT, PDIP, singulated
units, power devices, POP, etc.
Manual molding system derived from IDEALmold
Mold chase compatible with IDEALmold
Process parameter portability to IDEALmold
Low conversion cost, suitable for R&D
Advanced packaging capability
Pinnacle Gating System (PGS)
Tapeless QFN, clear compound
Punch type micro QFN
CURING
SYSTEM
Ideal for
Small lot, high product mix production
Flexible manufacturing work cell
Applications: Reel form lead frames or substrates, e.g. smartcards,

SIM, flex devices, discrete devices, etc.
World's only dual reel automatic molding system
Pinnacle Gating System (PGS) molding capability
Suitable for standalone or inline configuration
Simple operation
Excellent productivity and short cycle time
Fast conversion time
Windows operating system
Input and output vision inspection (option)
Clean cell and line scan (option)
Inspection and reject punch station (option)
AL WIRE WEDGE
BONDING SYSTEM
Applications: BGA, MLP/QFN, QFP, SOIC, SOT, PDIP, COB,

carrier molding, POP, etc.
Worlds smallest footprint automatic molding machine
Built-in PGS molding capability
IDEALmold R2R
TRANSFER
MOLDING SYSTEM
16
Compression Molding System
IDEALcompress
Applications: Large substrate molding: W150mm x L300mm, LED

Ideal for high-mix, low volume manufacturing
Small lot assembly
Compact
Ideal for eco-friendly manufacturing
No material wastage
No mold cleaning required
Ideal for complex designs
Thin chip, fine pitch, long wires
Multi stacked die package
Low-k die
And more...
WLP300
Applications: WLP, wafer level LED, exposed solder ball WLP, Cu

bump pillar WLP, embedded wafer ball grid array,
redistributed chip package
Worlds first 12 automated WLP compression encapsulation system
Flexible to handle wafer sizes ranging from 4 to 12
Equipped with encapsulant weight compensation
Dispensing options
Liquid epoxy
Clear silicone
Granular powder
Various dispensing configurations, including, liquid epoxy, clear
silicone, granular powder dispensing
Dispensing / Jetting System
DS500
DS500-IL
IDEALab - WLP
Applications: WLP, wafer level LED, exposed solder ball WLP, Cu

bump pillar WLP, embedded wafer ball grid array,
redistributed chip package
Tape assisted on top mold to release
Dispensing options
Liquid epoxy
Clear silicone
Granular powder
Quick change mold chase concept with aid of IDEALtrolley
Precision Dispensing System
DS500 Series
Applications: Die coat, adhesive dispensing, sealing, gel coating,

underfill dispensing, etc.
Excellent encapsulant placement repeatability and dispensing
quality
Extra large dispensing area with gantry table design
Glob top, dam and fill dispensing mechanism
Custom programmable dispensing patterns & parameters
Automatic substrate handling capability with input / output elevator
systems (option)
Dual dispensing heads with adjustable pitch (option)
Reel-to-reel handling capability (option)
Trim / Form / Singulation System
Precision Jetting System
Mechanical Press Trim / Form System
DS520 / M
MP209
COMPRESSION
SYSTEM
Dispensing / Jetting System
Maintaining fluid homogeneity by strategic agitating system

Supporting individual dual workholders control
Automatic materials handling with DS520M
QFP system (JEDEC tray off-loading)

SOIC system (Plastic tube off-loading)
SOT system (Bulk off-loading)
In-line system (integration with laser mark and finishing modules)
Discrete Package Trim / Form System
Memory Card Singulation System
MP-TAB
MP-SDS
Applications: SOT, SOD, QFN, DFN & etc.

High UPH discrete package singulation
Suitable for ultra high density lead frames
Modular construction for flexible integration
Vision inspection for orientation & uncut dam bar
TRIM / FORM /
SINGULATION SYSTEM
High accuracy & repeatability

Easy to operate & maintain
Long modules life
Applications: DPAK, DPAK, TO220, QFN, DFN, SOP, TQFP,

TSOP, TSSOP & etc.
High speed eccentric cam-follower driver mechanism with
synchronized indexer
Automatic tool height inching mechanism for tooling quality
assurance
High speed running trim / form operation
Modular construction configurable to accommodate different
applications
DISPENSING /
JETTING SYSTEM
Applications: Jetting encapsulant onto various substrates, including

phosphors mixed silicone on LED packages, etc.
Extremely high speed jetting with in-house developed jetting system
Excellent performance
Applications: Individual type SD card substrates

Self contained system to accept stacked magazine loading and
un-loading
Linear servo carrier transportation provides a flexible solution to
variety of frames
Supporting mark inspection
Flexible to integrate with any third party vision inspection
18
Laser Mark Handler
Test and Finish Handling Equipment
Laser Mark Handler
Turret Based Test Handler
LS1000
FT2030
Applications: All kinds of IC lead frames and power device matrix

lead frames
Standard module and fully constructed in modular, flexible for any
process customization
Open platform to accept any laser marker in market
Walking beam type transportation provides a flexible solution to
variety of packages
Optional mark inspection
Flexible to integrate with any third party vision inspection
Applications: TSSOP, QFN/MLP, MBGA, etc.

30 high speed turret pick heads for efficient processing of multiple
process steps with extremely short indexing time
High flexibility
Configuring any mix of process steps to provide a full range of flexible
solutions
Flexible system configurations

Onload: stack tube / vibratory bowl feeder / metal tray
Offload: stack tube / plastic tube / tape-and-reel / multiple tubes / multiple bins
Advanced vision technologies
2.5D lead inspection with lead co-planarity and stand-off check, 5S
inspection, in-pocket inspection, mark and surface inspection
FT2018
FT-Power
Applications: SC59, SC70, SOT23, SOD923, SOT113, SOT223,

etc.
Tailor-made for mini-discrete packages with high speed and high
accuracy performance
Individual up down driving mechanism further allowing high speed
performance
Flexible system configurations
2.5D lead inspection with lead co-planarity and stand-off check, 5S inspection,
in-pocket inspection, mark and surface inspection
Applications: TO220 series, TO263, TO252, TO3P, TO247, SIP9L,

TO264, etc.
High speed performance with strategic testing sequence
Intelligent buffer track design between HVT and main modules
Supporting rotary table for isolation test
Up to 4 test stations testing 8 units for HVT
Up to 8 test stations for non HVT test on rotary table
Mark inspection in table
2.5D lead inspection with lead co-planarity and stand-off check
In-pocket inspection
Test and Finish Handling Equipment
Complete Quality Inspection Handler
Singulation and Finishing Integrated System
FV2030
FET-CLUSTER
Applications: SC59, SC70, SOT23, SOT89, SOT113, SOT223,

SOIC, TSSOP, QFN/MLP, MBGA, DPAK, TO220,
TO3P, TO264, SIP9, etc.
Complete visual cosmetic inspection capability
6S inspection: chipping, piping hole, molding size & etc.

2.5D inspection: lead standoff, lead co-planarity, stand-off & etc.
2D inspection: lead width, lead length, lead pitch & etc.
In-pocket inspection: final package & lead quality check before packing
TEST AND FINISH

HANDLING EQUIPMENT
Flexible system configuration

Onload: stack tube / vibratory bowl feeder / metal tray
Offload: stack tube / plastic tube / tape-and-reel / multiple tubes / multiple
bins
Carrier Based Test Handler
Memory Test Handler
FT1000
FT1000-HD
Applications: M-BGA, QFN, SOIC, QFP, TSOP, etc.

Parallel device testing in singulated / strip form
Extra large carrier loading area
Programmable 3-axis carrier indexer
In-house design test contactor
Spring loaded Pogo pins
Unlimited multi-site testing depends on tester's resources
LASER MARK
HANDLER
Applications: M-CAN, S-CAN, SOP, TSOP, TSSOP & etc.

All-in-one solution for singulation, visual inspection and packing
30 high speed turret pick heads
Soft cut singulation
Multiple output bins
Vision inspection for mark, lead and in-pocket
Surface inspection for molding quality check (option)
Applications: SO, TSOP, QFN, MLF, BCC, BGA, CSP, etc.

Hi-density carrier based test handler system capable of testing 256
devices in parallel
Temperature range: ambient to 135C (option: 155C)
Adjustable contact force of 120 kgf (option: 240 kgf)
Heat compensation during test
Flexible input / output configuration
Combining with finishing module to provide a one-stop testing,
sorting, inspecting and packing solution
20
Ball Placement and CSP Handling Equipment
US PATENTED
Ball Placement System
High Speed Tape Sorting System
BP2000
CS900
Applications: CSBGA/PBGA, flex BGA & etc.

Ultra small ball / fine pitch CSBGA capability
Flexible material handling capability
Strip form substrate / flat carrier / plastic tray / U-boat / pallet / slot
magazine
Patented vision alignment pick & place mechanism
Patented BSU ball handling
Patented Smart Vibrator ball transfer
Built-in diverter for easy link-up with reflow oven
LED (SMD) Testing System
LED Tester System
TLB203
Applications: Measuring electrical and optical characteristics on

wafer prober or handler, e.g. AS899, SLS230 series,
IP360 series, etc. for die / package level sorting
Large range of power supply
Precision measurement
Flexible implementation
Supporting up to two testing stations simultaneously
Multiple drivers and photo-detectors handling capability
Applications: BCC, CSBGA, MLP, QFN, SiP & etc.

High speed linear motor mechanism
Advanced vision inspection capability
Mark inspection, lead / ball inspection and 5 sides inspection
Flexible offloading configuration tube-tray / tray-tray /
canister-tray
LED (SMD) Sorting & Taping System
PATENT PENDING
Automatic LED (SMD) Sorting System
Automatic LED (SMD) Sorting System
SLS230 / S
SLS230T Plus
Applications: Chip LED, sideview LED, etc.

Excellent performance by implementing patent pending design
Anti-bin mixing design by detecting bin removal for automatic label
printing with bin criteria
Optional with vision inspection for multi-chip LED to screen out
package with missing chip, defected chip, etc. before sorting
Wide range of applications
Applications: Top LED, e.g. 3014, 3020, 3528, 5050, etc.

Anti-bin mixing design by detecting bin removal for automatic label
printing with bin criteria
Long lasting performance with latest XY table design
Increasing bin capacity for large lot size
Optional with vision inspection for multi-chip LED to screen out
package with missing chip, defected chip, etc. before sorting
SLS230: chip LED devices, e.g. 0402, 0603, 0605, 0805, 1206, etc.
SLS230S: sideview LED devices, e.g. 008, 010, 020, 215, 335, etc.
BALL PLACEMENT AND

CSP HANDLING EQUIPMENT
SLT400
IP360 Series
Applications: Chip LED, top LED, sideview LED, etc.

In-house developed direct drive rotary motor and linear up down
motor to maximize system throughput
Advanced inspection algorithm for high accuracy inspection
Ensuring taping for good units with supporting test contact
technology
Simple and easy operation with MS Windows operating system
Wide range of applications
Chip LED devices: 0402, 0603, 0805, etc.
Top LED devices: 3014, 3020, 3528, 5050, etc.
Sideview LED devices: 008, 010, 020, etc.
Applications: Ceramic, silicon, molded LED with lens

One-stop solution for test, sort and output with good traceability
In-house developed direct drive rotary motor and linear up down
motor to maximize system throughput
Flexible materials handling input material handling
LED (SMD) SORTING &

TAPING SYSTEM
Ingenious (LED) Packing System
LED (SMD) TESTING

SYSTEM
Automatic LED (SMD) Taping System
Input system: wafer frame / bowl feeding system

Output system: tape-and-reel output, bin frames and / or bins
Powerful inspection capability
Wafer inspection
Tape-and-reel in-pocket inspection, etc.
Optional wafer barcode scanning, unit map, label printing and
output file generation package for good tractability of devices
22
Manufacturing Solution
Discrete Solution
AD838
(P. 5)
AD838R
AL501
ASM GoCu
eClip
Harrier Xteme
iHawk Xteme
(P. 5)
SD890A
(P. 7)
(P. 11)
(P. 14)
(P. 12)
Die Bonding
MP209
(P. 12)
(P. 18)
(P. 13)
IDEALmold
MP-TAB
FT2018
Molding
Trimming & Forming
Testing & Finishing
(P. 16)
Wire Bonding
(P. 18)
(P. 24)
DDR Memory / Memory Card Solution
Eagle Xtreme
MP-SDS
(P. 12)
LinDA
TwinEagle Xtreme
(P. 4)
(P. 12)
Die Bonding
Wire Bonding
IDEALmold
(P. 18)
BP2000
(P. 21)
(P. 16)
Molding
BEP System
Smartcard / RFID Solution
AD8312R
(P. 4)
Harrier Xtreme
AD838R
(P. 5)
(P. 12)
PC139R2R
(P. 15)
(P. 13)
Curing
Die Bonding
iHawk Xtreme
Wire Bonding
AD8312
AD838
(P. 5)
Die Bonding
23
iHawk Xtreme
DS500 Series
Wire Bonding
Dispensing
(P. 13)
(P. 16)
Molding
MEMS Solution
(P. 4)
IDEALmold R2R
(P. 17)
Manufacturing Solution
HP LED Solution
IDEALcompress
AD211/
AD212
(P. 17)
Harrier Xtreme
(P. 7)
DS500
(P. 12)
AD830U
AD220
(P. 6)
(P. 17)
DS520/M
iHawk Xtreme
(P. 7)
Die Bonding
IDEALab - WLP IP360 Series
(P. 18)
(P. 13)
Wire Bonding
(P. 17)
Molding
Dispensing / Jetting
(P. 22)
Packing
SMD LED Solution
Harrier Xtreme
SLS230/S
(P. 12)
AD830
iHawk Xtreme
(P. 6)
(P. 13)
Die Bonding
Wire Bonding
DS520/M
(P. 18)
Jetting
(P. 22)
SLS230T Plus
(P. 22)
Sorting
SLT400
(P. 22)
Taping
Vertical LED Solution
AD100
iHawk-V
DS520/M
Die Bonding
Wire Bonding
Jetting
(P. 8)
(P. 13)
(P. 18)
COB Solution
AD880
(P. 8)
AB559A
AD881
(P. 8)
Die Bonding
(P. 14)
AB530
(P. 15)
Wire Bonding
DS500 Series
(P. 17)
Dispensing
24
BEP In-line Solution
LS1000 + MP209
Applications: DPAK, DPAK, QFN, SO, SOT, TO, TO220, TQFP, TSOP, TSSOP, etc.
Slot
Magazine
Onload
LS1000
Laser Mark Handler System
MP209
Trim/Form System
Slot Magazine
Offload
LS1000 + MP209 + FT2030

Applications: DirectFET
LS1000 MP209
Laser Mark
Handler
System
25
Trim/Form
System
FT2030
Singulation
Press
Incline
Offload
China
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
2/F, Zu Chong Zhi Road Lot 1505
Shanghai Zhangjiang Hi-Tech Park
Shanghai 201203, China
()

1505 55 2
Tel : 86-21-5080 5465
Fax : 86-21-5080 5467

Room 705, Da An Building B
No. 41 You Yi Road, He Xi District
Tianjin 300211, China
()
41
B 705
Tel : 86-22-5881 3008
Fax : 86-22-5881 3009

Room C345-4, Chengdu Hi-Tech Zone
Innovation Service Centre
Chengdu 611731, China
()

C345-4
Tel : 86-28-8784 6551
Fax : 86-28-8784 6562

Room B, 31/F, Bi Li Da Building
No. 22 Lv Ling Road
Xiamen 361009, China
()
22 31B
Tel : 86-592-550 9125
Fax : 86-592-550 9121

Room 05-03/06, Block A
No. 5 Xing Han Street
Suzhou Industrial Park
Suzhou 215021, China
()

A 05-03/06
Tel : 86-512-6762 6278
Fax : 86-512-6762 6378

Room 7-11, 4th Floor, Block A
Tai'an Square, Dongshen Road
Zhang Mu Tou Town
Dongguan 523620, China
()

A A7-A11
Tel : 86-769-8712 5600
Fax : 86-769-8712 5601

East Wing, 4/F, Block 2
CATIC (Zhonghang) Shahe Industrial Zone
Qiao Xiang Road, Nanshan District
Shenzhen 518053, China
()

() 2 4
Tel : 86-755-8830 8533
Fax : 86-755-8344 6245

Room 1402-4
Jiangxin Guoji Jiayuan Yinzuo
No. 85 Jiefangxi Road, Qingyunpu District
Nanchang 330002, China
()

1402-1404
Tel : 86-791-8820 1517
Fax : 86-791-8820 7178
Hong Kong
Japan
Korea
ASM Pacific (Hong Kong) Ltd

4/F Watson Centre, 16-22 Kung Yip Street
Kwai Chung, Hong Kong
()
16-22
4
Tel : 852-2619 2000
Fax : 852-2619 2118/9
ASM Assembly Technology Co Ltd

5F, Tachikawa F-Bldg, 1-7-18
Nishiki-Cho, Tachikawa-Shi
Tokyo 190-0022, Japan
190-0022 1-7-18
5
Tel : 81-42-521 7751
Fax : 81-42-521 7750
ZEMOS Korea Inc. /

ASM Pacific Kor Ltd.
3F, 628-6, Deung Chon Dong
Kangseo Gu, Seoul 157-030, Korea
628-6 3 157-030
Tel : 82-2-538 5900
Fax : 82-2-561 5905
ASM Pacific Kor Ltd

Room 501, 5F, Hi-Tech Center
958-14 Daechon-dong, Buk-gu
Gwangju 500-470, Korea
958-14
501 500-470
Tel : 82-62-973 4174
Fax : 82-62-973 4216
ASM Pacific (Holding) Limited

Taiwan Branch
10F, No. 530, Sec. 2, Chung Shan Road
Chung Ho Dist, New Taipei City, Taiwan
530 10
Tel : 886-2-2227 3388
Fax : 886-2-2227 3399

Taiwan Branch
1F, No. 7, Lane 91, Dongmei Road
Hsinchu, Taiwan
91 7 1
Tel : 886-3-573 3750
Fax : 886-3-573 3551

Taiwan Branch
8F-1, No. 135, Sec 2
Chung Shan Road, Tantzu
Taichung, Taiwan
2 135 8F-1
Tel : 886-4-2535 6390
Fax : 886-4-2535 6820
ASM Assembly Equipment Malaysia

Sdn Bhd
24A, Jalan Medan Ipoh 1B
Medan Ipoh Bistarli
31400 Ipoh Perak, Malaysia
Tel : 605-542 3991
Fax : 605-542 3992

Sdn Bhd
B-1-12, Jalan SS6/20, Dataran Glomac
Pusat Bandar Kelana Jaya
47301 Petaling Jaya, Malaysia
Tel : 603-7806 4942
Fax : 603-7806 4943

Sdn Bhd
1, Tingkat Satu, Jalan Warisan 1
Taman Warisan Jalan Junid
84000, Muar, Johor, Malaysia
Tel : 606-951 5713
Fax : 606-951 5786
Taiwan
Taiwan Branch
No. 4-2, East 3 Road Street
N.E.P.Z. Kaohsiung, Taiwan
811
4-2
Tel : 886-7-367 6300
Fax : 886-7-367 6399
Malaysia
Sdn Bhd
Bayan Point, Block A, No. 15-1-23, 15-1-24
Medan Kampung Relau
11900 Penang, Malaysia
Tel : 604-644 9490
Fax : 604-645 1294
Philippines
Singapore
Thailand
Europe
Edgeward Development Limited

Philippines Branch
2108, Prime Street
Corner Enterprise Street
Madrigal Business Park, Alabang
Muntinlupa City, Philippines 1770
Tel : 63-2-850 4543
Fax : 63-2-850 4547
ASM Technology Singapore Pte Ltd
ASM Assembly Equipment Bangkok

Ltd
ASM Assembly Products B.V.
2 Yishun Avenue 7
Singapore 768924
Tel : 65-6752 6311
Fax : 65-6758 2287
51/3, Vibhavadi Tower, 18/2 Floor

Ngamwongwan Road, Ladyao,
Chathuchak, Bangkok 10900
Thailand
Tel : 66-2-941 3181/2
Fax : 66-2-941 3183
Weltevreden 4 A, 3731 Al De Bilt

The Netherlands
Tel : 31-30-890 6310
Fax : 31-30-890 6320
U.S.A.
ASM Pacific Assembly Products Inc.
3440 East University Drive, Phoenix

Arizona 85034-7200
U.S.A.
Tel : 1-602-437 4760
Fax : 1-602-437 4630
ASM Pacific Assembly Products Inc.

(Western Regional Office)
97 East Brokaw Road, Suite 100

San Jose, California 95112-4209
U.S.A.
Tel : 1-408-451 0800
Fax : 1-408-451 0808
M81
SEMICONDUCTOREQUIPMENT
http://www.asmpacific.com

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SEMICONDUCTOREQUIPMENT

ASM Semiconductor Equipment Products

Eagle Xtreme X2L

Snap Curing Oven

Lens Holder Attach

Dispensing/ Form Substrate DS500 Series

ASM Semiconductor Equipment Products

Laser Mark Handler

High Speed Tape

LED (SMD) SMD type

SMD LED Testing and

SMD LED Taping

High Power LED

Turret Based Test

Carrier Based Test

12 Flip Chip Bonding Equipment

Dual Head Flip Chip Bonder

Thermosonic Flip Chip Bonder

(for Image Sensor Application)

Applications: Flip chip bonding on SBGA, BGA, ceramic panels,

Applications: Thermosonic flip chip bonding on SBGA, BGA, ceramic

Thermocompression Flip Chip Bonder

12 Flip Chip Bonder

(for Image Sensor Application)

(for Image Sensor Application)

Applications: Thermocompression flip chip bonding on e.g. CLCC,

*Remark: All performance is package dependent

Applications: Image sensor flip chip bonding on e.g. CLCC, PLCC,

HEPA fan filter unit providing clean air flow

Flexible indexing system for substrate or boat carrier design

12 FLIP CHIP / DIE ATTACH

12 Die Attach Equipment

12 Automatic High Speed Die Bonder

12 Automatic Die Bonder

(for Stacked Dice Application)

Applications: Mini-BGA, flex BGA, CSPBGA, MLP/QFN, QFP,

Applications: Stacked dice application on Mini-BGA, flex BGA,

12 Automatic Die Bonder

(Reel Form Materials Handling)

(for Image Sensor Application)

Applications: Reel form materials handling e.g. smartcard

*Remark: All performance is package dependent

Applications: Image sensor die bonding on e.g. CLCC, PLCC, BGA,

HEPA fan filter unit providing clean air flow

Flexible indexing system for substrate or boat carrier

8 Die Attach Equipment

Automatic High Speed Epoxy Die Bonder

(Reel Form Materials Handling)

Applications: High density lead frames, e.g. QFN, TQFP, PLCC,

Applications: Reel form materials handling, e.g. metal lead frames

Automatic High Precision Epoxy Die Bonder

Applications: Direct substrate indexing, e.g. ceramic substrates for

*Remark: All performance is package dependent

Applications: High precision bonding performance on, e.g. QFN,

8 Die Attach Equipment

Automatic High Precision Epoxy Die Bonder

Applications: High density substrates, e.g. chip LED, top LED,

Applications: Large aspect ratio die handling, suitable for linear

Automatic High Speed Eutectic Die Bonder

Automatic High Speed Eutectic Die Bonder

Applications: High density substrates, e.g. SOIC, SOT, SOD, SOJ,

Applications: Reel form materials handling, e.g. metal lead frames,

Providing excellent oxidation control with forming gas supply