Sakthivel Rajamani

Member Technical staff

HCL TECHNOLOGIES LIMITED
CHENNAI
PH:+91-9962040555
EMAIL ID:sakthivelrajamani3@gmail.com
OBJECTIVE
EMBEDDED HARDWARE
To work in a stimulating and challenging environment that would facilitate the maximum utilization and application of
my broad skills and expertise in making a positive difference to the organization
SYNOPSIS
5.5 Years of experience working with HCL Technologies Limited, Chennai as Lead Engineer, encompassing
Embedded System Design. Extended expertise in Designing & Testing of Analog, Digital Circuits, Processor and
Controller based design, High speed Design and Testing, Value Engineering, Reverse Engineering and EMI/EMC
Testing. Deep understanding of technology with focus on delivering business solutions.
Note: Currently doing own business and not working with any organization
CORE COMPETENCIES

Board Design
Schematics Preparation
Board Bring up and Testing
EMI/EMC Testing

Component Engineering
Reverse Engineering

EDUCATION

B.Tech with specialization in Electronics and Communication engineering from SRM University in 2008
with First Class Distinction

TOOLS


Schematics Design Tools:
PCB Design Tool
:

ORCAD 16.2, DXDesigner 2005,Concept HDL

Allegro PCB 16.2, Board expedition ver 7.9

WORK EXPERIENCE: 5.5 YEARS

HCL TECHNOLOGIES LIMITED, Chennai

Lead Engineer

PROJECTS

1. Project:

Role:

Duration:

DREB board modification

Hardware Design
7 months

Description:

Involved in designing Dual redundant Ethernet board(DREB) which facilitates the implementation of SHP,
RSTP and PRP protocols in order to avoid failure in the data transfer to the SCADA system.

Responsibilities:

Involved in Requirement analysis, Circuit Design, schematics design

Various design analysis document prepared such as loading analysis, power analysis, voltage
compatibility analysis and de-rating analysis.

Placement and Layout guidelines preparation and verification.

Circuit simulations.

Programmers interface document, Test plan and Test procedure preparation.

Testing and integration of prototype boards

2. Project:

Role:

Duration:

TABLET PC
Hardware Design
8 months

Description:

Involved in Designing and testing a tablet. OMAP4460 Processor as System Controller.The OMAP4460
processor supports Streaming video up to full high definition (HD) (1920 × 1080 p, 30 fps), 2dimensional (2D)/3-dimensional (3D) mobile gaming, Video conferencing, High-resolution still image (up to 16
Mp). The Tablet supports LCD with touch screen of capacitive type control through GUI. It provides the LCD
displays which include the low-power, high-ESD protection touch screen controllers, display interface
products, and LCD bias and backlight solutions.

Responsibilities:

Involved in component selection and schematic preparation.

Schematic design(ORCAD 16.2) and layout Design(Allegro PCB 16.2)

Layout and placement guidelines for analog, digital, Flex cables and power supply circuits.

Involved in board bring up & testing.

Power consumption analysis, Derating analysis, Decap Analysis, Design Analysis.

Circuit simulation for Power supply circuits

3. Project:

Role:

Duration:

Combo UI
Hardware Design
5 months

Description

Combo UI (User Interface) consists of Hardware and Software of Combo washer/Dryer. There are two types
of user Interfaces to be developed; the software to be developed shall be configurable for each of the boards.
Combo Interface boards shall communicate with the Appliance Control Unit (ACU) over a proprietary Wide
and Reveal protocol. The interfaces on the Combo Interface hardware shall consist of LEDs Seven Segment
Display, Chime, Lighting modules, Smart Grid and GP Expansion modules, The ACU is reading continuously
information from the user IO related to selected wash cycle and modifiers. It will send also information to the
user IO related to the current program status, errors, estimated remaining time and wash process information.
The information exchange will be managed by GVAL protocol.

Responsibilities:
Requirements Document study

Mitigation of project risks.

Architecture design of the LEDs control, Touch sensor, Proximity sensor, GMR sensor, Encoder control, Drum
Light.

Component Selection.

Schematic design(DxDesigner 2005) and layout Design (Board expedition ver 7.9)

Power consumption analysis, Derating analysis, Decap Analysis, Design Analysis.

Board Layout Review, Board bring up and Testing

4. Project:
3 phase Smart Energy Meter

Role:
Hardware Design And Testing

Duration:
7 months

Description:

To Design & Develop a product which can read 3 AC load parameters(Voltage, Current, Power factor and
Power) and six analog channels . The data can be sent to host via wireless .It has EM773 Chip for Reading 3
AC parameters ,On board Mbed module- ARM Cortex-M3 which can read six 4 to 20mA or Ratiometric analog
input channels and On board RF transceiver 2.4Ghz which can send data wirelessly at a distance of 100 to

200meters . The hardware is connected to host network manager using wireless Dust API protocol

Responsibilities:

Requirements Document study

Schematic design(ORCAD 16.2) and layout Design(Allegro PCB 16.2)

Layout and placement guidelines for Analog, Digital and power supply circuits

Board Layout Review, Board bring up and Testing

Product deployment in the field.

5. Project:
Industrial cinematography camera

Role:
Hardware Design and Testing

Duration:
1 Year & 6 months

Description:

Involved in Designing a Industrial cinematography camera that provides high quality video and audio for digital

still and motion picture applications. OMAP processor OMAP3525 is the application processor used for the

camera system This card has various electronic interfaces like LVDS, XAUI, DDR3, SPI, I2S and I2C.

Responsibilities:

Involved in designing Audio board for a Industrial camera.

Schematic design(ORCAD 16.2) and layout Design(Allegro PCB 16.2)

Involved in designing Flex printed cables(FPC) for interconnection of two boards

Layout and placement guidelines for analog, digital, Flex cables and power supply circuits.

Involved in board bring up & testing for Analog and Digital boards.

Involved in component selection and schematic preparation.

Circuit simulation for Power supply circuits

Created documents on design and testing as per customer specifications and request.

6. Project:
Reverse Engineering for IO modules and Drives

Role:
Reverse Engineering

Duration:
6 months

Description:

Reverse Engineering for IO modules and drives

Responsibilities:

Involved in preparing Block diagram and functional grouping for the drives and IO modules(include Analog
input, Analog output, Digital input and Digital output) from the PCB based on component identification.

Involved in Component costing and component list preparation.

Involved in PCB assembly data preparation.

Involved in collecting Marketing feature information for IO modules and Drives.

7. Project:
Mobile Backhaul

Role:
Test Engineer

Duration:
6 months

Description:

Involved in EMI/EMC testing for a Mobile Backhaul product.

Responsibilities:

Involved in Various Testing like Radiated Emission, Radiated Immunity, Conducted Emission, Conducted
Immunity, Electrostatic Discharge, Surge, Electric Fast Transient Testing

Preparation of test reports for all the EMI/EMC Testing.