Professional Documents
Culture Documents
Course 2: Bio-Ceramics
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Introduction to Bio-Ceramics
Ceramics
Alumina and Zirconia in Surgical Implants
Bioactive Glasses - Materials
Bioactive Glasses - Clinical Applications
Glass-Ceramic - Clinical Applications
Machinable and Phosphate Glass-Ceramics
Glass
Hydroxyapatite Coatings
Porous Hydroxyapatite
Pyrolytic Carbon Coatings
Bioceramic Composites
Calcium Phosphate Cements
Radiotherapy Glasses
Dental Glass-Ceramics
LTCC with Low Permittivity and Low Loss Tangent at High Frequency
The ceramic package used for microwave applications requires following properties;
(a) Lower dielectric constant and lower loss tangent in the radio frequency range;
(b) Lower resistivity conductor;
(c) Thermal expansion coefficient of the ceramic material close to that of semiconductor chips;
(d) High reliabilityof hermeticity (airtight).
A new LTCC material was designed to be able to sinter at less than 1000C because of co-firing with copper
conductor. The LTCC is composed of lead-free, SiO2Al2O3MgOZnOB2O3 system glass and ceramic fillers. In
order to satisfy electrical and thermal properties, the amount of crystalline phases precipitated after sintering is
adjusted.
The coefficient of thermal expansion is 7.5 ppm/C in the range of 40300C. This value is close to that of GaAs
chips that are mainly used for microwave applications. Thermal conductivity and flexural strength and volume
resistivity are as good as conventional LTCC material. The dielectric constant is 6.0, which is lower than that of
alumina in the range of 260 GHz. The loss tangent increases as frequency increases and close to that of alumina,
which is good for microwave applications.
2
In the region II above the Curie temperature, resistance across the grain boundary increases exponentially with
increasing temperature. The increase of resistance corresponds to the decrease of spontaneous polarization (Ps) of
BaTiO3 due to the phase transition from the ferroelectric tetragonal phase to the paraelectric cubic phase. The gradual
decrease of Ps and dielectric constant cause the potential barrier height to recover. This recovery results in an increase
of resistance in region II.
In the temperature region III (T > Tn), the electrons that overcome the double Schottky barrier increase with
temperature, and resistance decreases from maximum resistance.
Manufacturing Process
Additives and their effects on PTC characteristics are
listed in Table 1. The transition temperature TC can be
lowered or elevated from its original value (120C) by
substitution of Sr2+ and Pb2+ at the Ba2+ site.
BaCO3, SrCO3, Pb3O4, TiO2 and donor dopant (e.g.
La2O3, Sm2O3, Y2O3 and Nb2O5) are used as starting
materials. Manufacturing processes of PTC thermistor are
almost the same as those in the electronic ceramics industry.
3
a- Pressure Sensors/Accelerometers/Gyroscopes
One of the very basic applications of piezoelectric ceramics is a gas igniter. The very high voltage generated in a
piezoelectric ceramic under applied mechanical stress can cause sparking and ignite the gas. There are two means to
apply the mechanical force, either by a rapid, pulsed application or by a more gradual, continuous increase.
increase
Piezoelectric ceramics can be employed as stress sensors and acceleration sensors, because of the direct
piezoelectric effect. A three-dimensional
dimensional (3D) stress sensor can be designed by combining an appropriate number of
quartz crystal plates (extensional and shear types), the multilayer device can detect 3D stresses.
b- Piezoelectric Vibrators/Ultrasonic Transducers
Piezoelectric Resonance
When an electric field is applied to a piezoelectric material, deformation ((L)
L) or strain (L/L)
(
arises. When the
field
ield is alternating, mechanical vibration is caused, and if the drive frequency is adjusted to a mechanical resonance
frequency of the device, large resonating strain is generated. This phenomenon can be understood as a strain
magnification due to accumulating
ting input energy, and is called piezoelectric resonance. Piezoelectric resonance is very
useful for realizing energy trap devices, actuators, etc.
Electromechanical Coupling Factor
Factor,, k: corresponds to the rate of electromechanical transduction.
k2 = (stored
ed mechanical energy/input electrical energy)
k2 = (stored electrical energy/input mechanical energy) = d2/0 s
The general processes for calculating the electromechanical parameters (k31, d31, sE11, and X33) are:
1. The sound velocity in the specimen is obtained from the resonance frequency fR
2. Knowing the density , the elastic compliance sE11 can be calculated.
3. The electromechanical coupling factor k31 is calculated from the value and the antiresonance frequency fA
4. Knowing the permittivity X33, the d31 is calculated
Piezoelectric Vibrators
In the use of mechanical vibration devices such as filters or oscillators,
the size and shape of a device are very important, and both the vibrational
mode and the ceramic
ic material must be considered.