PowerEdge M630

PowerEdge M630
Welcome
This reference guide is both an instructional aid and online reference for the Dell PowerEdge M630 modular server.
The technologies and features are described to better prepare technicians to provide outstanding support to Dell
customers.
Dell PowerEdge M630

RTS Dates:
Worldwide 20141202
Department
s:
Global Services and

Deployment
Authors:
Alan Khoo
Contributin
g Sources:
EM: Andy Berke

WWSPM: Margarita
Martinez
InfoDev
Contacting Dell
To contact Dell regarding issues with this reference guide, click Contact Us.
Dell Restricted Confidential

2014 Dell | For Dell Employees and Dell Service Providers only | Legal | Contact
Copyright
Copyright 2015 Dell Inc. All rights reserved. This product is protected by U.S. and international copyright and
intellectual property laws. Dell and the Dell logo are trademarks of Dell Inc. in the United States and/or other
jurisdictions. All other marks and names mentioned herein may be trademarks of their respective companies.
Contents
Welcome......................................................................................................................................... 1
Dell PowerEdge M630..................................................................................................................................................... 1
Contacting Dell................................................................................................................................................................ 1
Copyright......................................................................................................................................................................... 2
Using This Reference Guide........................................................................................................ 6

Navigation........................................................................................................................................................................ 6
Notes, Cautions, Warnings, and Tips.............................................................................................................................. 6
Browser Requirements.................................................................................................................................................... 6
Additional Required Software..........................................................................................................................................6
Course Introduction..................................................................................................................... 7
Goal.................................................................................................................................................................................. 7
Objectives.........................................................................................................................................................................7
Course Delivery Method..................................................................................................................................................7
Prerequisites.....................................................................................................................................................................7
Product Overview......................................................................................................................... 8
Product Positioning......................................................................................................................................................... 8
Product Features............................................................................................................................................................. 9
Product Comparison....................................................................................................................................................... 9
Technical Specifications................................................................................................................................................10
Supported Operating Systems...................................................................................................................................... 12
Quick Resource Locator ...............................................................................................................................................13
Block Updates..............................................................................................................................14
Q1 2015 Block................................................................................................................................................................14
BIOS Update.............................................................................................................................................................14
Lifecycle Controller Update.....................................................................................................................................15
iDRAC8 Version 2.10.10.10...................................................................................................................................... 15
Intel Chipset Driver Update..................................................................................................................................... 15
Q2 2015 Block............................................................................................................................................................... 16
Chassis Overview.........................................................................................................................17
Front Panel Features and Indicators..............................................................................................................................17
Chassis Assembly...........................................................................................................................................................19
Chassis LEDs..................................................................................................................................................................20
Hard Drive Indicator Patterns................................................................................................................................. 20
iDRAC Direct LED Indicator Codes......................................................................................................................... 21
Field Service Information.......................................................................................................... 22

Field Service Overview.................................................................................................................................................. 22
Product Overview..........................................................................................................................................................23
Product Positioning................................................................................................................................................. 23

Safety Precautions.........................................................................................................................................................24
Standby Power.........................................................................................................................................................24
Bonding....................................................................................................................................................................24
Electrostatic Discharge Protection......................................................................................................................... 24
The ESD Field Service KitAnti-Static MatWrist Strap and Bonding Wire................................................................26
ESD Wrist Strap Tester............................................................................................................................................. 27
Insulator Elements................................................................................................................................................... 27
Consider the Working Environment....................................................................................................................... 28
ESD Packaging.........................................................................................................................................................28
Transporting Sensitive Components...................................................................................................................... 29
ESD Protection Summary........................................................................................................................................29
Lifting Equipment.................................................................................................................................................... 29
Tools and Utilities..........................................................................................................................................................30
Hand Tools.............................................................................................................................................................. 30
Need to Know................................................................................................................................................................30
Critical Callouts....................................................................................................................................................... 30
Product Comparison............................................................................................................................................... 38
Common Error Messages....................................................................................................................................... 39
Version Control........................................................................................................................................................41
Start Up/Shut Down Sequence............................................................................................................................... 41
Diagnostics and Indicators............................................................................................................................................42
Hard Drive Indicator Patterns..................................................................................................................................42
iDRAC Direct LED Indicator Codes.........................................................................................................................43
Enhanced Pre-boot System Assessment (ePSA)....................................................................................................44
System Board Connectors.............................................................................................................................................51
System Board Jumper Settings.....................................................................................................................................52
Disassembly and Reassembly....................................................................................................................................... 53
Cover........................................................................................................................................................................53
Cooling Shroud........................................................................................................................................................54
Processor/DIMM Blank............................................................................................................................................55
Memory....................................................................................................................................................................56
2.5 Hard Drive.........................................................................................................................................................58
1.8 Solid State Drive............................................................................................................................................... 60
Internal Dual SD Module......................................................................................................................................... 62
rSPI Card.................................................................................................................................................................. 64
SD vFlash Card.........................................................................................................................................................65
I/O Module Mezzanine Card................................................................................................................................... 67
Network Daughter Card..........................................................................................................................................68
Heat Sink and Processor......................................................................................................................................... 69
Hard Drive Backplane.............................................................................................................................................. 74
Hard Drive/SSD Cage...............................................................................................................................................77
System Board........................................................................................................................................................... 78
System Battery......................................................................................................................................................... 81
PCIe Extender/Storage Controller Card................................................................................................................. 83
PERC and HDD Replacement................................................................................................................................. 84
Update BIOS.................................................................................................................................................................. 86
Re-enabling the Trusted Platform Module (TPM).................................................................................................. 86
Restoring the Service Tag Using Easy Restore............................................................................................................. 87
Update the Service Tag........................................................................................................................................... 87

Installation......................................................................................................................................................................87
Placemat.................................................................................................................................................................. 87
Initialization..............................................................................................................................................................88
Basic Configuration.................................................................................................................................................88
Quick Resource Locator .............................................................................................................................................. 89
Technology and Components.................................................................................................. 91

iDRAC8........................................................................................................................................................................... 91
Acquiring Licenses................................................................................................................................................... 91
New Features........................................................................................................................................................... 91
iDRAC Quick Sync (R630, R730 and R730XD Only)...............................................................................................92
Configurable Temperature and Power Thresholds............................................................................................... 92
iDRAC Robustness and Self-Healing...................................................................................................................... 93
Tech Support Report............................................................................................................................................... 93
Lifecycle Controller.......................................................................................................................................................94
iDRAC8 with Lifecycle Controller........................................................................................................................... 94
Benefits of Using iDRAC with Lifecycle Controller................................................................................................ 94
Whats New In This Release?...................................................................................................................................94
Key Features.............................................................................................................................................................94
Starting Lifecycle Controller................................................................................................................................... 95
Processor.......................................................................................................................................................................96
Processor Features.................................................................................................................................................. 96
Supported Processors............................................................................................................................................. 97
Chipset........................................................................................................................................................................... 97
Memory..........................................................................................................................................................................98
General Memory Module Installation Guidelines...................................................................................................99
Mode Specific Guidelines..................................................................................................................................... 100
Sample Memory Configurations........................................................................................................................... 101
Storage.........................................................................................................................................................................103
Hard Drive/SSD Bay Numbering........................................................................................................................... 104
Express Flash (PCIe SSD)....................................................................................................................................... 104
Backplane.................................................................................................................................................................... 105
General Configuration Notes................................................................................................................................106
PERC9.......................................................................................................................................................................... 106
PERC H330............................................................................................................................................................ 106
PERC H730.............................................................................................................................................................107
PERC H730P...........................................................................................................................................................107
Internal Dual SD Module............................................................................................................................................. 107
IDSDM New Features.............................................................................................................................................107
Supported Operating Systems.............................................................................................................................. 108
Network Daughter Card..............................................................................................................................................109
PCIe Mezzanine Card..................................................................................................................................................109
Supported Mezzanine Cards.................................................................................................................................109
PCIe Mezzanine Card Installation Guidelines.......................................................................................................110
Fabric Connection for M1000e............................................................................................................................. 110
Fabric Connection for VRTX.................................................................................................................................. 111
Mezzanine Population Rule................................................................................................................................... 112
Trusted Platform Module ............................................................................................................................................114
System Board Block Diagram...................................................................................................................................... 115
BIOS and UEFI............................................................................................................................ 117

4

Pre-operating System Management Applications...................................................................................................... 117

Using Navigation Keys..................................................................................................................................................117
About System Setup.....................................................................................................................................................118
F2 BIOS (System Setup)............................................................................................................................................118
System Setup Main Menu...................................................................................................................................... 119
System BIOS Settings Screen................................................................................................................................ 119
System Information Screen................................................................................................................................... 121
System Memory Screen.........................................................................................................................................122
Processor Settings Screen.....................................................................................................................................123
SATA Settings Screen.............................................................................................................................................126
Boot Settings Screen............................................................................................................................................. 128
Network Settings Screen.......................................................................................................................................130
Integrated Devices Screen.....................................................................................................................................131
Serial Communication Screen.............................................................................................................................. 133
System Profile Settings Screen..............................................................................................................................135
System Security Screen......................................................................................................................................... 138
Miscellaneous Settings Screen............................................................................................................................. 140
F10 Lifecycle Controller...........................................................................................................................................142
F11 UEFI Boot Manager............................................................................................................................................142
Entering Boot Manager......................................................................................................................................... 142
Boot Manager Main Menu.....................................................................................................................................143
Changing the Boot Order........................................................................................................................................... 144
Choosing the System Boot Mode...............................................................................................................................144
Assigning a System and/or Setup Password.............................................................................................................. 144
Deleting or Changing an Existing System and/or Setup Password...........................................................................145
Troubleshooting....................................................................................................................... 146
Minimum to POST....................................................................................................................................................... 146
Minimum Components......................................................................................................................................... 146
Known Issues...............................................................................................................................................................146
Disabling a Forgotten Password................................................................................................................................. 147
Troubleshooting System Memory.............................................................................................................................. 148
Troubleshooting Hard Drives......................................................................................................................................148
Troubleshooting Solid State Drives............................................................................................................................ 149
Troubleshooting USB Devices.................................................................................................................................... 149
Troubleshooting an Internal SD Card.........................................................................................................................149
Troubleshooting Processors.......................................................................................................................................150
Troubleshooting System Board.................................................................................................................................. 150
Troubleshooting the NVRAM Backup Battery............................................................................................................ 150
Additional Resources................................................................................................................151
Document History.................................................................................................................... 152

Using This Reference Guide

Navigation
To navigate through this reference guide, select topics using either the left navigation menu or the Previous and Next
buttons at the top right of each page.
Reference content may be accessed sequentially or randomly depending on your needs.
Notes, Cautions, Warnings, and Tips

The following symbols are used to highlight information that is of special significance to the topic.
NOTE: A NOTE highlights information of special interest or importance to the reader. Failure to read the note will
not result in physical harm to the reader, equipment, or data. A Note may not contain safety information, which
must always be presented in cautions or warnings.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
Tip: A TIP indicates important information to help you work more effectively and to assist you in providing
customers with the best experience.
Browser Requirements
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Additional Required Software

Adobe Acrobat PDF (.pdf) files require Acrobat Reader. Download Acrobat Reader and obtain additional information from
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Course Introduction
This is the online reference material for the Dell PowerEdge M630 modular server. The material introduces new
technologies and features specific to the Dell PowerEdge M630 in an effort to better prepare technicians to provide
support to our customers.
Goal
The goal of this reference guide is to provide the information that Technical Support agents, Dell Service Providers, and
Global Deployment and Field personnel need to provide outstanding customer support of the Dell PowerEdge M630.
Objectives
After completing this course, you will be able to do the following:
Identify the internal features and specifications of the Dell PowerEdge M630 module server.
Locate and identify all external chassis features and connectors.
Identify installation and configuration processes for the Dell PowerEdge M630 module server.
Identify any new technologies implemented and explain their significance.
Locate and reference any resources within this document which can be used to troubleshoot the Dell PowerEdge
M630 functionality issues.
Remove and replace all Field Replaceable Units (FRUs) in the Dell PowerEdge M630 module server.
Course Delivery Method

This course is designed as an online self-study module.
Prerequisites
Completion of the following:
Server New Hire

Product Overview
The Dell PowerEdge M630 is an ultra-efficient blade server combining up to 36 cores of Intel processing power
and 24 DIMMs of DDR4 memory in a dense, easy-to-manage platform ideal for data center workloads.
Product Positioning
The Dell PowerEdge M630 designed for use with the Dell PowerEdge M1000e blade enclosure and Dell PowerEdge VRTX
converged infrastructure. The Dell PowerEdge M630 offers exceptional scalability in environments ranging from IT as a
service providers and private clouds to remote and branch offices.
Performance
2S Intel Xeon E52600 v3 Processors (18 cores max each CPU; 36 total max cores, full server processor stack
2 x PCIe x8 Gen 3 Mezzanine Cards
Half-height single slot blade
Dual SD cards for redundant hypervisor
Availability
24 DIMMs (768 MB)
Up to 4 x 1.8 SSD or two 2 x 2.5
PERC 9/SAS HBA/Chipset SATA
Management: iDRAC8 Enterprise with Lifecycle Controller 3.x
Hot-plug, redundant power/cooling (chassis)
Expandability, I/O, Storage

Up to two Mezzanine Cards

4 x 1GbE, 2 x 10GbE, 4 x 10GbE LOMs
Managed Persistent Storage Options: 2x Express Flash PCIe Flash SSD
Product Features
The Dell PowerEdge M630 is a half-height blade, two socket blade server with up to 24 DIMMs, storage capacity of
up to four drive bays, and Intel Xeon E5-2600 v3 processors.
The Dell PowerEdge M630 is packed with the following features:
Leading storage performance and flexibility with 1U drive density
Cutting edge I/O capabilities: flexible LOMs, simple and cost effective aggregation with IOA, and I/O virtualization
with Network Partitioning (NPAR) 2
iDRAC 8 bringing System Management automation to mainstream IT.
Product Comparison
The following table compares the Dell PowerEdge M630 to the Dell PowerEdge M620 blade server.
Product Features Comparison
Feature
Dell PowerEdge M620
Dell PowerEdge M630
Processors
Intel Xeon processor E5-2600 v2

product family

product family
Memory
24 x DDR3 RDIMM, UDIMM, and

LRDIMM
Up to 768 GB
24 x DDR4 RDIMM and LRDIMM

Up to 768 GB
Disk Drive
2.5 6Gb SAS, 3Gb SATA
2.5 12Gb SAS/6Gb SATA, 1.8 6Gb

SATA
RAID Controller
S110
S130
H310 - Mini FX2 Specific
H330, H730, and H730P Mini Blade
PCIe SSD
Yes
Yes
Backplane Type
2 x 2.5
2 x 2.5 New backplane design
SATA only
SAS/SATA
PCIe SSD
SATA only From PCH

SAS/SATA From PERC
PCIe SSD From PCIe Extender
Module
4 x 1.8
uSATA From PCH

uSATA From PERC
NIC
bNDC: 2 x 10GbE, 4 x 10GbE
bNDC: 2 x 10GbE, 4 x 10GbE, 4 x 1GbE
USB
USB 2.0
One USB 2.0 and one USB 3.0 (front

ports)
I/O
Up to two x8 PCIe Gen3 SFF

Mezzanine

Mezzanine
Up to two x8 Gen2 PCIe switch
Mezzanine for VRTX


Feature
Dell PowerEdge M620
Dell PowerEdge M630
Heat Sink Type
57mm (24 DIMMs), 77mm (20 DIMMs), 68mm (24 DIMMs), 86mm (20 DIMMs)
97mm (16 DIMM-Fresh Air)
Fresh Air support with limited CPU and
memory sku.
Trusted Platform Module (TPM)
On board TPM 1.2
TPM Modular (FIPS TPM 1.2)
Remote Management
iDRAC7 (Express/Enterprise) with

Lifecycle Controller 2

Internal Dual SD Module (IDSDM)
Yes, on Management Riser
Yes, on IDSDM
Technical Specifications
Dell PowerEdge M630 Technical Specifications
Feature
Description
Processor
Processor type
One or two Intel Xeon processor E5-2600 v3 product

family
Memory
Architecture
2133 MT/s, 1866 MT/s, 1600 MT/s, or 13333 MT/s DDR4

DIMMs
Memory module sockets
Twenty-four 288-pin
Memory module capacities:

RDIMMs
4 GB (single-rank), 8 GB (dual-rank), and 16 GB (dual-rank)
LRDIMMs
32 GB (quad-rank)
Minimum RAM
4 GB (single processor configuration)
Maximum RAM
768 GB (with 32 GB LRDIMMs)
RAID controllers
Controller types
PERC H330, PERC H730P, and PERC H730
Drives
Hard drives
Up to two 2.5, hot-swappable SAS/SATA/PCIe SSDs or

SAS/SATA hard drives
SSDs
Up to four 1.8, hot-swappable SATA SSDs
Optical drive
External optional USB DVD

NOTE: DVD devices are data only.
Flash drive
Internal optional USB

Internal optional SD card
Optional vFlash card (with integrated iDRAC8 Enterprise)
Connectors
10


Feature
Description
Front:
USB
One 4-pin, USB 2.0-compliant and one 4-pin, USB 3.0compliant
Internal
SD
Two internal SD cards dedicated for the hypervisor

One SD card dedicated for future vFlash support
Mezzanine Cards
Mezzanine slots
Two PCIe x8 Gen 3 slots mezzanine card supporting dual

port 10 Gb Ethernet, quad port 10 Gb Ethernet, quad port 1
Gb, FC8 Fiber Channel, FC16 Fiber Channel, or Infiniband
mezzanine cards.
Video
Video type
Matrox G200 VGA controller integrated with iDRAC
Video memory
2 GB shared with iDRAC application memory
Battery
NVRAM backup battery
CR 2032 3.0 V lithium coin cell
Physical
Height
19.23 cm (7.57 inch)
Width
5.03 cm (1.98 inch)
Depth
54.43 cm (21.43 inch)
Weight (maximum)
6.8 kg (14.99 lb)
Environmental
Storage temperature
40 Celsius to 65 Celsius (40 Fahrenheit to 149

Fahrenheit) with a maximum temperature gradation of 20
Celsius per hour.
Standard operating temperature
Continuous operation: 10 Celsius to 35 Celsius at 10% to

80% relative humidity (RH), with 29 Celsius max dew
point. De-rate maximum allowable dry bulb temperature
at 1 Celsius per 300 m above 900 m (1 Fahrenheit per
550 ft).
The following conditions apply to the standard operating
temperature:
Certain system hardware configurations may require

reductions in the upper temperature limits.
System performance may be impacted when operating

above 30 Celsius or with a fan fault.

11

Feature
Description
Expanded operating temperature
NOTE: When operating in the expanded temperature

range, system performance may be impacted.
NOTE: When operating in the expanded temperature
range, ambient temperature warnings may be
reported on the LCD and in the System Event Log.
1% of annual operating hours
5 Celsius to 45 Celsius at 5% to 90% RH with 29

Celsius dew point.
NOTE: Outside the standard operating temperature
(10 Celsius to 35 Celsius), the system can operate
down to 5 Celsius or up to 45 Celsius for a
maximum of 1% of its annual operating hours.
For temperatures between 40 Celsius and 45 Celsius, derate maximum allowable dry bulb temperature by 1
Celsius per 125 m above 950 m (1 Fahrenheit per 228 ft).
Expanded operating temperature restrictions
Do not perform a cold startup below 5 Celsius.

135 W (4 core, 6 core, or 8 core) and 145 W processors
are not supported.
The following do not support the expanded operating
temperature range:
PCIe SSDs
Non Dell-qualified peripheral cards and/or
peripheral cards greater than 25 W
When populating the blade slots in the M1000e
enclosure with only Dell PowerEdge M630 blades:
Install 86 mm width heat sink for processors of 120
W or more.
Install 68 mm width heat sink for processors of less
than 120 W.
If you install a blade with two processors in the
M1000e enclosure, all blade slots in the enclosure
must have Dell PowerEdge M630 blades with the
same configuration (Dell PowerEdge M630 blades
with two processors). However, vacant blade slots
in the enclosure can be installed with blade blanks.
Supported Operating Systems

The Dell PowerEdge M630 supports the following operating systems.
Microsoft Windows Server 2008/2012 R2 (with Hyper-V enabled)
Microsoft Windows Server 2012 (with Hyper-V enabled)
Microsoft Windows Server 2008/2012 Datacenter (with Hyper-V enabled)
Microsoft Windows Server 2008 R2 SP1 (with Hyper-V enabled)
Microsoft Windows Server 2008 R2 SP2 x64/x86 (with Hyper-V enabled)
Novell SUSE Linux Enterprise Server
Red Hat Enterprise Linux
12

Optional Hypervisors:
Citrix XenServer
VMware vSphere ESXi
For more information on the specific versions and additions, please refer to Dell.com/OSsupport.
Quick Resource Locator

A useful feature included with the new 13G servers is the Quick Resource Locator (QRL) a model-specific Quick
Resource (QR) code on Dell PowerEdge servers. Use your phone to access the Dell QRL app to learn more about the
specific product in front of you. This QR code provides quick access to the following:
Step-by-step videos, including overviews of system internals and externals, as well as detailed, concise, task-oriented
videos, and installation wizards.
Reference materials, including searchable owners manual content, LCD diagnostics, and an electrical overview.
Service Tag lookup, so you can quickly gain access to your specific hardware configuration information and warranty
information.
Contact with Dell via a direct link to get in touch with technical support and sales teams, and provide feedback direct
to Dell.
These codes provide an easy way to retrieve the critical support information you need when you need it. This makes
more efficient and effective management for your data center hardware.
Use the QRL to get immediate access to system information and how-to videos. This can be done by visiting
dell.com/QRL or by using your smartphone or tablet and a model-specific QR code located on your Dell PowerEdge
system. To try out the QR code, scan the following image.

13
Block Updates
This topic contains information on block updates.
Q1 2015 Block
RTS Date: April 07, 2015
In April of 2015, Dell released the following updates to the Dell PowerEdge FC630/M630:
BIOS Update
Lifecycle Controller Update
iDRAC8 Version 2.10.10.10
Intel Chipset Driver Update
Added new Memory:

PR5D1 DIMM,32GB,2133,2RX4,8G,DDR4,R
Added new processor:

56H61 PRC,E52658V3,2.2,30M,HSL,M1 (for M630 only)
PH0T5 PRC,E52685V3,2.6,30M,HSL,M1
Added new network cards:

Y348Y CRD,NTWK,13G,BNDC,4X10,IN,10KR
DX69G CRD,NTWK,BNDC,2X10KR,INTEL
Y5M7N CRD,NTWK,10G,SFP+,DP,INTEL,V3 (FH)
5N7Y5 CRD,NTWK,10G,SFP+,DP,INT,LP,V3
DDJKY CRD,NTWK,4X10G,SFP+,INTEL
P90KD CRD,NTWK,PCIE,10G,NIC,DP,EMX,L
196TN CRD,NTWK,MEZZ,NIC,DP,EMULEX
R6D8Y CRD,NTWK,BNDC,NIC,EMULEX,DP,KR
Added Supported Operating Systems:

VMware ESXi 5.1 U3
VMware ESXi 5.5 U2
VMware ESXi 6.0 (factory install and web posting)
XenServer 6.5 (factory install)
Red Hat Enterprise Linux 7.0 (shipping)
Added new power source:

MVP7C PWR SPLY,2000W,RDNT,13G,DELTA
BIOS Update
Fixes
The following are the fixes for BIOS update:
14
Fixed Non-Volatile Memory Express (NVMe) device surprise-removal issue.

Fixed an issue with some complex USB monitors.
Fixed an issue where Controlled Turbo using RACADM did not follow profile settings.
Fixed a console redirection output issue that was not shutting-off when 'Serial Communication' is set to OFF.
Fixed an issue where the system and mouse are frozen when selecting the "Blink" option while configuring Dell NVMe
PCIe SSD under the Device Settings HII menu.
Enhancements
The following are the enhancements for BIOS update:
Updated the Intel processor and memory reference code to MR11.
Updated the Intel Xeon processor E5-2600 V3 product family processor microcode to 0x2D.
Updated the Intel Management Engine (ME) firmware version to SPS_E5_03.00.07.154.0_MR1-G_WBG_REL.
Updated the BIOS HII Setup menu.
Enable airflow (Cubic Feet per Minute (CFM)) and Exhaust Temperature for Power Thermal Aware Solution (PTAS).
Added Workload profile feature.
Lifecycle Controller Update

Added Supported Operating Systems:
Microsoft Windows Server 2012
Microsoft Windows Server 2012 R2
Microsoft Windows Server 2008 R2 SP1
Red Hat Enterprise Linux 6.5 x86_64
Red Hat Enterprise Linux 7.0 x86_64
SUSE Linux Enterprise Server 11 SP3 x86_64
SUSE Linux Enterprise Server 12 x86_64
VMware ESXi
Citrix XenServer
NOTE: If you select VMware ESXi, Citrix XenServer, or select the Any Other Operating System option, make sure
that you prepare the drivers required for installing these operating systems because the drivers not available.
iDRAC8 Version 2.10.10.10

NOTE: For more information about the iDRAC8 2.10.10.10 update, please refer to the reference material link below.
Internal Link: iDRAC8
External Link: iDRAC8
Intel Chipset Driver Update

Fixes
The following are the fixes for Intel Chipset Driver update:
Full Speed barcode scanner may fail to enumerate when connected behind a USB2.0.
USB3.0 Pendrive may fail to enumerate when connected behind a USB3.0 Hub after an S4 power cycle.
Fixed BSOD 0x9F that may occur during long S3 stress test.

15
Certain Bluetooth devices power state data is stuck in D0 when they are connected to the xHCI controller.
In certain conditions when a USB3.0 Hub is connected behind an xHCI controller, and both Hub and xHCI controller
have entered selective suspend, the xHCI will fail to detect USB3.0 devices if plugged in behind the USB3.0 Hub.
USB3.0 monitor application may crash under the Windows 7 operating system (Simplified Chinese) if a USB3.0
device with a long name is connected to a USB2.0 port.
Intel logo displayed in the installer windows is overlapped if the display configuration is set to Medium -125% under
the Control Panel.
Q2 2015 Block
RTS Date: June 29, 2015
In June of 2015, Dell released the following updates to the Dell PowerEdge FC630/M630:
Added new system board:

1TN3Y - ASSY,ENCL,BLDE,L6,FC630,V2
PHY8D - ASSY,CRD,PLN,BLDE,M/FC630,V2
YNHVN - CRD,PLN,BLDE,M/FC630,V2
4CGNX - ASSY,ENCL,BLDE,L6,M630,V2 (for M630 only)
Added new mezzanine card:

YVRX4 - MOD,PWA,RSR,PCIE,X16,MEZ,FC630
KHKN5 - ASSY,CRD,RSR,PCIE,X16,FC,V6
16

Chassis Overview
The following pages contain an overview of the chassis.
Front Panel Features and Indicators

Dell PowerEdge M630 Front Panel Features and Indicators
2.5 Chassis
Dell PowerEdge M630 Front Panel Features and Indicators

1.8 Chassis
Chassis Front
Item
Indicator, Button, or
Connector
Hard drives/SSDs
Icon
Description
2.5 inch harddrive system
Two 2.5 inch hot-swap

SAS/SATA/PCIe SSDs or
SAS/SATA hard-drives.
1.8 inch SSD

system
Four 1.8 inch hot-swap

SATA SSDs.

17
Chassis Front
Item
Indicator, Button, or
Connector
USB2 connector
Allows a USB device to be connected to the

system.
USB1/iDRAC managed
USB port
The USB management port can function as a

regular USB port or provide access to the iDRAC
features. For more information, see the iDRAC
Users Guide at www.dell.com/esmmanuals.
Management indicator
The management indicator lights when the

iDRAC controls the USB1 port for management
functions.
Status indicator
Provides information about the status of the

system.
Blade power-on indicator,

power button
The power-on indicator lights when the blade

power is on. The power button controls the
power supply output to the system.
Blade handle
Used to slide the blade server out of the

enclosure.
18
Icon
Description

Chassis Assembly
Chassis Assembly
Item
Descriptions
Restore Serial Peripheral Interface (rSPI) Card
PCIe Mezzanine Card Connector (2)
Network Daughter Card (NDC)
Memory Module (24)
Cooling Shroud
Hard Drive/SSD Backplane
Processor 2
Processor 1

19
Chassis LEDs
The following pages contain the information about chassis LEDs.
Hard Drive Indicator Patterns

The hard-drive/SSD (Solid State Drives) indicators display different patterns as drive events occur in the system.
NOTE: The blade server must have a hard-drive/SSD or a hard-drive blank installed in each drive bay.
1.
Drive activity indicator (green)
2.
Drive status indicator (green and amber)
NOTE: If the drive is in Advanced Host Controller Interface (AHCI) mode, the status LED (on the right side) does not
function and remains off.
Drive-Status Indicator Pattern
Condition
Blinks green two times per second
Identifying drive or preparing for removal.
Off
Drive ready for insertion or removal.

NOTE: The drive status indicator remains off until all
drives are initialized after system power is applied.
Drives are not ready for insertion or removal during
this time.
Blinks green, amber, and then turns off
Drive predicted failure.
Blinks amber four times per second
Drive failed.
Blinks green slowly
Drive rebuilding.
Steady green
Drive online.
20


Condition
Blinks green three seconds, amber three seconds, and off

six seconds
Rebuild aborted.
iDRAC Direct LED Indicator Codes

NOTE: The iDRAC Direct LED indicator will not light up for the USB mode.
1.
iDRAC Direct Status Indicator
The table below displays iDRAC Direct activity when configuring iDRAC Direct using the management port.
Convention
iDRAC Direct LED

Indicator Pattern
Condition
Green
Lights green for a minimum of 2 seconds or until file transfer begins.
Flashing green
Indicates file transfer or any operation tasks.
Green and turns off
Indicates that the file transfer is successful.
Flashing amber
Indicates that the file transfer failed.
The table below displays iDRAC Direct activity when configuring iDRAC Direct using your laptop and cable.
iDRAC Direct LED
Indicator Pattern
Condition
Solid green for two

seconds
Indicates that the laptop is connected.
Flashing green (on for

two seconds and off for
two seconds)
Indicates that the laptop connected is recognized.
Turns off
Indicates that the laptop is unplugged.

21
Field Service Information

The information in this section is specifically for field service personnel who perform installation, diagnosis, and repair
activities. Field personnel are required to know the information and procedures in this section whether or not they
perform all the service tasks. Information in this section is required knowledge, but should never override regional or
local policy and procedure.
Field Service Overview

Field service information for the Dell PowerEdge M630 includes the following content:
Dell PowerEdge M630 Overview High-level description of the Dell PowerEdge M630 that includes features and
functions, product-to-product comparison and supported operating systems (OS), if applicable. OEM branding
information is also included.
OEM Branding Information about the OEM features of the Dell PowerEdge M630 including required special
processes, notes, callouts that the technician needs to know to service it.
Safety Precautions Generic safety precautions for every service event.
Tools and Utilities Hand tools, diagnostic tools or utilities, software applications, or GUIs that are required to
service the Dell PowerEdge M630.
Need to Know Specific callouts about this system, common error codes, version control for BIOS, firmware or
software for OEM, required startup or shutdown sequences, new product technologies, and components
comparison. For networking products, the switch, user name, and password defaults are included in this section.
Diagnostics and Indicators Visual information about the health and state of the system.
System Board Connectors Information on system board connectors.
System Board Jumper Settings Information on system board jumper settings.
Disassembly and Reassembly Instructions for removing and replacing each replaceable part, with information
needed before, during, and after parts replacement.
Update BIOS Information and procedures for updating the BIOS after the Dell PowerEdge M630 has been serviced.
Restoring the Service Tag Using Easy Restore The procedure for updating the Service Tag. This procedure is
required when a system board or chassis is replaced to ensure that the system functions properly and can be verified.
Installation The placement, information about rack rails, cabling, system initialization, and basic configuration.
Quick Resource Locator Information on the new Quick Resource Locator (QRL) feature on the System Information
Label (SIL).
22

Product Overview
The Dell PowerEdge M630 is an ultra-efficient blade server combining up to 36 cores of Intel processing power
and 24 DIMMs of DDR4 memory in a dense, easy-to-manage platform ideal for data center workloads.
Product Positioning
The Dell PowerEdge M630 designed for use with the Dell PowerEdge M1000e blade enclosure and Dell PowerEdge VRTX
converged infrastructure. The Dell PowerEdge M630 offers exceptional scalability in environments ranging from IT as a
service providers and private clouds to remote and branch offices.
Performance
2S Intel Xeon E52600 v3 Processors (18 cores max each CPU; 36 total max cores, full server processor stack
2 x PCIe x8 Gen 3 Mezzanine Cards
Half-height single slot blade
Dual SD cards for redundant hypervisor
Availability
24 DIMMs (768 MB)
Up to 4 x 1.8 SSD or two 2 x 2.5
PERC 9/SAS HBA/Chipset SATA
Management: iDRAC8 Enterprise with Lifecycle Controller 3.x
Hot-plug, redundant power/cooling (chassis)
Expandability, I/O, Storage

Up to two Mezzanine Cards
23
4 x 1GbE, 2 x 10GbE, 4 x 10GbE LOMs

Managed Persistent Storage Options: 2x Express Flash PCIe Flash SSD
Safety Precautions
Observe the following safety precautions when you perform any installation or break/fix procedures involving
disassembly or reassembly:
Turn off the system and all attached peripherals.
Disconnect the system and all attached peripherals from AC power, and then remove the battery.
Disconnect all network cables, telephone or telecommunications lines from the system.
Use a wrist grounding strap and mat when working inside any computer system to avoid electrostatic discharge (ESD)
damage.
After removing a system component, carefully place the removed component on an anti-static mat.
Wear shoes with non-conductive rubber soles to help reduce the risk of being shocked or seriously injured in an
electrical accident.
Standby Power
Dell products with standby power must be completely unplugged before the case is opened. Systems that incorporate
standby power are essentially powered while turned off. The internal power enables the system to be remotely turned on
(wake on LAN), suspended into a sleep mode, and have other advanced power management features.
After you unplug a system and before you remove components, wait approximately 30 to 45 seconds to allow the charge
to drain from the circuits. Remove the battery from portable computers.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done
through the use of a Field Service ESD kit. When connecting a bonding wire, always ensure that it is connected to bare
metal and never to a painted or non-metal surface. The wrist strap should be secure and in full contact with your skin,
and be sure to always remove all jewelry such as watches, bracelets, or rings prior to bonding yourself and the
equipment.
Electrostatic Discharge Protection

ESD is a major concern when you handle electronic components, especially sensitive components such as expansion
cards, processors, memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be
obvious, such as intermittent problems or a shortened product life span. As the industry pushes for lower power
requirements and increased density, ESD protection is an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now
higher than in earlier Dell products. For this reason some previously approved methods of handling parts are no longer
applicable.
24

There are two recognized types of ESD damage: catastrophic and intermittent failures.
Catastrophic The damage causes an immediate and complete loss of device functionality. An example of
catastrophic failure is a memory DIMM that has received a static shock and immediately generates a "No POST/No
Video" symptom with a beep code emitted for missing or nonfunctional memory.
NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.
Intermittent The DIMM receives a static shock, but the tracing is merely weakened and does not immediately
produce outward symptoms related to the damage. The weakened trace may take weeks or months to melt, and in
the meantime may cause degradation of memory integrity, intermittent memory errors, etc.
NOTE: Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of
intermittent failures means that most of the time when damage occurs, it is not immediately recognizable.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or walking
wounded) failure. The following image shows an example of intermittent damage to a memory DIMM trace. Although
the damage is done, the symptoms may not become an issue or cause permanent failure symptoms for some time after
the damage occurs.
Do the following to prevent ESD damage:
Use a wired ESD wrist strap that is properly grounded.

The use of wireless anti-static straps is no longer allowed; they do not provide adequate protection.
Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased
sensitivity to ESD damage.
Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.
When handling static-sensitive components, grasp them by the sides, not the top. Avoid touching pins and circuit
boards.

25
When unpacking a static-sensitive component from its shipping carton, do not remove the component from the antistatic packing material until you are ready to install the component. Before unwrapping the anti-static packaging, be
sure to discharge static electricity from your body.
Before transporting a static-sensitive component, place it in an anti-static container or packaging.
The ESD Field Service Kit

The unmonitored Field Service kit is the most commonly used. Each Field Service kit includes three main components:
anti-static mat, wrist strap, and bonding wire.
Anti-Static Mat
The anti-static mat is dissipative and should be used to safely place parts on during service procedures. When using an
anti-static mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to bare-metal
on the system being worked on. Once deployed properly, service parts can be removed from the ESD bag and placed
directly on the mat. Remember, the only safe place for ESD-sensitive items are in your hand, on the ESD mat, in the
system, or inside a bag.
Wrist Strap and Bonding Wire

The wrist strap and bonding wire can be either directly connected between your wrist and bare metal on the hardware if
the ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily placed on the
mat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is
known as bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps.
Always be aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be
checked regularly with a wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test
the wrist strap and bonding wire a minimum of once per week.
26

ESD Wrist Strap Tester

The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is best practice to
regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best
method for doing this test. If you do not have your own wrist strap tester, check with your regional office to find out if
they have one. To perform the test, plug the wrist-straps bonding-wire into the tester while it is strapped to your wrist
and push the button to test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.
Insulator Elements
It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are insulators
and often highly charged.

27
Consider the Working Environment

Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit
for a server environment is different than for a desktop or portable environment. Servers are typically installed in a rack
within a data center; desktops or portables are typically placed on office desks or cubicles.
Always look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with additional
space to accommodate the type of system that is being repaired. The workspace should also be free of insulators that
can cause an ESD event. On the work area, insulators such as Styrofoam and other plastics should always be moved at
least 12 inches or 30 centimeters away from sensitive parts before physically handling any hardware components.
ESD Packaging
All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are preferred.
However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.
The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original
box that the new part arrived in.
ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should never
be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the
ESD mat, in the system, or inside an anti-static bag.
28

Transporting Sensitive Components

When transporting ESD-sensitive components such as replacement parts or parts to be returned to Dell, it is critical to
place these parts in anti-static bags for safe transport.
ESD Protection Summary

It is strongly suggested that all field service engineers use the traditional wired ESD grounding wrist strap and protective
anti-static mat at all times when servicing Dell products. In addition, it is critical that engineers keep sensitive parts
separate from all insulator parts while performing service and that they use anti-static bags for transporting sensitive
components.
Lifting Equipment
WARNING: Do not lift greater than 50 pounds. Always obtain assistance from another person or persons, or use
a mechanical lifting device.
Adhere to the following guidelines when lifting equipment:
1.
Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.
2.
Bend your knees. Do not bend at the waist.
3.
Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.
4.
Lift with your legs, not your back.
5.
Keep the load close. The closer it is to your spine, the less force it exerts on your back.
6.
Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load.
Avoid twisting your body and back.
7.
Follow the same techniques in reverse to set the load down.

29
Tools and Utilities

A set of tools is required to service the Dell PowerEdge M630 system. The following images illustrate the required
tools and the optional tools.
Hand Tools
A set of required and optional tools are necessary to service the product.
#1 and #2 Phillips screwdrivers
T8 and T10 Torx drivers
Wrist grounding strap connected to ground
Hex nut driver 5 mm
ESD mat
Needle-nose pliers help in disconnecting cables and

connectors in hard-to-reach locations.
Small flat-head screwdriver helps in disconnecting

small cables from boards.
Need to Know
Before you begin servicing the Dell PowerEdge M630, you must read the following information:
Critical callouts
NUDDs
Common error messages
Version control
Startup/shutdown sequence
Critical Callouts
Restoring the Service Tag Using Easy Restore
The easy restore feature allows you to restore system Service Tag, iDRAC License, UEFI Configuration, OEM ID Module,
and the System Configuration Data after replacing the system board. All data is backed up in a backup flash device
automatically. If BIOS detects a new system board, and the Service Tag in the backup flash device, BIOS prompts the user
to restore the backup information.
30

NOTE: In a scenario where both control panel and system board are dispatched, it is recommended to replace the
control panel first and attempt a power on to complete the backup process. Then proceed to replace the system
board.
NOTE: The OEM ID Module restore is available on iDRAC8 v2.20.20.20 and above.
To restore the Service Tag using Easy Restore:
1.
Power on the system.

If BIOS detects a new system board, and the Service Tag is present in the backup flash device, BIOS displays the
Service Tag, the status of the license, and the UEFI Diagnostics version.
2.
Press Y to restore the Service Tag, license, and diagnostics information, or;
Press N to navigate to the Lifecycle Controller based restore options, or;
Press <F10> to restore data from a previously created Hardware Server Profile.
After the restore process is complete, BIOS prompts to restore the system configuration data.
3.
Press Y to restore the system configuration data, or;

Press N to use the default configuration settings.
After the restore process is complete, system reboots.
Trusted Platform Module (TPM) Installation

In 13G, the Trusted Platform Module (TPM) chip is on a Plug In Module (PIM). The 13G TPM is bound to one and only one
system board.
CAUTION: Do not attempt to remove the TPM plug-in module from the motherboard. Once the TPM plug-in
module is installed, it is cryptographically bound to that specific motherboard. Any attempt to remove an
installed TPM plug-in module breaks the cryptographic binding, and it cannot be re-installed or installed on
another motherboard.
New TPM chip has to be dispatch, if system configured with TPM chip. Field engineer needs to install a new TPM chip
after system board replacement.
To install the TPM chip, use the following steps:
1.
Align the edge connectors on the TPM with the slot on the TPM connector.
2.
Insert the TPM into the TPM connector such that the plastic bolt aligns with the slot on the system board.
3.
Press the plastic bolt until the bolt snaps into place.

31
Item
Description
TPM
TPM Connector
Slot of the TPM Connector
Plastic Bolt
Slot on the System Board
Heat Sink Options

There are 2 types of heat sink available on the Dell PowerEdge M630.
For processors up to 105 W, 120 W, or 135 W, use heat sinks of 68 mm width.
For processors up to 135 W (four core, six core, or eight core) or 145 W, use heat sinks of 86 mm width.
32

Heat Sink Artwork Label for CPU 1 and CPU 2
NOTE: All replacement heat sinks will be copper-colored.
NOTE: Mixing processors of different wattages is not supported.

Heat Sink with DIMM Installation Rule

33
Heat Sink Options

Heat Sink
CPU
DIMM (Max)
DIMM (RAS)
68 mm (93 GVP
and D4T8T)
135W/12C
24
3 DIMM per
Channel (DPC)
24
3 DPC
86 mm (XCDC0
and CPC1C)
135W/8C/6C/4C
20
Ch 0/2: 3 DPC
16
2 DPC
Ch 1/3: 2 DPC
DDR4 Memory Installation Procedure

Do not rock or zip the DIMM. The DIMM is not flat along bottom edge.
C-Stack Mini-PERC Mounting

The new mini-PERC mounting is secured with two screws on the cable connector side. In 12G, the mini-PERC is
mounted with two tabs.
34

New 2.5 Hard Drive Carriers
To transition to plastic carriers, follow the below steps:
Add two plastic rails.
Add two EMI springs.
12G carriers physically fit in 13G servers, but are NOT supported.
Less heat retention:

35
Thermal effects (metal rails retained heat that will affect thermals within 13G chassis).
Cost effective.
New 1.8 SSD Carrier

12G to 13G transition:
New design for 13G.
Different design than what is currently used on 12G blade servers.
Accessing iDRAC Interface over Direct USB Connection (iDRAC Direct)

With the 13th generation of servers, one of the front panel USB ports is used by iDRAC for management purposes, such as
for pre-provisioning and troubleshooting. The port has an icon to indicate that it is a management port. All
13th generation servers with LCD panels support this feature. This port is not available in a few of the 200-500 model
variations that are ordered without the LCD panel.
36

Item
Description
iDRAC USB Management Port
In 13th generation servers, the new iDRAC Direct feature allows you to directly connect your laptop or PC USB port to the
iDRAC USB management port. This allows you to interact directly with iDRAC interfaces (such as the Web browser,
RACADM, and WSMAN) for advanced server management and servicing.
You must use a Type A/A USB cable to connect the laptop (a USB Host Controller) to the iDRAC in the server (a USB
device). No special software is required on the management laptop/PC. The supported OS are Windows 7, Windows 8,
and Ubuntu 12.
When iDRAC behaves as a USB device and the management port mode is set to Automatic, the USB port is always used
by iDRAC. The port does not switch automatically to the OS.

37
To access the iDRAC interface over the USB port:

1.
Connect a Type A/A USB cable from the laptop to the iDRAC Direct USB management port. The management LED
(if present) turns green and remains ON for two seconds.
NOTE: The Type A/A USB cable is not included with the purchase of Dell PowerEdge servers. The cable can be
purchased online through Dell Total Solutions.
2.
Wait for the IP address to be assigned to the laptop (169.254.0.4) and iDRAC (169.254.0.3).
3.
Start using the iDRAC network interfaces such as the Web interface, RACADM, or WS-Man.
4.
When iDRAC is using the USB port, the LED blinks, indicating activity. The blink frequency is four blinks per second.
5.
After using, disconnect the cable. The LED will turn itself off.
Enhanced BIOS Key

There is enhanced key behavior during POST, which allows the customer to toggle between <F2>/<F10>/<F11> functions
during POST.
Product Comparison
The following table compares the Dell PowerEdge M630 to the Dell PowerEdge M620 blade server.
Feature
Dell PowerEdge M620
Dell PowerEdge M630
Processors

product family

product family
Memory
24 x DDR3 RDIMM, UDIMM, and

LRDIMM
Up to 768 GB
24 x DDR4 RDIMM and LRDIMM

Up to 768 GB
Disk Drive
2.5 6Gb SAS, 3Gb SATA
2.5 12Gb SAS/6Gb SATA, 1.8 6Gb

SATA
RAID Controller
S110
S130
H310 - Mini FX2 Specific
H330, H730, and H730P Mini Blade
38


Feature
Dell PowerEdge M620
Dell PowerEdge M630
PCIe SSD
Yes
Yes
Backplane Type
2 x 2.5
2 x 2.5 New backplane design
SATA only
SAS/SATA
PCIe SSD
SATA only From PCH

SAS/SATA From PERC
PCIe SSD From PCIe Extender
Module
4 x 1.8
uSATA From PCH

uSATA From PERC
NIC
bNDC: 2 x 10GbE, 4 x 10GbE
bNDC: 2 x 10GbE, 4 x 10GbE, 4 x 1GbE
USB
USB 2.0
One USB 2.0 and one USB 3.0 (front

ports)
I/O

Mezzanine

Mezzanine
Up to two x8 Gen2 PCIe switch
Mezzanine for VRTX
Heat Sink Type
57mm (24 DIMMs), 77mm (20 DIMMs), 68mm (24 DIMMs), 86mm (20 DIMMs)
97mm (16 DIMM-Fresh Air)
Fresh Air support with limited CPU and
memory sku.
Trusted Platform Module (TPM)
On board TPM 1.2
TPM Modular (FIPS TPM 1.2)
Remote Management


Internal Dual SD Module (IDSDM)
Yes, on Management Riser
Yes, on IDSDM
Common Error Messages

The Event Message Reference contains the error and event information generated by firmware and other agents that
monitor system components. These events might be logged, presented to the user on one of the system management
consoles, or both logged and displayed.
Each event consists of the following fields:
Event Message Fields
Item
Description
Message ID
The unique alphanumeric identifier for the event. This

identifier can be up to eight characters long and consists
of two parts:
Message
Message ID Prefix Up to four alphabetic characters.

Message ID Sequence Up to four numeric digits.
The message text that is displayed to the user or logged as

a result of the event. If the message has variable content in
it, the variable substitution is reflected by text in italics.
These substitution variables are described in the
Arguments field of the event.

39

Item
Description
Arguments
Describes the values for any substitution variables

appearing in the event message text. If there is no variable
content in the message, this field is omitted from the event
description.
Detailed Description
Additional information describing the event.
Recommended Response Action
The recommended action to remedy the event described.

The response action can vary based on the specific
platform.
Category
Dell Lifecycle Controller log filter used to select a subset of

messages from different domains or agents.
Subcategory
Additional filter to further subset the event.
Trap/EventID
The identification number used as the Trap ID for SNMP

alert traps and as the Event ID when the message is logged
in operating system logs.
Severity
The classification of the event based on its impact to the

platform or system. The severity can be:
Severity 1 Critical Indicates a catastrophic production

problem that might severely impact production
systems or components, or systems are down or not
functioning.
Severity 2 Warning Indicates a high-impact problem
where a system or component is disrupted but can
remain productive and perform business-level
operations.
Severity 3 Information Indicates a medium-to-low
impact problem that involves a partial or noncritical
loss of functionality; operations are impaired but can
continue to function.
LCD Message
The event message text that is displayed on the system's

LCD.
Initial Default
Event messages result in event actions such as logging,

SNMP or email alerts. Generally, the event actions are
configurable using the Dell iDRAC event action filtering
feature. This item describes the initial default and possible
event actions for the message.
40


Item
Description
Event Action Filter
Describes additional configurable actions that are available

for the event action for this message. This information is
presented in a table, and each entry has a value of TRUE or
FALSE to indicate its applicability.
Filter Visibility Event visible to iDRAC event filtering.

IPMI Alert Event can generate an IMPI alert.
SNMP Alert Event can generate an SNMP trap.
Email Alert Event can generate an email alert.
LC Log Event can generate a Dell Lifecycle
Controller log entry.
LCD Event is displayed on the system's LCD.
Power Off Event can cause the system to power off.
Power Cycle Event can cause the system to perform
a power cycle.
Reset Event can cause the system to perform a reset.
For more information on the list of error and event messages, please refer to the Dell Event Messages Reference Guide
for 13G Dell PowerEdge Servers.
Version Control
For the latest BIOS, firmware, and software updates, visit Dell PowerEdge Support Site.
Start Up/Shut Down Sequence

NOTE: The 12G BIOS was only a UEFI overlay, whereas the 13G BIOS is pure UEFI with a legacy compatibility layer.
This layer is called the Compatibility Support Module.
New POST Display

The following are the POST display enhancements:
The look of the boot process has been revamped for 13G.
The Dell high-resolution splash screen displays instantly after power-on.
Both a progress bar and descriptive text appear on screen.
Hotkey behavior remains unchanged (<F2> still takes you to System Setup).
Uniform look and feel through the boot process (with one exception the system will drop to text mode briefly to
run legacy option ROMs when booting in legacy mode).
POST error messages are now compliant with Error Exception Message Initiative (EEMI).
NOTE: All POST error and warning messages will be logged in the Lifecycle Controller log.
UEFI option ROMs display error/warning messages on the screen via Driver Health Protocol (DHP). The auto-repair
logic is also included in Boot Device Selection (BDS) just before booting. Show the repair GUI and load the controller
formset if the EfiDriverHealthStatsuConfigurationRequired status is returned.

41
Enhanced Boot Support

The following lists the boot support enhancements:
Enhanced method to change boot list based on Fully Qualified Descriptors (FQDDs). This allows for systems
management consoles and the factory to specify a boot list for devices that are not currently present, for example, a
disabled network daughter card (NDC) or other boot mode.
New ability to toggle between LC and BIOS.
The Boot Manager (<F11>) and BIOS Setup (<F2>) will only contain the boot option enumeration of the current Boot
mode.
Completely revised boot flow.
Diagnostics and Indicators

The following pages contain the information about diagnostics and indicators.

The hard-drive/SSD (Solid State Drives) indicators display different patterns as drive events occur in the system.
NOTE: The blade server must have a hard-drive/SSD or a hard-drive blank installed in each drive bay.
42

1.
Drive activity indicator (green)
2.
Drive status indicator (green and amber)
NOTE: If the drive is in Advanced Host Controller Interface (AHCI) mode, the status LED (on the right side) does not
function and remains off.
Condition
Blinks green two times per second
Identifying drive or preparing for removal.
Off
Drive ready for insertion or removal.

NOTE: The drive status indicator remains off until all
drives are initialized after system power is applied.
Drives are not ready for insertion or removal during
this time.
Blinks green, amber, and then turns off
Drive predicted failure.
Blinks amber four times per second
Drive failed.
Blinks green slowly
Drive rebuilding.
Steady green
Drive online.
Blinks green three seconds, amber three seconds, and off

six seconds
Rebuild aborted.

NOTE: The iDRAC Direct LED indicator will not light up for the USB mode.

43
1.
iDRAC Direct Status Indicator
The table below displays iDRAC Direct activity when configuring iDRAC Direct using the management port.
Convention
iDRAC Direct LED

Indicator Pattern
Condition
Green
Lights green for a minimum of 2 seconds or until file transfer begins.
Flashing green
Indicates file transfer or any operation tasks.
Green and turns off
Indicates that the file transfer is successful.
Flashing amber
Indicates that the file transfer failed.
The table below displays iDRAC Direct activity when configuring iDRAC Direct using your laptop and cable.
iDRAC Direct LED
Indicator Pattern
Condition
Solid green for two

seconds
Indicates that the laptop is connected.
Flashing green (on for

two seconds and off for
two seconds)
Indicates that the laptop connected is recognized.
Turns off
Indicates that the laptop is unplugged.
Enhanced Pre-boot System Assessment (ePSA)

Dell Embedded System Diagnostics
NOTE: The Dell Embedded System Diagnostics is also known as Enhanced Pre-boot System Assessment (ePSA)
diagnostics.
The embedded system diagnostics provides a set of options for particular device groups or devices allowing you to:
Run tests automatically or in an interactive mode
Repeat tests
Display or save test results
Run thorough tests to introduce additional test options to provide extra information about the failed device(s)
View status messages that inform you if tests are completed successfully
44

View error messages that inform you of problems encountered during testing.
Running the Embedded System Diagnostics from Boot Manager

To run the embedded system diagnostics from Boot Manager:
1.
As the system boots, press <F11>.
2.
Use the up and down arrow keys to select System Utilities Launch Diagnostics.

45
3.
46
Wait while the Quick Tests automatically run.

4.
Once the tests have completed, on the Results tab, view test results for the selected test or tests.

47
5.
View the System Health tab for more information.
6.
View the Configuration tab for more information.
48

7.
View the Event Log tab for more information.
8.
Close the Embedded System Diagnostics utility.

49
9.
Click Exit to leave the Diagnostics.
10. Click OK when prompted, and the system reboots.

The System Diagnostic Controls details are explained below.
System Diagnostic Controls
Menu
Description
Configuration
Displays the configuration and status information of all

detected devices.
Results
Displays the results of all tests that are executed.
System Health
Provides the current overview of the system performance.
Event Log
Displays a time-stamped log of the results of all tests run

on the system. This is displayed if at least one event
description is recorded.
Running the Embedded System Diagnostics from the Dell Lifecycle Controller
To run the embedded system diagnostics from the Dell Lifecycle Controller:
1.
As the system boots, press <F10>.
2.
Select Hardware Diagnostics Run Hardware Diagnostics.
50

System Board Connectors

This section list the system board connectors for the Dell PowerEdge M630.

51
System Board Connectors

Item
Connector
Description
BATTERY
Connector for the 3.0 V coin cell battery
STORAGE
Storage controller card connector
B3, B7, B11, B4, B8, B12
Memory module sockets (processor 2)
CPU2
Processor socket 2
CPU1
Processor socket 1
A1, A5, A9, A2, A6, A10
IDSDM/rSPI
Internal Dual SD Module (IDSDM)/rSPI card connector
MEZZ1_FAB_C
PCIe mezzanine card connector for the expansion bus
MEZZ2_FAB_B
PCIe mezzanine card connector for the expansion bus
10
VFLASH
SD vFlash card connector
11
bNDC
Network daughter card (NDC) connector
12
A3, A7, A11, A4, A8, A12
13
PWRD_EN, NVRAM_CLR
System configuration jumpers

NOTE: Access to these requires removal of the system board.
14
B1, B5, B9, B2, B6, B10
15
USB2
USB connector
16
USB1
USB connector
17
TPM
TPM connector
18
J_BP
Hard-drive backplane connector
System Board Jumper Settings

System Board Jumper Settings
Jumper
Setting
Description
PWRD_EN
(default)
The password feature is enabled (pins 12).

The password feature is disabled (pins 23).
NVRAM_CLR
(default)
The configuration settings are retained at system boot (pins 2

3).
The configuration settings are cleared at the next system boot
(pins 12).
52

Disassembly and Reassembly

The following pages contain the procedures for removing and replacing system components.
Cover
Pre-Removal Instructions
Before you remove the cover:
Turn off the blade server using the operating system commands or the CMC.
Remove the blade server from the enclosure.
Install the I/O connector cover.
Cover Disassembly
1.
Press the release button and slide the cover toward the back of the blade.
2.
Lift the cover away from the blade server.
Item
Description
Alignment Guides on the System Cover and the Chassis
System Cover
Release Button
I/O Connector Cover
Cover Reassembly
1.
Align the alignment guide on the system cover with the alignment guide on the chassis.
2.
Lower the cover onto the chassis.
3.
Slide the cover until it clicks into position.

A properly seated cover is flush with the surface of the chassis.
53
After Service Instructions

1.
Install the blade server in the enclosure.
2.
Turn on the blade.
3.
Demonstrate the working system to the customer.
Cooling Shroud
CAUTION: Never operate your system with the cooling shroud removed. The system may get overheated
quickly, resulting in shut down of the system and loss of data.
Before you remove the cooling shroud:
Turn off the blade server using the operating system commands or the Chassis Management Controller (CMC).
Remove the blade server from the enclosure.
Remove the cover.
Cooling Shroud Disassembly

1.
Hold the cooling shroud at both ends.
2.
Lift it up and away from the system.
Item
Description
Cooling Shroud
Cooling Shroud Reassembly

NOTE: You must remove the cooling shroud to service other components inside the system.
1.
Lower the cooling shroud into the chassis until it is firmly seated.
2.
Close the blade server.

1.
2.
Turn on the blade server.
54

3.
Let the system boot.
4.
Processor/DIMM Blank
CAUTION: If you are permanently removing a processor, you must install a socket protective cap and a
processor blank/DIMM blank in the vacant socket to ensure proper system cooling. The processor/DIMM blank
covers the vacant sockets for the DIMMs and the processor.
Before you remove the processor/DIMM blank, make sure the following steps are complete:
Turn off the blade using the operating system commands or the Chassis Management Controller (CMC).
Remove the cover.
Remove the cooling shroud.
Processor/DIMM Blank Disassembly

1.
Pressing both release latches on the processor/DIMM blank near the sled chassis.
2.
Lift the processor/DIMM blank away from the sled.
Item
Description
Processor/DIMM Blank
Heat Sink Retention Socket (4)
Standoff (4)
Processor/DIMM Blank Reassembly

1.
If installed, remove the processor and heat sink.
2.
Align the standoffs on the processor/DIMM blank with the heat sink retention sockets on the processor socket.
3.
Lower the processor/DIMM blank onto the system until the standoffs on the processor/DIMM blank engages with the
heat sink retention sockets.
4.

55

1.
2.
3.
Memory
WARNING: The memory modules are too hot to touch for some time after the system has been powered down.
Allow time for the memory modules to cool before handling them. Handle the memory modules by the card
edges and avoid touching the components or metallic contacts on the memory module.
CAUTION: To ensure proper system cooling, memory module blanks must be installed in any memory socket
that is not occupied. Remove memory module blanks only if you intend to install memory modules in those
sockets.
Before you remove the memory, make sure the following steps are complete:
Remove the cover.
Memory Disassembly
1.
Locate the appropriate memory module socket(s).
2.
To release the memory-module from the socket, simultaneously press the ejectors on both ends of the memorymodule socket.
CAUTION: Handle each memory module only by the card edges, making sure not to touch the middle of the
memory module or metallic contacts.
3.
56
Remove the memory module from the socket.

Item
Description
Memory
Memory Socket
Memory Socket Ejector (2)
Memory Reassembly
NOTE: You must remove a memory module to upgrade a memory module or replace a faulty memory module.
1.
Locate the appropriate memory module socket.
2.
Press the ejectors on the memory module socket outward to allow the memory module to be inserted into the
socket.
CAUTION: Handle each memory module only on either card edge, making sure not to touch the middle of
the memory module.
3.
Align the memory module's edge connector with the alignment key of the memory module socket, and insert the
memory module in the socket.
NOTE: The memory module socket has an alignment key that allows you to install the memory module in the
socket in only one orientation.
CAUTION: To prevent damage to the memory module socket during installation, apply pressure at both
ends of the memory module evenly. Do not apply pressure to the center of the memory module.
4.
Press down on the memory module with your thumbs to lock the memory module into the socket.
NOTE: When the memory module is properly seated in the socket, the ejectors on the memory module socket
align with the ejectors on the other sockets that have memory modules installed.

57
Item
Description
Memory
Alignment Key
Memory Socket Ejector (2)
5.
Repeat step 1 through step 4 of this procedure to install the remaining memory modules.
6.
If applicable, install the hard drive backplane.
7.
Install the cooling shroud.
8.

1.
2.
3.
Press <F2> to enter the System Setup, and check the memory settings. The system should have already changed the
value to reflect the newly installed memory.
4.
If the value is incorrect, one or more of the memory modules may not be installed properly. Repeat step 1 through
step 3 of this procedure, making sure that the memory modules are firmly installed in their sockets.
5.
Run the appropriate diagnostic test.
6.
2.5 Hard Drive

NOTE: The mixing of solid state drives (SSDs), SAS, or SATA hard drives is not supported.
Before you remove the hard drive, perform the following steps:
Using the management software, prepare the hard drive for removal. Wait until the indicators on the hard drive carrier
signal that the hard drive can be removed safely. If the hard drive is online, the green activity/fault indicator flashes as
the drive is turned off. When the hard drive indicators are off, the hard drive is ready for removal.
NOTE: No operating systems support hot-swappable drive installation.
2.5 Hard Drive Disassembly

1.
Press the release button to open the hard drive carrier release handle.
2.
Slide the hard drive carrier out until it is free of the hard drive slot.
CAUTION: To maintain proper system cooling, all empty hard drive slots must have hard drive blanks
installed.
3.
Remove the screws from the slide rails on the hard drive carrier.
4.
Lift the hard drive out of the hard drive carrier.
5.
If you are not replacing the hard drive immediately, insert a hard drive blank in the empty hard drive slot.
58

Item
Description
Release Button
Hard Drive
Hard Drive Carrier Handle
Item
Description
Screw (4)
Hard Drive
Hard Drive Carrier
2.5 Hard Drive Reassembly

CAUTION: Use only hard drives that have been tested and approved for use with the hard drive backplane.
CAUTION: Combining SAS and SATA hard drives in the same RAID volume is not supported.

59
CAUTION: When installing a hard drive, ensure that the adjacent drives are fully installed. Inserting a hard drive
carrier and attempting to lock its handle next to a partially installed carrier can damage the partially installed
carrier's shield spring and make it unusable.
1.
Insert the hard drive into the hard drive carrier with the connector end pointing toward the back.
2.
Align the screw holes on the hard drive with the set of screw holes on the hard drive carrier.
When aligned correctly, the back of the hard drive is flush with the back of the hard drive carrier.
3.
Attach the screws to secure the hard drive to the hard drive carrier.
4.
If a hard drive blank is installed in the hard drive slot, remove it.
5.
Insert the hard drive carrier into the hard drive slot until the carrier connects with the backplane.
6.
Close the hard drive carrier handle to lock the hard drive in place.
Assigning or Unassigning Global Hot Spare Using the Web Interface

To assign or unassign a global hotspare for a physical disk drive, perform the following steps:
1.
In the iDRAC web interface, go to Overview> Storage>Physical Disks>Setup. The Setup Physical Disk page is
displayed.
2.
From the Controller drop-down menu, select the controller to view the associated physical disks.
3.
To assign as a global hotspare, from the drop-down menus in the Action-Assign to All column, select Global
Hotspare for one or more physical disks.
4.
To unassign a hotspare, from the drop-down menus in the Action-Assign to All column, select Unassign Hotspare
for one or more physical disks.
5.
From the Apply Operation Mode drop-down menu, select when you want to apply the settings.
6.
Click Apply.

1.
Check that the drives LED status is operational.
2.
Using the management software/applicable hard drive controller/operating system interface to demonstrate the
working system to the customer.
1.8 Solid State Drive

CAUTION: To prevent data loss, make sure that your operating system supports hot-swap drive installation. See
the documentation supplied with your operating system.
Before you remove the 1.8 solid state drive (SSD):
Using the management software, prepare the hard drive for removal. Wait until the indicators on the hard drive carrier
signal that the hard drive can be removed safely. If the hard drive is online, the green activity/fault indicator flashes as
the drive is turned off. When the hard drive indicators are off, the hard drive is ready for removal.
1.8 SSD Disassembly

1.
Press the release button to open the SSD carrier release handle.
2.
Slide the SSD carrier out until it is free of the SSD slot.
60

Item
Description
SSD Connector (on backplane)
SSD
SSD Carrier Handle
Release Button
CAUTION: To maintain proper system cooling, all empty hard drive slots must have hard drive blanks
installed.
3.
Pull out on the edges of the SSD carrier in the direction of the arrows marked on the SSD carrier, and disengage the
SSD from the carrier.
4.
Slide the SSD out of the SSD carrier.
5.
If you are not replacing the hard drive immediately, insert a hard drive blank in the empty hard drive slot.
Item
Description
SSD Carrier

61
Item
Description
SSD
1.8 SSD Reassembly

CAUTION: Use only hard drives that have been tested and approved for use with the hard drive backplane.
CAUTION: Combining SAS and SATA hard drives in the same RAID volume is not supported.
CAUTION: When installing a SSD, make sure that the adjacent drives are fully installed. Inserting a SSD carrier
and attempting to lock its handle next to a partially installed carrier can damage the partially installed carrier's
shield spring and make it unusable.
1.
Align the SSD with the SSD hard drive carrier so that the connectors on the SSD face up and match the connector
alignment label on the SSD carrier.
CAUTION: To avoid damaging the SSD or the SSD carrier, do not use excessive force while installing the SSD
in the SSD carrier.
2.
Slide the SSD hard drive into the SSD hard drive carrier until it is secured inside the SSD hard drive carrier.
Assigning or Unassigning Global Hot Spare Using the Web Interface

To assign or unassign a global hotspare for a physical disk drive, perform the following steps:
1.
In the iDRAC web interface, go to Overview> Storage>Physical Disks>Setup. The Setup Physical Disk page is
displayed.
2.
From the Controller drop-down menu, select the controller to view the associated physical disks
3.
To assign the disk as a global hotspare, from the drop-down menus in the Action-Assign to All column, select
Global Hotspare for one or more physical disks.
4.
To unassign a hotspare, from the drop-down menus in the Action-Assign to All column, select Unassign Hotspare
for one or more physical disks.
5.
From the Apply Operation Mode drop-down menu, select when you want to apply the settings.
6.
Click Apply.

1.
Check that the drives LED status is operational.
2.
Using the management software, applicable hard drive controller, or operating system interface to demonstrate the
working system to the customer.
Internal Dual SD Module

Internal Dual SD Module Disassembly/Reassembly Video
Due to security settings on the video, it may only be accessible through EducateDell. If you see the message
"CONTENT UNAVAILABLE" then log into EducateDell to access the video.
http://www.dell.com/support/troubleshooting/us/en/04/SupportVideos/OpenSingleVideoPlayerTab?
embedCode=BiNzR0cToEbdqqcyeLTvzWIrXv4pobRZ
Before you remove the internal dual SD module, perform the following:
62

Remove the cover.
Remove the following if installed:

USB key
SD card
Internal Dual SD Module Disassembly

1.
Remove the two screws securing the internal dual SD module (IDSDM) card to the system board.
2.
Remove the SD card slot bracket.

CAUTION: To prevent damage to the IDSDM card, you must hold the card only by its edges.
3.
Lift the card up and away from the system.
Item
Description
IDSDM Card
Screw (2)
SD Card Slot Bracket
Mezzanine Card Support Bracket
IDSDM Card Connector on the System Board
Standoff (2)
Internal Dual SD Module Reassembly

1.
Align the following:
The slot on the card edge with the projection tabs on the PCIe mezzanine card support.
The two screw holes on the IDSDM card with the standoffs on the system board.
2.
The hole on the SD card slot bracket with the screw hole on the IDSDM card.
Install the two screws to secure the SD card slot bracket and IDSDM card to the system board.
3.

63

1.
2.
3.
rSPI Card
The Restore Serial Peripheral Interface (rSPI) is a SPI flash device to store information about the system service tag,
system configuration, or iDRAC license.
rSPI Card Disassembly/Reassembly Video
embedCode=lpYzR0cTpkn18qKwvkeBrFPkELOriKhq
Before you remove the rSPI card, make sure the following steps are complete:
Remove the cover.
rSPI Card Disassembly

1.
Remove the two screws securing the rSPI card to the system board.
CAUTION: To prevent damage to the rSPI card, you must hold the card only by its edges.
2.
64
Lift the card up and away from the system.
Item
Description
Screw (2)
rSPI Card

Item
Description
Standoff (2)
Connector
rSPI Card Reassembly

NOTE: You must remove the rSPI card to replace a faulty rSPI card or service other components inside the system.
1.
Align the two screw holes on the rSPI card with the standoffs on the system board.
NOTE: To prevent damage to the rSPI card, you must hold the card only by its edges.
2.
Install the two screws to secure the rSPI card to the system board.
3.

1.
Install the sled in the enclosure.
2.
Turn on the sled.
3.
SD vFlash Card
Before you remove the SD vFlash card:
Remove the cover.
SD vFlash Card Disassembly

If installed, remove the SD vFlash card from the card slot.
NOTE: The SD vFlash card slot is near below the network daughter card (NDC).

65
Item
Description
SD vFlash Card
SD vFlash Card Slot
SD vFlash Card Slot Identification Label
SD vFlash Card Reassembly

1.
Insert the contact-pin end of the SD card into the card slot on the vFlash media unit.
NOTE: The slot is keyed to ensure correct insertion of the card.
2.
Press inward on the card to lock it into the slot.
3.

1.
2.
3.
66

I/O Module Mezzanine Card

I/O Module Mezzanine Card Disassembly/Reassembly Video
embedCode=NzaDN0cTpuZAPFEYDUxMDJOKwFkZpNqj
Before you remove the I/O module mezzanine card:
Remove the cover.
I/O Module Mezzanine Card Disassembly

1.
Open the retention latch by pressing the ridged area on the retention latch, and lifting the latch up.
CAUTION: To prevent damage to the mezzanine card, you must hold the card only by its edges.
2.
Lift the mezzanine card up and away from the system.
3.
Close the retention latch.
Item
Description
Mezzanine Card
Mezzanine Card Connector
Ridge Area on the Retention Latch

67
I/O Module Mezzanine Card Reassembly

NOTE: You must remove the mezzanine card to replace a faulty mezzanine card or to service other components
inside the system.
1.
Open the retention latch by pressing the ridged area on the retention latch with your thumb and lifting the end of
the latch.
2.
If present, remove the connector cover from the mezzanine card bay.
CAUTION: To prevent damage to the PCIe mezzanine card, you must hold the card by its edges only.
3.
Rotate the card to align the connector on the bottom of the mezzanine card with the corresponding socket on the
system board.
4.
Lower the card into place until it is fully seated and the plastic clip on the outer edge of the card engages over the
side of the blade chassis.
5.
Close the retention latch to secure the mezzanine card.
6.

1.
2.
3.
Network Daughter Card

Network Daughter Card Disassembly/Reassembly Video
embedCode=90eXlzcTofnv4340cjMUqrrYnLjNjYWU
Before you remove the network daughter card, make sure the following steps are complete:
Remove the cover.
Remove the I/O module mezzanine card.
Network Daughter Card Disassembly

1.
Remove the two screws that secure the Network Daughter Card (NDC) to the system board.
CAUTION: To prevent damage to the NDC, you must hold the card only by its edges.
2.
68
Lift the card from the system board.

Item
Description
Slot on the NDC
Screw (2)
NDC
Standoff (2)
Connector on the System Board
Tab Projections
Network Daughter Card Reassembly

1.
2.

The slots on the card edge with the projection tabs on the plastic bracket covering the PCIe mezzanine card
slots.
The screw holes on the card with the standoffs on the system board.
Lower the card into place until the card connector fits into the corresponding connector on the system board.
3.
Secure the card with the two screws.
4.
Install the I/O module mezzanine card.
5.

1.
2.
3.
Heat Sink and Processor


69
Before you remove the processor, complete the following steps:
Remove the cover.
If applicable, remove the processor/DIMM blank.

NOTE: Before upgrading your system, download the latest system BIOS version from dell.com/support. Follow the
instructions included in the compressed download file to install the update on your system.
NOTE: You can update the system BIOS using the Lifecycle Controller.
WARNING: The heat sink and processor are hot to the touch for some time after the system has been powered
down. Allow the heat sink and processor to cool before handling them.
CAUTION: Never remove the heat sink from a processor unless you intend to remove the processor. The heat
sink is necessary to maintain proper thermal conditions.
Heat Sink and Processor Disassembly

1.
Loosen one of the screws that secure the heat sink to the system board.
Wait 30 seconds for the heat sink to loosen from the processor.
2.
Remove the screw diagonally opposite from the screw you removed first.
3.
Repeat the procedure for the remaining two screws.
4.
Remove the heat sink.

NOTE: Set the heat sink upside down on the work surface to avoid contaminating the thermal grease.
70

5.
Item
Description
Captive Screw (4)
Heat Sink
Processor Socket
Heat Sink Retention Socket (4)
Use a clean, lint-free cloth to remove any thermal grease from the surface of the processor shield.
CAUTION: The processor is held in its socket under strong pressure. Be aware that the release lever can
spring up suddenly if not firmly grasped.
6.
Position your thumb firmly over the socket-release lever 1 and lever 2 of the processor and release both the levers
simultaneously from the locked position by pushing down and out from under the tab.
Item
Description
Socket Release Lever 1
Processor
7.
Hold the tab on the processor shield and rotate the shield up and out of the way.
8.
Lift the processor out of the socket and leave the release lever up so that the socket is ready for the new processor.
CAUTION: If you are permanently removing a processor, you must install a socket protective cap and a
processor/DIMM blank in the vacant socket to ensure proper system cooling. The processor/DIMM blank
covers the vacant sockets for the DIMMs and the processor.

71
Item
Description
Pin-1 Corner of the Processor
Processor
Slots (4)
Processor Shield
Processor Socket
Tab (4)
Heat Sink and Processor Reassembly

NOTE: If you are installing a single processor, it must be installed in socket CPU1.
NOTE: You must remove a processor to upgrade a processor or replace a faulty processor.
1.
Unlatch and rotate the socket-release levers 90 degrees upward and make sure that the socket-release lever is fully
open.
2.
Hold the tab on the processor shield and rotate the shield up and out of the way.
NOTE: It is recommended that you install/remove the socket protective cap from the processor shield with the
processor shield in the open position.
72

3.
If installed, remove the socket protective cap from the processor shield. To remove the socket protective cap, push
the cap from the inside of the processor shield and move it away from the socket pins.
CAUTION: Positioning the processor incorrectly can permanently damage the system board or the
processor. Be careful not to bend the pins in the socket.
CAUTION: Do not use force to seat the processor. When the processor is positioned correctly, it engages
easily into the socket.
4.
Install the processor in the socket:

a.
Identify the pin-1 corner of the processor by locating the tiny gold triangle on one corner of the processor.
Place this corner in the same corner of the ZIF socket identified by a corresponding triangle on the system
board.
b.
Align the pin-1 corner of the processor with the pin-1 corner of the system board.
c.
Set the processor lightly in the socket.

Because the system uses a ZIF processor socket, do not use force. When the processor is positioned correctly, it
drops down into the socket with minimal pressure.
d.
5.
Close the processor shield.
e. Rotate the socket-release lever 1 and lever 2 simultaneously until it is locked in position.
To install the heat sink:
a. If applicable, remove the existing thermal grease from the heat sink using a clean lint-free cloth.
b. Apply thermal grease on the top of the processor. Use the thermal-grease syringe included with your processor
kit to apply the grease in a thin spiral on the top of the processor as shown in the figure.
CAUTION: Applying too much thermal grease can result in excess grease coming in contact with and
contaminating the processor socket.

73
Item
Description
Processor
Thermal grease
Thermal grease syringe
NOTE: The thermal grease is intended for one-time use only. Dispose of the syringe after you use it.
c. Place the heat sink onto the processor.
d. Tighten the four screws to secure the heat sink to the system board.
NOTE: Tighten the screws diagonally opposite to each other. Do not over-tighten the heat sink retention
screws when installing the heat sink. To prevent over-tightening, tighten the retention screw until
resistance is felt, and stop once the screw is seated. The screw tension should be no more than 6 in-lb (6.9
kg-cm).
After-Service Instructions
1.
Install the cooling shroud.
2.
If applicable, install the processor/DIMM blank.
3.
4.
Turn on the blade server. As the system boots, it detects the presence of the new processor and automatically
changes the system configuration information in the System Setup.
5.
Press <F2> to enter the System Setup and make sure that the processor information matches the new system
configuration.
6.
Run the system diagnostics to verify that the new processor operates correctly.
7.
Hard Drive Backplane

Hard Drive Backplane Disassembly/Reassembly Video
embedCode=kxODN0cTo9M5pURJZ2WF3oFDVhLE7tXD
Before you remove the hard drive backplane, do the following:
If applicable, remove the 2.5" hard drives.
If applicable, remove the 1.8" SSD.
Remove the cover.

CAUTION: To prevent damage to the hard drives/solid state drives (SSDs) and the hard-drive backplane, you
must remove the hard drives/SSDs from the blade server before removing the hard-drive backplane.
CAUTION: You must note the number of each hard drive/SSD and temporarily label them before removal so that
you can replace them in the same locations.
74

Hard Drive Backplane Disassembly

1.
Pressing the release latches, hold both the edges of the backplane near the blade server chassis and lift it up and
away from the system.
2.
Remove the hard drive/SSD cage.
3.
Loosen the two retention screws securing the hard-drive/SSD backplane cable connector to the system board
connector.
4.
Lift the hard-drive/SSD backplane up and away from the system.

2.5 Hard Drive Backplane
1.8 SSD Backplane

75
Item
Description
Hard Drive/SSD Backplane
Hard Drive/SSD Backplane Cable
Release Latch (2)
Guide Pin (3)
Retention Screw on the Backplane Cable Connector (2)
Connector on System Board
Hard Drive Backplane Reassembly

1.
Align the captive screws on the hard drive backplane cable connector with the screw holes on the system board
connector.
2.
Tighten the two captive screws to secure the backplane cable connector on the system board.
3.
Install the hard drive cage.
4.
Guide on the hard drive backplane with the guide pin on the hard drive/SSD cage.
5.
Captive screws on the hard drive backplane with the screw holes on the hard drive cage.
Lower the hard drive backplane into place until the captive screws on the hard drive backplane engage with the
screw holes on the hard drive/SSD cage.
6.
Tighten the two captive screws to secure hard drive backplane on the hard drive/SSD cage.
7.

1.
2.
3.
76

Hard Drive/SSD Cage

Hard Drive/SSD Cage Disassembly/Reassembly Video
embedCode=kxODN0cTo9M5pURJZ2WF3oFDVhLE7tXD
Before you remove the hard drive/solid state drive (SSD) cage, make sure the following steps are complete:
If applicable, remove the 2.5" hard drives.
If applicable, remove the 1.8" SSD hard drives.
Remove the cover.
Remove the hard drive backplane.
Hard Drive/SSD Cage Disassembly

1.
Remove the four screws securing the hard-drive/SSD cage to the chassis.
2.
Holding the hard-drive/SSD cage by its edges, lift it up and away from the system.
Item
Description
Hard Drive/SSD Cage
Screw (4)

77
Item
Description
Guide Pin (3)
Screw Hole on the Chassis (4)
Standoff (2)
Hard Drive/SSD Cage Reassembly

1.
Align the screw holes on the hard-drive/SSD cage with the screw holes on the chassis.
2.
Lower the hard-drive/SSD cage into the chassis until it is seated firmly in place.
3.
Install the four screws to secure the hard-drive/SSD cage to the chassis.
4.
Install the following:
5.
Hard drive/SSD backplane
Hard drive/SSD in their original locations.


1.
2.
3.
System Board
System Board Disassembly/Reassembly Video
embedCode=c2YjN0cTpsfWluMx2sIZWtFLIu4FTyIh
Before you remove the system board:
Remove the cover.
Remove the following:

Processor/DIMM blank
Memory
Cooling shroud
If applicable, 2.5" hard drive
If applicable, 1.8" SSD
Hard drive backplane
Hard drive/SSD cage
PCIe extender/storage controller card
I/O module mezzanine card
Internal dual SD module
rSPI card
Network daughter card
SD vFlash card
If installed, internal USB key
78
Install an I/O connector cover on the I/O connector(s) at the back of the board.

CAUTION: Do not lift the system board assembly by holding a memory module, processor, or other
components.
CAUTION: You must temporarily label the hard-drive/SSD before removal so that you can replace them in their
original locations.
WARNING: The processor and heat sink can become extremely hot. Be sure the processor has had sufficient
time to cool before handling.
WARNING: The memory modules are hot to the touch for some time after the system has been powered down.
edges and avoid touching the components.
System Board Disassembly

1.
Remove the 14 screws on the system board that secure the system board to the chassis.
2.
Lift the system board by its back end and angle it upward.
3.
Remove the system board from the chassis by disengaging the USB connectors from the slots on the front wall of
the chassis.
4.
Make sure that the I/O connector cover is still in place on the I/O connector at the back of the board.

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Item
Description
Hex Nut Screw (4)
System Board
Screw (10)
System Board Handle
System Board Reassembly

CAUTION: Do not lift the system board assembly by holding a memory module, processor, or other
components.
CAUTION: Take care not to damage the system identification button while placing the system board into the
chassis.
1.
Hold the system board by its edges and align the USB connectors with the slots on the front wall of the chassis.
2.
Lower the system board until the system board is firmly seated on the chassis.
3.
Install the 14 screws to secure the system board to the chassis.
4.
Install the Trusted Platform Module (TPM). Please refer to the Critical Callouts page for TPM installation instructions.
80

The TPM plug-in module is attached to the motherboard and cannot be removed. A replacement TPM plug-in
module will be provided for all motherboard replacements where a TPM plug-in module was installed.
5.
6.
If installed, internal USB key
SD vFlash card
Internal SD module
rSPI card
Network daughter card
PCIe mezzanine card
Storage controller card
Hard-drive/SSD cage
Hard-drive backplane
If applicable, 2.5 hard drive (make sure that you reinstall the hard drives in their original locations)
If applicable, 1.8 SSD hard drive (make sure that you reinstall the SSD hard drives in their original locations)
Cooling shroud
Memory
Processor/heat sink

1.
2.
3.
If you do not have a service tag, use the Easy Restore feature. Refer to Easy Restore page.
4.
Enter the system service tag after you replace the system board. Refer to the Update the Service Tag page for more
information.
5.
Update the BIOS version. Refer to the Update BIOS page.

NOTE: The RACADM command RACADM sslresetcfg is used to generate a new SSL certificate with service
tag providing the unique Common Name (CN). If the certificate is not generated at time of service, inform the
customer or technical support so they can follow up.
NOTE: RACADM must be installed. If RACADM is not installed, download and install the Dell DRAC Tools
(Windows only).
NOTE: For more information on RACADM Command Line Interface, click here.
6.
Re-enable the Trusted Platform Module (TPM). Refer to the Re-enabling the Trusted Platform Module (TPM) page for
more information.
System Battery
System Battery Disassembly/Reassembly Video
embedCode=4xNzR0cTo996RU59AHAW2WekEvaQ18Ec

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Before you remove the system battery, make sure the following steps are complete:
Remove the cover.
Remove the system board.
System Battery Disassembly

1.
Press down firmly on the positive side of the connector.
2.
Lift the battery out of the securing tabs at the negative side of the connector.
Item
Description
Positive Side of Battery
Negative Side of Battery Connector
System Battery Reassembly

1.
Support the battery connector by pressing down firmly on the positive side of the connector.
2.
Hold the battery with the + facing up, and slide it under the securing tabs at the positive side of the connector.
3.
Press the battery straight down into the connector until it snaps into place.

1.
Reinstall the system board.
2.
3.
4.
5.
Enter the System Setup to confirm that the battery is operating properly.
6.
Enter the correct time and date in the System Setup's Time and Date fields.
7.
Exit the System Setup.
8.
To test the newly installed battery, remove the blade server for at least an hour.
9.
After an hour, reinstall the blade server.
10. Enter the System Setup and if the time and date are still incorrect.
11. Demonstrate the working system to the customer.
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PCIe Extender/Storage Controller Card

PCIe Extender/Storage Controller Card Disassembly/Reassembly Video
embedCode=lpMTN0cTpJ6l004udopMx8bCW8ng9ggy
Before you remove the PCIe extender/storage controller card, make sure the following steps are complete:
Remove the following:
If applicable, 2.5" hard drive

If applicable, 1.8" SSD
Cover
Hard drive backplane
Hard drive/SSD cage
PCIe Extender/Storage Controller Card Disassembly

1.
Loosen the two retention screws on the hard-drive/SSD backplane cable connector and lift it away from the PCIe
extender/storage controller card.
CAUTION: To prevent damage to the PCIe extender/storage controller card, you must hold the card only by
its edges.
2.
Lift the PCIe extender/storage controller card up and away from the system.

83
Item
Description
Retention Screw (2)
Slot on the PCIe Extender/Storage Controller Card
Tabs on the PCIe Extender/Storage Controller Card

Support Bracket
Standoff (2)
PCIe Extender/Storage Controller Card Reassembly

1.
Align the slots on the PCIe extender/storage controller card edge with the tabs on the support bracket.
2.
Lower the PCIe extender/storage controller card on to the connector on the system board.
3.
Tighten the two retention screws on the hard-drive/SSD backplane cable connector to secure the card on to the
system board.
4.
5.
If applicable, the 2.5 hard drive. Make sure that you reinstall the hard drives in their original locations.
If applicable, the 1.8 SSD hard drive. Make sure that you reinstall the SSD hard drives in their original locations.
The hard drive/SSD backplane.
The hard drive/SSD cage.


1.
2.
3.
Let the system boot.
4.
Refer to the next section PERC and HDD Replacement, and demonstrate the working system to the customer.
PERC and HDD Replacement

When you replace a failed PERC card, you need to ensure successful recovery of existing storage arrays and visibly
validate with the customer that the configuration is being rebuilt.
NOTE: Drives within a RAID array must be the same type. Ensure replacement drives are of the correct type
(SATA/SAS/NL-SAS/SSD).
Follow the procedure below to import the configuration of an existing HDD RAID array to a replacement PERC card
through the PERC BIOS utility.
1.
Replace the PERC card.
2.
Power the system on and press <Ctrl> + <R> to enter the PERC BIOS.
3.
Press <F2> with the new card selected.
4.
Use the up and down arrow keys to highlight the Foreign Configuration option.
84

5.
Press <Enter>.
6.
Use the up and down arrow keys to navigate to the Import option. Press <Enter> again.
7.
Choose OK when asked to confirm. The BIOS will state that the import has completed successfully.
8.
Confirm that the imported virtual disk has been imported under the VD Management section.
9.
Reboot once finished. Try to boot if this was the array with the OS installed on it. If it was a data array, boot to the OS
and check to see if the data is visible.
10. Disk Manager is incorporated into Dell OpenManage Server Administrator now. So if you have replaced a single
HDD or even multiple HDDs, you can launch Server Administrator, expand the Storage section, and navigate to the
virtual disk to see the rebuild progress.
11. You can also see the progress from the physical disk view using Disk Management in the OS.

85
Update BIOS
To update the BIOS:
1.
Copy the BIOS update file on a USB device.
2.
Plug in the USB device into any of the USB ports on your system.
3.
Turn on your system.
4.
While booting, press <F11> to enter the Boot Manager.
5.
Go to System Utilities BIOS Update File Explorer, and select the plugged in USB device.
6.
From the BIOS Update File Explorer, select the BIOS update file.
The BIOS Update Utility with the current and new version of BIOS is displayed.
7.
Select Continue BIOS Update to install the BIOS update.
Re-enabling the Trusted Platform Module (TPM)

1.
BitLocker users must initialize the TPM. For more information on initializing the TPM, please refer to Microsoft
TechNet. The TPM Status changes to Enabled, Activated.
2.
Intel TXT users must perform the following steps:

a.
b.
c.
d.
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While booting your system, press <F2> to enter System Setup.

In the System Setup Main Menu, click System BIOS System Security Settings.
In the TPM Security option, select On with Pre-boot Measurements.
In the TPM Command option, select Activate.
e.
f.
g.
h.
i.
Save the settings.

Reboot your system.
Enter System Setup again.
In the Intel TXT option, select On.
Restoring the Service Tag Using Easy Restore

The easy restore feature allows you to restore your service tag, license, UEFI configuration, and the system configuration
data after replacing the system board. All data is backed up in a backup flash device automatically. If BIOS detects a new
system board, and the service tag in the backup flash device, BIOS prompts the user to restore the backup information.
1.
Turn on the system.

If BIOS detects a new system board, and the service tag is present in the backup flash device, BIOS displays the
service tag, the status of the license, and the UEFI Diagnostics version.
2.
Press Y to restore the service tag, license, and diagnostics information or

Press N to navigate to the Lifecycle Controller based restore options or
Press <F10> to restore data from a previously created Hardware Server Profile.
After the restore process is complete, BIOS prompts to restore the system configuration data.
3.
Press Y to restore the system configuration data or

Press N to use the default configuration settings.
After the restore process is complete, system reboots.
Update the Service Tag

This section lists the procedures on entering the system service tag using System Setup after system board replacement.
If you know the system service tag, use the System Setup menu to enter the service tag.
1.
Turn on the system.
2.
Press <F2> to enter the System Setup.
3.
Click Service Tag Settings.
4.
Enter the service tag.

NOTE: You can enter the service tag only when the Service Tag field is empty. Ensure that you enter the
correct service tag. Once the service tag is entered, it cannot be updated or changed.
NOTE: Please note that asset.com tool no longer work in 13G PowerEdge servers.
5.
Click Ok.
Installation
Installing the Dell PowerEdge M630 requires information about the following topics:
Placemat
System initialization
Basic configuration
Placemat
Click the items below to open high-resolution views of the Getting Started Guide document. These provide helpful
diagrams on setting up the system.
Dell PowerEdge M630-M1000e Getting Started Guide

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PowerEdge M630-VRTX Getting Started Guide
Initialization
After you receive your system, you must set up your system, install the operating system, and set up and configure the
system iDRAC IP address for system management.
Setting up your system
Unpack the server.
If applicable, install the server into the rack. For more information on installing the server into the rack, see your
system's Rack Installation Placemat at dell.com/poweredgemanuals.
Connect any peripherals to the system.
Connect the system to its electrical outlet.
Turn the system on by pressing the power button.
Turn on the attached peripherals.
Methods of setting up and configuring the iDRAC IP address

You can set up the Integrated Dell Remote Access Controller (iDRAC) IP address by using one of the following interfaces:
1.
iDRAC Settings utility
2.
Lifecycle Controller
3.
Dell Deployment Toolkit
You can configure iDRAC IP using:

1.
iDRAC Web Interface
2.
Remote Access Controller ADMin (RACADM)
3.
Remote Services that includes Web Services Management (WS-Man)
For more information on setting up and configuring iDRAC, see the Integrated Dell Remote Access Control User's Guide
at dell.com/esmmanuals.
Information about logging in to iDRAC

You can log in to iDRAC as an iDRAC local user, as a Microsoft Active Directory user, or as a Lightweight Directory Access
Protocol (LDAP) user. You can also log in using Single Sign-On or Smart Card. The default user name is root and
password is calvin . For more information on logging in to iDRAC and iDRAC licenses, see the Integrated Dell Remote
Access Control User's Guide at dell.com/esmmanuals.
You can also access iDRAC using RACADM. For more information, see the RACADM Command Line Interface Reference
Guide and the Integrated Dell Remote Access Controller User's Guide available at dell.com/esmmanuals.
Basic Configuration
Once the server has been set up correctly, users may perform further configurations such as operating system
installation, remote management and also drivers/firmware installation.
Methods of installing the operating system

You can install the supported operating system on the server module, if the server module has been shipped without an
operating system, use the following methods:
Dell Systems Management Tools and Documentation media.
Dell Lifecycle Controller. See the Lifecycle Controller documentation at dell.com/esmmanuals.
Dell OpenManage Deployment Toolkit. See the OpenManage documentation at dell.com/openmanagemanuals.
88

For information on the list of operating systems supported on your system, see the operating systems support matrix at
dell.com/ossupport.
Remote management
To perform out-of-band systems management using iDRAC, you must configure iDRAC for remote accessibility, set up
the management station and managed system, and configure the supported Web browsers. For more information, see
the iDRAC Users Guide at dell.com/esmmanuals.
You can also remotely monitor and manage the server, using the Dell OpenManage Server Administrator (OMSA)
software and OpenManage Essentials (OME) systems management console. For more information, see dell.com/
openmanagemanuals.
Downloading and installing drivers and firmware

It is recommended that you download and install the latest BIOS, drivers, and systems management firmware on your
system.
1.
Go to dell.com/support/drivers.
2.
In the Product Selection section, enter the service tag of your system in the Service Tag or Express Service Code
field.
NOTE: If you do not have the service tag, select Automatically detect my Service Tag for me to allow the
system to automatically detect your service tag, or select Choose from a list of all Dell products to select your
product from the Product Selection page.
3.
Click Get drivers and downloads. The drivers that are applicable to your selection are displayed.
4.
Download the drivers that you require to a diskette drive, USB drive, CD, or DVD.
Quick Resource Locator

A useful feature included with the new 13G servers is the Quick Resource Locator (QRL) a model-specific Quick
Resource (QR) code on Dell PowerEdge servers. Use your phone to access the Dell QRL app to learn more about the
specific product in front of you. This QR code provides quick access to the following:
Step-by-step videos, including overviews of system internals and externals, as well as detailed, concise, task-oriented
videos, and installation wizards.
Reference materials, including searchable owners manual content, LCD diagnostics, and an electrical overview.
Service Tag lookup, so you can quickly gain access to your specific hardware configuration information and warranty
information.
Contact with Dell via a direct link to get in touch with technical support and sales teams, and provide feedback direct
to Dell.
These codes provide an easy way to retrieve the critical support information you need when you need it. This makes
more efficient and effective management for your data center hardware.
Use the QRL to get immediate access to system information and how-to videos. This can be done by visiting
dell.com/QRL or by using your smartphone or tablet and a model-specific QR code located on your Dell PowerEdge
system. To try out the QR code, scan the following image.

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90

Technology and Components

The following pages contain information about technology and components.
iDRAC8
iDRAC8 is a systems management hardware and software solution that provides remote management capabilities,
crashed system recovery, and power control functions for Dell PowerEdge systems.
iDRAC8 features are available based on the purchased license. They are available in the following variants:
Basic Management with IPMI
iDRAC8 Express (Rack and Tower servers)
iDRAC8 Express for Blades
iDRAC8 Enterprise
The 200-500 series servers will ship with Basic Management as the default, but the customer will have the ability to
upgrade to Express or Enterprise by purchasing a digital license key. For the 200-500 series servers, customers who
upgrade APOS to Enterprise have the option to purchase the iDRAC Ports Card, which provides the hardware features of
a dedicated management NIC and vFlash. The card is not required to activate or enable the rest of the Enterprise
features.
NOTE: This is an overview of iDRAC8. For a full technology training on iDRAC8, please refer to the reference
material link below.
Internal Link: iDRAC8
External Link: iDRAC8
Acquiring Licenses
Use any of the following methods to acquire the licenses:
E-mail License is attached to an email that is sent after requesting it from the technical support center.
Self-Service Portal A link to the Self-Service Portal is available from iDRAC. Click this link to open the licensing SelfService Portal on the internet. Currently, you can use the License Self-Service Portal to retrieve licenses that were
purchased with the server. You must contact the sales representative or technical support to buy a new or upgrade
license. For more information, see the online help for the self-service portal page.
Point-of-Sale License is acquired while placing the order for a system.
New Features
The following list contains the key new features available on iDRAC8:
iDRAC Direct Securely connect directly to iDRACWeb UI via USB Cable in front of the server.
iDRAC Direct (USB) Offers the convenience of USB keys to install new hardware configurations to Dell 13G servers.
iDRAC Quick Sync This feature enables at-the-server management with a Near Field Communication (NFC)enabled mobile device. Customers may view inventory and monitoring information and configure basic iDRAC
settings using a mobile device. This feature is only available on the PowerEdge R630, R730, and R730XD.
Real-Time Storage Configuration Configure storage real-time through the iDRACUI.
Agent-Free SAS Monitoring and PCIe-SSD Monitoring Monitor 12Gb SAS and PCIe-SSD storage via iDRAC without
any OS agents.
Easy Restore Automatically restore hardware configuration and license information after a system board
replacement.
91
Tech Support Report Gathers all hardware and OS logs and inventory information required for technical support.
Agent-Free Performance Monitoring Monitor basic memory, CPU, and I/O performance metrics through iDRAC.
iDRAC Quick Sync (R630, R730 and R730XD Only)
Requires Quick Sync Bezel.
Features are supported on specific 13G platforms only R630, R730, and R730XD. (No support for 12G and older
platforms.)
OpenManage Mobile (OMM) 1.1 is the mobile application version that has Quick Sync support.
Configurable Temperature and Power Thresholds
This feature provides capability to modify default warning thresholds for temperature and power consumption
warning thresholds from GUI , RACADM, WSMAN, OMSA, and IPMI tool.
Applicable to both lower and upper warning thresholds for temperature sensors and warning threshold for power
consumption reading.
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iDRAC Robustness and Self-Healing
Implemented as a service recovery mechanism, which is responsible for the following tasks:
Detects memory leaks in a service and restarts that service.
Detects a terminated service and restarts it.
Detects a frozen service and restarts it.
Detects a service that runs with less number of threads and restarts it.
The feature is not visible to the user. The user cannot interact with this feature nor change its configuration.
Tech Support Report
Requires minimal interaction and users can export the report to the management station (local), Common Internet
File System (CIFS), or Network File Share (NFS).
The report is generated in the standard ZIP format. The report contains information that is similar to the information
available in the DSET report such as:
Hardware inventory for all components.
System, Lifecycle Controller, and component attributes.
Operating system and application information.
Active Lifecycle Controller logs (archived entries are not included).
PCIe SSD logs.
Storage controller logs.

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Lifecycle Controller
NOTE: This is an overview of the Lifecycle Controller. For a full technology training on the Lifecycle Controller,
please refer to the reference material links below.
Internal Link: Lifecycle Controller 3.0
External Link: Lifecycle Controller 3.0
iDRAC8 with Lifecycle Controller

Dell Lifecycle Controller provides advanced embedded systems management to perform systems management tasks
such as deploy, configure, update, maintain, and diagnose using a graphical user interface (GUI). It is delivered as part of
integrated Dell Remote Access Controller (iDRAC) out-of-band solution and embedded Unified Extensible Firmware
Interface (UEFI) applications in the latest Dell servers. iDRAC works with the UEFI firmware to access and manage every
aspect of the hardware, including component and subsystem management that is beyond the traditional Baseboard
Management Controller (BMC) capabilities.
Benefits of Using iDRAC with Lifecycle Controller

The benefits include:
Increased availability Early notification of potential or actual failures that help prevent a server failure or reduce
recovery time after failure.
Improved productivity and lower Total Cost of Ownership (TCO) Extending the reach of administrators to larger
numbers of distant servers can make the IT staff more productive while driving down operational costs such as travel.
Secure environment By providing secure access to remote servers, administrators can perform critical
management functions while maintaining server and network security.
Enhanced embedded management through Lifecycle Controller Lifecycle Controller provides deployment and
simplified serviceability through the Lifecycle Controller GUI for local deployment and Remote Services (WS-Man)
interfaces for remote deployment integrated with Dell OpenManage Essentials and partner consoles.
Whats New In This Release?

The new features for this release are:
Support for Dell PowerEdge R730, R630, and T630 servers.
Support for unattended installation of the Red Hat Enterprise Linux (RHEL) 7 operating system.
Support for deploying an operating system using UEFI Secure Boot.
Support for enhanced system erase.
Support for Technical Support Report feature.
Key Features
The key features of Lifecycle Controller are:
Provisioning Entire pre-operating system configuration from a unified interface.
Deploying Simplified operating system installation with the embedded drivers on Lifecycle Controller. Unattended
installation mode is available for Microsoft Windows and Red Hat Enterprise Linux 7 operating systems.
Download drivers for operating system installation from one of the following sources:
ftp.dell.com
Dell Lifecycle Controller OS Driver Packs DVD for Windows and Linux
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Patching or updating Operating system diagnostics, and reduced maintenance downtime with direct access to
updates from ftp.dell.com. It simplifies firmware updates by maintaining a working version for rollback.
Servicing Continuous availability of diagnostics without depending on a hard-disk drive. Ability to flash firmware
automatically, while replacing components such as a Dell PowerEdge storage controller, NIC, and power supply unit.
Support for VLAN in network configuration.
System erase Deletes the server and storage-related data on selected components of a server. You can delete
information on BIOS, Lifecycle Controller logs, iDRAC settings, and storage components on the server. However, you
cannot delete the iDRAC license information.
Security Support local key encryption.
Restoring the server Back up the server profile (including RAID configuration) and restore the server to a previously
known state. Importing a server license, firmware rollback, and restoring system configuration in case of system board
replacement.
Lifecycle Controller logs for troubleshooting.
Hardware inventory Provides information about the current and factory system configuration.
Starting Lifecycle Controller

To start Lifecycle Controller, restart the system and press <F10> during POST to select Lifecycle Controller from the list
displayed. When Lifecycle Controller is started for the first time, it displays the Settings wizard that allows you to
configure the preferred language and network settings.

95
Processor
The Dell PowerEdge M630 features the Intel Xeon processor E5-2600 v3 (Haswell) product family, offering an
ideal combination of performance, power efficiency, and cost. These processors provide high performance no matter
what your constraint isfloor space, power, or budgetand on workloads ranging from scientific exploration to webserving and infrastructure applications. In addition to providing raw performance gains, improved I/O is also possible with
Intel Integrated I/O, which reduces latency by adding more lanes and doubling bandwidth.
Processor Features
The new Intel Xeon processor E5-2600 v3 product family adds new features and improves upon many features of the
predecessor Intel Xeon processor E5-2600 v2 series, including:
Up to 18 execution cores per processor
Each core supports two threads for up to 36 threads per processor
46-bit physical addressing and 48-bit virtual addressing
1 GB large page support
32 KB instruction and 32 KB data first-level cache (L1) for each core
256 KB shared instruction/data mid-level cache (L2) for each core
Up to 35 MB last-level cache (LLC) shared among all cores, up to 2.5 MB per core
Two Intel QuickPath Interconnect (QPI) links up to 9.6 GT/s
Four Direct Media Interface (DMI) 2 lanes
40 PCIe Gen 3 links capable of 8.0 GT/s
Socket R, 2011-land FCLGA10 package
No termination required for non-populated CPU (must populate CPU socket 1 first)
Integrated 4-channel DDR4 memory controller
64-byte cache line size
Execute Disable Bit (EDB)
Support for CPU Turbo Mode
Increase in CPU frequency if operating below thermal, power, and current limits
Streaming Single Instruction, Multiple Data (SIMD) Intel Advanced Vector Extensions (AVX)
Intel 64 Technology
Intel VT-x and VT-d technology for virtualization support
Enhanced Intel SpeedStep technology
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Demand-based switching for active CPU power management as well as support for ACPI P-States, C-States, and TStates.
Supported Processors
The Dell PowerEdge FC630/M630 supports up to two processors with up to 18 cores per processor.
The following table lists the Intel Xeon processors supported by the PowerEdge FC630/M630.
Supported Processors
Processor
Clock Speed
Cache
QuickPath
Cores/
Interconnect Threads
(QPI)
Turbo
Thermal
Design
Power (TDP)
Stepping
E5-2699 v3
2.3 GHz
45 M
9.6 GT/s
18/36
Turbo
145 W
C1
E5-2698 v3
2.3 GHz
40 M
9.6 GT/s
16/32
Turbo
135 W
C1
E5-2697 v3
2.6 GHz
35 M
9.6 GT/s
14/28
Turbo
145 W
C1
E5-2695 v3
2.3 GHz
35 M
9.6 GT/s
14/28
Turbo
120 W
C1
E5-2690 v3
2.6 GHz
30 M
9.6 GT/s
12/24
Turbo
135 W
M1
E52685 v3
2.6 GHz
30 M
9.6 GT/s
12/24
Turbo
120 W
M1
E5-2683 v3
2.0 GHz
35 M
9.6 GT/s
14/28
Turbo
120 W
C1
E5-2680 v3
2.5 GHz
30 M
9.6 GT/s
12/24
Turbo
120 W
M1
E5-2670 v3
2.3 GHz
30 M
9.6 GT/s
12/24
Turbo
120 W
M1
E5-2660 v3
2.6 GHz
25 M
9.6 GT/s
10/20
Turbo
105 W
M1
E5-2650 v3
2.6 GHz
25 M
9.6 GT/s
10/20
Turbo
105 W
M1
E5-2640 v3
2.6 GHz
20 M
8.0 GT/s
8/16
Turbo
90 W
R2
E5-2630 v3
2.4 GHz
20 M
8.0 GT/s
8/16
Turbo
85 W
R2
E5-2620 v3
2.4 GHz
15 M
8.0 GT/s
6/12
Turbo
85 W
R2
E5-2609 v3
1.9 GHz
15 M
4.0 GT/s
6/6
N/A
85 W
R2
E5-2603 v3
1.6 GHz
15 M
4.0 GT/s
6/6
N/A
85 W
R2
E5-2687W v3 3.1 GHz
25 M
9.6 GT/s
10/20
Turbo
160 W
R2
E5-2650L v3
1.8 GHz
30 M
9.6 GT/s
12/24
Turbo
65 W
M1
E5-2630L v3
1.8 GHz
20 M
8.0 GT/s
8/16
Turbo
55 W
R2
E5-2667 v3
3.2 GHz
20 M
9.6 GT/s
8/16
Turbo
135 W
R2
E5-2643 v3
3.4 GHz
20 M
9.6 GT/s
6/12
Turbo
135 W
R2
E5-2637 v3
3.5 GHz
15 M
9.6 GT/s
4/8
Turbo
135 W
R2
E5-2623 v3
3.0 GHz
10 M
8.0 GT/s
4/8
Turbo
105 W
R2
Chipset
The Intel C610 (Wellsburg) chipset is implemented on the Dell PowerEdge M630.
The QuickPath Architecture consists of serial point-to-point interconnects for the processors. The Dell PowerEdge M630
has a total of two QuickPath Interconnect (QPI) links connecting the processors.
Each link consists of 20 lanes (full-width) in each direction with a link speed of 9.6 GT/s.
An additional lane is reserved for a forwarded clock. Data is sent over the QPI links as packets.
97
The QuickPath Architecture implemented in Haswell features four layers.
The physical layer consists of the actual connection between components. It supports polarity inversion and lane
reversal for optimizing component placement and routing.
The link layer is responsible for flow control and the reliable transmission of data. The link layer also provides
independent flow control for each message class going to and from the routing layer.
The routing layer is implemented in a distributed manner between all agents that send Intel QPI messages on the ring
(Intel QPI Module, Coherence Engine (Cbo), Integrated IO, High Availability (HA)). The Intel QPI Module will provide a
routing function for determining the correct ring stop to forward an inbound packet.
The protocol layer is responsible for high-level protocol communications, including the implementation of a Modify,
Exclusive, Shared, Invalid, Forward (MESIF) cache coherence protocol.
Memory
The Dell PowerEdge M630 supports DDR4 registered DIMMs (RDIMMs) and load reduced DIMMs (LRDIMMs). It
supports DDR4 voltage specifications.
NOTE: MT/s indicates DIMM speed in MegaTransfers per second.
Memory bus operating frequency can be 2133 MT/s, 1866 MT/s, 1600 MT/s, or 1333 MT/s depending on:
Number of DIMMs populated per channel
System profile selected (for example, Performance Optimized, Custom, or Dense Configuration Optimized)
Maximum supported DIMM frequency of the processors
The system contains 24 memory sockets split into two sets of 12 sockets, with one set per processor. Each 12-socket set
is organized into four channels. In each channel, the release levers of the first socket are marked white, the second
socket black, and the third socket green.
NOTE: DIMMs in sockets A1 to A12 are assigned to processor 1 and DIMMs in sockets B1 to B12 are assigned to
processor 2.
The following table shows the memory populations and operating frequencies for the supported configurations.
Memory Populations and Operating Frequencies
DIMM Type
RDIMM
DIMMs Populated Per

Channel
Single rank
2133, 1866, 1600, 1333
Dual rank
2133, 1866, 1600, 1333
Single rank
2133, 1866, 1600, 1333
Dual rank
1866, 1600, 1333
Single rank
1866, 1600, 1333
Dual rank
2133, 1866, 1600, 1333
Quad rank
2133, 1866, 1600, 1333
Quad rank
1866, 1600, 1333
Quad rank
98
Maximum DIMM Rank Per

Channel
2133, 1866, 1600, 1333
LRDIMM
Operating Frequency (in MT/s)

For 1.2 V

Memory channels are organized as follows:

Processor 1
channel 0: memory sockets A1, A5, and A9

Processor 2
channel 0: memory sockets B1, B5, and B9

General Memory Module Installation Guidelines

Your system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset
architectural configuration. The following are the recommended guidelines for best performance:
LRDIMMs, and RDIMMs must not be mixed.

x4 and x8 DRAM based DIMMs can be mixed.
A maximum of three single- or dual-rank RDIMMs can be populated in a channel.
Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available.
For dual-processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
Populate all sockets with white release tabs first, black, and then green.
Populate the sockets by highest capacity DIMM in the following orderfirst in sockets with white release levers and
then black. For example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB DIMMs in the sockets with white
release tabs and 8 GB DIMMs in the sockets with black release tabs.
In a dual-processor configuration, the memory configuration for each processor must be identical. For example, if
you populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
99
Memory modules of different sizes can be mixed provided that other memory population rules are followed (for
example, 4 GB and 8 GB memory modules can be mixed).
Depending on mode-specific guidelines, populate four DIMMs per processor (one DIMM per channel) at a time to
maximize performance.
Heat sink Processor Configurations
Processor
Configuration
Processor Type (in

Watts)
Heat
Sink
Width
Number of DIMMs
Single processor
105 W, 120 W or 135 W
68 mm 12
12
135 W (four cores, six

cores, or eight cores) or
145 W
104
mm
8 (Two DIMMs per channel)
Maximum System
Capacity
10 (Three DIMMs in
channel 0 and channel 2
and two DIMMs in
channel 1 and channel 3)
Reliability, Availability, and

Serviceability (RAS) Features
NOTE: When using an 86 mm wide heat sink for a single processor, the memory module sockets A10 and A12
are not available for population.
Dual processor
105 W, 120 W or 135 W
68 mm 24
24
135 W (four cores, six

cores, or eight cores) or
145 W
86 mm 20 (Three DIMMs in
channel 0 and channel 2
and two DIMMs in
channel 1 and channel 3)
16 (Two DIMMs per channel)
NOTE: When using an 86 mm wide heat sink for dual processors, the memory module sockets A10, A12, B10,
and B12 are not available for population.
Mode Specific Guidelines

Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode
selected.
NOTE: The x4 and x8 DRAM-based DIMMs can be mixed providing support for RAS features. However, all
guidelines for specific RAS features must be followed. The x4 DRAM based DIMMs retain Single Device Data
Correction (SDDC) in memory optimized (independent channel) mode. The x8 DRAM based DIMMs require
Advanced ECC mode to gain SDDC.
The following sections provide additional slot population guidelines for each mode.
Advanced ECC (Lockstep)

Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects against single
DRAM chip failures during normal operation.
Memory installation guidelines:
Memory modules must be identical in size, speed, and technology.
DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies for sockets with
black and green release tabs. This ensures that identical DIMMs are installed in matched pairs - for example, A1 with
A2, A3 with A4, A5 with A6, and so on.
NOTE: Advanced ECC with mirroring is not supported.
100

Memory Optimized (Independent Channel) Mode

This mode supports SDDC only for memory modules that use x4 device width and does not impose any specific slot
population requirements.
Memory Sparing
NOTE: To use Memory Sparing, all populated channels must have at least two DIMMs and Memory Sparing must be
enabled in the System Setup.
In this mode, one rank per channel is reserved as a spare. If persistent correctable errors are detected on a rank, the data
from this rank is copied to the spare rank and the failed rank is disabled.
With Memory Sparing enabled, the system memory available to the operating system is reduced by one rank per channel.
For example, in a dual-processor configuration with sixteen 4GB dual-rank DIMMs, the available system memory is: 3/4
(ranks/channel) 16 (DIMMs) 8GB = 96GB, and not 16 (DIMMs) 8GB = 128GB.
NOTE: Memory Sparing does not offer protection against a multi-bit uncorrectable error.
NOTE: Both Advanced ECC/Lockstep and Optimizer modes support Memory Sparing.
Memory Mirroring
Memory Mirroring offers the strongest DIMM reliability mode compared to all other modes, providing improved
uncorrectable multi-bit failure protection. In a mirrored configuration, the total available system memory is one half of
the total installed physical memory. Half of the installed memory is used to mirror the active DIMMs. In the event of an
uncorrectable error, the system will switch over to the mirrored copy. This ensures SDDC and multi-bit protection.
Memory installation guidelines:
Memory modules must be identical in size, speed, and technology.
DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies for sockets with
black and green release tabs. This ensures that identical DIMMs are installed in matched pairs - for example, A1 with
A2, A3 with A4, A5 with A6, and so on.
Sample Memory Configurations

The following tables show sample memory configurations that follow the appropriate memory guidelines stated in this
section.
NOTE: 1R, 2R, and 4R in the following tables indicate single-, dual-, and quad-rank DIMMs respectively.
NOTE: When using an 104 mm wide heat sink for a single processor, the memory module sockets A6, A8, A10, and
A12 are not available for population.
Memory Configurations Single processor
System Capacity
(in GB)
DIMM Size (in

GB)
Number of
DIMMs
Organization and
Speed
DIMM Slot Population
16
1R x8, 2133 MT/s
A1, A2, A3, A4
24
1R x8, 2133 MT/s
A1, A2, A3, A4, A5, A6

101
Memory Configurations Single processor

System Capacity
(in GB)
DIMM Size (in

GB)
Number of
DIMMs
Organization and
Speed
48
12
1R x8, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,
A11, A12
48
2R x8, 2133 MT/s
A1, A2, A3, A4, A5, A6
96
12
2R x8, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,
A11, A12
96
16
2R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6
128
16
2R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6, A7, A8
144
16 and 8
10
2R x4, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8, A9, A11
NOTE: 16GB DIMMs must be
installed in the slots numbered
A1, A2, A3, A4, A5, A6, A7, and A8
and 8GB DIMMs must be
installed in slots A9 and A11.
256
32
4R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6, A7, A8
384
32
12
4R x4, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,
A11, A12
NOTE: When using an 104 mm wide heat sinks for dual processors, the memory module sockets A6, A8, A10, A12,
B6, B8, B10, and B12 are not available for population.
Memory Configurations Two Processors
System Capacity (in
GB)
DIMM Size (in GB) Number of

DIMMs
Organization and
Speed
32
1R x8, 2133 MT/s
A1, A2, A3, A4, B1, B2, B3, B4
64
16
1R x8, 2133 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8
64
2R x8, 2133 MT/s
A1, A2, A3, A4, B1, B2, B3, B4
96
24
1R x8, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,
B4, B5, B6, B7, B8, B9, B10,
B11, B12
96
12
2R x8, 2133 MT/s
A1, A2, A3, A4, A5, A6, B1, B2,

B3, B4, B5, B6
128
16
2R x8, 2133 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8
128
16
2R x4, 2133 MT/s
A1, A2, A3, A4, B1, B2, B3, B4
102

Memory Configurations Two Processors

System Capacity (in
GB)
DIMM Size (in GB) Number of

DIMMs
Organization and
Speed
160
20
2R x8, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

A9, A11, B1, B2, B3, B4, B5, B6,
B7, B8, B9, B11
160
16 and 8
12
2R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6, B1, B2,

B3, B4, B5, B6
NOTE: 16GB DIMMs
must be installed in the
slots numbered A1, A2,
A3, A4, B1, B2, B3, and
B4 and 8GB DIMMs must
be installed in slots A5,
A6, B5 and B6.
192
24
2R x8, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,
B4, B5, B6, B7, B8, B9, B10,
B11, B12
192
16
12
2R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6, B1, B2,

B3, B4, B5, B6
256
16
16
2R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8
384
16
24
2R x4, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,
B4, B5, B6, B7, B8, B9, B10,
B11, B12
512
32
16
4R x4, 2133 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8
768
32
24
4R x4, 1600 MT/s
A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,
B4, B5, B6, B7, B8, B9, B10,
B11, B12
Storage
The Dell PowerEdge M630 supports up to two 2.5" SAS/SATA/PCIe SSDs or SAS/SATA hard drives and four 1.8" SATA
SSDs. The hard drives/SSDs are supplied in special hot-swappable drive carriers that fit in the drive bays and these drives
connect to the system board through the hard drive backplane board.
The following are the supported SSD/SAS/SATA hard drives on Dell PowerEdge M630.
Support for 10,000 and 15,000 rpm 2.5 SAS drives
Support for 7,200 rpm 2.5 Enterprise SATA drives
Support for 2.5 Solid State Drives (SSD) including PCIe SSD drives
Support for 1.8 Solid State Drives (SSD)

NOTE: Mixing of SSD/SAS/SATA hard drives is not supported.

103
Hard Drive/SSD Bay Numbering

Hard Drive/SSD Bay Numbering 2.5 Hard Drive/SSD System
SSD Bay Numbering 1.8 SSD System
Express Flash (PCIe SSD)

The Dell PowerEdge M630 has an option to support Express Flash . Express Flash drives use PCIe and SSD technologies
to provide performance, scalability, and optimal serviceability. Accelerated performance with high Input/Output
Operations per second (IOPs) is made possible without requiring processor resources or capturing DRAM.
Also, Express Flash drives use a standardized, 2.5 hot-plug form factor, which allows a common management process
for all drives.
The Dell PowerEdge M630 has an option to support up to two Express Flash PCIe SSD drives with the PCIe SSD
backplane configuration. PCIe SSD drives can be configured to RAID 0 or RAID1 via the OS RAID option.
NOTE: Software RAID is only supported for PCIe SSD with no RAID configuration. The PCIe SSD is an optional
configuration and it is not factory installed.
104

Backplane
This section describe the backplane options on Dell PowerEdge M630.
The following table lists the backplane and controller options.

Backplane and Controller Options
HDD/SS Backpla Support No
D
ne
ed
Hard
Control Drive
ler/
Configs
No
RAID
(PERC)
RAID 0
RAID 1
RAID 5
RAID 10 No
RAID
(Intel
C610
Chipset
)
RAID 0 RAID 1
(Requir (Requir
es S130) es S130)
2.5" SAS 2 x 2.5

or SATA SAS
H330/
H730/
H730P
Yes
Yes
Yes
Yes
N/A
N/A
N/A
N/A
N/A
2.5
SATA
2.5
SATA
S130
Yes
N/A
Yes
Yes
N/A
Yes
Yes
Yes
Yes
2.5
PCIe
PCIe
PCIe
N/A*
Extende
r
Yes
N/A
N/A
N/A
N/A
N/A
N/A
N/A

105
Backplane and Controller Options

HDD/SS Backpla Support No
D
ne
ed
Hard
Control Drive
ler/
Configs
No
RAID
(PERC)
RAID 0
RAID 1
RAID 5
RAID 10 No
RAID
(Intel
C610
Chipset
)
RAID 0 RAID 1
(Requir (Requir
es S130) es S130)
1.8
uSATA
1.8 SAS
H330/
H730/
H730P
N/A*
Yes
Yes
Yes
Yes
Yes
N/A
N/A
N/A
1.8
uSATA
1.8
SATA
S130
N/A*
N/A
Yes
Yes
N/A
Yes
Yes
Yes
Yes
* This is not a factory installed option, but will work
General Configuration Notes

The following are the general configuration notes for backplane and controller options.
SAS HDD, SATA HDD, as well as SAS SSD, SATA SSD drives are supported but not on all backplanes.
SAS HDD, SATA HDD, SAS SSD, SATA SSD and NO hard drive configurations with RAID controller (H330) require SAS
backplane.
SAS backplane supports:
*
Both SATA and SAS hard drives
Both SATA SSD and SAS SSD drives
Diskless configuration, which requires SATA backplane without PERC controller
Mixed HDD/SSD are not supported
Software RAID S130 supports SATA HDD and SATA SSD only.
Backplane in the system is driven by one controller.
Unmanaged (No-RAID, no partitioned) drives support the H330, H730, and H730P.
RAID 0 and RAID 1 can support H330, H730 and H730P.
The Dell PowerEdge FC630 follows the same factory configuration guidelines as the Dell PowerEdge M630. Unique
factory configurations are contained at the chassis level not blade/node/sled
PERC9
The Dell PowerEdge Expandable RAID Controller (PERC) 9 is a refresh of the Dell PERC portfolio in support of Dells
13G PowerEdge servers, encompassing both hardware changes and firmware updates, while continuing to support SAS,
SATA and Solid State Drive (SSD) devices internal to Dell PowerEdge servers. The PERC9 series of cards consist of the
H330, H730, and H730P cards.
NOTE: This is an overview of PERC9. For a full technology training on PERC9, please refer to the reference material
link below.
Internal Link: PERC9
External Link: PERC9
PERC H330
The PERC H330 is a general purpose RAID solution card. The card is available in Adapter (low profile and full height), Mini
Modular, and Mini Monolithic form factors for internal storage and tape devices.
106

PERC H730
The PERC H730 is a RAID solution card consisting of 512 MB or 1 GB Non-Volatile Cache and is available in the Adapter
(low profile and full height), Mini Modular, and Mini Monolithic form factors for internal storage.
PERC H730P
The PERC H730P is the performance RAID solution card consisting of 1 GB or 2 GB Non-Volatile Cache and is available in
the Adapter (low profile and full height), Mini Modular, and Mini Monolithic form factors for internal storage.
Internal Dual SD Module

The Internal Dual SD Module (IDSDM) is included on mainstream 2 socket servers following the same behavior as 12G
IDSDM. Customers can use IDSDM with a single SD card in either slot or in redundant mode with two SD cards installed.
The Internal Dual SD Module (IDSDM) card provides the following major functions:
Dual SD interface, maintained in a mirrored configuration (primary and secondary SD).
The IDSDM card does provide full RAID-1 functionality.
Dual SD cards are not required. The module can operate with only one card, but will provide no redundancy.
IDSDM will enable support for Secure Digital eXtended Capacity (SDXC) cards.
USB interface to host system.
I2C interface to host system and onboard EEPROM for out-of-band status reporting.
Onboard LEDs showing status of each SD card.
IDSDM New Features

The following table lists the new features of IDSDM on 13G systems.
IDSDM New Features
New Features
Description
Support for RAID and Data Integrity
13G iDSDM implements RAID functionality. This means

that at any given time, after rebuild, contents will stay
synchronized. If RAID feature is enabled, writes to iDSDM
will perform write operation to both SD cards
simultaneously.
Support to ensure data integrity during power loss
conditions is implemented.
Support for USB 3.0 (Higher Bandwidth)
System will work with USB 3.0. If USB 3.0 is disabled, or if

the an error on USB 3.0 is detected, iDSDM will fall back to
USB 2.0.
User Prioritized SD Slots
User will be able to define which SD slot is primary.

Once primary SD slot it selected, iDSDM will perform
operation using that SD card.
If RAID is enabled, content of primary SD card will be
mirrored on secondary SD card.

107
IDSDM New Features

New Features
Description
Bad Block Management
Unlike 12G where a single bad sector will cause SD card to

be considered Failed, 13G iDSDM implements more
robust mechanism for bad block management.
This mean SD cards failing on 12G might be functional on
13G iDSDM.
Multiple read/write needs to happen before SD card is
considered to be in failed state.
No More BIOS Halt During Rebuild
Unlike 12G, 13G iDSDM does not require the BIOS to halt
during POST and wait for the rebuild to complete.
Rebuild will happen in background and is much faster as
compared to 12G. An 8GB card should rebuilt in less than
30 minutes.
Enhanced Support for Mismatched SD Cards
Functionality of primary SD card will not be compromised

if the secondary SD card has a different speed or lower
storage.
Mismatch check will only happen if the iDSDM is operating
in RAID mode.
Only secondary SD card will be placed in mismatch state.
If the secondary card does not match the speed or has
lower storage capacity than the primary card, the
secondary card will be placed in the MISMATCH state.
Enhanced Support for Write-Protected SD Cards
After insertion, a card is determined to be in WRITE

PROTECTED state if write protect notch is enabled.
Cards in the WRITE PROTECTED state will be treated as
Read Only. If at least one card is in the WRITE PROTECTED
state and RAID is enabled, the iDSDM will operate in the
degraded RAID state. RAID will automatically be disabled if
both cards are in this state.
Seamless SD Card Assignments
IDSDM will bring secondary SD card online and will make it

primary if, for some reason, primary SD card fails.
If RAID is enabled, there will be no compromise in
functionality however, system will notify user of degraded
RAID status.
Enriched Error Reporting
New errors have been implemented to help root cause a

failure.
Failures will be in iDRAC logs.
Multiple failures can be now recorded and logged.
Mass Erase for Enhanced Security
Mass erase options are provided in iDSDM. Enabling this

register will clean up all the data preset on SD cards.
UHS-1 SD Card Support
New to 13G. Was not supported on 12G.
Supported Operating Systems

The following operating systems are supported on IDSDM.
VMWare ESXi 5.1 and above
108

Citrix XenServer 6.1 and above
Windows Hyper-V Server 2008 R2 (not supported by Dell)
Windows 2012 Hyper-V Core (not supported by Dell)
Network Daughter Card

The 13G blade/sled Network Daughter Card (NDC) is a custom form factor card that contains a complete network
interface card (NIC) subsystem.
The Dell PowerEdge M630/FC630 system will support one blade Network Daughter Card (bNDC) card instead of the
traditional LAN on motherboard (LOM) design.
The bNDC card interfaces with the M630/FC630 system board through the following interfaces from the system board:
PCIe x8 Gen3 compatible link from CPU1 (can be bifurcated as two separate x4 links)
NC-SI
I2C
Power and ground
Miscellaneous control signals
The bNDC interface support the following cards:
10GbE Intel X520 DP bNDC KR
1GbE Intel i350 QP bNDC
10GbE Broadcom 57840 QP bNDC KR
10GbE Broadcom 57810S DP bNDC KR
1GbE Broadcom 5720 QP bNDC
10GbE Emulex DP bNDC KR
PCIe Mezzanine Card

The Dell PowerEdge M630 provides two PCIe Gen3 mezzanine connectors for add-in cards. The Dell PowerEdge
M630 has been designed to be PCIe Gen3 compliant in order to take full advantage of the processor capabilities.
Supported Mezzanine Cards

The following table lists the supported mezzanine cards for the Dell PowerEdge M630.
Type
Adapter
1Gb/10Gb NICs
Broadcom 5719 Serdes 4 port 1Gb

Intel i350 Serializer-Deserializer (SERDES) 4 port 1Gb
Broadcom 57810S 2 port 10Gb
Intel x520-x/k 2 port 10Gb
QLogic QME8262-k 2 port 10Gb
Brocade BR1741M-k 2 port 10Gb
FC8 adapters
QLogic QME2572 2 port 8Gb

Emulex KOe1205-M 2 port 8Gb

109

Type
Adapter
Infiniband
Mellanox QDR CX-3 40Gb

Mellanox FDR CX-e 56Gb
PCIe Mezzanine Card Installation Guidelines

The blade server supports two mezzanine cards:
Mezzanine card slot C supports Fabric C. This card must match the fabric type of I/O modules installed in I/O module
bays C1 and C2.
Mezzanine card slot B supports Fabric B. This card must match the fabric type of I/O modules installed in I/O module
bays B1 and B2.
The blade server supports SFF mezzanine cards. x8 PCIe Gen 3 cards are supported.
NOTE: The Dell PowerEdge M630 only supports small form factor cards.
Fabric Connection for M1000e

The below diagram shown the Dell PowerEdge M630 fabric connection on M1000e.
Click the image to view a larger version.
110

Fabric Connection for VRTX

The below diagram shown the Dell PowerEdge M630 fabric connection on VRTX.

111
Mezzanine Population Rule

The following table lists the PCIe slot matrix for Dell PowerEdge M630.
NOTE: For blades with single mezzanine cards, the mezzanine card is always populated in the Fabric B slot.
112

PowerEdge M630 PCIe Slot Matrix

Category
Card Priority
Description
Dell P/N
Width
Slot Priority
Maximum
Cards (FI)
bNDC
N/A
PW,PLN,
12G,BNDC,BC
OM,DP,KR
JVFVR
N/A
N/A
CRD,NTWK,BN
DC,BCOM,QP,
KR
TKR5K/JNK9N
N/A
N/A
CRD,NTWK,
13G,BNDC,BC
OM,QP,1G
MW9RC
N/A
N/A
CRD,NTWK,
12G,BNDC,INT
EL,10KR
XWKGY
N/A
N/A
CRD,NTWK,BN P3V42
DC,EMULEX,DP
,KR.V2
N/A
N/A
CRD,NTWK,
13G,BNDC,
4X10,IN,10KR
Y348Y
N/A
N/A
CRD,NTWK,
13G,BNDC,QP,
1G
V017G
N/A
100
CRD,NTWK,BC
OM,
10G,DP,MEZZ
55GHP
Mezzanine slot
B or C
(populate B
first)
180
CRD,NTWK,DP, 8F6NV
INTEL,
10GBE,KX4,KR
Mezzanine slot
B or C
(populate B
first)
680
CRD,NTWK,ME
ZZ,
10G,CX3,DP,M
LNX
Mezzanine slot
B or C
(populate B
first)
FCoE/CNA
191
CRD,NTWK,ME HCJR0
ZZ,
10G,DP,EMULE
X,V2
Mezzanine slot
B or C
(populate B
first)
1 GB Ethernet
Mezz
360
CRD,NTWK,BC
OM,
1G,QP,MEZZ
22TDT
Mezzanine slot
B or C
(populate B
first)
380
CRD,NTWK,INT 8CF6D
EL,
1G,QP,MEZZ,I3
50
Mezzanine slot
B or C
(populate B
first)
10GB Ethernet
Mezz
6256K

113
PowerEdge M630 PCIe Slot Matrix

Category
Card Priority
Description
Dell P/N
Width
Slot Priority
Maximum
Cards (FI)
FC8
460
CRD,CTL,FC8,
HBA,LPE1205
M
R072D
Mezzanine slot
B or C
(populate B
first)
480
CRD,CTL,FC8, 2H47D
HB,QME2572,B
LDE,V4
Mezzanine slot
B or C
(populate B
first)
500
CRD,CTL,FC16, 73TM8
HBA,LPM16002
,EX,2
Mezzanine slot
B or C
(populate B
first)
520
CRD,CTL,FC16, 4GDP5
HBA,QME2662,
BLDE
Mezzanine slot
B or C
(populate B
first)
640
CRD,INFC,IFB,F CDMG5
DR10,X3,FI
Mezzanine slot
B or C
(populate B
first)
660
CRD,INFC,IFB,F 8PTD1
DR,X3,FI
Mezzanine slot
B or C
(populate B
first)
FC16
Infiniband
Trusted Platform Module

The Trusted Platform Module (TPM) is used to generate/store keys, protect/authenticate passwords, and create/store
digital certificates. The TPM can also be used to enable the Microsoft BitLocker hard drive encryption feature in
Microsoft Windows Server 2008.
In 13G, the TPM chip is on the Plug-in Module (PIM). Unlike in 12G, the TPM chip is soldered down on the system board.
The 13G TPM has to be bounded to one and only one system board.
The system board will have a connector for the plug-in module and it is factory-installed only.
114

There are four types of TPM chip options:
No TPM
TPM 1.2 FIPS Nuvoton
TPM 2.0 ROW Nuvoton (Post-RTS)
TPM 2.0 China NationZ (Post-RTS)

NOTE: The TPM is an optional module for the Dell PowerEdge FC630/M630 and is only available from the factory.
It is not offered After Point of Sales (APOS).
NOTE: In a scenario where both the control panel and system board are dispatched, it is recommended to replace
the control panel first and attempt a power-on to complete the Easy Restore process (Service Tag, licenses, copy
to the new control panel). Then, proceed to replace the system board. For more information, please refer to the
Critical Callouts page.
System Board Block Diagram

This section contain the block diagram for the Dell PowerEdge M630 system board.

115
116

BIOS and UEFI

Pre-operating System Management Applications
The pre-operating system management applications for PowerEdge system helps to manage different settings and
features of the system without booting to the operating system.
The PowerEdge system has three pre-operating system management applications.
System Setup
Boot Manager
Dell Lifecycle Controller
The following keystrokes provide access to system features during startup:

Accessing the System Features
Keystroke Description
<F2>
Enters the System Setup.
<F10>
Enters System Services, which opens the Dell Lifecycle Controller 3 (LC3). The Dell LC3 supports systems
management features, such as operating system deployment, hardware diagnostics, firmware updates, and
platform configuration, using a GUI. The exact LC3 feature set is determined by the iDRAC license
purchased.
<F11>
Enters the BIOS Boot Manager or the Unified Extensible Firmware Interface (UEFI) Boot Manager,
depending on the system's boot configuration.
<F12>
Starts Preboot Execution Environment (PXE) boot.
System Setup and Boot Manager are described in detail in following page.
Using Navigation Keys

The navigation keys can help you access the pre-operating system management applications of your system quickly.
Navigation Keys
Key
Description
<PgUp>
Moves to the previous screen.
<PgDn>
Moves to the next screen.
Up arrow
Moves to the previous field.
Down arrow
Moves to the next field.
<Enter>
Allows you to type in a value in the selected field (if applicable) or follow the link in the field.
Spacebar
Expands or collapses a drop-down list, if applicable.
<Tab>
Moves to the next focus area.

NOTE: For the standard graphics browser only.
<Esc>
Moves to the previous page till you view the main screen. Pressing <Esc> in the main screen exits
System BIOS/IDRAC Settings/Device Settings/Service Tag Settings and proceeds with system boot.

117
Navigation Keys
Key
Description
<F1>
Displays the System Setup help file.
About System Setup

Using System Setup, you can configure the BIOS settings, iDRAC settings, and device settings of your system.
You can access System Setup in two ways:
Standard graphical browser, which is enabled by default.
Text Browser, whish is enabled using Console Redirection.
To enable Console Redirection, in System Setup, select System BIOS Serial Communication On with Console
Redirection via COMx (or Auto if a serial terminal is present).
NOTE: By default, help text for the selected field is displayed in the graphical browser. To view the help text in the
text browser, press <F1>.
F2 BIOS (System Setup)

1.
Turn on or restart your system.
2.
Press <F2> immediately after you see the following message:

<F2> = System Setup
If your operating system begins to load before you press <F2>, allow the system to finish booting, and then restart
your system and try again.
118

System Setup Main Menu

The System Setup Main Menu screen allows you to access the System BIOS, iDRAC Settings, Device Settings, and Service
Tag Settings.
System Setup Main Menu

Option
Description
System BIOS
Enables you to configure BIOS settings.
iDRAC Settings
Enables you to configure iDRAC settings.

The iDRAC Settings utility is an interface to setup and
configure the iDRAC parameters using UEFI. You can
enable or disable various iDRAC parameters using the
iDRAC Settings Utility.
Device Settings
Enables you to configure device settings.
System BIOS Settings Screen

The System BIOS screen allows you to view BIOS settings as well as edit specific functions such as boot order, system
password, setup password, setting RAID mode, and enabling or disabling USB ports.
In the System Setup Main Menu, click System BIOS.

119
The System BIOS screen details are explained below.

System BIOS Screen
Menu Item
Description
System Information
Displays information about the system such as the system

model name, BIOS version, Service Tag, and so on.
Memory Settings
Displays information and options related to installed

memory.
Processor Settings
Displays information and options related to the processor

such as speed, cache size, and so on.
SATA Settings
Displays options to enable or disable the integrated SATA

controller and ports.
Boot Settings
Displays options to specify the boot mode (BIOS or UEFI).

Enables you to modify UEFI and BIOS boot settings.
Network Settings
Displays options for changing the network settings.
Integrated Devices
Displays options to enable or disable integrated device

controllers and ports, and to specify related features and
options.
120

System BIOS Screen

Menu Item
Description
Serial Communication
Displays options to enable or disable the serial ports and

specify related features and options.
System Profile Settings
Displays options to change the processor power

management settings, memory frequency, and so on.
System Security
Displays options to configure the system security settings

such as system password, setup password, TPM security,
and so on. It also enables or disables support for the
power and NMI buttons on the system.
Miscellaneous Settings
Displays options to change the system date, time, and so

on.
System Information Screen

The System Information screen allows you to view system properties such as Service Tag, system model, BIOS version,
and so on.
In the System Setup Main Menu, click System BIOS System Information.
The System Information screen details are explained below.

121
System Information Screen

Menu Item
Description
System Model Name
Displays the system model name.
System BIOS Version
Displays the BIOS version installed on the system.
System Management Engine Version
Displays the current revision of the Management Engine

firmware.
System Service Tag
Displays the system Service Tag.
System Manufacturer
Displays the name of the system manufacturer.
System Manufacturer Contact Information
Displays the contact information of the system

manufacturer.
System CPLD Version
Displays the current revision of the system CPLD firmware.
UEFI Compliance Version
Displays the system firmware UEFI compliance level.
System Memory Screen

The System Memory screen allows you to view all the memory settings as well as enable or disable specific memory
functions such as system memory testing and node interleaving.
In the System Setup Main Menu, click System BIOS System Memory.
122

The System Memory screen details are explained below.

System Memory Screen
Menu Item
Description
System Memory Size
Displays the amount of memory installed in the system.
System Memory Type
Displays the type of memory installed in the system.
System Memory Speed
Displays the system memory speed.
System Memory Voltage
Displays the system memory voltage.
Video Memory
Displays the amount of video memory.
System Memory Testing
Specifies whether system memory tests are run during

system boot. Options are Enabled and Disabled. By
default, the System Memory Testing option is set
to Disabled.
Memory Operating Mode
Specifies the memory operating mode. The options

available are Optimizer Mode, Advanced ECC
Mode, Mirror Mode, Spare Mode, Spare with Advanced
ECC Mode, and Dell Fault Resilient Mode. By default,
the Memory Operating Mode option is set to Optimizer
Mode.
NOTE: The Memory Operating Mode can have
different defaults and available options based on the
memory configuration of your system.
NOTE: The Dell Fault Resilient Mode establishes an

area of memory that is fault resilient. This mode can
be used by an operating system that supports the
feature to load critical applications or enables the
operating system kernel to maximize system
availability.
Node Interleaving
If this field is Enabled, memory interleaving is supported if

a symmetric memory configuration is installed. If Disabled,
the system supports Non-Uniform Memory architecture
(NUMA) (asymmetric) memory configurations. By
default, Node Interleaving option is set to Disabled.
Snoop Mode
Snoop Mode options available are Disabled, Home Snoop,

Early Snoop, Cluster on Die. By default, the Snoop Mode
option is set to Disabled. The field is only available when
Node Interleaving is Disabled.
Processor Settings Screen

The Processor Settings screen allows you to view the processor settings and perform specific functions such as enabling
virtualization technology, hardware prefetcher, and logical processor idling.
In the System Setup Main Menu, click System BIOS Processor Settings.

123
The Processor Settings screen details are explained below.

Processor Setting Screen
Menu Item
Description
Logical Processor
Enable or disable logical processors and display the number of logical

processors. If the Logical Processor option is set to Enabled, the BIOS
displays all the logical processors. If this option is set to Disabled, the
BIOS only displays one logical processor per core. By default, the Logical
Processor option is set to Enabled.
Alternate RTID (Requestor Transaction ID)

Setting
Allocate more RTIDs to the remote socket, increasing cache

performance between the sockets or work in normal mode for NUMA.
By default, the Alternate RTID (Requestor Transaction ID) Setting is set
to Disabled.
Virtualization Technology
Enable or disable the additional hardware capabilities provided for

virtualization. By default, the Virtualization Technology option is set to
Enabled.
Address Translation Service (ATS)
Define the Address Translation Cache (ATC) for devices to cache the
DMA transactions. This field provides an interface to a chipset's Address
Translation and Protection Table to translate DMA addresses to host
addresses. By default, the option is set to Enabled.
124


Menu Item
Description
Adjacent Cache Line Prefetch
Optimize the system for applications that require high utilization of

sequential memory access. By default, the Adjacent Cache Line Prefetch
option is set to Enabled. You can disable this option for applications that
require high utilization of random memory access.
Hardware Prefetcher
Enable or disable the hardware prefetcher. By default, the Hardware

Prefetcher option is set to Enabled.
DCU Streamer Prefetcher
Enable or disable the Data Cache Unit (DCU) streamer prefetcher. By

default, the DCU Streamer Prefetcher option is set to Enabled.
DCU IP Prefetcher
Enable or disable the Data Cache Unit (DCU) IP prefetcher. By default,

the DCU IP Prefetcher option is set to Enabled.
Execute Disable
Enable or disable execute disable memory protection technology. By

default, the Execute Disable option is set to Enabled.
Logical Processor Idling
Enable or disable the OS capability to put logical processors in the idling

state in order to reduce power consumption. By default, the option is set
to Disabled.
Configurable TDP
This field allows reconfiguration of Thermal Design Power (TDP) to lower

levels.
TDP refers to the maximum amount of power the cooling system is
required to dissipate.
X2Apic Mode
Enable or disable X2Apic mode.
Dell Controlled Turbo
NOTE: Depending on the number of installed CPUs, there may be

up to four processor listings.
Control the turbo engagement. Enable this option only when System
Profile is set to Performance.
Number of Cores per Processor
Control the number of enabled cores in each processor. By default, the

Number of Cores per Processor option is set to All.
Processor 64-bit Support
Specifies if the processor(s) support 64-bit extensions.
Processor Core Speed
Displays the maximum core frequency of the processor.
Processor Bus Speed
Displays the bus speed of the processors.

NOTE: The processor bus speed option displays only when both
the processors are installed.
Processor 1
NOTE: Depending on the number of installed CPUs, there may be

up to four processor listings. The following settings are displayed
for each processor installed in the system.
Family-Model-Stepping
Displays the family, model, and stepping of the processor as defined by

Intel.
Brand
Displays the brand name reported by the processor.
Level 2 Cache
Displays the total L2 cache.
Level 3 Cache
Displays the total L3 cache.

125

Menu Item
Description
Number of Cores
Displays the number of cores per processor.
SATA Settings Screen

The SATA Settings screen allows you to view the SATA settings of SATA devices and enable RAID on your system.
In the System Setup Main Menu, click System BIOS SATA Settings.
The SATA Settings screen details are explained below.

Viewing SATA Settings Screen
Menu Item
Description
Embedded SATA
Allows the embedded SATA to be set to Off, ATA, AHCI, or RAID modes. By default, the
Embedded SATA option is set to AHCI.
Security Freeze Lock
Sends Security Freeze Lock command to the Embedded SATA drives during POST. This
option is only applicable to ATA, AHCI mode, and is not applicable to RAID mode.
Write Cache
Enables or disables the command for Embedded SATA drives during POST.
126


Menu Item
Description
Port A
Sets the drive type of the selected device. For Embedded SATA settings in ATA mode, set
this field to Auto to enable BIOS support. Set it to OFF to turn off BIOS support.
For AHCI mode or RAID mode, BIOS always enables support.
Model
Displays the drive model of the selected device.
Drive Type
Displays the type of drive attached to the SATA port.
Capacity
Displays the total capacity of the hard drive. The field is undefined for removable media
devices such as optical drives.
Port B
Model
Drive Type
Capacity
Port C
Model
Drive Type
Capacity
Port D
Model
Drive Type
Capacity
Port E
Model
Drive Type
Capacity
Port F

127

Menu Item
Description
Model
Drive Type
Capacity
Port G
Model
Drive Type
Capacity
Port H
Model
Drive Type
Capacity
Port I
Model
Drive Type
Capacity
Port J
Model
Drive Type
Capacity
Boot Settings Screen

The Boot Settings screen allows you to set the Boot mode to either BIOS or UEFI. It also allows you to specify the boot
order.
In the System Setup Main Menu, click System BIOS Boot Settings.
128

The Boot Settings screen details are explained below.

Boot Setting Screen
Menu Item
Description
Boot Mode
Enables you to set the boot mode of the system.

CAUTION: Switching the boot mode may prevent
the system from booting if the operating system is
not installed in the same boot mode.
NOTE: Setting this field to UEFI disables BIOS Boot

Settings menu. Setting this field to BIOS disables the
UEFI Boot Settings menu.
If the operating system supports UEFI, you can set this
option to UEFI. Setting this field to BIOS allows
compatibility with non-UEFI operating systems. By default,
the Boot Mode option is set to BIOS.

129
Boot Setting Screen

Menu Item
Description
Boot Sequence Retry
Enables or disables the boot sequence retry feature. If this

field is enabled and the system fails to boot, the system
reattempts the boot sequence after 30 seconds. By
default, the Boot Sequence Retry option is set to Enabled.
Hard Disk Failover
Specifies which devices in the Hard-Disk Drive Sequence

are attempted in the boot sequence. When the option is
Disabled, only the first hard disk device in the list is
attempted to boot. When set to Enabled, all hard disk
devices are attempted in order, as listed in the Hard-Disk
Drive Sequence. This option is not enabled for UEFI Boot
Mode.
Boot Options Settings
Configure the boot sequence and the boot devices.
Network Settings Screen

The Network Settings screen allows you to modify PXE device settings. Network Settings are only available in UEFI boot
mode. BIOS does not control network settings in the BIOS boot mode path. For BIOS boot mode, the network settings
are handled by the network controllers option ROM.
In the System Setup Main Menu, click System BIOS Network Settings.
130

The Network Settings screen details are explained below.

Network Settings Screen
Menu Item
Description
PXE Device n (n = 1 to 4)
Enables or disables the device. When enabled, a UEFI boot

option is created for the device.
PXE Device n Settings (n = 1 to 4)
Controls the configuration of the PXE device.
Integrated Devices Screen

The Integrated Devices screen allows you to view and configure the settings of all integrated devices including the video
controller, integrated RAID controller, and the USB ports.
In the System Setup Main Menu, click System BIOS Integrated Devices.

131
The Integrated Devices screen details are explained below.

Menu Item
Description
USB 3.0 Setting
Enable or disable the USB 3.0 support. Enable this option

only if the operating system support USB 3.0. Disabling this
allows devices to operate at USB 2.0 speed. USB 3.0 is
disabled by default
User Accessible USB Ports
Enable or disable the USB ports. Selecting Only Back Ports

On disables the front USB ports, selecting All Ports Off
disables all USB ports. The USB keyboard and mouse
operates during boot process in certain operating systems.
After the boot process is complete, the USB keyboard and
mouse do not work if the ports are disabled.
NOTE: Selecting Only Back Ports On and All Ports
Off will disable the USB management port and also
restrict access to iDRAC features.
Internal USB Port
132
Enable or disable the internal USB port.


Menu Item
Description
Integrated RAID Controller
Enable or disable the integrated RAID controller.

NOTE: This feature is not supported for the Dell
PowerEdge T630 system.
Integrated Network Card 1
Enable or disable the integrated network card.
I/OAT DMA Engine
Enable or disable the I/OAT option. Enable only if the

hardware and software supports the feature.
Embedded Video Controller
Enable or disable the Embedded Video Controller. By

default, the embedded video controller is Enabled. Current
state of Embedded Video Controller is Enabled. Current
State of Embedded Video Controller is a read-only field,
indicating the current state for the Embedded Video
Controller. If the Embedded Video Controller is the only
display capability in the system (that is, no add-in graphics
card is installed), then the Embedded Video Controller is
automatically used as the primary display even if the
Embedded Video Controller setting is Disabled.
SR-IOV Global Enable
Enable or disable the BIOS configuration of Single Root I/O

Virtualization (SR-IOV) devices. By default, the SR-IOV
Global Enable option is set to Disabled.
OS Watchdog Timer
If the system stops responding, this watchdog timer aids in

the recovery of the operating system. When this field is set
to Enabled, the operating system is allowed to initialize the
timer. When it is set to Disabled (the default), the timer will
have no effect on the system.
Memory Mapped I/O above 4GB
Enable support for PCIe devices that require large amounts

of memory. By default, the option is set to Enabled.
Slot Disablement
Enable or disable available PCIe slots on the system. The

Slot Disablement feature controls the configuration of
PCIe cards installed in the specified slot. Slot disablement
must be used only when the installed peripheral card is
preventing booting into the operating system or causing
delays in system startup. If the slot is disabled, both the
Option ROM and UEFI driver are disabled.
Serial Communication Screen

The Serial Communication screen allows you to view the properties of the serial communication port.
In the System Setup Main Menu, click System BIOS Serial Communication.

133
The Serial Communication screen details are explained below.

Menu Item
Description
Serial Communication
Select serial communication devices (Serial Device 1 and

Serial Device 2) in the BIOS. BIOS console redirection can
also be enabled and the port address can be specified. By
default, Serial Communication option is set to Auto.
Serial Port Address
Set the port address for serial devices. By default, the Serial
Port Address option is set to Serial Device 1=COM2, Serial
Device 2=COM1.
NOTE: Only Serial Device 2 can be used for Serial
Over LAN (SOL). To use console redirection by SOL,
configure the same port address for console
redirection and the serial device.
134


Menu Item
Description
External Serial Connector
Associate the external serial connector to serial device 1,

serial device 2, or remote access device. By default, the
External Serial Connector option is set to Serial Device1.
NOTE: Only Serial Device 2 can be used for SOL. To
use console redirection by SOL, configure the same
port address for console redirection and the serial
device.
Failsafe Baud Rate
Displays the failsafe baud rate for console redirection. The

BIOS attempts to determine the baud rate automatically.
This failsafe baud rate is used only if the attempt fails and
the value must not be changed. By default, the Failsafe
Baud Rate option is set to 11520.
Remote Terminal Type
Set the remote console terminal type. By default, the

Remote Terminal Type option is set to VT 100/VT 220.
Redirection After Boot
Enable or disable to the BIOS console redirection when

the operating system is loaded. By default, the Redirection
After Boot option is set to Enabled.
System Profile Settings Screen

The System Profile Settings screen allows you to enable specific system performance settings such as power
management.
In the System Setup Main Menu, click System BIOS System Profile Settings.

135
The System Profile Settings screen details are explained below.

Menu Item
Description
System Profile
Set the system profile. If the System Profile option tis set o
a mode other than Custom, the BIOS automatically sets
the rest of the options. You can only change the rest of the
options if the mode is set to Custom. By default, the
System Profile option is set to Performance Per Watt
Optimized (DAPC). DAPC is Dell Active Power Controller.
NOTE: The following parameters are available only
when the System Profile is set to Custom.
CPU Power Management
Set the CPU power management. By default, the CPU

Power Management option is set to System DBPM
(DAPC). DBPM is Demand-Based Power Management.
Memory Frequency
This field sets the speed of the system memory. You can
select Maximum Performance, Maximum Reliability, or a
specific speed.
136


Menu Item
Description
Turbo Boost
Enable or disable the processor to operate in turbo boost

mode. By default, the Turbo Boost option is set to
Enabled.
Energy Efficient Turbo
This field enables/disables the Energy Efficient Turbo.

Energy Efficient Turbo (EET) is a mode of operation where
a processors core frequency is adjusted within the turbo
range based on workload.
C1E
Enable or disable the processor to switch to a minimum

performance state when it is idle. By default, the C1E
option is set to Enabled.
C States
Enable or disable the processor to operate in all available

power states. By default, the C States option is set to
Enabled.
Collaborative CPU Performance Control
When set to Enabled, the CPU power management is

controlled by the OS DBPM and the System DBPM (DAPC).
By default, the option is set to Disabled.
Memory Patrol Scrub
Set the memory patrol scrub frequency. By default, the

Memory Patrol Scrub option is set to Standard.
Memory Refresh Rate
Set the memory refresh rate to either 1x or 2x. By default,

the Memory Refresh Rate option is set to 1x.
Uncore Frequency
This field selects the Processor Uncore Frequency.

Dynamic mode allows the processor to optimize power
resources across the cores and uncore during runtime.
The optimization of the uncore frequency to either save
power or optimize performance is influenced by the
setting of the Energy Efficiency Policy.
Energy Efficient Policy
This field selects the Energy Efficient Policy.

The CPU uses the setting to manipulate the internal
behavior of the processor and determines whether to
target higher performance or better power savings.
Number of Turbo Boot Enabled Cores for Processor 1
NOTE: If two processors are installed in the system,

there is an entry for Number of Turbo Boost Enabled
Cores for Processor 2.
Controls the number of turbo boost enabled cores for
processor 1. By default, the maximum number of cores is
enabled.

137

Menu Item
Description
Monitor/Mwait
Enables Monitor/Mwait instructions in the processor. By

default, the Monitor/Mwait option is set to Enabled for all
system profiles, except Custom.
NOTE: This option can be disabled only if the C
States option in Custom mode is disabled.
NOTE: When C States is enabled in Custom mode,

changing the Monitor/Mwait setting does not impact
system power/performance.
System Security Screen

System Security screen allows you to perform specific functions such as setting the system password, setup password,
and disabling the power button.
The System Security Settings screen details are explained below.
138

System Security Settings Screen

Menu Item
Description
Intel AES-NI
Improves the speed of applications by performing

encryption and decryption using the Advanced Encryption
Standard Instruction Set and is set to Enabled by default.
System Password
Set the system password. This option is set to Enabled by

default and is read-only if the password jumper is not
installed in the system.
Setup Password
Set the setup password. This option is read-only if the

password jumper is not installed in the system.
Password Status
Lock the system password. By default, the Password

Status option is set to Unlocked.
TPM Security
Control the reporting mode of the Trusted Platform

Module (TPM). By default, the TPM Security option is set to
Off. You can only modify the TPM Status, TPM Activation ,
and Intel TXT fields if the TPM Status field is set to either
On with Pre-boot Measurements or On without Pre-boot
Measurements.
TPM Information
Change the operational state of the TPM. By default, the

TPM Activation option is set to No Change.
TPM Status
Displays the TPM status.
TPM Command
CAUTION: Clearing the TPM results in the loss of all

keys in the TPM. The loss of TPM keys may affect
booting to the operating system.
Clear all the contents of the TPM. By default, the TPM
Clear option is set to No.
Intel TXT
Enable or disable Intel Trusted Execution Technology

(TXT). To enable Intel TXT, Virtualization Technology must
be enabled and TPM Security must be Enabled with Preboot measurements. By default, the Intel TXT option is set
to Off.
Power Button
Enable or disable the power button on the front of the

system. By default, the Power Button option is set to
Enabled.
AC Power Recovery
Set how the system reacts after AC power is restored to

the system. By default, the AC Power Recovery option is
set to Last.
UEFI Variable Access
Provides varying degrees of securing UEFI variables. When

set to Standard (the default) UEFI variables are accessible
in the Operating System per the UEFI specification. When
set to Controlled, selected UEFI variables are protected in
the environment and new UEFI boot entries are forced to
be at the end of the current boot order.
Secure Boot
Enable Secure Boot, where the BIOS authenticates each

pre-boot image using the certificates in the Secure Boot
Policy. Secure Boot is disabled by default.

139
System Security Settings Screen

Menu Item
Description
Secure Boot Policy
When Secure Boot policy is Standard, the BIOS uses the

system manufacturers key and certificates to authenticate
pre-boot images. When Secure Boot policy is Custom, the
BIOS uses the user-defined key and certificates. Secure
Boot policy is Standard by default.
Secure Boot Policy Summary
View the list of certificates and hashes that secure boot

uses to authenticated images.
Secure Boot Custom Policy Settings

Secure Boot Custom Policy Settings is displayed only when Secure Boot Policy is set to Custom.
In the System Setup Main Menu, click System BIOS System Security Settings Secure Boot Custom Policy Settings.
The Secure Boot Custom Policy Settings screen details are explained below.
Secure Boot Custom Policy Settings
Menu Item
Description
Platform Key
Import, export, delete, or restore the platform key (PK).
Key Exchange Key Database
Import, export, delete, or restore entries in the Key

Exchange Key (KEK) Database.
Authorized Signature Database
Import, export, delete, or restore entries in the Authorized

Signature Database (db).
Forbidden Signature Database
Import, export, delete, or restore entries in the Forbidden

Signature Database (dbx).
Miscellaneous Settings Screen

The Miscellaneous Settings screen allows you to perform specific functions such as updating the asset tag, and
changing the system date and time.
In the System Setup Main Menu, click System BIOS Miscellaneous Settings.
140

The Miscellaneous Settings screen details are explained below.

Menu Item
Description
System Time
Set the time on the system.
System Date
Set the date on the system.
Asset Tag
Displays the asset tag and allows you to modify it for

security and tracking purposes.
Keyboard NumLock
Set whether the system boots with the NumLock enabled

or disabled. By default the Keyboard NumLock is set to
On.
NOTE: This option does not apply to 84-key
keyboards.
F1/F2 Prompt on Error
Enable or disable the F1/F2 prompt on error. By default,

F1/F2 Prompt on Error is set to Enabled. The F1/F2 prompt
also includes keyboard errors.

141

Menu Item
Description
Load Legacy Video Option ROM
Determine whether the system BIOS loads the legacy

video (INT 10H) option ROM from the video controller.
Selecting Enabled in the operating system does not
support UEFI video output standards. This field is for UEFI
boot mode only. You cannot set this to Enabled if UEFI
Secure Boot mode is enabled.
In-System Characterization
Enables or disables In-System Characterization. By

default, In-System Characterization is set to Fast Boot.
The two other options are Optimized Boot and Disabled.
When enabled, In-System Characterization (ISC) executes
during POST upon detecting relevant change(s) in system
configuration to optimize system power and performance.
ISC takes about 20 seconds to execute, and system reset is
required for ISC results to be applied. The Fast Boot option
executes ISC and continues without applying ISC results
until the next time system reset occurs. The Optimized
Boot option executes ISC and forces an immediate system
reset so that ISC results can be applied right away. It takes
the system longer to be ready due to the forced system
reset. When disabled, ISC does not execute.
F10 Lifecycle Controller

The Dell Lifecycle Controller allows users to perform useful tasks such as configuring BIOS and hardware settings,
deploying operating system, updating drivers, changing RAID settings, and saving hardware profiles. For more
information on the Dell Lifecycle Controller, please refer to the reference material link below.
Internal Link: Lifecycle Controller 3.0
External Link: Lifecycle Controller 3.0
F11 UEFI Boot Manager

The Boot Manager enables you to:
Add, delete, and arrange boot options.
Access System Setup and BIOS-level boot options without restarting the system.
Entering Boot Manager

Boot Manager screen allows you to select boot options and diagnostic utilities.
1.
Turn on or restart the system.
2.
Press <F11> when you see the message <F11> = Boot Manager.
If the operating system begins to load before you press <F11>, allow the system to finish booting, and then restart
the system and try again.
142

Boot Manager Main Menu
The Boot Manager Main Menu screen details are explained below.
Boot Manager Main Menu Screen
Menu Item
Description
Continue Normal Boot
The system attempts to boot to devices starting with the

first item in the boot order. If the boot attempt fails, the
system continues with the next item in the boot order until
the boot is successful or no more boot options are found.
One Shot Boot Menu
Takes you to the Boot menu where you can select a one
time boot device to boot from.
Launch System Setup
Enables you to access the System Setup.
Launch Lifecycle Controller
Exits the Boot Manager and invokes the Lifecycle

Controller program.
System Utilities
Launches system utilities menu such as system diagnostics

and UEFI shell.

143
Changing the Boot Order

The boot order must be changed in order to boot from a USB key or an optical drive.
NOTE: The instructions given below may vary if BIOS for Boot Mode is selected.
1.
In the System Setup Main Menu, click System BIOS Boot Settings.
2.
Click Boot Option Settings Boot Sequence.
3.
Use the arrow keys to select a boot device, and use the + and - keys to move the device down or up in the ordering.
4.
Click Exit, click Yes to save the settings on exit.
Choosing the System Boot Mode

System Setup enables you to specify the boot mode for installing your operating system:
BIOS boot mode (the default) is the standard BIOS-level boot interface.
UEFI boot mode is an enhanced 64-bit boot interface based on Unified Extensible Firmware Interface (UEFI)
specifications that overlays the system BIOS.
You must select the boot mode in the Boot Mode field of the Boot Settings screen of System Setup. Once you specify
the boot mode, the system boots in the specified boot mode and you then proceed to install your operating system from
that mode. Thereafter, you must boot the system in the same boot mode (BIOS or UEFI) to access the installed operating
system. Trying to boot the operating system from the other boot mode will cause the system to halt at startup.
NOTE: Operating systems must be UEFI-compatible to be installed from the UEFI boot mode. DOS and 32-bit
operating systems do not support UEFI and can only be installed from the BIOS boot mode.
NOTE: For the latest information on supported operating systems, go to dell.com/ossupport.
Assigning a System and/or Setup Password

NOTE: The password jumper enables or disables the System Password and Setup Password features.
You can assign a new System Password and/or Setup Password or change an existing System Password and/or Setup
Password only when the password jumper setting is enabled and Password Status is Unlocked. If the Password Status is
Locked, you cannot change the System Password and/or Setup Password.
If the password jumper setting is disabled, the existing System Password and Setup Password is deleted and you need not
provide the system password to boot the system.
To assign a system and/or setup password:
1.
To enter System Setup, press <F2> immediately after a power-on or reboot.
2.
In the System Setup Main Menu, select System BIOS and press <Enter>.
The System BIOS screen is displayed.
3.
In the System BIOS screen, select System Security and press <Enter>.
The System Security screen is displayed.
4.
In the System Security screen, verify that Password Status is Unlocked.
5.
Select System Password , enter your system password, and press <Enter> or <Tab>.
Use the following guidelines to assign the system password:
144

A password can have up to 32 characters.
The password can contain the numbers 0 through 9.
Only the following special characters are allowed: space, (), (+), (,), (-), (.), (/), (;), ([), (\), (]), (`).
A message prompts you to re-enter the system password.

6.
Re-enter the system password that you entered earlier and click OK.
7.
Select Setup Password, enter your system password and press <Enter> or <Tab>.
A message prompts you to re-enter the setup password.
8.
Re-enter the setup password that you entered earlier and click OK.
9.
Press <Esc> to return to the System BIOS screen. Press <Esc> again, and a message prompts you to save the
changes.
NOTE: Password protection does not take effect until the system reboots.
Deleting or Changing an Existing System and/or Setup Password

Make sure that the Password jumper is set to enabled and the Password Status is Unlocked before attempting to delete
or change the existing System and/or Setup password. You cannot delete or change an existing System or Setup
password if the Password Status is Locked.
To delete or change the existing System and/or Setup password:
1.
To enter System Setup, press <F2> immediately after a power-on or restart.
2.
In the System Setup Main Menu, select System BIOS and press <Enter>.
3.
In the System BIOS Screen, select System Security and press <Enter>.
The System BIOS screen is displayed.

The System Security screen is displayed.
4.
In the System Security screen, verify that Password Status is Unlocked.
5.
Select System Password, alter or delete the existing system password, and press <Enter> or <Tab>.
6.
Select Setup Password, alter or delete the existing setup password, and press <Enter> or <Tab>.
NOTE: If you change the System and/or Setup password a message prompts you to re-enter the new
password. If you delete the System and/or Setup password, a message prompts you to confirm the deletion.
7.
Press <Esc> to return to the System BIOS screen. Press <Esc> again, and a message prompts you to save the
changes.

145
Troubleshooting
The following pages contain information about troubleshooting.
Minimum to POST
Minimum Components
The minimum components to allow the Dell PowerEdge FC630/M630 to complete POST are as follows:
System board
One processor (CPU) in socket CPU1 (minimum for troubleshooting)
One memory module (DIMM) installed in socket A1
No Network Daughter Card (bNDC) (requires F1 press to continue)
No Mezzanine Cards
No HDD Backplane
No HDDs
Known Issues
This section provides a list of known issues specific to the Dell PowerEdge M630 server. For more information, refer
to the Oracle Knowledge Info Center.
PowerEdge M630 Known Issues
Oracle Knowledge ID
Problem
Description
Solution
SLN294807
Dependency value for some

of the BIOS component is
incorrectly displayed as
NULL in WSMAN.
If the customer run the

below WSMAN command
on the FC630/M630 server,
they may observe that some
of the BIOS components are
displayed as NULL which is
incorrect.
Do not replace any

hardware. Dell engineering
team is aware of the issue.
The fix will be available in
BIOS 1.1.x which will be
available in March 2015.
winrm e http://
schemas.dmtf.org/wbem/
wscim/1/cim-schema/2/
root/dcim/
DCIM_BIOSEnumeration -u:
%2 -p:%3 -r:https://%1/
wsman -SkipCNcheck SkipCAcheck encoding:utf-8 -a:basic
146

PowerEdge M630 Known Issues

Oracle Knowledge ID
Problem
Description
Solution
SLN294726
CPU 1 is absent/present
event logged in LC.
In a very rare case, a

customer may notice that
there are several "CPU 1 is
absent" events followed by
"CPU 1 present" events in
the LC log.
Do not replace any

hardware. Dell engineering
team is aware of the issue
and working on root cause
and final solution.
This is a cosmetic issue, with
no functional impact. Dell
engineering team.
The fix will be available in
the next firmware release
which will be available in
March 2015.
SLN294483
The rebranded Dell

PowerEdge M630 may
restart itself while entering
LC GUI after the rebranding
process.
QNA43599
Duplicated PCI slot#9 and

slot#10 information is listed
on the ePSA configuration
page
After rebranding a Dell

PowerEdge M630 server,
when the user tries to enter
the Lifecycle Controller (LC)
GUI, the server may reboot
itself without entering the
GUI. This issue is
intermittent and does not
happen every time.
When the server reboots

itself, the user can press
<F10> again, and this time it
will successfully enter the
LC GUI.
Customers may notice that

the PCI slot# 9 and slot# 10
information is duplicated
(one show empty and
another one show correct
information) on the ePSA
configuration page.
Do not replace any

hardware. This is a cosmetic
issue. Dell engineering team
is aware of the issue.
Dell engineering is aware of

this issue, and a permanent
fix will be made available in
Q1FY16 in the Integrated
Dell Remote Access
Controller (iDRAC) firmware.
The final solution will be

availabe in iDRAC 2.10.10
which will be available in
March 2015.
Disabling a Forgotten Password

The software security features of a blade server include a system password and a setup password. The password jumper
enables these password features or disables them, and clears any password(s) currently in use.
1.
2.
Remove the blade server from the enclosure to access the jumpers.
3.
Move the jumper on the system-board jumper from pins 2 and 3 to pins 1 and 2.
4.
5.

When the blade is on, the power-on indicator is solid green. Allow the blade server to finish booting.
The existing passwords are not disabled (erased) until the system boots with the password jumper on pins 1 and 2.
However, before you assign a new system and/or setup password, you must reinstall the password jumper back to
pins 2 and 3.
NOTE: If you assign a new system and/or setup password with the jumper on pins 1 and 2, the system disables
the new password(s) the next time it boots.
6.

147
7.
Remove the blade server from the enclosure to access the jumpers.
8.
Move the jumper on the system-board jumper from pins 1 and 2 to pins 2 and 3.
9.
10. Turn on the blade server.

11. Assign a new system and/or setup password.
Troubleshooting System Memory

NOTE: Before performing the following procedure, make sure that you have installed the memory modules
according to the memory installation guidelines for the blade.
1.
Restart the blade:

a. Press the power button once to turn off the blade.
b. Press the power button again to apply power to the blade.
If no error messages appear, go to step 8.
2.
Enter the System Setup and check the system memory setting.
If the amount of memory installed matches the system memory setting, go to step 8.
3.
Remove the blade from the enclosure.
4.
Open the blade.

CAUTION: The memory modules are hot to touch for some time after the blade has been powered down.
edges and avoid touching the components.
5.
Re-seat the memory modules in their sockets.
6.
Close the blade.
7.
Install the blade in the enclosure.
8.
Troubleshooting Hard Drives

CAUTION: This troubleshooting procedure can destroy data stored on the hard drive. Before you proceed, back
up all the files on the hard drive, if possible.
1.
Run the appropriate controllers test and the hard drive tests in system diagnostics.
2.
Take the hard drive offline and wait until the hard-drive indicator codes on the drive carrier signal that the drive may
be removed safely, then remove and re-seat the drive carrier in the sled.
3.
Restart the sled, enter the System Setup and confirm that the drive controller is enabled.
4.
Make sure that any required device drivers are installed and are configured correctly.
If the tests fail, go to step 3.
NOTE: Installing a hard drive into another bay may break the drive mirroring if the mirror state is optimal.
5.
Remove the hard drive and install it in the other drive bay.
6.
If the problem is resolved, reinstall the hard drive in the original bay.
If the hard drive functions properly in the original bay, the drive carrier could have intermittent problems. Replace the
drive carrier.
7.
If the hard drive is the boot drive, make sure that the drive is configured and connected properly.
8.
Partition and logically format the hard drive.
9.
If possible, restore the files to the drive.
148

Troubleshooting Solid State Drives

CAUTION: This troubleshooting procedure can destroy data stored on the SSD. Before you proceed, back up all
the files on the SSD, if possible.
1.
Run the appropriate tests in system diagnostics.
2.
Take the SSD offline and wait until the indicator codes on the SSD carrier signal that the SSD may be removed safely,
then remove and re-seat the SSD carrier in the sled.
3.
Restart the sled, enter the System Setup and confirm that the drive controller is enabled.
4.
Make sure that any required device drivers are installed and are configured correctly.
If the tests fail, go to step 3.
NOTE: Installing a SSD into another bay may break the mirror if the mirror state is optimal.
5.
Remove the SSD and install it in the other SSD slot.
6.
If the problem is resolved, reinstall the SSD in the original slot.

If the SSD functions properly in the original slot, the SSD carrier could have intermittent problems. Replace the SSD
carrier.
7.
If the SSD is the boot drive, make sure that the SSD is configured and connected properly.
8.
Partition and logically format the SSD.
9.
If possible, restore the files to the SSD.
Troubleshooting USB Devices

1.
Make sure that the blade is turned on.
2.
Check the USB device connection to the blade.
3.
Swap the USB device with a known-working USB device.
4.
Connect the USB devices to the blade using a powered USB hub.
5.
If another blade is installed, connect the USB device to that blade. If the USB device works with a different blade, the
first blade may be faulty.
Troubleshooting an Internal SD Card

1.
Enter the System Setup and make sure that the Internal SD Card Port is enabled.
2.
Please note that the Internal SD Card Redundancy option is enabled in the Integrated Devices screen of the System
Setup (Mirror or Disabled).
3.
Turn off the sled using the operating system commands or the CMC.
4.
Remove the sled from the enclosure.
5.
If the Internal SD Card Redundancy option in the Integrated Devices screen of the System Setup is set to Mirror
mode and SD card 1 has failed:
a. Remove the SD card from SD card slot 1.
b. Remove the SD card present in SD card slot 2 and insert it into SD card slot 1.
c. Install a new SD card in slot 2.
6.
If the Internal SD Card Redundancy option in the Integrated Devices screen of the System Setup is set to Mirror
mode and SD card 2 has failed, insert the new SD card into SD card slot 2.
7.
If the Internal SD Card Redundancy option in Integrated Devices screen of the System Setup is set to Disabled,
replace the failed SD card with a new SD card.
8.
Install the sled in the enclosure.
9.
Turn on the sled.
10. Enter the System Setup and make sure that the Internal SD Card Port option is enabled and Internal SD Card
Redundancy option is set to Mirror mode.

149
11. Check if the SD card is functioning properly.
Troubleshooting Processors
1.
2.
Open the blade.
3.
Make sure that the processor(s) and heat sink(s) are properly installed.
4.
If the system only has one processor installed, make sure that it is installed in the primary processor socket (CPU1).
5.
Close the blade.
6.
7.
Troubleshooting System Board

1.
2.
Open the blade.
3.
Clear the blade NVRAM.
4.
If there is a still a problem with the blade, remove and reinstall the blade in the enclosure.
5.
Turn on the blade.
6.
Troubleshooting the NVRAM Backup Battery

The battery maintains the blade configuration, date, and time information in the NVRAM when the blade is turned off.
You may need to replace the battery if an incorrect time or date is displayed during the boot routine.
You can operate the blade without a battery; however, the blade configuration information maintained by the battery in
NVRAM is erased each time you remove power from the blade. Therefore, you must re-enter the system configuration
information and reset the options each time the blade boots until you replace the battery.
1.
Re-enter the time and date through the System Setup.
2.
Remove the blade from the enclosure for at least one hour.
3.
4.
Enter the System Setup.

If the date and time are not correct in the System Setup, replace the battery.
NOTE: If the blade is turned off for long periods of time (for weeks or months), the NVRAM may lose its system
configuration information. This situation is caused by a defective battery.
NOTE: Some software may cause the blades time to speed up or slow down. If the blade operates normally
except for the time maintained by the System Setup, the problem may be caused by a software rather than by
a defective battery.
150

Additional Resources
Additionally, reference documents may be found at support.dell.com and/or http://salesedge/browse .

151
Document History
Document History
Date
Owner
Page
Requested By
Reviewed By
Approved By
Change
Date: 20150908
Owner: Alan Khoo
Page: Critical Callouts
Requested By: Greg Swinney, Tim

Lovass
Reviewed By: Katherine Simon, Tom

Eades
Approved By: Steven Blood
Changes: Added OEM ID Module on Easy Restore feature.

Date: 20150512
Owner: Alan Khoo
Page: Q2 2015 Block
Requested By: Andy Berke
Reviewed By: Andy Berke, Margarita

Martinez
Changes: Added Q2 2015 Block updates.

Date: 16 January 2015
Owner: Katherine Abrahams
Page: All
Requested By: Alan Khoo
Reviewed By: Katherine Abrahams
Change: Reviewed content for adherence to style guide and made the necessary adjustments.
Date: 20141118
Owner: Alan Khoo
Page: All
Requested By: Margarita Martinez
Reviewed By: Andy Berke, Margarita

Martinez
Changes: Initial Release.
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PowerEdge M630

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Global Services and

EM: Andy Berke

Dell Restricted Confidential

Using This Reference Guide........................................................................................................ 6

Field Service Information.......................................................................................................... 22

Dell Restricted Confidential

Dell Restricted Confidential

Technology and Components.................................................................................................. 91

BIOS and UEFI............................................................................................................................ 117

Dell Restricted Confidential

Pre-operating System Management Applications...................................................................................................... 117

Dell Restricted Confidential

Using This Reference Guide

Notes, Cautions, Warnings, and Tips

Additional Required Software

Dell Restricted Confidential

Locate and identify all external chassis features and connectors.

Identify any new technologies implemented and explain their significance.

Course Delivery Method

Server New Hire

Dell Restricted Confidential

Expandability, I/O, Storage

Dell Restricted Confidential

Up to two Mezzanine Cards

Leading storage performance and flexibility with 1U drive density

iDRAC 8 bringing System Management automation to mainstream IT.

Dell PowerEdge M620

Dell PowerEdge M630

Intel Xeon processor E5-2600 v2

Intel Xeon processor E5-2600 v3

24 x DDR3 RDIMM, UDIMM, and

24 x DDR4 RDIMM and LRDIMM

2.5 6Gb SAS, 3Gb SATA

2.5 12Gb SAS/6Gb SATA, 1.8 6Gb

H310 - Mini FX2 Specific

H330, H730, and H730P Mini Blade

2 x 2.5 New backplane design

SATA only From PCH

uSATA From PCH

bNDC: 2 x 10GbE, 4 x 10GbE

bNDC: 2 x 10GbE, 4 x 10GbE, 4 x 1GbE

One USB 2.0 and one USB 3.0 (front

Up to two x8 PCIe Gen3 SFF

Up to two x8 PCIe Gen3 SFF

Dell Restricted Confidential

Product Features Comparison

Dell PowerEdge M620

Dell PowerEdge M630

Heat Sink Type

Trusted Platform Module (TPM)

On board TPM 1.2

TPM Modular (FIPS TPM 1.2)

iDRAC7 (Express/Enterprise) with

iDRAC8 (Express/Enterprise) with

Internal Dual SD Module (IDSDM)

Yes, on Management Riser

One or two Intel Xeon processor E5-2600 v3 product

2133 MT/s, 1866 MT/s, 1600 MT/s, or 13333 MT/s DDR4

Memory module sockets

Memory module capacities:

4 GB (single-rank), 8 GB (dual-rank), and 16 GB (dual-rank)

4 GB (single processor configuration)