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XTR108
108
DESCRIPTION
APPLICATIONS
CS1
CS2
SDIO
SCLK
EEPROM
SPI and
Control Circuits
Excitation
Linearization
V/I-0
VPS
4-20mA
V/I-2
V/I-3
V/I-4
Multiplexer
V/I-1
IO
PGA
V/I
RLOAD
V/I-5
R1
R2
R3
R4
R5
XTR108
IRet
RTD
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola, Inc. All other trademarks are the property of their respective owners.
Copyright 2001-2005, Texas Instruments Incorporated
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ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
XTR108EA
XTR108EA/2K5
Rails
Tape and Reel, 2500
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
XTR108EA
SSOP-24
DBQ
40C to +85C
XTR108EA
"
"
"
"
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at
www.ti.com.
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = 40C to +85C.
At TA = +25C, VPS = 24V, and Supertex DN2540 external depletion-mode FET transistor, unless otherwise noted, all voltages measured with respect to IRET pin.
XTR108EA
PARAMETER
VIN TO IOUT TRANSFER FUNCTION
Output
Specified Range
Over-Scale Limit Resolution
Fault Over-Scale Level(1)
Under-Scale Limit Resolution
Fault Under-Scale Level(1)
Output for Zero Input
Zero Error, Unadjusted
vs Temperature
vs Loop-Supply Voltage, VLOOP
vs Common-Mode Voltage
Adjustment Resolution, Zero Input
Adjustment Range, Zero Input
Span(2)
Initial, Unadjusted
Drift (vs Temperature)
Span Adjustment Resolution
Span Adjustment Range
PGA + Output Amplifier(3)
Nonlinearity, Ideal Input
PGA
Autozeroing Internal Frequency
PGA Offset Voltage (RTI)(4)
vs Temperature
vs Supply Voltage, VS
vs Common-Mode Voltage
Common-Mode Input Range
Input Bias Current
vs Temperature
Input Offset Current
vs Temperature
CONDITIONS
MIN
TYP
MAX
UNITS
20
mA
mA
mA
mA
mA
0.5
+1.0
0.2
0.4
VIN = 0V
50
0.2
0.02
1
1.8
4
Span = IO/VIN
RVI = 6.34k
Full-Scale VIN = 50mV
1.5
1
40
0.05
49.3
%
ppm/C
%
3150
0.01
6.5
10
0.02
0.5
105
VCM = 1V
VS = 4.5V to 5.5V
VCM = 0.2V to 3.5V
0.2
50
VS 1.5
50
Doubles/10C
10
Doubles/10C
A
A/C
A/V
A/V
A/Step
mA
mA/V
%
kHz
V
V/C
V/V
dB
V
pA
pA
pA
pA
XTR108
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SBOS187C
vs Temperature
Output Voltage Range(5)
Typical Operating Range
Capacitive Drive
Short-Circuit Current
ZERO OFFSET DACS
Zero-Code Output Level
RTO(6) of Current Amplifier
RTO(6) of PGA
Coarse DAC, 256 Steps
Adjustment Range
RTO(6) of Current Amplifier
RTO(6) of PGA
Step Size
RTO(6) of Current Amplifier
RTO(6) of PGA
Linearity
Fine DAC, 256 Steps
Adjustment Range
RTO(6) of Current Amplifier
RTO(6) of PGA
Step Size
RTO(6) of Current Amplifier
RTO(6) of PGA
Linearity
Noise, RTO(6)
CONDITIONS
LINEARIZATION DAC
Linearization Range, 256 Steps
Max Linearization Coefficient
Step Size
SUB-REGULATOR, VS
Voltage
vs Temperature
vs Loop-Supply Voltage
6.25
0.2
0.5
0.5
0.8
30
MAX
UNITS
G || pF
G || pF
Vp-p
400
2.5
3
3.5
4.5
0.5 to 2.5
200
+6/9
V/V
%
%
%
ppm/C
V
V
pF
mA
4.116
522
7 Bits + Sign
mA
mV
3.77 to +3.77
470 to +470
mA
mV
0.029
3.7
0.5
7 Bits + Sign
mA
mV
LSB
236 to +236
29.4 to +29.4
A
mV
0.0018
0.23
1
1.1
mA
mV
LSB
Ap-p
f = 0.1Hz to 10Hz
RSET = 12.1k
49
50
10
51
A/A
ppm/C
480
493
7 Bits + Sign
195 to +195
1.54
7 Bits + Sign
12.2 to +12.2
96
510
VS 2
f = 0.1Hz to 10Hz
A
A
A
nA
0.2
0.5
35
0.2
10
VS 1.5
100
0.015
LSB
LSB
ppm/C
%
ppm/C
V
M
Ap-p
8 Bits
0.99
3.9
A/mV
nA/mV
XTR108
SBOS187C
TYP
30 || 6
50 || 20
6
CURRENT AMPLIFIER
Current Gain
Current Gain Drift
CURRENT SOURCES, IREF1 AND IREF2
Zero-Code Output Level, Each
Coarse DAC, 256 Steps
Adjustment Range(7)
Step Size
Fine DAC, 256 Steps
Adjustment Range(7)
Step Size
Linearity
Coarse
Fine
vs Temperature
Matching
vs Temperature
Compliance Voltage, Positive(5)
Output Impedance
Current Noise
MIN
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5.1
50
0.03
5.4
V
ppm/C
mV/V
CONDITIONS
MIN
RVI = 6.34k
RVI = 6.34k
UNITS
Bits
20.7 to 28.1
2.625 to 3.563
mA
V
0.49
62.5
10
3
mA
mV
%
Bits
2.17 to 3.55
275 to 450
mA
mV
0.195
25
5
mA
mV
%
50
V
ppm/C
VS 0.2
mV
V/C
dB
dB
V
V
2
3
90
110
0 to 3.5
VCM = 2V
RL = 10k to VS / 2
MAX
1.193
5
0.2
CMOS
0
3.5
IOL = 300A
IOH = 300A
VS 1
200
20
20
INTERNAL OSCILLATOR
Frequency, fOSC
120
6
6
0.8
VS
0.4
V
V
V
V
10
10
10
A
A
A
210
TEMPERATURE RANGE
Specification
Operating
JA, Junction to Ambient
LOOP SUPPLY
Voltage Range
Quiescent Current
TYP
100
C
C
C/W
0.5
V
mA
40
55
kHz
+85
+125
7.5
NOTES: (1) Over-scale and under-scale complies with NAMUR NE43 recommendation. (2) Span adjustment is determined by PGA gain and sensor
excitation. (3) Span can be digitally adjusted in three ways: PGA gain, current reference Coarse, and current reference Fine. (4) RTI = Referred to Input.
(5) Current source output voltage measured with respect to IRET. (6) RTO = Referred to Output. (7) Excitation DAC range sufficient to adjust span fully
between PGA gain steps. (8) Output current into external circuitry is limited by an external MOS power FET. (9) Measured with over- and under-scale limits
disabled.
XTR108
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SBOS187C
PIN CONFIGURATION
Top View
SSOP
V/I-0
24
OPA +IN
V/I-1
23
OPA IN
V/I-2
22
OPA OUT
V/I-3
21
REFOUT
V/I-4
20
REFIN
V/I-5
19
RSET
XTR108
CFILTER
18
CS1
RLIN
17
SCLK
VO
16
SDIO
IIN
10
15
CS2
IO
11
14
VGATE
IRET
12
13
VS
PIN ASSIGNMENTS
PIN
V/I-0
V/I-1
V/I-2
V/I-3
V/I-4
V/I-5
CFILTER
RLIN
VO
IIN
IO
IRET
VS
VGATE
CS2
SDIO
SCLK
CS1
RSET
REFIN
REFOUT
OPA OUT
OPA IN
OPA +IN
NAME
FUNCTION
MUX
MUX
MUX
MUX
MUX
MUX
Input
Input
Input
Input
Input
Input
XTR108
SBOS187C
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TYPICAL CHARACTERISTICS
At TA = +25C, V+ = 24V, unless otherwise noted. RVI = 6.34k.
TRANSCONDUCTANCE vs FREQUENCY
90
G = 400
60
50
80
G = 200
40
Rejection (20log mA )
V
Transconductance (20log mA )
V
70
G = 50
30
20
10
0
10
G = 6.25
70
60
G = 100
50
40
30
G = 6.25
G = 400
20
20
30
100
10
10k
1k
10
100k 200k
100
1k
100k
100
120
90
110
80
Transconductance
(20 log(mA/V))
Transconductance
(20 log(mA/V))
10k
Frequency (Hz)
Frequency (Hz)
70
60
50
100
90
80
40
70
30
60
20
10
100
1k
10k
10
100
Frequency (Hz)
1k
10k
Frequency (Hz)
IREF vs TEMPERATURE
492
20%
18%
Percent of Units
16%
IREF (A)
490
488
14%
12%
10%
8%
6%
4%
2%
1.00
0.90
Temperature (C)
0.70
125
0.50
100
0.30
75
0.10
50
0.10
25
0.30
0.50
25
0.70
0%
50
0.90
486
75
XTR108
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SBOS187C
VIN
VIN
20mA
IOUT
IOUT
20mA
4mA
4mA
CFILT = 0
CFILT = 0.01F
500s/div
VIN
VIN
250s/div
20mA
IOUT
IOUT
20mA
4mA
4mA
CFILT = 0
500s/div
250s/div
10
100
CFILT = 0.01F
1.0
0.1
10
1
1
10
100
1k
10k
Frequency (Hz)
XTR108
SBOS187C
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10
100
Frequency (Hz)
1k
10k
1000
1.25V/div
100
CFILT = 0.01
10
1
10
100
1k
5s/div
10k
Frequency (Hz)
OVERVIEW
EE PROM
SDIO
CS2
SCLK
CS1
Isolation
Couplers
Calibration
System
Calib
GND
XTR108
IO
IRET
TX
GND
RV
PS
RX
GND
XTR108
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SBOS187C
THEORY OF OPERATION
REFERENCE
The XTR108 has an on-board precision bandgap voltage
reference with output at pin 21 (REFOUT). The value of the
reference is factory-trimmed to 1.193V, with a typical temperature drift of 5ppm/C. Pins 21 (REFOUT) and 20 (REFIN)
must be connected together to use the internal reference.
External circuitry, such as a voltage excited sensor or an
Analog-to-Digital Converter (ADC), can be connected to the
REFOUT pin. The unbuffered REFOUT is capable of sourcing
current but not sinking.
If the application necessitates, an external reference can be
connected to the XTR108 REFIN pin, as long as the reference
does not exceed 1.4V. The REFIN pin has a high input
impedance with the input current not exceeding a few
nanoamps.
INPUT MULTIPLEXER
The XTR108 input multiplexer is a full 6 by (2+2) crosspoint switch. The current references and PGA inputs can be
independently connected to any of the six external pins,
including simultaneous connections to the same pin. This
allows a great flexibility in the sensor excitation and input
configuration. The input pins must not be driven below the
IRET potential or above VS.
See Figure 2 for an RTD sensor connected to pin VIN0 with
both IREF supplied and PGA VIN+ sensed at that pin. The
other five input pins are used for a bank of RZ resistors that
can be selected during the calibration process for a particular
measurement range.
PROGRAMMABLE GAIN
INSTRUMENTATION AMPLIFIER
The programmable gain instrumentation amplifier has seven
voltage-gain settings in binary steps from 6.25V/V to 400V/V.
The input common-mode range of the PGA is 0.2V to 3.5V
above the IRET potential.
Normally, in the application for 4-20mA transmitters, the
PGA output voltage range should be set to VZERO = 0.5V and
VFS = 2.5V. Connecting a resistor (RVI = 6.34k) between
pin 9 (VO) and pin 10 (IIN) converts this voltage to the signal
for the output amplifier that produces a 4-20mA scale
current output. In this mode, the PGA voltage gain converts
to an overall transconductance in the range of 50mA/V to
3200mA/V (approximately). Table I shows the gain to
transconductance relationship.
VOLTAGE GAIN
V/V
6.25 12.5
OUTPUT TRANSCONDUCTANCE
mA/V
49
99
320 160
25
50
40
ZERO DACS
20
10
XTR108
SBOS187C
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RTD
RCM
V/I-5
V/I-4
V/I-3
V/I-2
V/I-1
V/I-0
OPA OUT
Multiplexer
10
XTR108
SBOS187C
OPA IN
0.01F
CFILT
PGA
ILIN
DAC
IREF
DAC
OPA +IN
15.8k
RLIN
CS2
12.1k
RSET
IIN
OSC
RVI
6.34k
VOUT
SDIO SCLK
SPI and
Control Circuits
Linearization
Circuit
Zero
DAC
CS1
2.5k
51
Output
Current
Amplifier
Sub-Regulator
Driver
XTR108
Voltage
Reference
REFIN
IRET
IO
VS
VGate
CGATE
REFOUT
CREG
4-20mA
CLOOP
RLOAD
Loop
Supply
OVERALL
PROGRAM
COARSE DAC
FINE DAC
V Z PROGRAM =
V Z COARSE =
V Z FINE =
3.5V REF
8
I Z PROGRAM =
V REF N13
80
4
I Z COARSE =
V REF N12
80
64
I Z FINE =
175V REF
8R VI
5V REF N13
8R VI
4
5V REF N12
8R VI
64
NOTE: N13 and N12 are assigned decimal values of registers 13 and 12, respectively.
COARSE DAC
FINE DAC
IREF PROGRAM =
IREF COARSE =
IREF FINE =
5V REF
R SET
V REF N11
64
R SET
N
V REF
10
R SET 1024
NOTE: N11 and N10 are the decimal values of registers 11 and 10,
respectively.
XTR108
SBOS187C
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11
I REF
N14
V IN 16 R LIN
Nonlinearity (%)
4
3
2
1
Uncorrected
RTD Nonlinearity
Corrected
Nonlinearity
MOSFET MODEL
CGATE VALUE
Supertex
DN2535, DN2540
DN3535, DN3525
220pF
1000pF
Siliconix
ND2012, ND2020
220pF
Infineon
BSP149
1000pF
UNCOMMITTED OP AMP
1
200C
+850C
Process Temperature (C)
12
XTR108
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SBOS187C
CONTROL REGISTERS
POWER-GOOD/POWER-ON RESET
BIT
F0
F1
F2
F3
FAULT MODE
Negative Input Exceeds Positive Limit.
Negative Input Exceeds Negative Limit.
Positive Input Exceeds Positive Limit.
Positive Input Exceeds Negative Limit.
Instruction
D7
D6
D5
D4
D3
D2
D1
D0
Read/Write
R/W
A3
A2
A1
A0
Read/Write Operation
EEPROM Mode
Assert CS2
Ignore Serial Data/A
Data Bit
D7
D6
D5
D4
D3
D2
D1
D0
RST
0
0
0
0
FD
0
AC7
0
0
FG7
CG7
FZ7
CZ7
L7
S7
CSE
0
0
0
0
US2
0
AC6
VP2
IB2
FG6
CG6
FZ6
CZ6
L6
S6
0
0
0
0
0
US1
0
AC5
VP1
IB1
FG5
CG5
FZ5
CZ5
L5
S5
0
0
0
0
0
US0
0
AC4
VP0
IB0
FG4
CG4
FZ4
CZ4
L4
S4
0
0
0
F3
0
OS3
0
AC3
0
0
FG3
CG3
FZ3
CZ3
L3
S3
0
0
0
F2
0
OS2
G2
AC2
VN2
IA2
FG2
CG2
FZ2
CZ2
L2
S2
0
0
0
F1
0
OS1
G1
AC1
VN1
IA1
FG1
CG1
FZ1
CZ1
L1
S1
0
0
0
F0
RBD
OS0
G0
AC0
VN0
IA0
FG0
CG0
FZ0
CZ0
L0
S0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Read/Write
Reserved
Reserved
Read Only
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Control Register 1
XTR108
SBOS187C
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13
OS3
OS2
OS1
OS0
VO OVER-SCALE
THRESHOLD
IO OVER-SCALE
THRESHOLD
RVI = 6.34k
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
2.625V
2.6875V
2.75V
2.8125V
2.875V
2.9375V
3.0V
3.0625V
3.125V
3.1875V
3.25V
3.3125V
3.375V
3.4375V
3.5V
3.5625V
20.7mA
21.2mA
21.7mA
22.2mA
22.7mA
23.2mA
23.7mA
24.2mA
24.6mA
25.1mA
25.6mA
26.1mA
26.6mA
27.1mA
27.6mA
28.1mA
US2
US1
US0
VO UNDER-SCALE
THRESHOLD
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
450mV
425mV
400mV
375mV
350mV
325mV
300mV
275mV
IO UNDER-SCALE
THRESHOLD
RVI = 6.34k
3.55mA
3.35mA
3.15mA
2.96mA
2.76mA
2.56mA
2.37mA
2.17mA
G2
G1
G0
PGA
VOLTAGE GAIN
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
6.25V/V
12.5V/V
25V/V
50V/V
100V/V
200V/V
400V/V
Reserved
SIGNAL PATH
TRANSCONDUCTANCE
RVI = 6.34k
49mA/V
99mA/V
197mA/V
394mA/V
789mA/V
1577mA/V
3155mA/V
AC
AC
AC
AC
AC
AC
AC
AC
7
h
l
6
l
h
5
l
l
4
h
h
3
n
l
2
n
h
1
l
n
0
h
n
VINN
VINP
VP1
VP0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
VIN+
VIN+
VIN+
VIN+
VIN+
VIN+
Connected
Connected
Connected
Connected
Connected
Connected
Reserved
Reserved
to
to
to
to
to
to
V/ I-0
V/ I-1
V/ I-2
V/ I-3
V/ I-4
V/ I-5
VN1
VN0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
VIN
VIN
VIN
VIN
VIN
VIN
Connected
Connected
Connected
Connected
Connected
Connected
Reserved
Reserved
to
to
to
to
to
to
V/ I-0
V/ I-1
V/ I-2
V/ I-3
V/ I-4
V/ I-5
14
XTR108
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SBOS187C
IA1
IA0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
IB2
IB1
IB0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
IREF CONNECTION
IREF1
IREF1
IREF1
IREF1
IREF1
IREF1
Connected to
Connected to
Connected to
Connected to
Connected to
Connected to
Reserved
Reserved
V/ I-0
V/ I-1
V/ I-2
V/ I-3
V/ I-4
V/ I-5
IREF CONNECTION
IREF2
IREF2
IREF2
IREF2
IREF2
IREF2
Connected to
Connected to
Connected to
Connected to
Connected to
Connected to
Reserved
Reserved
V/ I-0
V/ I-1
V/ I-2
V/ I-3
V/ I-4
V/ I-5
SERIAL INTERFACE
PROTOCOL
The XTR108 has an SPI-compatible serial interface. The
data is transmitted MSB first in 8-bit bytes. The first byte is
an instruction byte in which the first bit is a read/write flag
(0 = write, 1 = read), the lowest four bits are the register
address and the remaining three bits are set to zero. The
second, and all successive bytes, are data. During a write
operation, the successive data bytes are written to successive
registers within the XTR108. The address is automatically
incremented at the completion of each byte. The SDIO line
is always an input during a write operation. During a read
operation, the SDIO line becomes an output during the
second and successive bytes. As in the case of a write
operation, the address is automatically incremented at the
completion of each byte. Each communication transaction is
terminated when CS1 is de-asserted. The CS2 line remains
de-asserted during read and write operations.
The calibration controller also needs to be able to read from
and write to the external EEPROM device. This is accomplished by sending a special instruction code (0x7F) to the
XTR108. At the completion of this instruction byte, the
XTR108 will assert the CS2 line to select the EEPROM
device and ignore all data on the SDIO line until CS1 is deasserted and reasserted. The CS2 line will also be deasserted when CS1 is de-asserted. This allows the calibration controller to communicate with the EEPROM device
directly. The calibration controller then has control over the
timing required to write data to the EEPROM device.
In normal operation, the XTR108 reads data from the EEPROM
device to retrieve calibration coefficients. This is accomplished by the read-back controller on the XTR108. The readback controller is clocked by an on-chip oscillator and provides stimulus to the EEPROM device over the SCLK, SDIO,
and CS2 lines to perform the read operation, while simultaneously providing stimulus to the serial interface controller in
the XTR108. The read-back controller defaults to being active
when the XTR108 is powered on and will be continuously
active unless disabled. (It will start a new read operation as
soon as the previous operation is completed, see Figure 4.) A
control bit (RBD) is provided to allow the XTR108 to read the
EEPROM once and then stop.
The read-back controller will abort a read-back operation
when the CS1 line is asserted. The calibration controller
must wait at least 40s after setting the CS1 line LOW
before the first rising edge of SCLK occurs.
For an external controller to write directly to the XTR108
(sensor calibration operation) or load data into the EEPROM,
it is necessary to interrupt the default read-back mode. For
both of these modes, the SCLK direction must be reversed.
See Figure 5 for the timing of this operation. First, the SCLK
line must be pulled LOW for at least 20ns (t10). Then CS1
is set LOW. The XTR108 will set DIO to a tri-state within
20ns (t13) and CS2 HIGH within 50ns (t12). After a delay of
at least 40s (t11), the external system will start communication with a rising edge on SCLK.
XTR108
SBOS187C
www.ti.com
15
Hi-Z
SCLK
t8
t8
DIO
t9
Instruction/Address to EEPROM
CS2
FIGURE 4. Timing Diagram for the XTR108 Continuous Readback Cycle. (See Table XIV for timing key.)
SCLK
t10
t11
DIO
t13
CS2
t12
CS1
FIGURE 5. Interrupting an XTR108 EEPROM Readback Cycle. (See Table XIV for timing key.)
As long as CS1 is held LOW, the external system can write to
the EEPROM. See Figure 7 for this timing. Releasing CS1
will allow the XTR108 to resume in the read-back mode.
For interactive calibration operations, the first command to
the XTR108 should set bit 0, Register 4 (RBD). This will
disable the read-back mode. It will be possible to write to the
various registers and cycle CS1. If RBD is not set, then as
soon as CS1 is released, the XTR108 will read the EEPROM
16
XTR108
www.ti.com
SBOS187C
CS1
t7
t1
t5
SCLK
t2
t2
t3
t4
t6
DIO
FIGURE 6. Timing Diagram for Writing to and Reading From the XTR108 with EEPROM Readback Disabled. (See Table
XIV for timing key.)
SCLK
DIO
Instruction to XTR108
CS1
t14
CS2
FIGURE 7. Writing to and Reading From the EEPROM Device From External Controller. (See Table XIV for timing key.)
SPEC
DESCRIPTION
MIN
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
2.0
100
20
20
20
0
0
TYP
MAX
50
20
5
10
20
40
0
0
0
50
20
20
0.9
UNITS
ns
ns
ns
ns
ns
ns
ns
us
us
ns
us
ns
ns
ns
kHz
XTR108
SBOS187C
www.ti.com
17
18
XTR108
www.ti.com
SBOS187C
10
V+
0.01F
XTR108
14
D1(1)
1N4148
Diodes
13
RL
VPS
IO
11
IRET
12
RTD APPLICATION
The values to be entered into the DAC control registers are
given by the formulas in Table XV.
EXCITATION CURRENT IREF
1) For a chosen temperature range, using an industry-standard polynomial set as shown in Table XVI, calculate
RTD values at min, max, and the middle temperatures:
64 IREFR SET
320
N11 = round
VREF
BV =
5120 16 N11
N10 = round
VREF
3) Pick an external zero resistor, RZ closest to RMIN. Selecting RZ greater than RMIN will cause a voltage offset that
must be corrected by the PGA zero adjustment.
4) Calculate the linearization coefficient::
32 I ZEROR VI
140
N13 = round
5 VREF
G LIN =
512 I ZEROR VI
2240 16 N13
N12 = round
5 VREF
[
]
1
+
+
1
0
850
At
B
for
C
t
<
<
C
[
]
(0.5 + BV ) R MAX
2 BV
(0.5 BV ) R MIN 2 BV R Z
R MAX + R MIN
2
R MAX R MIN
R MID
A = 3.9083e 3
B = 5.775e 7
C = 4.183e 12
XTR108
SBOS187C
www.ti.com
19
(I
OUTMAX
) (
Step 3.
Calculate corrections using the following equations:
I REFA =
R Z A = R MIN +
G LINA =
(I MEAS2 I MEAS1 ) R VI
IREFB =
(I ZERO I MEAS1 )R VI
50 A PGA I REFA
2 BV
) (
R VI
Example:
Measurement Range: TMIN = 20C, TMAX = 50C; 100
RTD.
1) RMIN = 92.16, RMAX = 119.40, RMID = 105.85;
VREF
50 APGAIREFB RMIN R Z A
R VI
512 IZEROR VI
Adjusted IZERO fine DAC Code : N12 A = N12 + round
5 VREF
20
XTR108
www.ti.com
SBOS187C
ERROR SOURCE
INPUT
Input Offset Voltage
vs Common Mode
Input Bias Current
Input Offset Current
ERROR EQUATION
Note (1)
CMRR CM/(VIN MAX) 106
Note (1)
Note (1)
Note (1)
CM/ROUT RRTD MIN/(VIN MAX) 106
Note (1)
1LSBFINE RRTD MIN/(VIN MAX) 106
0.1V/100M 100/40mV
96nA 100/40mV 106
Total Excitation Error:
Note (1)
Nonlinearity (%)/100% 106
CALIBRATED ERROR
(ppm of Full Scale)
0
12.5
0
0
12.5
0
2.5
240
242.5
0.01%/100% 106
Total Gain Error:
0
100
100
Note (2)
2 1.8A/16mA 106
Total Output Error:
0
6
225
231
OUTPUT
Zero Output
vs Supply
DAC Resolution and Linearity
Note (1)
(IZERO vs V+) V+/16mA 106
2LSBFINE/16mA 106
10
700
390
600
250
1950
6V/40mV 106
0.015A 100/40mV 106
1.1A/16mA 106
Total Noise Error:
150
37.5
68.5
256
TOTAL ERROR:
2792 (1997)(3)
0.28% (0.20%)(3)
NOTES: (1) Does not contribute to the output error due to calibration. (2) All errors are referred to input unless otherwise stated. (3) Calculated as rootsumsquare.
XTR108
SBOS187C
www.ti.com
21
APPLICATIONS
RTD CONNECTION METHODS
Two-Wire Connection
The simplest circuit that can be used to connect an RTD to
the XTR108 is the two-wire connection shown in Figure 9.
If the RTD is separated from the XTR108 by any distance
the resistance of the lead wires can cause significant error in
the reading. This wire resistance is noted as RLINE1 and
RLINE2. If the RF filter is not required, then the PGA inputs
could be taken from the same pins as are used for the current
sources.
Three-Wire Connection
It is possible to minimize the errors caused by the lead-wire
resistance by connecting the RTD, see Figure 10. Operating
under the assumption that the wire connecting pin 1 to the
XTR108 is the same length as the wire at pin 2, and with the
current through the RTD identical to the current through RZ
any error voltage caused by the lead-wire is the same on both
sides. This appears as a common-mode voltage and is
subtracted by the PGA.
The circuit in Figure 10 also shows a scheme where one
board can be optimized for a wide range of temperatures.
Consider a range of applications where there are up to five
different minimum temperatures. Select RZ1 through RZ5 to
be optimum for each of the minimum temperatures. The
configuration codes in the EEPROM can be set to select that
resistor for that unique situation.
Four-Wire Connection
For those applications where the resistance of the lead-wires
is not equal, it may be an advantage to add a precision op
amp to a four-wire connection, see Figure 11. The voltage
offset and drift are error terms that degrade the operation of
the system. This circuit does not suffer any loss of accuracy
for the resistance of the RTD lead-wires.
BRIDGE SENSOR CONNECTIONS
Fixed Voltage Excitation
There exists a class of sensors that are best supplied with a
voltage source excitation such as the bridge sensor shown in
Figure 12. The excitation voltage here is given by:
R
VEX = VREF 1 + 1
R
2
Uni-Directional Linearity Control
The circuit in Figure 13 shows a bridge sensor with an
excitation voltage that is adjusted to linearize the response
using the same algorithm as the RTD linearization.
VEX = 2 I REF R I
1k
1
1k
RTD
RZ
0.01F
0.01F
RLINE2
Multiplexer
RLINE1
IRET
RCM
2
0.01F
22
XTR108
www.ti.com
SBOS187C
R21
Equal line resistances here create a
small common-mode voltage which is
rejected by the XTR108.
R22
R23
1
RLINE2
RLINE1
Multiplexer
R24
R25
RTD
IRET
RLINE3
3
Resistance in this line causes a small
common-mode voltage which is rejected
by the XTR108.
RCM
0.01F
FIGURE 10. Three-Wire RTD Connection with Multiple Minimum Temperature Capabilities.
VS
RLINE1
RLINE2
RTD
RLINE3
RLINE4
Multiplexer
RZ
OPA277
IRET
RCM
0.01F
XTR108
SBOS187C
www.ti.com
23
VREF
R1
Multiplexer
R2
IRET
FIGURE 12. Voltage Excited Bridge with Excitation Derived from VREF.
VREF
Multiplexer
R1
IRET
24
XTR108
www.ti.com
SBOS187C
to build this charge pump using two resistors, two capacitors, and two diodes (in an SOT package). The charge pump
uses the clock signal from the XTR108 SCLK pin to operate;
consequently, the XTR108 must be in continuous EEPROM
read mode (register 4, bit 0). Figure 15 shows the typical
output of this circuit (50mV dc).
VOUT = 50mV
BAV99
OPA IN
OPA +IN
CS1
CS2
36.5k
1nF
SDIO SCLK
30k
330pF
XTR108
SPI and
Control Circuits
OPA OUT
REFIN
OSC
Voltage
Reference
REFOUT
IREF
DAC
+5V
ILIN
DAC
Sub-Regulator
Driver
Zero
DAC
V/I-0
V/I-3
V/I-4
Multiplexer
V/I-1
V/I-2
DSUB
PGA
Q1
Output
Current
Amplifier
IQ1 = 0mA
0mV
V/I-5
RZ1 RZ2 RZ3 RZ4 RZ5
2.5k
Linearization
Circuit
RTD
CFILT
RCM
VS
+0V
VGate
RLIN
0.01F
15.8k
51
IO
RSET
VOUT
IIN
IRET
12.1k
VOUT
XTR108
SCLK
5.0V
50mV
Charge
Pump
Output
XTR108
SBOS187C
www.ti.com
25
CS1
XTR108
Microcontroller
VCC
CS1
1k
SCLK
SCLK
DIO
SCLK
DIO
CS2
CS
CS1
SCLK
DIO
Memory
26
XTR108
www.ti.com
SBOS187C
www.ti.com
7-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
XTR108EA
ACTIVE
SSOP
DBQ
24
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
XTR108EA
XTR108EA/2K5
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
XTR108EA
XTR108EA/2K5G4
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
XTR108EA
XTR108EAG4
ACTIVE
SSOP
DBQ
24
TBD
Call TI
Call TI
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
www.ti.com
7-Nov-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
16-Aug-2012
Device
XTR108EA/2K5
DBQ
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
9.0
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
16-Aug-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
XTR108EA/2K5
SSOP
DBQ
24
2500
367.0
367.0
38.0
Pack Materials-Page 2
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