Professional Documents
Culture Documents
Wireless Systems
Executive Team
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AT&T:LAN
VLSI Architectures
UIUC:MAP
AT&T:VDSL
Integrated Circuit Design
Intersymbol:EDC
Communication ICs
UIUC:ANT
Communicationsinspired SOC 3
Communication IC design
i FEC-based high-speed serial links (w/ Rosenbaum)
i Low-power turbo and LDPC decoders
Communications-Inspired Design
i Stochastic sensor network-on-a-chip (w/ Doug Jones)
i System level power optimization of low-power links (w/ Andy
Singer)
i Error-resilient high-data rate 4G Viterbi decoders
i Robust SRAM design
i Joint equalization and coding for on-chip busses
i Low-power media kernels
IC Reliability (Rosenbaum)
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Zero-inductor CB
CE cascode*
[Ismail, ISSCC04]
S21
17.0 dB @ 2GHz
19.1 dB at 7GHz
16.1 dB
21 dB
-3dB BW
DC 10 GHz
DC 17 GHz
2 10 GHz
Noise Figure
4.7dB @ 10 GHz
5.65dB @ 10GHz
4.5dB @ 10GHz
S11
< -10dB
< -10dB
< -10dB
Linearity
-1dbCP = -17.1dBm
-1dBCP = -16.8dBm
IIP3 = 0dBm
VCC
2.7 V
2.7 V
2.7 V
Power dissipation
3.65 mW
3.65 mW
27 mW
ESD Protection
> 1.5 kV
> 1.5 kV
Technology
0.18m SiGe
BiCMOS
0.18m SiGe
BiCMOS
0.18m SiGe
BiCMOS
HS
C
Circuit
Design
Device
Model
DSP
RF FRONT END
IQ Modulator
IQ Demodulator
DAC
DSP
ADC
900
PA
900
LNA
DAC
ADC
VCO
PLL
10
25
20
15
10
NFmin (dB)
0
0
10
15
20
25
Frequency (GHz)
10
ADI 12401
ADC Architecture
Pipeline
Interleaving
Calibration method
Resolution
12 bits
12 bits
SNR
65 dB
64 dB
Sample rate
400 MS/s
400 MS/s
Supply voltage
1.2 V
3.7/3.5/1.5 V
Reference voltage
1 V (diff. p-p)
Power consumption
500 mW (analog)
6.8 W
Technology
0.13-m CMOS
0.35-m?
11
Distorted spectrum
Compensated spectrum
EVMRMS= 92%
EVMRMS= 4.2%
ACPR = 54 dB
ACPR = 67 dB
m-1 MUX
1-m DEMUX