Professional Documents
Culture Documents
( Reaffirmed 1996 )
Indian Standard
( First Revision )
Second Reprint SEPTEMBER
UDC
1994
691116 : 674816.41
Q Copyright 1986
BUREAU
OF
MANAK
BHAVAN.
INDIAN
9
NEW
BAHAJXJR
DELHI
STANDARDS
SHAH
11OMQ
WFAR
MARC3
I!3:3087-1985
Indian Standard
SPECIFICATION FOR WOOD
PARTICLE BOARDS ( MEDIUM DENSITY )
FOR GENERAL PURPOSES
(
First Revision )
Wood Products
chairman
DR P. M.
IndiasAy
GANAPATHY
Representing
Industries
Research
Institute,
Institute
( CSIR ),
Members
to
Cent;dmr%ilding
Research
)
Directorate General of Civil Aviation, New Delhi
Forest Department, Government of Assam
Federation of Indian Plywood and Panel Industry,
New Delhi
SHRI M. R. MOTEYED( Alternate )
National Buildings Organization, New Delhi
EDITOR
Ministry of Defence ( DGI ), New Delhi
SHRI D. P. GHOST
SHRI J. K. S~NHA( Alternate )
Directorate
General of Technical Development,
I~o~srn1.4~ ADVISER .
New Delhi
SHRI P. V. MEHTA( Alternate )
Ministry of Railways ( RDSO ), Lucknow
JOINTDIRECTORSTANDARDS
( CARRIAGE-I)
The Western Indian Plywood Limited, Cannanore
SHRI A. K. KADERKUT~Y
Ministry of Defence ( R and D ), New Delhi
SHRI U. B. KANCHAN
SHR~B. B. MEHTA( Alternate )
( Continued on page 2 )
BUREAU
@I Copyright 1986
OF INDIAN STANDARDS
This Publication is protected under the Indian Copyrighl Act ( XIV of 1957 ) and
reproduction in whole or in part by any means except with written permission of the
publisher shall be deemed to be an infringement of copyright under the said Act.
IS : 3087 -
1985
( Confinuedffampage 1 )
Members
Repremlng
SHRI K. S. LAULY
Indian Plywood Manufacturing Co Ltd, Dandoli
LT-COL G. B. SINOH( Afternate )
In personal capacity ( C - 59, Inderpuri, New Delhi )
DR A. N. NAYER
DR A. PTJRUSHOTHAM
Indian Academy of Wood Science, Dharwad
DR SATISHKUMAR( Alternate )
SHRI A. K. RAMACHANDRAN
Association,
SHRIJOSEPH
K. KURIAN( Aiternate )
Engine~ne~X&iefs
SHRIP. R. RIOHSINO~NI
Branch,
Army
Headquarters,
Assa~ssa~lywood
Manufacturers
Association,
&RI S. N. SANYAL
Forest Research
SECRETARY
SHRI SWARANSINOH
SUPEIUNTENDINO
SURVEYOROF
WORKS ( NZ )
SURVEYOROF WORKS ( NZ ) ( Alternate )
Sitapur Plywood Manufacturers Ltd. Sitapue
SHRI II. THOMSON
Director General, IS1 ( Ex-oficio Memh? )
SHRI G. RAMAN,
Director ( Civ Engg )
Secretary
SHRI P. SATYANARAYANA
Assistant Director ( Civ Engg ). IS1
Wood-Based
Building
Boards
Sub Committee,
BDC 20 : 6
Convener
SHRI J. S. MATHARU
M - 39C. Rajouri ffarden, New Delhi 110010
Representing ,,
Uemfbzrs
DR ARNN DAS
Gzntr;rw Bn&img
Research
Institute
( CSIR ),
( Codnucd
2
on page 19 )
IS :3087-1985
Indian Standard
SPECIFICATION FOR WOOD
PARTICLE BOARDS ( MEDIUM DENSITY )
FOR GENERAL PURPOSES
( First Revision )
0. FOREWORD
0.1 This Indian Standard ( First Revision ) was adopted by the Indian
Standards Institution on 30 August 1985, after the draft finalized by the
Wood Products Sectional Committee had been approved by the Civil
Engineering Dtvision Council.
0.2 There are three catagories of particle boards based on their density
classification namely high density particle board having specific gravity
over 0.9 covered in IS : 3478 - 1968*, low density particle boards having
specific gravity not exceeding 0.4 covered in IS : 3129 - 1965t and medium
density particle board covered in this standard having specific gravity in
the range of 0.5 to 0.9.
0.3 Medium density particle boards are used for partitions, for doors, in
the furniture industry, etc. This standard was first formulated in 1965 to
provide guidance in the manufacture of med!am density particle boards.
Based on the development in the particle board industry, this revision has
been taken up. In this revision the types of particle boards have been
redefined and the requirements in respect of the physical and mechanical
characteristics have also been revised. Other significant changes relate to
the inclusion of test for screw withdrawal strength and deletion of that for
,
thermal conductivity and tensile strength.
0.4 All organic building materials are prone to decay if they are used in
damp and unventilated situations without adequate protective treatment. lt
is, therefore, recommended that the guidance of the manufacturers should
be sought when it is proposed to use wood-particle boards in conditions
condusive to the growth of fungs or moulds. BS : 1982 Methods of testing
fungal resistance ( corresponding Indian Standard to be formulated in due
course ) provides means for assessing the resistance to fungal decay of
building materials of, or, containing materials of organic origin, and for
judging the efficiehcy of such protective treatment as may be applied to them.
*High density wood particle boards.
$Particle board for insidation purposes.
IS:3087- 1985
0.5For the purpose of deciding whether a particular
requirement of thir
standard is complied with, the final value, observed or calculated, express.
ing the result of a test or analysis, shall be rounded off in accordance witt
IS : 2 - 1960*. The number of significant places retained in the rounded
off value should be the same as that of the specified value in this standard.
1.SCOPE
1.1 This standard covers the requirements of medium density wood particle
boards for general purposes, having specific gravity in the range 0.5 to 0.9.
1.2 This standard does not cover veneered particle boards, moulded particle
boards, high and low density particle boards or particle boards faced by
impregnated paper surfaces.
2. TERMINOLOGY
2.0 For the purpose of this standard, the following definitions shall apply
and for definitions other than those given below, reference may be made to
IS : 707 - 1976t.
2.1 Additive - Any material introduced prior to the final consolidation of
a board to improve some property of the final board. Fillers and preservatives are included under this term.
2.2 Extruded Particle Board - Resin-bonded particle board manufactured
by mixing wood particles of pre-determined sizes and shapes with synthetic
resins and curing and pressing while the mix is being forced through an
extrusion hot platen press, pressure being applied in the direction of the
length of extrusion which tends to orientate the wood particles considerably
in a direction at right angles to the direction of extrusion.
2.3 Flat-Pressed Particle Board - Resin-bonded particle board manufactured by mixing wood particles of pre-determined sizes and shapes with
synthetic resins and curing and pressing in a parallel platen hot press of
the usual multidaylight type but may be pressed in a continuous hand type
of press. The applied pressure is perpendicular to the plane of the board.
2.4 Formation ( Forming ) - Laying up of the glued particles in the form
of a matready to the pressed.
2.5 Graded Particle Board - A board formed by arranging the wood
particles in a grad&d manner such that the smallest particles form.the top
most layer and the largest particles form the middle layer. In graded
*Rules for rounding of numerical values ( revised).
tC.Xossary of terms applicable to timber technology and utilizalion
( second revision).
2.6 Multi-Layer
Particle Board - A board made of more than three
layers of like material in which particles of different shapes and sizes may
be used in diKerent layers.
2.7 Particles - Distinct particle or fraction of wood or other lignocellulose
material produced mechanically for use as the aggregate for a particle
board. This may be in the form of flake, granule, shaving splinter and a
sliver as stated below:
a>Flakes
wood
b)
cl
Sltavirlg -
Splinter and Sliver - Particle of nearly square or rectangular crosssection with a length parallel to the grain of the wood of at least
four times the thickness.
IS : 3087 - 1985
NOTE- A three-layer particle board has a steep density gradient across the board
thickness that is the board has highest density at the two surfaces and the lowest
density in the centre. This density gradient helps in attaining higher bending strengths
at lower board density.
TYP?
1
2
-
Designation
FPS
FPT-1
FPT-2
XPS
XPT
The flat pressed-three layer, multilayer and graded class shall be. of two
types, namely, Type 1 and Type 2; the grading is based on the physical and
mechanical properties as given in Table 1.
4. MATERIALS
4.1 Any species of wood or any other ligno-cellulosic
used in the manufacture of particle board.
material
may be
4.2 Adhesive - Any suitable type of synthetic resin conforming IS : 848 1974* may be used for the purpose of bonding. However, for flat-pressedthree layer, multilayer and graded boards of Type I, BWR or BWP type
adhesive should be used.
4.3 Sizing Material - Paraffin wax dissolved in mineral spirit or alternatively emulsified with water or melted shall be used as sizing material.
5. MANUFACTURE
5.1 Wood particles for the manufacture
(first revision ).
IS:3087-1985
content of the binder does not excessively increase the moisture content of
the chips. The well-blended chips are then formed into a mat and
pressed into panels by passing into the pressing machine under controlled
heat pressure and time conditions. The hot pressed boards are subsequently
cooled, conditioned to attain equilibrium moisture content and sanded on
both sides to attain uniform thickness and finally trimmed and cut to standard sizes.
5.2 In case of three-layer particle boards, the construction shal be wellbalanced about the central plane. In case of a single-layer particle board,
the particles shall be uniformly laid. Care shall be taken that no asymmetric
grading of chips takes place.
5.3 Preservative Treatment - A suitable preservative may be added to the
particle mix at the stage of rensing of adhesive. The following preservatives
are regarded as suitable and their percentage is given on the basis of
oven dry weight of particles:
a) Sodium pentachlorophenate
b) Pentachlorophenol
Alternatively,
pentachlorophenol
edges.
6. F?NISH
6.1 The particle boards shall be of uniform thickness and uniform density
throughout the length and width of the boards. All particle boards shall
be flat. Both surfaces of the particle board shall be sanded to a smooth
finish.
7. DIMENSIONS
AND TOLERANCES
IS:3087- 1985
TABLE 1 PHYSICAL AND MECHANICAL PROPERTIES OF, VARIOTYPES OF PARTICLES BOARDS
( Cfuuses 3.1, 8 and 10 )
PROPERTIES
PRE%~ED FLATPRESSEDEXTRUSIONEXTRUSION
SINOLELAYER THREE LAKER
PREZSED
FLAT
MULTILAYER&
GRADED
Type
(1)
1.l Density Variation, percent
1.2 Water Absorption, percent
2 h soaking
24hsoaking
1.3 Thickness Swelling, percent
2 h soaking
Thickness
Length
Width
1.4 Swelling due to surface
absorption, percent
1.5 Modulus of Rupture,N/mm*
up to 20 mm thickness
above 20 mm thickness
1.6 Tensile Strength perpendicular
to surface, N/mm*
up to 20 mm thickness
above 20 mm thickness
1.7 Tensile Strength perpendicular
to surface, N/mm8
*a) After cyclic test
tb) Accelerated water
resistance test
1.8 Screw withdrawal strength, N
Face
Edge
TVBVLAR
-P-O
pSYLZD
(XPS)
----
Type
(2)
(3)
(4)
rtl0
*10
&IO
Z.tlO
25
50
10
20
40
80
40
80
40
80
10
05
05
9
8
0.5
0.5
6
12
05
0.5
9
5
2
0.5
4
5
2
0.5
4
::
15.0
125
;:;
;;;
045
040
(5)
0.2
0.15
1 250
850
1 250
850
1 250
700
-_
(6)
110
IS:3@$7-1985
on specii?l demand as
on dimensions
of
Tolerance
Dimension
kg mm
+g mm
*2*5 percent
c) Thickness - Above 25 mm
15 percent
Up to and including 25 mm
rectan-
7.4.2 The edges of the board shall be straight with a tolerance of 3 mm.
8. PHYSICAL
CHARACTERISTICS
8.1 Den6ity - The mean density of the boards, when tested in accordance
with 10.3 shall be between 500 to 900 kg/m3. The density shall not vary
from one sample to another by more than ten percent of the mean density.
8.2 Moisture Content -- The mean moisture content of the boards, when
determined in accordance with 10.4, shall not be less than 5 percent and
not more than 15 percent. The moisture content of individual test
specimen shall not vary from the mean percentage by more than $3 percent.
8.3 Water Absorption - The mean water absorption of the boards, when
tested as described in 10.5, shall not exceed the prescribed limits given in
Table 1 for various types of boards after both 2-hours and 24 hours immersion.
8.4 Swelling in Wafer - The mean swelling in thickness, length and width,
when tested as described in 10.6, shall not exceed the limits given in
Table 1 for various types of boards.
8.5 Swelling Due to Surface Absorption - The mean swelling in thickness
due to surface absorption, when tested in accordance with 10.7, shall not
exceed the limits given in Table 1 for ;larious types of boards.
8.6 Workability - The particle boards shall not crack or split when drilled,
sawed and nailed perpendicular to the surface.
VOTE - Recommended precautions for storing, cutting and working
Soards aregivcn in Appendix A.
with particle
IS : 3087 - 1985
9. SAMPLING
AND INSPECTION
N
up
50
51 to 100
101 to 200
201t0300
301 to 500
to
10
IS : 3087 - 1985
specified under 10. The method of preparation and conditioning
mens shall be as specified in IS : 2380 ( Part 1 ) - 1977*:
of speci-
b>For
*Methodsof test for wood particle boards and boards from other lignoeellulosic
materials.
11
IS : 3087 - 1985
10.2 Accuracy of Dimensions of Boards - The accuracy of dimensions of
boards shall be measured as specified in IS : 2380 ( Part 2 ) - 1977*. All the
samples selected in accordance with 9.2.1 shall be measured for straightness
of edges, squareness of boards, lengths, widths and thicknesses.
10.3 Test for Density - The mean density of the board shall be determined
in accordance with IS : 2380 ( Part 3 ) - 1977*, and shall comply with the
requirements specified in 8.1. The mean density shall be straight average of
the density of the test specimen taken out from each of the sample as
in 9.1. While calculating the density of the tubular board, the empty
tubular space shall be deducted from the volume of the test specimen.
10.4 Test for Moisture Content - The moisture content of wood particle
boards shall be tested for each specimen as prepared in 9.2.1 (b) in accordance with the method prescribed in IS : 2380 ( Part 3) - 1977* and the
average value for all the samples shall comply with the requirements specified in 8.2.
10.5 Test for Water Absorption - The water absorption in test specimen
as prepared in 9.2.1 (c) shall be tested in accordance with IS : 2380
( Part 16 ) - 1977* and shall comply with the requirements specified in 1.2
of Table 1.
10.6 Test for Swelling io Water - The swelling in thickness, length a.lo
width of test specimen as specified in 9.2.1 (d), when tested by the method
prescribed in IS : 2380 ( Part 17 ) - 1977*, for 2 hours soaking shall not
exceed the limits specified under 1.3 of Table 1. The length of specimen in
case of FPT boards shall be taken as in the line extrusion.
10.7 Test for Swelling Due to Surface Absorption - ne swelling in thickness due to surface absorption on test specimen as specified in.9.2.I (e),
when tested in accordance with IS : 2380 ( Part 17 ) - 1977* shall comply
with the requirements given under 1.4 of Table 1.
PO.8 Test for Modulus of Rupture - The modulus of rupture on test
specimens specified in 9.2.1 (f) and tested as prescribed in IS : 2380
( Part 4 ) - 1977* shall conform to the requirements laid down in Table 1.
10.9 Tensile Strength Perpendicular to Surface - Tensile strength perpendicular to surface of test specimens as specified in 92.1 (g), and tested as
prescribed in IS : 2380 ( Part 5 ) - 1977*, shall have maximum failing load
not less than the values prescribed in Table 1.
10.9.1 Cyclic Test - Cyclic test tested as prescribed in Table 1 shall have
maximum failing load not less than the value prescribed.
*Methods of test for wood particle boards and boards
materials.
12
from other
IignocJulosic
x3:3087-1985
10.9.2 Accelerated Water Resistance Test - Accelerated water resistance
test tested as prescribed in Table 1 shall have maximum failing load not less
than the values prescribed.
10.10 Screw Withdrawal Strength - The screw withdrawal strength as
prescribed in 9.2.1(h) and tested as prescribed in IS : 2380 (Part 14) - 1977*
shall have a failing load not less than value specified in Table 1.
11. MARKING
11.1 Each particle board shall be legibly marked near any of its edges with
the following:
a) Name of the manufacturer or trade-mark, if any;
b) Designation of particle board (see Table 1);
c) Thickness (see 7.2); and
d) Date of manufacture.
11.1.1 Each particle board may also be marked with the IS1 Certification
Mark.
NOTE - The use of the IS1 Certification Mark is governed by the provisions of the
Indian Standards Institution (Certification Marks Act and the Rules and Regulations
made thereunder.
The IS1 Mark on products covered by an Indian Standard
conveys the assurance that they have been produced to comply with the requirements
of that standard under a well-defined system of inspection, testing and quality
IS1
control which is devised and supervised by IS1 and operated by the producer.
marked products are also continuously checked by ISI for conformity to that
standard as a further safeguard.
Details of conditions under which a licence for the
use of the ISI Certification Mark may be granted to manufacturers or processors, may
be obtained from the Indian Standards Institution.
13
from
other
IignoceIluIosic
IS : 3087 - 1985
APPENDIX
( Clause 8.6 )
STORAGE AND WORKING
OF WOOD PARTICLE
BOARDS
A-l. GENERAL
A-l.1 Wood particle board is a composite board of wood particles bonded
together with a resin-bonding agent. The wood grain is, therefore, nondirectional as compared with natural wood which has only one grain
direction. Due to the abrasive nature of the resin and the multitudinous
grain direction, tool wear is greater than with most medium density natural
woods. Because of this special saw and cutter tips should be used on
production runs. By working according to the following basic principles,
wood particles boards can be generally handled, cut and worked in such
the same manner as natural wood.
A-2. STORING
A-2.1 Wood particle boards shall be-stored in packs on a level 5at surface
in a clean, dry and covered place with free circulation of air. The boards
Ishall be protected from rain, dampness and insect and fungal attack. The
edges of boards in a pack shall be in a straight vertical plane. If required,
the edge may be sprayed or painted with a suitable protective coat or
sealing material. The packs shall be kept clear of the floor. The top of
the stack shall be kept covered with a cover board and weighted down
suitably.
A-3. CUTTING
A-3.1 For hand cutting, normal carpentry tools used for wood working
machines, each of the circular saw, hand saw, fret saw, etc, shall be used.
The tools shall be kept sharp and free from swarf at all times. When
working on machines, high-speed steel tools are preferable. For productions runs, carbide-tipped saws and cutters give a smoother cut and longer
life. The same feed speeds as for natural hard woods shall be used, but
care should be taken at all times not to force the cut. Cutter life will be
improved if the cutter at all times not to force the cut. Cutter life will be
improved if the cutter face angle is increased to approximately 4OC and,
where uossible, the cutting angle decreased as CornDared to natural wood.
A cutter speed-of 6 000 rcrn ii recommended.
A-4. SAWS AND SAWING
A-4.1 Coarse rip saws shall not be used. Well sharpened, moderately set
saws give consistently good results. Do not force the boards through the
14
Is:3087-1985
saw at unneccessarily high-feed speeds. This is the cause of tearing or
break cut on the underside. Always cut veneered boards facing upwards.
For clean fast cutting, always adjust the saw height so that only 12 mm
protrudes above the material being sawn. For trenching or grooving
across the boards dada should be used. For sawing, highspeed steel saws
or carbide-tipped saws are recommended.
A-5. DRILLING
A-5.1 Drilling shall be effecttd by using standard bench, portable or pillar
drilling machines. The conventional hand drill shall be used but the drill
edge should,be always kept sharp. The use of drills having an helix angle
between 20 and 32 is recommended.
Drills shall be kept free from swarf
during drilling by backing out. When particularly clean cuts are required,
spur type drills will give best results.
A-6. ROUTING AND MOULDING
A-6.1 Tugsten carbide-tipped cutters are recommended for long production
runs. High speed steel cutters will produce good finishes but edge life
between sharpening is limited. As in the case of sawing, moderate feed
speeds shall be used.
A-6.2 Recommended spindle speeds for routers and spindle moulders are
given below:
Spindle Speeds in revlmin for
-___A---7
--
Spindle Moulders
Routers
Tungsten carbide-tipped tools
High speed steel
18 OOOto 24.000
13 000
9 OOOto 12 000
4 500 to 6 000
A-7. SANDING A-7.1 Sanding operations shall be carried out in the same manner as with
natural timber. It should be remembered that there is no grain direction
in carrying out this operation.
A-7.2 Drum Sanders - The following combination
mended for use with triple drum sanding machines:
First drum
Second drum
Third drum
NOTE-
of papers is recom-
15
may be varied
Is :3087- 1985
A-7.3 For hand sanding, generally compressive stones with grip size 50 to
OF PLASTIC LAMINATES
A-g.1 Most resin glues and contact adhesives are suitable for bonding plastic
laminates to particle board, provided manufacturers instructions are fully
adhered to. Case in glues are not suitable.
A-9. JOINERY WORK
A-9.1 Particle,board is a composite board panel and cutting of asymmetrically for any joinery is not recommended, unless the composite joint is
again symmetrical. In case of three-layer boards and veneered particle
boards, the strength of the board is made up of all the layers and balanced.
Therefore, where joints are to be effected, cutting shall be done keeping a
symmetry about the centre. Edge-joining by tongue and groove method is
possible if a separate tongue of wood is provided. But joint shall be done
with a backing strip of wood or metal or other metal fixtures like l-sections,
corrugated pins or other connectors.
Lap joint or level joint shall be done
with the use of an adhesive for holding tacks and screws, but the joints
shall be symmetrical about the centrd. Mortise and tenon joints shall not
be used for the ends. However, the surface may be cut through and end.
to surface joints are possible. For edge to edge joining, dove-tail joint,
finger joint, lap joint, mitre joint, etc, are all possible, provided the
composite nature of the joint is kept symmetrical. Cutting for joints shall
be with sharp tools and machine-cutting shall be only with high-speed
machines. The joints may be tied by conventional carpenters glues
combined with holding tacks, pins, rivets, screws or nails.
A-9.2 Veneered type of particle boards require particular care to see that
the composite nature of the boards is preserved. If one surface of the board
is to be cut, it should be so done that the assembled componentsa. gain
develop symmetry around the central axis.
IS : 3087- 1985
Screw Size
Depth
of
E&e
mm
1.85 mm
1.85 mm
2.20 mm
2.20 mm
230 mm
2.20 mm
2.30 mm
Depth
of
Edge
mm
6
10
10
10
10
-
10
10
19
AND BEADING
A-11.1 Lipping and beading of wood particle board shall be done by the
conventional method either with a veneer or with wood moulding or plastic
moulding. Use of carpenters glue and conventional holding tacks or nails
or screws are recommended.
Metal beading, if required, shall be done
with a suitable glue which will hoId metal to wood.
A-12. GLUING
A-12.1 The best results are obtained with glue having a low moisture
content. These include urea formaldehyde, phenolic type glues, PVA,
resorcinal and spirit-based contact adhesives. Animal glues may be used
satisfactorily, but it is essential that a thick mix is prepared and used hot.
A-12.1.1 In all cases, the manufacturers instructions should be followed
implicitly. Casein ghres are not recommended.
A-13. PAINTING,
VARNISHING,
POLISHlNG
AND PRINTING
or polished by the
of the surface and
x3:3087-1985
filling is necessary. The filler, only sufficient to fill the grain, shall be
applied with broad knife or scraper, pressing well into the pores of the
board. On carefully rubbing down and thoroughly drying, a perfect surface
for decorating will be obtained. Dusting, sealing, staining and filling
operations are similar to those used in conventional woodwork. When
treating both surfaces of the panels in an exposed position, the treatment
shall be done simultaneously on both sides. It is recommended that the
edges of the boards are heavily sealed before painting. Normally, the
edges of the boards are covered by lipping.
A-13.2 Particle boards may be veneered with commercial or decorative
veneers by use of any glue mentioned in A-12.1, and with conventional
methods.
18
IS : 3087- 1985
( Conrinuedfiom
page 2 )
Members
Represenring
SHRI S. K. KAPOOR
SHRIS. S. KAPUR
SHRI T. UDAYAKUMAI~( AJternute
SHRI A. K. MEXROTRA
$HRI M. L. LAHOTI( AJrernate )
SHRI P. V. MEHTA
Novopan
SHRI S. A. NAQ~I
SHRI K. R. SREEDHARAN( AJternare )
of Technical
Development,
19
BUREAU
OF
INDIAN
STANDARDS
Headquarters;
Manak Bhavan, 9 Bahadur Shah Zafar Marg. NEW DELHI 110002
Talephones : 331 01 31, 331 13 75
Telegrams : Manaksanotha
( Common to all offices)
Telephones
Regional Ofllces:
331 01 31
Central
: Manak Bhevan. 9 Behadur Shah Zafar Mara.
_[ 331 1375
NEW DELHI-1 iOOO2
36 24 99
gEastern : 1 /14 C.I.T. Scheme VII All, V. I. P. Road.
Maniktola, CALCUTTA 700054
Northorn : SC0 445-446, Sector 35-C,
21643
[ 31641
CHANDIGARH
160036
41 24 42
Southern : C. I. T. Campus, MADRAS 600113
41 25 19
1 41 2916
twostern : Manakalaya, E9 MIDC, Marol, Andheri (East),
6 32 92 96
BOMBAY 400093
Branch Oflces:
26348
Pushpak Nurmohamed Shaikh Marg, Khanpur,
[ 26349
AHMEDABAD
38.0001
38 49 55
SPeenya Industrial Area, 1st Stage, Bangalore Tumkur Road
[ 38 49 56
BANGmALORE 560058
66716
Gangotri Complex, 5th Floor, Bhadbhada Road, T. T. Nagar,
BHOPAL 462003
Plot No. 82/83, Lowis Road, BHUBANESHWAR
751002
6 36 27
5315, Ward No. 29, R. G. Barua Road, 5th Byelane,
3 31 77
GUWAHATI 781003
6-8-6X
L. N. Gupta Marg ( Nampally Station Road ),
231063
HYDERABAD 500001
63471
R14 Yudhlster Marg, C Scheme, JAIPUR 302005
E69832
21 68 76
117/418 B Sarvodaya Nagar, KAN PUR 208005
121 82 92
62305
Patllputra Industrial Estate, PATNA 800013
6 21 04
T.C. No. 14/1421, University P.O., Palayam
[ 621 17
TRIVANDRUM
695035
lnspecflon Oflce (With Sale Point) :
2 61 71
Pushpanjali, 1st Floor, 205-A West High Court Road,
Shankar Nagar Square, NAGPUR 440010
52435
Institution of Engineers ( India ) Building. 1332 Shivail Naglar
PUNE 411005
27
*Sales Office in Calcutta Is at 5 Chowrlngheo Approach, P.O. Prlncsp
Strret, Calcutta 700072
22
TSalrr Office In Bombay Is at Novelty Chamber&
Grant Road,
Bombay 400007
22
_
stales OfRce In Bangalore lo at Unlty Bulldlng, NararlmharrJa Square
Bangalorr 560002
Ctlnted at Slmro Prlntlno Pram. Ddhl.
82 00
6s 22
36 II
Indl~
A&lENDMENT NO. 1
AUGUST 1987
'
TO
Substitute 'no
(BDC
20)
_-Printed at Simco Printing Press, Delhi. India
AMENDMENT
NO. 2
MARCH 1990
CklSS
Grade
Designation
FPS
FPT-1
FPT-2
XPS
tiPT
I
II
-
Substitute gradefor
Substitute
the following
clause:
9.1.1 Lot - In any consignment, all the particle boards of the same class,
grade and dimensions, and manufactured under similar conditions of production, shall be grouped together to constitute a Jot.
10.9 Tensile Strength Perpendicular to Surface - Tensile strength perpendicular to the surface of test specimens 8s prescribed in 9.2.1. (g), when
I
( CED 2iJ J
2
Printed at Simco Printing Press. Delhi. India
AMENDMENT
Substitute
the following
for the
The method of preparation and conditioning of specimens for tests listed in (c),
(d), (e), (f) and (g) be1ow shall be as specified in IS 2380 (Part 1) : 1977*:
[ Page 11, clause 9.2.1(g) ] -
In addition to this for Grade I boards, three more test specimens shall be taken for
cyclic or accelerated water resistance test as given in 10.9.1.
(Page 12, clause 10.8 ) -
10.9 Tensile
Strength
Perpendicular
to Surface
Tensile
strength
perpendicular
to the surface of three test specimens as prescribed in 9.2.1(g),
when tested in accordance with IS 2380 (Part 5 ) : 1977* shall have an average
value not less than the value specified in 1.6 of Table 1.
[ Page 12, clause 10.9.1 (see also Amendment
following for the existing clause :
No. 2 )] -
Substitute
the
Substitute
(CED
20)
Printed
at Simco
Printing
Press,
Delhi
AMENDMENT
NO. 4
MAY 1993
TO
IS 3087 : 1985 SPECIFICATION
FOR WOOD
PARTICLE
BOARDS ( MED!UM DENSITY ) FOR
GENERAL PURPOSES
(First
(Page 6, clause 4.2, last fine ) ( Page 8, Table 1, Sl No. 1.4 ) swelling and due.
(Page 8, Table 1, SI No. 1.8 ) word Edge.
Revision)
Substitute
Insert in thickness
Insert ( for thickness
between
the words
(CED20)
AMENDMENT
( Page 3, Foreword, clause 0.2) Substitute 1S 3478: 1966~or 1S34781968 and IS 3129:1985 for IS 3129:1965.
( Page 3, Foreword,
---------
- . . ..
. .. .-
( Clauses 2.2,2.3,2.5,5.1
and A-1.l ) Substitute -particles of wood or
other lignoeellulosic materials for wood particles.
,R-
..
~z~
...,,,,,,,......_._._._-_-..~
~
[
For ECO Mark, only species of wood from sources other than naturalforests
from rubber, coconut, cashew, industrial and social forestry
plantations, etc and shade trees from tea and coffee estates, wood residues or
agricultural wastes shall be used for the manufacture of wood particle boards.
such as wood
i)
Ixngth
ii) Width
b) Ihickne= swelling,
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
12
Substitute IS 4905:1968
Jiw IS :4905-
1961.
{ Page 13, chuse 10.10 ) Insert the following new clauses after 10.10
and renumber the subsequent clauses:
11
11.1
OPTIONAL REQUIREMENTS
.. ---- ..
..
percent 2 h soaking
(
..
pereent 2 h soaking
General Requirements
11.1.1 The particle board shall conform to the requirements of quality and
performance as specified in this standard.
11.1.2 The manufacturer shall produce to BIS environmental consent clearance
from the concerned State Pollution Control Board as per the provisions of the
Water (Prevention and Control of Pollution) Act, 1974 and Air (Prevention and
Control of Pollutwn) Act, 1981 and Water (Preventwn and Control of Pollutwn)
Cess ACL 1977 alongwith the authorization, if required under the Environment
(Protection) Act, 1986 while applying for ECO Mark appropriate with enforced
rules and regulationa of Forest Department.
,.
...
,-.
......
. . ... .
,,
Spwilic
Requirements
The particle board shall coukrrm 10 the specific requirements given for ECO
Mark under relevant clauses of the sta mlard.
NOTE The manufacturer shall provide documentary evidence by way of certificate or
declaration to Bureau of Indian Standards while applying for ECO Mark.
clause:
e) The criteria for which the particle board has been label led as ECO Mark.
( CED 20 )
AMENDMENT
5.3 Preservative
Treatment
A suitable preservative may be added to the
particle mix at the time of rinsing of adhesive. The following percentages of
preservatives are regarded as suitable
a)
Sodium pentachlorophenate
b)
Trichlorophenol
( CED 20 )
Reprography UniL BIS, New Delhi, Ida
AMENDMENT
( CED 20 )
Reprography Unit, BIS, New Delhi, India