This paper presents two topics on antennas in packaging for millimeter-wave applications. One is on a patch ANTENNA ON A THICK RESIN LAYER OF A SILICON CHIP to achieve high radiation efficiency. The other is a dielectric-slab antenna fed by Post-wall Waveguide to have about 45-degree beam-width in both the E and H planes.
This paper presents two topics on antennas in packaging for millimeter-wave applications. One is on a patch ANTENNA ON A THICK RESIN LAYER OF A SILICON CHIP to achieve high radiation efficiency. The other is a dielectric-slab antenna fed by Post-wall Waveguide to have about 45-degree beam-width in both the E and H planes.
This paper presents two topics on antennas in packaging for millimeter-wave applications. One is on a patch ANTENNA ON A THICK RESIN LAYER OF A SILICON CHIP to achieve high radiation efficiency. The other is a dielectric-slab antenna fed by Post-wall Waveguide to have about 45-degree beam-width in both the E and H planes.
2012 IEEE Asia-Pacific Conference on Antennas and Propagation, August 27-29, 2012, Singapore
Antenna on a Thick Resin layer of a Silicon Chip and
a Slab Antenna fed by Post-wall Waveguide (Invited Paper) J.Hirokawa*, J.Asano, M.Ando
R.Suga
H.Nakano, Y.Hirachi
Dept. of Electrical & Electronic Eng.
Tokyo Institute of Technology Tokyo, Japan jiro@antenna.ee.titech.ac.jp
Dept. of Electrical Eng. & Electronics
Aoyama Gakuin University Sagamihara, Japan rsuga@ee.aoyama.ac.jp
Ammsys Inc. Tokyo, Japan y.hirachi@ammsys.jp
AbstractThis paper presents two topics on antennas in
packaging for millimeter-wave applications. One is on a patch antenna on a thick resin layer of a silicon chip to achieve high radiation efficiency and to try to connect a RF circuit on the opposite side of the chip through a coax-line structure. The other is a dielectric-slab antenna fed by post-wall waveguide to have about 45-degree beam-width in both the E and H planes and to achieve 46dB isolation by arraying the two antennas in the Hplane. Keywords- package; chip antenna; slab antenna; post-wall waveguide; isolation
I.
INTRODUCTION
Recently, there are many discussions on antenna integration
with a 60GHz silicon CMOS chip ([1], [2] for example). Typically there are two ways of the integrations. One is to integrate an antenna in a chip and the other is to integrate an antenna separately from a chip. This paper presents antennas for these two integrations. When an antenna is integrated on the same layer of a RF circuit in a chip, the radiation efficiency is quite low due to small height (typically 10m) of the RF circuit layer. We proposed the configuration where an antenna is integrated on a thick resin layer of 200m on the opposite side of a RF circuit layer through a hole in a silicon chip [3]. The thick resin layer can make the radiation efficiency large and the connection loss can be small. We also have been developing a dielectric-slab antenna fed by post-wall waveguide, which is separated from a chip [4]. The antenna has about 45-degree beam-width in both the E and H planes suitable for use of kiosdownload and achieves 46dB isolation by arraying the two antennas in the H-plane sufficient for TDD (time division duplexing). II.
ANTENNA ON A THICK RESIN LAYER OF A SILICON CHIP
We have investigated the feasibility of a patch antenna fed
through a hole with a coaxial line. Fig.1 shows the configuration of the antenna on a silicon chip of 5mm square placed in a fixture of 20mm square. The square patch antenna is trimmed off at two corners to radiate circular polarization. The design frequency is 60.0GHz. The silicon chip has a hole with 0.5mm diameter coated by copper on the wall to act as the outer conductor of a coaxial line. The resin has a hole with 0.3mm diameter to insert a pin of a glass bead to act as the inner conductor. An air region is placed between the antenna
978-1-4673-0668-3/12/$31.00 2012 IEEE
and the fixture for matching. A choke is also installed to
prevent from leakage between the chip and the fixture. We fabricate four patch antennas with same dimension. The designed reflection is below -15dB from 58.5GHz to 63.5GHz. The measured reflection of all the four antennas is shifted a bit lower than the designed one but the bandwidth for the reflection below -15dB is almost the same between the measurement and the design. Fig.2 shows the frequency dependence of the measured gain. The designed gain is about 5dBic at 60GHz. There is variation among the four fabricated antennas, but the antennas #2 and #3 have similar frequency dependence to the design. The measured spin-linear radiation pattern has good agreement to the simulation over all angle regions because the design includes the structure of the fixture. The minimum of the axial ratio of the four antennas is about 1dB, which is equal to the simulation. The measured 3dB bandwidth is a bit narrower than the designed one (1.5GHz). III.
SLAB ANTENNA FED BY POST-WALL WAVEGUIDE
Fig.3 shows the antenna structure. The antenna is made of
three dielectric layers, which are a post-wall waveguide layer and two microstrip line (MSL) layers. The MSL layers made of thin buildup film were laminated on the top and bottom of the post-wall waveguide layer which thickness is 0.86 mm. The substrates for the MSL and post-wall waveguide layer are an epoxy substrate and a glass cloth-epoxy resin substrate, respectively. The post-wall waveguide is formed between metal 1 and metal 4 as shown in Fig.3. An open stub, MSL/waveguide transition and the GSG pad are printed on the top MSL layer. A key for the required beamwidth is to realize a large effective aperture area in the E plane with a planar substrate with fixed thickness. For realizing broadband characteristics, the dielectric slab waveguide is arranged in front of the open-ended post-wall waveguide as a substitute for the directors made of metallic parasitic elements, which have narrow band characteristics. The beamwidth in the E plane and gain are determined by the length of the slab waveguide. Two metal side walls made of via-holes are arranged on the both side of the slab waveguide. The walls are for the design of the beamwidth in the H plane and to suppress the mutual coupling between two antennas arrayed in the H plane for realizing the high isolation. The transition between the post-wall waveguide and slab waveguide should be designed to realize lower reflection and not to excite evanescent modes.
IV.
7 6
Gain[dBi]
The calculated and measured isolations between the two
antennas arrayed in the H plane in the antenna-package (Fig.4) and the required isolation are shown in Fig.5. The result is compared with that of the conventional antenna with loop-type directors [5]. The transmission loss of the CPW was measured to be less than 0.1 dB in the frequency range of 50 - 70 GHz and is confirmed negligibly small. The reflection coefficient of the antenna seen from the bent CPW was measured to be -10 dB in the frequency range of 58.3 - 64.6 GHz. The isolation level is improved by 6.0 dB to 27.5 dB in the frequency range compared with the conventional one. The measured isolation of the antenna-package with the slab waveguide is more than 38.1 dB and on the average of 46.0 dB.
1202_1 1202_2 1202_3 1202_5 Design
2 1 0 55
57.5
60 Frequency[GHz]
62.5
65
Fig.2 Measured gain
CONCLUSION
We have presented two types of the antennas suitable for
packaging for millimeter-wave applications. REFERENCES [1]
[2]
[3]
[4]
[5]
J.Grzyb, D.Liu and B.Gaucher, Packaging effects of a broadband 60
GHz cavity-backed folded dipole superstrate antenna, IEEE AP-S Intl. Symp,. 331-3, pp.4365-4368, 2007. A.Babakhani, D.B.Rutledge, A.Hajimiri, mm-wave phased arrays in silicon with integrated antennas, IEEE AP-S Intl. Symp., 331-4, pp.4369-4372, 2007. K.Kimishima, J.Hirokawa, R.Suga, H.Nakano, Y.Hirachi and M.Ando, "Feasibility study of a millimeter-wave antenna on a thick resin layer on the back side of a silicon CMOS chip," Intl. Symp. Antennas Propagat., TP-C06-4, Oct. 2008. R. Suga, H. Nakano, Y. Hirachi, J. Hirokawa, and M. Ando, Millimeter-wave antenna with high-isolation using slab waveguide for WPAN applications, Euro. Microwave Conf., 32-4, Oct. 2011. R. Suga, H. Nakano, Y. Hirachi, J. Hirokawa, and M. Ando, Costeffective 60-GHz antenna package with end-fire radiation for wireless file-transfer system, IEEE Trans. Microw. Theory and Tech., vol.58, no.12, pp. 3989 3995, Dec. 2010.
Fig.3 Slab antenna fed by post-wall waveguide
Fig.4 Fabricated antenna-package with two antennas for Tx and Rx.
Fig.1 Antenna on the thick resin of a silicon chip with a fixture
Fig.5 Isolation between two antennas arrayed in H-plane