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INTRODUCTION
Thermal behavior in a CPV module is a very
important issue and is directly related to the yield of
the energy obtained in a CPV system. It is well known
that the performance of electronics is better and more
efficient at lower temperature operation of devices [1,
2], so it is important to correctly balance the operating
temperature and the cost of this passive heat sinking,
since the competitiveness of a CPV system is critical.
Therefore, heat sink optimization can be one of the
keys in the development of a CPV system.
CFD (Computational fluid dynamics) software is a
well-known tool for studying the performance of heat
sinks and other devices regarding their thermodynamic
behavior under given conditions [3], especially for
heat transfer in processes of conduction, convection
and radiation.
The design procedure for heat sinks can be a little
tedious and much time and effort must be invested in
order to achieve a suitable and cost-effective product.
This paper presents a user subroutine that allows initial
analysis of heat sinks at early design stages avoiding
complex CFD analysis. The proposed model
establishes mixed boundary conditions (steady state
conditions) for heat transfer from nodes plates to the
surrounding air by using a local film coefficient for
free air convection. The user-subroutine obtains better
METHODOLOGY
An analytical methodology has been developed for
the purpose of this study. FD (Fluid Dynamics) cases
take into account magnitudes like ambient temperature
(C), wind speed (ms-1), angle of the module versus the
horizontal plane (), irradiation coming from the sun
(Wm-2), optical performance of the module (%), the
conductivity of each of the materials used in the
thermal stack (Wm-1K-1), and of course the geometry
used in this thermal stack and the integrated or nonintegrated heat sink and module-housing environment
[4,5].
Heat transfer can be provided by conduction (more
high-energy molecules transfer a part of the energy to
nearby molecules), convection and radiation. Thermal
conduction, i.e. the heat flux through a cross section A,
is described by Fouriers law
x
k
wT
wn
kT ,
(1)
h A (TFL TW ) .
(2)
Procedure Description
A mixed boundary condition for heat transfer was
established from nodes plate to surrounding air q
(Wm-2), by using a local film coefficient hc (Wm-2K-1)
for free convection of air (considered as ideal gas)
externally to a tilted plate [6]. This term was obtained
from semi-empirical correlations depending on a mean
Nusselt number NuL (dimensionless), which in turn is
evaluated from the Rayleigh number RaL
(dimensionless). At each node j at the boundary, this
approach matches:
where
and
hC =
Nu L
3NuL k
,
4L
(3)
CRa Ln ,
(4)
Ra L
gE TFL TW L3
GrL Pr
XD
(5)
1 wU
,
U wT P
(6)
hR
H V Tw4 Ta4 Tw Ta
(7)
EXPERIMENT DESCRIPTION
A correlation experiment was run in order to
evaluate and compare the simplified finite element
model with real CPV conditions. The measures taken
are shown in Table 1.
FIGURE 1. Flux power representation in the CPV
prototype.
Implementation Of User-Subroutine
The user subroutine was implemented in
commercial software ABAQUS/Standard [8], due to
its capabilities for solving coupled and uncoupled
thermal analyses. 22200 planar quadrilateral elements
of four nodes compose the total model. The element
length is 1.9mm, small enough to capture the
temperature gradient. The mid surface geometry of the
sink is modeled in order to avoid offset thickness. The
normal elements must be defined in the same direction
as the heat flux in order to simulate the real heat flow
trajectories. Two different models were developed in
order to compare the results using the variable
convection coefficient with the user subroutine (model
1) and constant convection implemented in ABAQUS
software (model 2). In both cases similar conduction
coefficients and cell heat flux due to DC electricity
power generation are used, and the values for each are
defined under operating conditions.
The value of the conduction coefficient of the
aluminum heat sink (Figure 2 and Figure 3), 6060-T6
is 210Wm1K-1 [9]. This value is not dependent on
temperature and is used for both models. The thermal
interface material between the heat spreader and the
heat sink 3.5 Wm-1K-1 [2] is ignored in thermal
analysis. In the case of convection heat transfer for
model 1, a constant coefficient of 5.1Wm-2K-1 at 25C
and 7.0 Wm-2K-1 at 50C was used [7], and a hR
estimated of 4.1Wm-2K-1 at 25C and 4.6 Wm-2K-1 at
CONCLUSIONS
ACKNOWLEDGEMENTS
The authors would like to appreciate the help of
M.A. Parras in the assembly of the CPV prototype
module and M. Fernandez for his kind help in the
thermal camera images processing.
REFERENCES
1. Y. Ota, H. Nagai, K.Araki and Kensuke Nishioka,
Temperature distribution in 820X CPV module during
outdoor operation, AIP Conf. Proc. 1477, 364 (2012).
2. Jie Wei, (2008). Challenges in Cooling Design of CPU
Packages for High-Performance Servers. Heat Transfer
Engineering, 29:2,178-187
3. Yue-Tzu Yang and Huan-Sen Peng. (2009). Numerical
study of thermal and hydraulic performance of
compound heat sink. Numerical Heat Transfer, Part A,
55: 432447, 2009
4. Eduardo F. Fernndez, P. Prez-Higueras, F. Almonacid,
A. J. Garca Loureiro, J. I. Fernndez et al., Quantifying
the effect of air temperature in CPV modules under
outdoor conditions , AIP Conf. Proc. 1477, 144 (2012)