Professional Documents
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CABLING
STANDARDS
The Latest News This Issue!
March 2009
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Mohawk2009 Master Catalog ................................................................................................................ 2
Cabling Standards
TIA TR 42.1 and 42.7 Cabling Committees .............................................................................................. 3
(TIA 568-C.0) Customer Owned Telecommunications Networks
(TIA 568-C.1) Commercial Building Telecommunications Cabling Standard
(TIA 568-C.2) Copper Cabling Systems
(TIA 942, Addendum 1) Additional Media and Guidelines for Data Centers
(TIA 862) Building Automation Systems
(TIA 568-C.1, Addendum 1) Temperature Limits
(TIA 758) Outside Plant
(TIA TSB 185) MICE Tutorial
(TIA TSB 184) Current Capacity
(TIA 1152) Field Testers
(TIA TSB 155) Revision for 10 GBASE-T over Category 6 Cabling
(TIA-568-C.2, Addendum 1) Additional Balance and Coupling Attentuation
(TIA new standard) for Healthcare Facilities
TIA TR 42.2 Residential Cabling Committee ......................................................................................... 10
(TIA 570-B, Addendum 1) Additional Requirements for (Broadband) Coax Cabling
(TIA 570-C) Update to Residential Cabling
TIA TR 42.3 Pathways and Spaces Committee ..................................................................................... 11
(TIA 569-B, Addendum 1) Temperature/Humidity
(TIA 1005, Addendum 1) Industrial Pathways and Spaces
(TIA 569-C) Update to Commercial Building Standard for Telecommunications Pathways and Spaces
TIA TR 42.4 Outside Plant ....................................................................................................................... 14
(TIA 758-B) Update to Outside Plant
TIA TR 42.6 Administration (Labeling) Committee ............................................................................... 15
(TIA 606-B) Update to Administration for the Telecommunications Infrastructure
TIA TR 42.8 Fiber Cabling Committee ................................................................................................... 16
(TIA 568-C.3) Optical Fiber Cabling
OM4 Fiber
IEEE 802.3ba Pinouts for Array Connectivity
TIA TR 42.9 Industrial Cabling Committee ........................................................................................... 18
(TIA 1005) Update to Industrial Building Cabling
TIA TR 42.16 Grounding and Bonding Requirements for Telecommunications ............................... 20
(TIA 607-B) Update to Grounding and Bonding
IEEE
IEEE 802/802.3 Ethernet .......................................................................................................................... 22
IEEE 802.3at DTE Power Enhancements Task Force ........................................................................... 22
IEEE 802.3az Energy Efficient Ethernet Task Force ............................................................................ 22
IEEE 802.3av 10 Gbps PHY for EPON Task Force ................................................................................. 23
IEEE 802.3ba Higher Speed Task Force (40 and 100 Gbps) ................................................................ 24
Miscellaneous
Cabling-Related Standards Approved and In Progress ....................................................................... 25
Glossary of Acronyms ............................................................................................................................ 27
Cabling Standards
Telecommunications
Industries
Association
Mohawk/High
Performance Cable
Products
Meeting Topics
1. TIA 568-C.0 (Telecom Networks) Status
2. TIA 568-C.1 (Commercial Building Cabling) Status
3. TIA 568-C.2 (Copper Cabling Components) Ballot
Comment Review
4. TIA 942 (Additional Media and Guidelines for Data
Centers) Ballot Comment Review
5. TIA 862 (Building Automation Systems) Ballot
Comment Review
6. TIA 568-C.1, Addendum 1 (Temperature Limits)
Status
7. Energy Efficiency
8. TIA 758 (Outside Plant) Status
9. TSB 185 (Mice Tutorial) Status
10. TSB 184 (Current Capacity) Status
11. TIA 1152 (Field Testers) Status
12. TIA 155 Revision (Field Testing for 10GBASE-T)
for Cat 6
13. New Standard for Health Care Facilities
14. Next Plenary Meeting
15. Next Interim Meeting (42.7)
Volume 01-09
Revised Temperature and Humidity Requirements for Data Center Spaces Only
TIA Space
Environmental Requirements
Temperature: 18-27 C (64-81 F) dry
bulb
Maximum Relative Humidity (RH): 60%
Maximum dew point: 15C (59F)
Minimum dew point (lower moisture limit):
5.5C (42F)
Maximum rate of temperature change:
5C (9F) per hour
Issue: Include the telecommunications enclosure under the section for backbone cabling.
Resolution: Section 4.1 (General) would add telecommunications enclosures (TEs) to the list of interconnections (such as for the telecommunications
room, the common telecommunications room, the
equipment room, etc.).
Issue: When describing where a Zone Box can go,
remember it can also be placed in the oor.
Resolution: Change text to state that the Zone Box
shall be located in a fully accessible, permanent location, such as a building column, a oor or a permanent wall, and should be provided with appropriate
security.
Issue: There are more mounting options for a Zone
Box than are mentioned in this draft.
Resolution: They would rewrite Section 6.4.5 titled
Plywood Backboards and call it Mounting Methods and state that a variety of methods can be used
including: metal perforated panel, plywood backboard or EIA-310-E compliant mounting. These
may be located in the back or side of the interior
portion of the box.
Issue: Regarding grounding and bonding of the zone
box, remind the reader to comply with the requirements in the TIA grounding and bonding standard
ANSI-J-STD-607-A.
7. Energy Efficiency
IEEE 802.3 acknowledged TR 42s support of green
initiatives and replied that they were working on
this issue by developing energy efcient PHYs and
applications that work over TIA specied cabling.
ACTIONS:
1. A green initiative paragraph was recommended for inclusion in the foreword of future
TR-42 standards (see TR 42.3 section for text).
2. TIA would share any progress on the development of energy-efcient cabling specs with
IEEE.
would be editorially changed to reect the common placement of TIA 758-A for Outside Plant.
Volume 01-09
Standards
Hierarchy
Standards
Hierarchy
Common Standards
ANSI/TIA-568-C.0
Generic
Telecommunications
Cabling for Customer
Premises
ANSI/TIA-569-B
Commercial Building
Standard for
Telecommunications
Pathways and
Spaces
ANSI/TIA-606-A
Administration
Standard for
Commercial
Telecommunications
Infrastructure
ANSI/TIA-607-B
Telecommunications
Grounding (Earthing)
And Bonding for
Customer Premises
Premises Standards
ANSI/TIA-568-C.1
Commercial Building
Telecommunications
Cabling Standard
ANSI/TIA-570-B
Residential
Telecommunications
Infrastructure
Standard
Component Standards
ANSI/TIA-568-C.2
Balanced Twisted Pair
Telecommunications
Cabling and
Components
Standard
ANSI/TIA-568-C.3
Optical Fiber Cabling
Components
Standard
ANSI/TIA-942
Telecommunications
Infrastructure
Standard for Data
Centers
ANSI/TIA-1005
Telecommunications
Infrastructure
Standard for
Industrial Premises
ANSI/TIA-758-A
Customer-Owned
Outside Plant
New Placement!
Telecommunications
Infrastructure
Standard
ANSI/TIA-862
Building Automation
Systems
Cabling Standard
for Commercial
Buildings
Issue: Explain more clearly, the performance parameters for Level IIe testers.
Resolution: Say that Level IIe eld testers shall
conform to the requirements in the Table for Measurement Requirements for Level IIe Testers for the
baseline, permanent link, and channel test congurations. The channel accuracy performance parameters
include the effects of the modular jack mating of the
test instrument with the local end of the user patch
cord. Methods to verify compliance of eld tester requirements are specied in clause 4.5 (Procedures for
testing eld tester parameters).
Issue: Explain more clearly, the performance parameters for Level III testers.
Resolution: Say that Level III eld testers shall
conform to the requirements in the Table for Measurement Requirements for Level III Testers for the
baseline, permanent link, and channel test congurations. The channel accuracy performance parameters
include the effects of the modular jack mating of the
test instrument with the local end of the user patch
cord. Methods to verify compliance of eld tester requirements are specied in clause 4.5 (Procedures for
testing eld tester parameters).
Issue: Correct where the permanent link and channel information actually resides.
Resolution: This would be changed from
TIA 568-C.0 to TIA 568-C.2.
Issue: Since there is no information about testing
anything less than Category 5e cabling, explain.
Resolution: Change the text to say that a Level IIe
tester is suitable to test up to and including Category
5e cabling.
Issue: Do the same thing for Category 6 and 6A
testing.
Resolution: Change the text to say that a Level III tester is suitable to test up to and including Category 6
cabling and that a Level IIIe tester is suitable to test
up to and including Category 6A cabling.
Sampling of
Sampling
of Level
Nominal
Measurementaccuracies
Accuraciesat
at Category
Category 5e
Level
II-E II-E
Nominal
measurement
5ePass/Fail
pass/failLimits
limits
Test
Parameter
Insertion loss
Frequency
in MHz
100
Baseline accuracy
at perm. link limits
( dB)
Permanent link
accuracy at perm. link
limits
( dB)
Channel accuracy at
channel limits ( dB)
0.6
0.9
1.0
ACRF
100
1.2
1.6
2.2
Return loss
100
1.0
1.5
1.3
Sampling of
SamplingLevel
of Level
III Nominal
Measurementaccuracies
Accuracies at
Limits
III Nominal
measurement
at Category
Category6 6Pass/Fail
pass/fail
limits
Test
Parameter
Frequency
in MHz
100
Insertion loss
ACRF
Return loss
Baseline accuracy
at perm. link limits
( dB)
Permanent link
accuracy at perm. link
limits
( dB)
Channel accuracy at
channel limits ( dB)
0.6
0.7
250
1.0
1.1
1.3
100
250
1.0
1.7
1.1
2.0
1.7
2.5
100
250
1.5
1.2
1.7
2.2
1.5
1.9
0.7
Test
Parameter
Insertion loss
ACRF
Return loss
Frequency
in MHz
100
250
500
100
250
500
100
250
500
Baseline accuracy
at perm. link limits
( dB)
0.6
1.0
1.3
1.0
1.6
2.3
1.4
1.2
1.1
Permanent link
accuracy at perm. link
limits
( dB)
0.7
1.1
1.4
1.1
2.0
2.6
1.7
2.1
2.2
Channel accuracy at
channel limits ( dB)
0.7
1.3
1.6
1.7
2.4
3.0
1.5
1.9
2.0
ACTION: The original TSB Project was cancelled and a new standard project was initiated titled
Healthcare Facility Telecommunications Infrastructure. It was estimated to be published in June 2010.
Scope of This Project
Requirements and guidelines for topology planning, design, installation, and testing of telecommunications cabling pathways and spaces that support
various telecommunications applications within a
healthcare facility, including facilities comprising
multiple buildings.
Volume 01-09
10
TIA TR 42.2
Residential Cabling
Mesa, AZ, February 5, 2009
The TIA TR 42.2 committee that created the TIA 570-B
standard for Residential Telecommunications Cabling, has recently approved a standard for Additional
Requirements for Broadband Coaxial Cabling in the
data center (570-B, Addendum 1) which is now available. At this rst meeting in 2009, they looked at when
TIA 570-B should be updated and what new work
should be undertaken.
Meeting Topics
1.
2.
3.
4.
Home Automation
Since there are computers in the house, you can control appliances, etc. The house becomes an intelligent building. Some systems are wired and some
are wireless.
ACTIONS:
3. New Projects
Distributed/Whole House Audio
This is where the audio can be distributed throughout the house and zones can be separated out.
1. Study Group created to look into home theater, distributed audio and video cabling.
2. Establish formal liaison with CEDIA.
3. Study Group created to make recommendations for additional content for Home Theater
and Distributed Audio.
Discussion
Create a generic coaxial cabling standardlike a
568-C.4 for broadband coax cabling.
Every hospital has coax and it cant be ignored.
Remember that the cable used has to be plenum
rated.
TIA TR 42.3
Pathways & Spaces
Mesa, AZ, February 3, 2009
The TIA TR 42.3 subcommittee created the standard,
TIA 569 for Commercial Building Telecommunications
Pathways and Spaces. At this rst Plenary meeting of
2009, the group covered the nal version of the Green
Stewardship/Initiative umbrella statement TR 42 would
be using with future standards, the CITG (Cabling
Implementation Task Group out of ISO/IEC) liaison
report, the acceptance of comments on TIA 569-B.1 for
Temperature and Humidity, the nal changes agreed to
for TIA 1005, Addendum 1 (Industrial Pathways and
Spaces), and how the update to TIA 569-C would be
handled.
Meeting Topics
1. Green Initiative
2. CITG (Cabling Implementation Task Group) Liaison
Report
3. Changes to TIA 569-B, Addendum 1 Temperature
and Humidity Requirements for Telecommunications Spaces
4. Changes to TIA 1005, Addendum 1 Industrial Pathways and Spaces
5. TIA 569-C (3rd revision) Update Plan
6. Next Plenary Meeting
1. Green Initiative
The Stewardship/Initiative paragraph was nalized
and put on the 2008 section of the TIA website.
The Study Group agreed on the following nal
draft:
Telecommunications infrastructure affects raw material consumption. The infrastructure design and
installation methods also inuence product life and
sustainability of electronic equipment life cycling.
These aspects of telecommunications infrastructure
impact our environment. Since building life cycles
are typically planned for decades, technological
electronic equipment upgrades are necessary. The
telecommunications infrastructure design and installation process magnies the need for sustainable
infrastructures with respect to building life, electronic equipment life cycling and considerations of
effects on environmental waste. Telecommunications
designers are encouraged to research local building
practices for a sustainable environment and conservation of fossil fuels as part of the design process.
11
569-C.
Volume 01-09
12
13
Temperatureand
andhumidity
Humidity Requirements
Spaces
Temperature
requirementsfor
forTelecommunication
telecommunication
spaces
TIA Space
Telecommunications rooms,
common telecommunications
rooms, telecommunications
enclosures and entrance rooms
Environmental Requirements
Temperature: 18-27 C (64-81 F) dry
bulb
Reduce maximum dry-bulb temperature
1C/300m (1.8 F/1000 ft) above 1800m
(5900 ft) altitude.
Maximum Relative Humidity (RH): 60%
Dew point : 5.5C (42F) to 15C (59F)
Maximum rate of temperature change :
5C (9F) per hour
Temperature: 5-40 C (41-104 F) dry
bulb. Reduce maximum dry-bulb
temperature 1C/300m (1.8 F/1000 ft)
above 900m (3000 ft) altitude. Minimum
temperature with diskette in a drive is 10
C (50 F)
Relative Humidity : 8-80 %
Maximum dew point : 28 C (82F)
ACTIONS:
ACTIONS:
Volume 01-09
14
TIA TR 42.4
Outside Plant
Mesa, AZ, February 4, 2009
The TIA TR 42.4 subcommittee created the standard
TIA 758-A for Customer-Owned Outside Plant Telecommunications Cabling. At this rst Plenary meeting
of 2009, the group discussed the position of the 758
standard in relation to other TIA TR 42 standards and
whether it should be updated.
Meeting Topics
1. Hierarchical Position of TIA 758-A
(Outside Plant Cabling)
2. TIA 758-B Plans
3. Next Plenary Meeting
TIA TR 42.6
Administration
Mesa, AZ, February 3, 2009
The TIA TR 42.6 committee created the TIA 606-A
standard for Administration (Labeling) of Telecommunications Cabling. This rst Plenary meeting of 2009
also covered the work done in ISO/IEC on identiers
and where the TIA 606-B standard was going.
Meeting Topics
1.
2.
3.
4.
15
ACTIONS:
More Discussion
When the CITG adopts their document, base our
identier portion of TIA 606-B on CITGs and
then decide if we want to nalize 606-B or wait
more to see what ISO/IEC does.
We are only waiting for this Identier product and
not yet doing anything with 606-B yet.
Our goal should be to have only part of 606-B the
same as the ISO/IEC (international) standard.
3. TIA Symbols
Discussion
Compile all the symbols in TIA 606 now and send
them to the Denitions Committee, TR 42.5
TR 42.5 would keep up with the symbols.
TIA 606-B would be the only published document that showed the symbols.
Volume 01-09
16
TIA TR 42.8
Optical Fiber Cabling
Mesa, AZ, February 3, 2009
The TIA TR 42.8 committee for Telecommunications
Optical Fiber Cabling Systems, provides research, testing, and presentations on optical ber being used in performance standards. This committee has now developed
the TIA-568-C.3 standard, Optical Fiber Cabling
Components which is an update to 568-B.3 published
in April 2000. This rst meeting of 2009 discussed
TIA 568-C.3, the new Optical Fiber Cabling standard, and what was going on with OM4 ber.
Meeting Topics
1. TIA 568-C.3 Status
2. OM4 Fiber Status
3. IEEE 802.3ba (40 and 100 Gig Ethernet)
Array Connectivity
4. Next Plenary Meeting
Tx Tx Tx Tx
Rx Rx Rx Rx
Illustration by M. Michelson,
Business Communication Services
Preliminary Information, Subject to Revision
Fig. 86-3-40 GBASE-SR4 optical lane assignments when viewed looking into the MDI receptacle with keyway feature on top
86.5.2 Optical lane assignments for 100GBASESR10
The ten transmit and ten receive optical lanes of
100GBASE-SR10 shall occupy the positions depicted in Fig 86-4a, or Fig 86-4b, or Fig 86-4c when
looking into the MDI optical receptacle(s) with the
connector keyway feature(s) on top
17
Figure 86-4a-100GBase-SR 10
Transmitter
Receiver
Tx Tx Tx Tx Tx Tx Tx Tx Tx Tx
Rx Rx Rx Rx Rx Rx Rx Rx Rx Rx
Figure 86-4c-100GBASE-SR10 optical lane assignments for single MDI receptacle when viewed
looking into the receptacle with keyway feature
on top. Transmitter occupies the bottom row and
receiver the top row.
Figure 86-4-b-100GBase-SR-10
Figure 86-4-c-100GBase-SR-10
Receiver
Rx Rx Rx Rx Rx Rx Rx Rx Rx Rx
Rx Rx Rx Rx Rx Rx Rx Rx Rx Rx
Tx Tx Tx Tx Tx Tx Tx Tx Tx Tx
Transmitter
Tx Tx Tx Tx Tx Tx Tx Tx Tx Tx
Illustration by M. Michelson,
Business Communication Services
Preliminary Information, Subject to Revision
Figure 86-4b 100GBASE-SR10 optical lane assignments for vertically stacked MDI receptacles
when viewed looking into the receptacles with
keyway features on top. Receiver is on the top
and transmitter on the bottom.
Illustration by M. Michelson,
Business Communication Services
Preliminary Information, Subject to Revision
Volume 01-09
18
TIA TR 42.9
Industrial Building Cabling
Mesa, AZ, February 4, 2009
The TR 42.9 subcommittee is developing the TIA
1005 standard for the industrial telecommunications
infrastructure. This brought in new effects from noise,
dust, distance, vibration, EMI, etc. This standard refers
to cabling for industrial manufacturingon the factory oor. During this rst Plenary meeting of 2009,
the subcommittee covered an ODVA (Open DeviceNet
Vendors Association) update that shows the work theyre
doing on industrial standards, the work done by the
POF Task Group before this meeting, and what the
next update of TIA-1005 could cover.
Meeting Topics
1.
2.
3.
4.
This Task Group was continuing to monitor standards for 1mm POF adds/changes and would prepare a proposal for 1mm POF for TIA 1005 (to
include pulling tension, bend radius, testing, etc.).
This work will be kept in this TR 42.9 group.
What is different now is that distance is different
and perhaps 65 meters would work in the industrial (versus commercial) environment.
Industrial needs to decide whether POF is acceptable to TIA 568-C.0. If Industrial wants to add
this as a media, they would need to do some more
work. The Task Group seemed to be going down
that path.
ISO/IEC has information on A4a and A4d POF.
What had happened to make this more viable
was that MOST (the Media Oriented Systems
Transport protocol from Europe) used Ethernet
and when POF for the lower bandwidth was developed, that led to the higher bandwidth over
POF. This was pushed by Europea technology
changed.
19
Volume 01-09
20
TIA TR 42.16
Bonding and Grounding
Mesa, AZ, February 2, 2009
TIA continues working on updating the Grounding
and Bonding standard, 607-A. This rst Plenary
meeting of 2009 covered sections being developed for
the ground bar, testing and verication, design, an
EMI Annex, and use of the term MESH-BN. The
grounding and bonding standard that exists now is
ANSI/TIA/EIA-J-STD-607-A.
Meeting Topics
1.
2.
3.
4.
5.
6.
7.
8.
4. EMC Annex
Presentation
a. The group was advised to use balanced twistedpair cabling to reduce EMI (electromagnetic
interference).
b. The ultimate objective was to reduce noise.
Discussion
This would involve information as in NECA/BISCI
607. It would cover:
Computer room
Cabinets and racks
Equipment in cabinets and racks
Cable ladders, cable runways, conduit, pipes, and
building steel
The mesh-bonding network
Bonding conductors for connections to the meshBN or RGB
Telecommunications equipment bonding connector (TEBC)
Separation
Bonding equipment cabinets/equipment racks to
the TEBC
Structural bonding of equipment cabinets/equipment racks
this and get a draft ready for the next Plenary meeting, August 2009.
5. Term: MESH-BN
ACTION: A Task Force would propose new
terms and explain their relationship with other
known terms.
What You Need to Know
The term SBG (Supplementary Bonding Grid) was
brought up as that being generally placed under a
raised metal floor or above the racks/cabinets complex to a supplementary function to the serving power
circuits equipment grounding protector... and they considered renaming that the Mesh-BN but had problems
because the MeshBN did not include Star grounding
and IBDN. They needed somehow to point out that the
MeshBN was not the only bonding network.
MESH-BN is the correct terminology. The objective of the Task Group was to recommend a new section just for Mesh-BN and then to include all types.
21
6. Document Plan
ACTION: The draft of 607-B was still being
reviewed internally and there was a plan to have
that qualied for its rst ballot by the August Plenary meeting.
7. Future Work
ACTION: Items due from this meeting:
Volume 01-09
22
IEEE 802
IEEE, the Institute of Electrical and Electronics Engineers, Inc., is a not-for-prot association that publishes
technical documents, holds conferences, and develops
standards. IEEE 802 is the LAN/MAN Standards
Committee for Layers 1 and 2 of the OSI (Open System
Interconnection) reference model.
Layer 1 is the physical layer (hardware including cabling) that applies to the LAN (Local Area Network)
dened as a campus, and MAN (Metropolitan Area
Network) for intracity networking. Light or radio signals are conveyed through the network at the electrical
and mechanical level. It consists of the electromagnetic
and physical aspects of a device, a transmission medium
(the cable), and the interface between them (connectors
or NICs [network interface cards]). The PHY refers
to anything relating to hardware (cables, connectors,
cards) that is enabled to send and receive data.
Layer 2 is the Data Link Layer where data packets become bits and carry transmission protocol information
to 1) handle errors in the physical layer; 2) provide ow
control, and 3) provide frame synchronization. This
data link layer is made up of two sublayersthe Media Access Control (MAC) layer and the Logical Link
Control (LLC) layer. That MAC sublayer controls how
we access data and gives permission for its transmission.
The LLC layer controls frame synchronization, ow
control and error checking.
The other ve layers of the OSI model are Layer 3, the
Network Layer (where switching and routing is provided
and logical paths [virtual circuits] are created that send
data from node to node); Layer 4, the Transport Layer
(where data is transferred [transparently] between systems/hosts and end-to-end error recovery and ow control
is performed); Layer 5, the Session Layer (where connections between applications are managed); Layer 6, the
Presentation Layer (where data is transformed into the
form that the application layer can accept when that
data is different;) and, Layer 7, the Application Layer
(where application and end-user processes are supportedeverything at this layer is application specic).
IEEE 802.3Ethernet
IEEE 802.3 is referred to as the Ethernet standard (an
application). This includes projects for 1 gigabit Ethernet transmission (1000 Mbps) over both ber (802.3z1998) and copper (802.3ab-1999). The standard for
DTE Power over Ethernet (802.3af-2003) has been
completed and published; so has Ethernet in the First
Mile (802.3ah-2004); the standard for 10 gigabit Ethernet over coaxial cable (802.3ak-2004), and the standard for 10 gigabit Ethernet over ber (802.3ae-2003).
Committee work continues with the Power over Ethernet Plus Task Force (802.3at) who have now settled on
a slightly higher minimum capability than 24 watts,
the Energy Efcient Task Force (802.3az) nding ways
to reduce energy, the 10 Gigabits per second EPON
group (802.3av) and, there is a Higher Speed Study
Group (802.3ba) that is studying 40 Gbps and 100
Gbps over ber and copper.
23
Status
The Task Force was currently working on development of the next-generation, 10 Gbit/s capable
Ethernet Passive Optical Network (10G EPON)
specications, anticipated to bring a new avor of
PON technology to life by 2009. This would be
applicable in multiple environments to support
bandwidth-intensive applications that would require fast, reliable, scalable, rst-mile connections.
Such applications included Broadcast TV (expanded HDTV content), IPTV, time-shifted TV, rich
unicast based VOD (Voice on Demand) content
libraries, 3D Online Interactive Games, UltraHigh
SpeedInternet, Personal Video Casting, and many
more applications.
Draft 3 of this application standard, released
1/16/2009, was in its ballot process.
The last technical changes had been made and
it was planned to go to RevCom (the Standards
Board Review Committee) in July with the expectation that the standard would be approved in
September 2009.
Volume 01-09
24
TIA 568-C.1
TIA 568-C.3
TIA 568-B.1
TIA 942
TIA 942, AD1
TIA 862
TIA 568-B.2
TIA-568-B.2
TIA 568-B.2, AD 1
TIA 568-B.2, AD 2
TIA-568-B.2, AD 3
TIA 607-B
IEEE 802.3af-2003
IEEE 802.3ak-2004
TIA 758-B
TSB 185
TIA x
TIA 568-C.2, AD x
TIA 1152
TIA-569-C
TIA 1005-x
TIA 1005, AD 1
TIA 606-B
TIA-492AAAD
25
Volume 01-09
26
Glossary of Acronyms
10GBASE-T
40GBASE-SR4
40GBASE-SR10
100GBASE-SR10
ACRF
AD1
ANSI/J-STD
ASHRAE
BAS
BICSI
BN
C
CD
CEA
CEDIA
CITG
CP
dB
EMC
EMI
F
ft
ftp
Gbps
HVAC
IEC
IEEE
IHS
IP
ISO
JSIG
m
MHz
MICE
MOST
MUTOA
NECA
ODVA
OM4
OSP
PAR
PHY
POF
RGB
RH
SCTE
SC65/JWG10
10 Gigabit Ethernet
4 Transmit/ 4 Receive parallel lanes over 4 + 4 OM3
parallel fibers connected to a high density SFF
10 Transmit/ 4 Receive parallel lanes over 10 + 10
OM3 parallel fibers connected to a high density SFF
100 Gbps over 10 lanes of, short reach, multimode
fiber
Attenuation to Crosstalk Ratio, Far End
Addendum 1
American National Standards Institute/Joint-Standard
American Society of Heating, Refrigeration and Air
Conditioning Engineers
Building Automation System
BICSI
Bonding Network
Centigrade
Committee Draft (in ISO/IEC)
Consumer Electronics Association
Custom Electronic Design & Installation Association
Cabling Implementation Task Group
Connection/Consolidation Point
Decibel
Electromagnetic Compatibility
Electromagnetic Interference
Fahrenheit
foot
File Transfer Protocol
Gigabits per second
Heating, Ventilation and Air Conditioning
Internationale Electrotechnical Commission
Institute of Electrical and Electronics Engineers, Inc.
Information Handling Services (includes Global Engineering Documents)
Internet Protocol
International Standards Organization
Joint Special Interest Group
meter
Megahertz
Classifications for Mechanical, Ingress, Climatic/
Chemical, and EMI Environments
Media Oriented Systems Transport protocol
Multi-User Telecommunications Outlet Assembly
National Electrical Contractors Assoc.
Open DeviceNet Vendors Association
850nm Laser Optimized 50 micron multimode fiber (a
higher bandwidth fiber)
Outside Plant
Project Authorization Request
Physical Layer
Plastic Optical Fiber
Re Grounding or a MESH-BN
Relative Humidity
Society of Cable and Telecommunications Engineers
Subcommittee 65/Joint Work Group 10
SFF
TE
TEBC
TGB
TIA
TR (- xx)
TSB
US TAG
WG3