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VDSS

HiPerFETTM Power MOSFETs


ISOPLUS247TM

IXFR 50N50
IXFR 55N50

(Electrically Isolated Back Surface)

ID25

RDS(on)

100 m

90 m

500 V 43 A
500 V 48 A
trr 250 ns

Single Die MOSFET

Maximum Ratings

ISOPLUS 247TM

Symbol

Test Conditions

VDSS
VDGR

TJ = 25C to 150C
TJ = 25C to 150C; RGS = 1 M

500
500

V
V

VGS
VGSM

Continuous
Transient

20
30

V
V

ID25

TC = 25C

IDM

TC = 25C, Pulse width limited by TJM

IAR

TC = 25C

43
48
200
220
50
55

A
A
A
A
A
A

EAR

TC = 25C

60

mJ

EAS

TC = 25C

dv/dt

IS IDM, di/dt 100 A/s, VDD VDSS


TJ 150C, RG = 2

V/ns

PD

TC = 25C

400

-40 ... +150


150
-40 ... +150

C
C
C

300

2500

V~

TJ
TJM
Tstg
TL

1.6 mm (0.063 in.) from case for 10 s

VISOL

50/60 Hz, RMS

50N50
55N50
50N50
55N50
50N50
55N50

t = 1 min

Weight

Isolated back surface*

G = Gate
S = Source

Test Conditions

Characteristic Values
(TJ = 25C, unless otherwise specified)
min. typ. max.

VDSS

VGS = 0 V, ID = 1mA

500

VGS(th)

VDS = VGS, ID = 8mA

2.5

4.5 V

IGSS

VGS = 20 V, VDS = 0

Features
l

l
l

IDSS

VDS = VDSS
VGS = 0 V

TJ = 25C
TJ = 125C

RDS(on)

VGS = 10 V, ID = IT
Note 1

50N50
55N50

2002 IXYS All rights reserved

25 A
2 mA
100 m
90 m

Silicon chip on Direct-Copper-Bond


substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Low drain to tab capacitance(<50pF)
Low RDS (on) HDMOSTM process
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS)
rated
Fast intrinsic Rectifier

Applications

l
l
l
l

200 nA

D = Drain

* Patent pending

Symbol

DC-DC converters
Battery chargers
Switched-mode and resonant-mode
power supplies
DC choppers
AC motor control

Advantages
l
l
l

Easy assembly
Space savings
High power density

98588B (04/02)

IXFR 50N50
IXFR 55N50
Symbol

Test Conditions

Characteristic Values
(TJ = 25C, unless otherwise specified)
min. typ. max.

gfs

V DS = 10 V; ID = IT

Note 1

45

9400

pF

1280

pF

Crss

460

pF

td(on)

45

ns

60

ns

Ciss
Coss

VGS = 0 V, VDS = 25 V, f = 1 MHz

tr

VGS = 10 V, VDS = 0.5 VDSS, ID = IT

td(off)

RG = 1 (External),

120

ns

45

ns

330

nC

55

nC

155

nC

tf
Qg(on)
Qgs

VGS = 10 V, VDS = 0.5 VDSS, ID = IT

Qgd

0.30

RthJC
0.15

RthCK

Source-Drain Diode

K/W
K/W

Characteristic Values
(TJ = 25C, unless otherwise specified)
min. typ. max.

Symbol

Test Conditions

IS

VGS = 0 V

55N50
50N50

55
50

A
A

ISM

Repetitive;
pulse width limited by TJM

55N50
50N50

220
200

A
A

VSD

IF = IS, VGS = 0 V

1.5

250

ns

t rr
QRM

ISOPLUS 247 OUTLINE

IF = 25A,-di/dt = 100 A/s, VR = 100 V

1.0

10

IRM

See IXFK55N50 data sheet for


characteristic curves.

Note: 1. Pulse test, t 300 s, duty cycle d 2 %


2. IT test current:
50N50 IT = 25A
55N50 IT = 27.5A

IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents:

4,835,592
4,850,072

4,881,106
4,931,844

5,017,508
5,034,796

5,049,961
5,063,307

5,187,117
5,237,481

5,486,715
5,381,025

6,306,728B1

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