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Department of Chemistry, Imperial College of Science Technology and Medicine, London, UK SW7 2AZ
Received 6 November 2001; received in revised form 13 November 2001; accepted 14 November 2001
Abstract
A method for producing insulated nanometer-sized carbon electrodes is presented. These electrodes are produced using electrochemical etching of carbon bers followed by deposition of electrophoretic paint. A new deposition approach for insulating the
tips, the so-called ``inverted deposition'' technique, is introduced. This technique allows complete insulation of the whole body of the
etched carbon ber except for the very tip, leaving an electrochemical active area with eective diameters as small as a few nanometers. The process overcomes pinhole formation that can be a problem with the normal electrophoretic paint deposition process.
The fabricated electrodes show ideal steady-state voltammetric behavior. The voltammetric response corresponding to the reduction
of hexacyanoferrate(III) and hexaammineruthenium(III) is investigated on these small electrodes in the absence and presence of
supporting electrolyte. For these two multiple-charged ions the steady-state voltammetric behavior in the absence of supporting
electrolyte is found to deviate from expected behavior, especially at very small electrodes. 2002 Elsevier Science B.V. All rights
reserved.
Keywords: Nanometer-sized electrode; Carbon ber; EDP insulation; Absence of supporting electrolyte
1. Introduction
During the last two decades there has been widespread and growing interest in fabricating and characterizing electrodes with nanometer dimensions due to
the novel applications of such ultrasmall devices and the
unique electrochemistry at the interface between individual nanoelectrodes and the electrolyte [14]. Preparation of ultrasmall electrodes involves two crucial steps.
First, a commercially obtained microwire of the electrode material has to be signicantly thinned down to
form a tapered tip with the end of nanometer dimensions. This thinning task is generally accomplished by
various etching techniques [1,59]. The other crucially
important step is insulation of the whole of the surface
of the etched wire except the very apex of the tip, thus
exposing only a very tiny electrochemically active area
to the electrolyte. Several research groups have reported
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1388-2481/02/$ - see front matter 2002 Elsevier Science B.V. All rights reserved.
PII: S 1 3 8 8 - 2 4 8 1 ( 0 1 ) 0 0 2 7 8 - 8
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Fig. 2. Schematic of the inverted deposition arrangement, (a); photomicrograph of ber tip just penetrating the surface of the EDP solution, (b). The bright region is due to low angle light reecting o of the
meniscus. Copper wire, 1; electrophoretic paint solution, 2; light
source, 3; meniscus, 4; carbon ber, 5; carbon colloid contact, 6.
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Fig. 5. The dependence of the ratio between the limiting plateau current (I) in 0:01 mol dm 3 RuNH3 6 Cl3 and the limiting plateau current (Id ) in 0:01 mol dm 3 RuNH3 6 Cl3 0:5 mol dm 3 KCl on the
eective radius of the carbon microelectrode electrode.
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ruthenium(III) such deviations are only seen for electrodes with eective radii of 20 nm or less. A possible
diuse double layer eect may arise when the active
radius of electrodes becomes less than 20 nm, which is
comparable to the size of the double layer in the dilute
solution without supporting electrolyte. For ferricyanide
reduction, the absence of supporting electrolyte potentially favors the reactant decomposition reaction which
produces adsorbed species which block the electrode
surface, thus resulting in a signicant inhibition of the
reduction current.
Acknowledgements
We thank the Leverhulme trust for the nancial
support, Mr. Peter Hope from LVH Ltd. for providing
the electrophoretic paint solution and suggestions on its
use, and Mr. Simon Turner for his workshop skills.
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