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Semiconductor
MSM82C51A-2RS/GS/JS
Semiconductor
FEATURES
Wide power supply voltage range from 3 V to 6 V
Wide temperature range from 40C to 85C
Synchronous communication upto 64 Kbaud
Asynchronous communication upto 38.4 Kbaud
Transmitting/receiving operations under double buffered configuration.
Error detection (parity, overrun and framing)
28-pin Plastic DIP (DIP28-P-600-2.54): (Product name: MSM82C51A-2RS)
28-pin Plastic QFJ (QFJ28-P-S450-1.27): (Product name: MSM82C51A-2JS)
32-pin Plastic SSOP(SSOP32-P-430-1.00-K): (Product name: MSM82C51A-2GS-K)
1/26
Semiconductor
MSM82C51A-2RS/GS/JS
D7 - D0
Data Bus
Buffer
RESET
CLK
C/D
RD
WR
CS
Read/Write
Control
Logic
DSR
DTR
CTS
RTS
Modem
Control
Transmit
Buffer
(P - S)
TXD
Transmit
Control
TXRDY
TXE
TXC
Recieve
Buffer
(S - P)
RXD
Recieve
Control
RXRDY
RXC
SYNDET/BD
2/26
Semiconductor
MSM82C51A-2RS/GS/JS
28 D1
D3
27 D0
RXD
26 VCC
GND
25 RXC
D4
24 DTR
D5
23 RTS
D6
22 DSR
D7
21 RESET
TXC
20 CLK
WR 10
19 TXD
18 TXEMPTY
26 VCC
27 D0
28 D1
1 D2
CS 11
2 D3
3 RXD
4 GND
D2
C/D 12
17 CTS
RD 13
16 SYNDET/BD
15 TXRDY
RXRDY 14
D4
25 RXC
D5
24 DTR
D6
23 RTS
D7
22 DSR
TXC
21 RESET
D2
32
D1
18
CTS 17
D3
31
D0
TXEMPTY
SYNDET/BD 16
TXRDY 15
RXRDY 14
19 TXD
RD 13
20 CLK
CS 11
C/D 12
WR 10
RXD
30
VCC
NC
29
NC
GND
28
RXC
D4
27
DTR
D5
26
RTS
D6
25
DSR
D7
24
RESET
TXC
10
23
CLK
WR
11
22
TXD
CS
12
21
TXEMPTY
NC
13
20
NC
C/D
14
19
CTS
RD
15
18
SYNDET/BD
16
17
TXRDY
RXRDY
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Semiconductor
MSM82C51A-2RS/GS/JS
FUNCTION
Outline
The MSM82C51A-2's functional configuration is programed by software.
Operation between the MSM82C51A-2 and a CPU is executed by program control. Table 1
shows the operation between a CPU and the device.
Table 1 Operation between MSM82C51A and CPU
CS
C/D
RD
WR
Status CPU
Data CPU
Data CPU
Asynchronous
yes
no
Write First Sync
Charactor
Single
Sync Mode
yes
no
Write Second Sync
Charactor
4/26
Semiconductor
MSM82C51A-2RS/GS/JS
Control Words
There are two types of control word.
1. Mode instruction (setting of function)
2. Command (setting of operation)
1) Mode Instruction
Mode instruction is used for setting the function of the MSM82C51A-2. Mode instruction
will be in wait for write at either internal reset or external reset. That is, the writing of a
control word after resetting will be recognized as a mode instruction.
Items set by mode instruction are as follows:
Synchronous/asynchronous mode
Stop bit length (asynchronous mode)
Character length
Parity bit
Baud rate factor (asynchronous mode)
Internal/external synchronization (synchronous mode)
Number of synchronous characters (Synchronous mode)
The bit configuration of mode instruction is shown in Figures 2 and 3. In the case of
synchronous mode, it is necessary to write one-or two byte sync characters.
If sync characters were written, a function will be set because the writing of sync characters
constitutes part of mode instruction.
D7
D6
D5
D4
D3
D2
D1
D0
S1
S1
EP
PEN
L2
L1
B2
B1
Baud Rate Factor
0
0
Refer to
Fig. 3
SYNC
16
64
Charactor Length
0
5 bits
6 bits
7 bits
8 bits
Parity Check
0
0
Odd
Parity
1
Even
Parity
Disable
Disable
Inhabit
1 bit
1.5 bits
2 bits
5/26
Semiconductor
MSM82C51A-2RS/GS/JS
D7
D6
D5
D4
D3
D2
D1
D0
SCS
ESD
EP
PEN
L2
L1
0
Charactor Length
0
5 bits
6 bits
7 bits
8 bits
0
Odd
Parity
1
Even
Parity
Parity
Disable
Disable
Synchronous Mode
0
Internal
Synchronization
External
Synchronization
2 Charactors
1 Charactor
6/26
Semiconductor
MSM82C51A-2RS/GS/JS
2) Command
Command is used for setting the operation of the MSM82C51A-2.
It is possible to write a command whenever necessary after writing a mode instruction and
sync characters.
Items to be set by command are as follows:
Transmit
Enable/Disable
Receive Enable/Disable
DTR, RTS
Output of data.
Resetting of error flag.
Sending to break characters
Internal resetting
Hunt mode (synchronous mode)
D6
D5
D4
D3
D2
D1
D0
EH
IR
RTS
ER
SBRK
RXE
DTR
TXEN
1Transmit Enable
0Disable
DTR
1 DTR = 0
0 DTR = 1
1Recieve Enable
0Disable
1Sent Break Charactor
0Normal Operation
1Reset Error Flag
0Normal Operation
RTS
1 RTS = 0
0 RTS = 1
1Internal Reset
0Normal Operation
1Hunt Mode (Note)
0Normal Operation
Note: Seach mode for synchronous
charactors in synchronous mode.
7/26
Semiconductor
MSM82C51A-2RS/GS/JS
Status Word
It is possible to see the internal status of MSM82C51A-2 by reading a status word.
The bit configuration of status word is shown in Fig. 5.
D7
D6
D5
D4
D3
D2
D1
D0
DSR
SYNDET
/BD
FE
OE
PE
TXEMPTY
RXRDY
TXRDY
1Overrun Error
1Framing Error
Note: Only asynchronous mode.
Stop bit cannot be detected.
Shows Terminal DSR
1DSR = 0
0DSR = 1
Standby Status
It is possible to put the MSM82C51A-2 in standby status
When the following conditions have been satisfied the MSM82C51A-2 is in standby status.
(1) CS terminal is fixed at Vcc level.
(2) Input pins other CS , D0 to D7, RD, WR and C/D are fixed at Vcc or GND level (including
SYNDET in external synchronous mode).
Note:
8/26
Semiconductor
MSM82C51A-2RS/GS/JS
Pin Description
D0 to D7 (l/O terminal)
This is bidirectional data bus which receive control words and transmits data from the CPU and
sends status words and received data to CPU.
RESET (Input terminal)
A High on this input forces the MSM82C51A-2 into reset status.
The device waits for the writing of mode instruction.
The min. reset width is six clock inputs during the operating status of CLK.
CLK (Input terminal)
CLK signal is used to generate internal device timing.
CLK signal is independent of RXC or TXC.
However, the frequency of CLK must be greater than 30 times the RXC and TXC at Synchronous
mode and Asynchronous x1 mode, and must be greater than 5 times at Asynchronous x16
and x64 mode.
WR (Input terminal)
This is the active low input terminal which receives a signal for writing transmit data and
control words from the CPU into the MSM82C51A-2.
RD (Input terminal)
This is the active low input terminal which receives a signal for reading receive data and
status words from the MSM82C51A-2.
C/D (Input terminal)
This is an input terminal which receives a signal for selecting data or command words and status
words when the MSM82C51A-2 is accessed by the CPU.
If C/D = low, data will be accessed.
If C/D = high, command word or status word will be accessed.
CS (Input terminal)
This is the active low input terminal which selects the MSM82C51A-2 at low level when the
CPU accesses.
Note: The device wont be in standby status; only setting CS = High.
Refer to Explanation of Standby Status.
TXD (output terminal)
This is an output terminal for transmitting data from which serial-converted data is sent out.
The device is in mark status (high level) after resetting or during a status when transmit is
disabled. It is also possible to set the device in break status (low level) by a command.
9/26
Semiconductor
MSM82C51A-2RS/GS/JS
10/26
Semiconductor
MSM82C51A-2RS/GS/JS
11/26
Semiconductor
MSM82C51A-2RS/GS/JS
Rating
Symbol
Unit
Conditions
VCC
0.5 to +7
Input Voltage
VIN
VOUT
TSTG
Output Voltage
Storage Temperature
Power Dissipation
55 to +150
0.9
PD
0.7
0.9
With respect
to GND
Ta = 25C
OPERATING RANGE
Symbol
Range
Unit
Parameter
VCC
3-6
Operating Temperature
Top
40 to 85
Symbol
Min.
Typ.
Max.
Unit
VCC
4.5
5.5
Operating Temperature
Top
40
+25
+85
VIL
0.3
+0.8
VIH
2.2
VCC +0.3
DC CHARACTERISTICS
(VCC = 4.5 to 5.5 V Ta = 40C to +85C)
Parameter
Symbol
Min.
Typ.
Max.
0.45
VOH
3.7
ILI
10
ILO
10
Operating Supply
Current
ICCO
Standby Supply
Current
ICCS
VOL
Unit
Measurement Conditions
IOL = 2.5 mA
IOH = 2.5 mA
10
mA
0 VIN VCC
10
mA
0 VOUT VCC
mA
100
mA
12/26
Semiconductor
MSM82C51A-2RS/GS/JS
AC CHARACTERISTICS
CPU Bus Interface Part
(VCC = 4.5 to 5.5 V, Ta = 40 to 85C)
Parameter
Symbol
Max.
Unit
Remarks
Note 2
tAR
Min.
20
tRA
20
ns
Note 2
RD Pulse Width
tRR
130
ns
ns
tRD
100
ns
RD to Data Float
tDF
10
75
ns
tRVR
tCY
Note 5
tAW
20
ns
Note 2
tWA
20
ns
Note 2
WR Pulse Width
tWW
100
ns
tDW
100
ns
tWD
ns
tRVW
tCY
Note 4
tRESW
tCY
13/26
Semiconductor
MSM82C51A-2RS/GS/JS
Parameter
Symbol
Max.
Unit
Remarks
tCY
Min.
160
ns
Note 3
tf
50
ns
tf
70
tCY 50
ns
tr, tf
20
ns
tDTX
mS
1 Baud
fTX
DC
64
kHz
16 Baud
fTX
DC
615
kHz
Note 3
64 Baud
fTX
DC
615
kHz
1 Baud
tTPW
13
tCY
16 , 64 Baud
tTPW
tCY
1 Baud
tTPD
15
tCY
16 , 64 Baud
tTPD
tCY
1 Baud
fRX
DC
64
kHz
16 Baud
fRX
DC
615
kHz
64 Baud
fRX
DC
615
kHz
1 Baud
tRPW
13
tCY
16 , 64 Baud
tRPW
tCY
1 Baud
tRPD
15
tCY
16 , 64 Baud
tRPD
tCY
tTXRDY
tCY
tTXRDY CLEAR
400
ns
tRXRDY
26
tCY
tRXRDY CLEAR
400
ns
tIS
26
tCY
Note 3
tES
18
tCY
tTXEMPTY
20
tCY
tWC
tCY
tCR
20
tCY
tRXDS
11
tCY
tRXDH
17
tCY
Notes: 1. AC characteristics are measured at 150 pF capacity load as an output load based on 0.8 V at
low level and 2.2 V at high level for output and 1.5 V for input.
2. Addresses are CS and C/D.
3. fTX or fRX 1/(30 Tcy) 1 Baud
fTX or fRX 1/(5 Tcy) 16, 64 Baud
4. This recovery time is mode Initialization only. Recovery time between command writes for
Asynchronous Mode is 8 tCY and for Synchronous Mode is 18 tCY.
Write Data is allowed only when TXRDY = 1.
5. This recovery time is Status read only.
Read Data is allowed only when RXRDY = 1.
6. Status update can have a maximum delay of 28 clock periods from event affecting the status.
14/26
Semiconductor
MSM82C51A-2RS/GS/JS
TIMING CHART
Sytem Clock Input
tf
tr
tf
tf
tCY
CLK
tTPW
TXC (1 MODE)
tTPD
tDTX
TXD
RXD
RXC (1 Mode)
RXC (16 Mode)
tRPW
8RXC Periods
(16Mode)
Data bit
3tCY
INT Sampling
Pulse
Data bit
tRPD
3tCY
tf
15/26
Semiconductor
MSM82C51A-2RS/GS/JS
WR
DATA IN (D. B.)
tTXRDY Clear
tWD
tDW
Don't Care
Don't Care
Data Stable
C/D
tAW
tWA
CS
tAW
tWA
RD
DATA OUT (D. B.)
tRD
Data Float
tDF
Data Float
C/D
tAR
tRA
CS
tAR
tRA
DATA IN
(D. B.)
tWC
tWW
WR
tWD
tDW
Don't Care
Don't Care
Data Stable
C/D
CS
tAW
tWA
tAW
tWA
tRR
RD
DATA OUT
(D. B.)
tDF
Data Float
tRD
Data Out Active
Data Float
tAR
tRA
tAR
tRA
C/D
CS
16/26
Semiconductor
MSM82C51A-2RS/GS/JS
tTXEMPTY
TXEMPTY
TXRDY
(STATUS BIT)
tTXRDY
TXRDY
(PIN)
Wr DATA 1
Wr DATA 2
Wr DATA 3
Wr DATA 4
C/D
Wr TxEn
Wr SBRK
WR
0
1
2
3
4
5
6
TXD
DATA CHAR 2
DATA CHAR 3
DATA CHAR 4
STOP BIT
START BIT
DATA CHAR 1
Note: The wave-form chart is based on the case of 7-bit data length + parity bit + 2 stop bit.
DATA
CHAR2
Lost
tRXRDY
Rd Data
C/D
WR
Wr RxEn
Wr Error
RxEn
RD
RXDATA
Data CHAR 2
Data CHAR 3
Break
Data Bit
Start Bit
Stop Bit
Parity Bit
Data CHAR 1
Note: The wave-form chart is based on the case of 7 data bit length + parity bit + 2 stop bit.
WR
Marking State
TXD
Wr Data
CHAR2
Wr Data
CHAR3
Wr Data
CHAR4
Wr Commond
SBRK
Data
Data
SYNC
SYNC
Data
Marking
CHAR1
CHAR2
CHAR1 SYNC CHAR2
CHAR3
CHAR4
State
0123 4 012 34 0 12 34 01234 012 34 0 123 4
PAR
PAR
PAR
PAR
PAR
PAR
Spacing
State
Wr Data
CHAR5
Marking
State
Data
SYNC
CHAR5
CHAR ETC
0123 4 012 34 0 1
PAR
PAR
Note: The wave-form chart is based on the case of 5 data bit length + parity bit and 2 synchronous charactors.
17/26
Semiconductor
MSM82C51A-2RS/GS/JS
SYNDET
(Pin) (Note 1)
tES
tIS
SYNDET (SB)
OVERRUN
ERROR (SB)
Data
CHAR2
Lost
RXRDY (PIN)
Rd Status
C/D
Wr EH
RxEn
Wr Err Res
Rd Data
CHAR 1
Rd Data
CHAR 3
Rd Status
Rd Status
Wr EHo
Rd SYNC
CHAR 1
WR
RD
Don't
Care
RXD
SYNC
CHAR 1
SYNC
CHAR 2
Data
CHAR 1
Data
CHAR 2
Data
CHAR 3
SYNC
CHAR 1
SYNC
CHAR 2 Don't Care
Data
CHAR 1
x x x x x x 0 1 2 3 4
0 1 2 3 4
0 1 2 3 4
0 1 2 3 4
0 1 2 3 4
0 1 2 3 4
0 1 2 3 4
0 1 2 3 4
PAR
PAR
PAR
PAR
CHAR ASSY Begins
RXC
PAR
PAR
x x x x x x x
PAR
PAR
Data
CHAR 2
CHAR ASSY
Begins
ETC
0 1 x 3 4
PAR
PAR
Note: 1. Internal Synchronization is based on the case of 5 data bit length + parity bit and 2 synchronous charactor.
2. External Synchronization is based on the case of 5 data bit length + parity bit.
Mode
Operation
16
64
16
64
16
64
18/26
Semiconductor
MSM82C51A-2RS/GS/JS
ST D0 D1 D2 D3 D4 D5 D6 D7 P SP
ST D0 D1 D2 D3 D4 D5 D6 D7 P SP
RXRDY
RXD
ST
RXRDY
RXD
ST
RXRDY
RXD
ST
RXRDY
ST:
SP:
P:
D0 - D7:
Start bit
Stop bit
Parity bit
Data bits
19/26
Semiconductor
MSM82C51A-2RS/GS/JS
ST D0
D7 P SP ST D0
D7 P SP ST D0 D1 D2 D3 D4 D5 D6 D7 P SP
RXD
RXRDY
No parity flag is set. and no RXRDY signal
is outputted.
Bug Timing
BIT POS.
ST D0
D7 P SP ST D0
D7 P SP ST D0 D1 D2 D3 D4 D5 D6 D7 P SP
RXD
RXRDY
A parity flag is set, but, no RXRDYsignal
is outputted.
Normal Operation
BIT POS.
ST D0
D7 P SP ST D0
D7 P SP ST D0 D1 D2 D3 D4 D5 D6 D7 P SP
RXD
RXRDY
A parity flag is set. and a RXRDY signal
is outputted.
20/26
Semiconductor
MSM82C51A-2RS/GS/JS
The conventional low speed devices are replaced by high-speed devices as shown below.
When you want to replace your low speed devices with high-speed devices, read the replacement
notice given on the next pages.
Remarks
M80C85AH
M80C86A-10
M80C86A/M80C86A-2
16bit MPU
M80C88A-10
M80C88A/M80C88A-2
8bit MPU
M82C84A-2
M82C84A/M82C84A-5
Clock generator
M81C55-5
M82C37B-5
M81C55
M82C37A/M82C37A-5
RAM.I/O, timer
DMA controller
M82C51A-2
M82C51A
USART
M82C53-2
M82C55A-2
M82C53-5
M82C55A-5
Timer
PPI
8bit MPU
21/26
Semiconductor
MSM82C51A-2RS/GS/JS
Parameter
Symbol
MSM82C51A
MSM82C51A-2
IOL
+2.0 mA
+2.5 mA
IOH
-400 mA
-2.5 mA
Although the output voltage characteristics of these devices are identical, but the measurement
conditions of the MSM82C51A-2 are more restricted than the MSM82C51A.
3-2) AC Characteristics
Parameter
Symbol
MSM82C51A
MSM82C51A-2
RD Pulse Width
tRR
250 ns minimum
130 ns minimum
tRD
200 ns maximum
100 ns maximum
tRF
100 ns maximum
75 ns minimum
WR Pulse Width
tWW
250 ns minimum
100 ns minimum
tDW
150 ns minimum
100 ns minimum
tWD
20 ns minimum
0 ns minimum
tCY
250 ns minimum
160 ns minimum
tf
90 ns minimum
50 ns minimum
tf
120 ns minimum
tCY-90 ns maximum
70 ns minimum
tCY-50 ns maximum
22/26
Semiconductor
MSM82C51A-2RS/GS/JS
PACKAGE DIMENSIONS
(Unit : mm)
DIP28-P-600-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
4.30 TYP.
23/26
Semiconductor
MSM82C51A-2RS/GS/JS
(Unit : mm)
QFJ28-P-S450-1.27
Spherical surface
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
1.00 TYP.
24/26
Semiconductor
MSM82C51A-2RS/GS/JS
(Unit : mm)
SSOP32-P-430-1.00-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.60 TYP.
25/26
Semiconductor
MSM82C51A-2RS/GS/JS
4) Notices on use
Note the following when replacing devices as the ASYNC pin is differently treated between the
MSM82C84A and the MSM82C84A-5/MSM82C84A-2:
Case 1: When only a pullup resistor is externally connected to.
The MSM82C84A can be replaced by the MSM82C84A-2.
Case 2: When only pulldown resistor is externally connected to.
When the pulldown resistor is 8 kiloohms or less, the MSM82C84A can be replaced by the
MSM82C84A-2.
When the pulldown resistor is greater than 8 kiloohms, use a pulldown resistor of 8 kiloohms or less.
Case 3: When an output of the other IC device is connected to the device.
The MSM82C84A can be replaced by the MSM82C84A-2 when the IOL pin of the device to drive the
ASYNC pin of the MSM82C84A-2 has an allowance of 100 mA or more.
26/26