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This is intended to be an introductory course for semiconductor chip fabrication processes.

The target audience is undergraduate chemical engineering and electronics and communication engineering students.

The focus will be on the various modules (equivalent to unit operations in traditional chemical engineering) relevant for chip m

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The course will start with an overviewImportant:
of the manufacturing
process.
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Bulk of the course will deal with understanding the individual processes and the tools used.

An overview of the MOS transistor structure and operation will be given so that the sequence of processes needed to create t
from that perspective.

The issues relevant for the industry such as process integration, testing and yield will be covered at the later stages of the cours
The analytical tools used in the semiconductor industry are different compared to the typical tools used in chemical industry.
Hence a brief overview of the relevant analytical tools and techniques will also be given.
Course contents:

Overview, Lithography, Deposition techniques (physical vapor deposition, chemical vapor deposition, electrochemical depositi

Removal methods (wet etching, dry etching, chemical mechanical planarization), front end of line (FEOL) basics, transistor str

Material modification methods (diffusion, ion implantation, oxidation), process integration, testing and yield, relevant tools and

S.No

Topics

Introduction:

No. of
Hours
1

overview of Chip Manufacturing Process, FEOL and BEOL concepts.


2

PhotoLithography:

1. Lithography basics, layout, hierarchy vs flat file, levels and layers in


layout file.
2. Mask making with e-beam, alignment and test structures in masks.
3

Lithography details:
1. Projection printing, dark field mask, positive resist and its advantages.
2. Process details including resist coating, pre-exposure bake, exposure,
soft bake, developing and hard bake.
3. Stepper vs scanner.

Course Description:
A hands-on introduction to the fundamentals of micro- and nano-fabrication processes with emphasis
on cleanroom practices. The physical principles of oxidation, optical lithography, thin film deposition,
etching and metrology methods will be discussed, demonstrated and practiced. Students will be trained
in cleanroom concepts and safety protocols. Sequential micro-fabrication processes involved in the
manufacture of microelectronic and photonic devices will be shown. Training in imaging and
characterization of micro- and nano-structures will be provided.

Textbook:
-Introduction to Microelectronic Fabrication, 2nd edition, Richard C. Jaeger, Prentice Hall (ISBN
0201444941)
-Fabrication Engineering at the Micro and Nanoscale, 3rd edition, Stephen A. Campbell, Oxford
University Press 2008 (ISBN-10: 0195320174)

Other References:
- VLSI Fabrication Principles, 2nd Edition, Sorabh K. Ghandhi, Wiley Interscience
- Process Engineering Analysis in Semiconductor Device Fabrication, Middleman and Hochberg,
McGraw Hill, 1993

Course Grading:
Weekly labs: 30%
Exam 1: 30%
Project: 40%

Grading Policy:
90% or above A
80% to 89% B
65% to 79% C
45% to 64% D
44% or below F

Topics
We will look into the following topics in the lecture series:
Oxidation & metrology
Physical Vapor Deposition (PVD)
The metal oxide semiconductor (MOS) capacitor

Lithography and patterning


Etching - dry and wet
Chemical vapor deposition (CVD) and atomic layer deposition (ALD)
e-beam lithography
Class discussions and brainstorming series
Note: Every lecture we will have a few minutes to recap the lab classes from the previous weeks. Your
inputs on how things worked out will be important. My e-communication to most of you will be
through this website. I will provide a lot of reading material and I will expect you to read the material
before coming to class or going to the laboratory. There is simply not enough lecture time to cover all
the topics of importance. However, reading them offline will help you better conduct your experiments
in the cleanroom.

Syllabus (tentative)
Dates
(week beginning)

Topics

Links

Chapter

Week 1

Introduction to Nanofab pdf

Week 2

Safety Training

Safety Manual
Alarm Protocol
Online Scheduling

Week 3

Lithography

pdf

Ch. 2 from Jaeger

Week 4

Etching

pdf

Ch. 2 from Jaeger

Week 5

Deposition

pdf

Ch. 12 from Campbell

Week 6

Thermal Oxidation

pdf

Ch. 3 from Jaeger

Week 7

Exam Revies

pdf

Labs
Dates
(week beginning)

Topics

Links

Lab 0

Introduction to Nanofab

Safety Manual
Alarm Protocol
Online Scheduling

Lab 1

Lithography with S1808

pdf

Lab 2

Lithography with Su8


Su8 datasheet

pdf
pdf

Lab 3

Liftoff with Aluminum


Omnicoat datasheet

pdf
pdf

Lab 4

RIE of Aluminum

pdf

Lab 5

Deposition and etching Rates

pdf

Lab 6

Design of a Capacitor

pdf

Final Project
Here is a link to the final project description (pdf)
There is a forth final project. Detailes are provided here (pdf)

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