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THERMAL CONTACT RESISTANCE

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DOI: 10.1615/AtoZ.t.thermal_contact_resistance

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When a junction is formed by pressing two similar or dissimilar metallic materials together, only a small fraction of the

nominal surface area is actually in contact because of the nonflatness and roughness of the contacting surfaces. If a heat flux

is imposed across the junction, the uniform flow of heat is generally restricted to conduction through the contact spots, as

shown in Figure 1. The limited number and size of the contact spots results in an actual contact area which is significantly

smaller than the apparent contact area. This limited contact area causes a thermal resistance, the contact resistance or thermal

contact resistance.

K
L
M
N
O
P
Q

Figure 1. Magnified view of two materials in contact.

R
S

The presence of a fluid or solid interstitial medium between the contacting surfaces may contribute to or restrict the heat
transfer at the junction, depending upon the thermal conductivity, thickness, and hardness (in the case of a solid) of the

T
1,1,1-TRICHLOROETHANE
T-JUNCTIONS

interstitial medium. If there is a significant temperature difference between the surfaces composing the junction, heat
exchange by radiation also may occur across the gaps between the contacting surfaces.

TACHOMETRIC FLOWMETERS

When a metallic junction is placed in a vacuum, conduction through the contact spots is the primary mode of heat transfer,

TACONITE

and the contact resistance is generally greater than when the junction is in the presence of air or other fluid. In a vacuum, the

TAIT EQUATION

temperature distribution in the contacting materials, with the resulting temperature difference at the junction, is shown

TAME

Figure 2 for both flat and cylindrical junctions.

TANK COILS
TANTALUM
TARS
TAU METHOD
TAYLOR COLUMN
TAYLOR EQUATION FOR MIXTURE
VISCOSITY
TAYLOR FLOWS
TAYLOR INSTABILITY
TAYLOR NUMBER
TAYLOR SERIES
TAYLOR'S THEOREM
TAYLOR-COUETTE HEAT

Figure 2. Temperature distribution across flat and cylindrical contacting solids.

EXCHANGER
TAYLOR-GRTLER VORTEX FLOWS

This temperature difference is used to define the contact resistance at the junction, such that:

TAYLOR-PROUDMAN THEOREM

(1)

TDS, TOTAL DISSOLVED SOLIDS

TEMA

where T1 and T2 are the temperatures of the bounding contact surfaces, S is the area across which the heat is transferred, and

TEMA STANDARDS

ac is the heat transfer coefficient for the junction, or the thermal contact conductance. This contact conductance or joint

TEMPERATURE

conductance is often reported in the literature and is defined as:

TEMPERATURE GRADIENT IN

(2)

EARTH'S CRUST
TEMPERATURE MEASUREMENT,
BASES

The magnitude of the contact conductance is a function of a number of parameters including the thermophysical and

TEMPERATURE MEASUREMENT,

mechanical properties of the materials in contact, the characteristics of the contacting surfaces, the presence of gaseous or

PRACTICE

nongaseous interstitial media, the apparent contact pressure, the mean junction temperature, and the conditions surrounding
the junction, as noted by Fletcher (1988).

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TEMPERATURE PROFILES IN
BOUNDARY LAYER AND
SEPARATED FLOWS
TEMPERATURE SENSITIVE
COATINGS
TEMPERATURE-DEPENDENT
VISCOSITY VARIATION
TEMPERATURE-HEAT LOAD PLOT

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In view of the significant number of parameters affecting the contact conductance or contact resistance, it has not been
possible to develop a single analytical expression for the prediction of the contact resistance at a junction between two
materials, except for cases of highly idealized single and multiple contacts. An overview of the idealized models has been
reported by Sridhar and Yovanovich (1994). An analytical expression for predicting the contact conductance of nonflat or
machined metallic surfaces in contact has been developed by Lambert and Fletcher (1995) for a wide range of metallic
materials and test conditions. Despite the availability of these models, a majority of the. contact resistance information is
determined experimentally in order to provide a measure of the thermal performance of a specific configuration or system.

TEMPERING

Most experimental contact resistance data are obtained using a traditional cutbar, vertical column test facility in a vacuum

TEMPERING OF CHEMICAL

or ambient environment over a range of steadystate test conditions. More specialized test facilities have been developed for

REACTION

use with such configurations as bolted joints, periodic or sliding contacts, concentric cylinders, and full scale or partial scale

TERMINAL SETTLING VELOCITY

models, while some configurations are studied by electrolytic analogue techniques. Essentially all of these experimental

TERMINAL VELOCITY

facilities may be used for evaluation of metallic and nonmetallic materials in contact, or metallic and nonmetallic materials

TERMINAL VELOCITY OF PARTICLE

with gaseous or nongaseous interstitial media between the contacting surfaces, over a wide range of test parameters.

IN GAS

The force applied to the nominal contact area of the junction provides the apparent contact pressure on the junction. The
TERRAIN INDUCED INSTABILITIES
TETRAFLUOROETHYLENE

mean junction temperature, Tm, is the average of the contacting surface temperatures. The apparent contact pressure and the
mean junction temperature, combined with the thermophysical and mechanical properties of the contacting materials and

TEXTURE

the surface characteristics, are the primary factors in determining the magnitude of the contact resistance. High junction

THEORETICAL BASIS OF

loads and high temperatures result in low contact resistances, whereas light junction loads and low temperatures lead to

STOCHASTIC MODELS

high contact resistances.

THEORETICAL PLATE
THERMAL ANEMOMETERS

The surface finish, or roughness and flatness of the contacting surfaces, can significantly affect the magnitude of the contact
resistance. If the axial force on the contacting surfaces is increased, the surface roughness peaks or asperities may deform

THERMAL BARRIER COATINGS

plastically or elastically, depending upon the material properties, leading to increased contact area and decreased contact

THERMAL BOUNDARY LAYER

resistance. An elevated temperature at the junction may also cause plastic and/or elastic deformation of the roughness

THERMAL BUILDING DYNAMICS

asperities, especially for softer materials, with an associated increase in the actual contact area and a decrease in the contact

THERMAL CAMERA

resistance. Typical contact resistance values for Aluminum 2024T4 samples in contact at moderate test conditions in a

THERMAL CONDUCTIVITY

vacuum environment are shown in Figure 3, to demonstrate the effect of surface finish and mean junction temperature on

THERMAL CONDUCTIVITY IN

contact resistance [Fletcher (1991)].

POROUS MEDIA
THERMAL CONDUCTIVITY OF
ALUMINUM NANOPOWDERS
THERMAL CONDUCTIVITY OF
CARBON DIOXIDE
THERMAL CONDUCTIVITY OF
GASES
THERMAL CONDUCTIVITY VALUES
THERMAL CONDUCTIVITY, OF AIR
THERMAL CONTACT
CONDUCTANCE
THERMAL CONTACT RESISTANCE
THERMAL DATA FOR METALS
THERMAL DIFFUSION
THERMAL DIFFUSIVITY

Figure 3. Temperature distribution across flat and cylindrical contacting solids.

THERMAL EFFECTS
THERMAL EFFICIENCY

Some additional factors which may affect the contact resistance are the direction of the heat flux, surface scratches or cracks,

THERMAL EMISSION

nonuniform loading which causes uneven contact pressure, relative motion or slipping between the surfaces, and the

THERMAL ENERGY STORAGE

presence of oxides or contaminants on the contacting surfaces.

THERMAL EQUILIBRIUM
THERMAL EXPANSION
THERMAL EXPANSION
COEFFICIENTS

The use of interstitial or thermal control materials for thermal enhancement or thermal isolation of metallic junctions further
effects the contact resistance. Although there are variations in material thickness and composition, the contact resistance for
representative interstitial materials is shown in Figure 4. These interstitial materials have been categorized as greases and
oils; metallic foils and screens; ceramic composites and cements; and synthetic and natural sheets [Fletcher (1972)]. While

THERMAL EXPLOSION

metallic foils and greases are often used for thermal enhancement, most of the interstitial materials are generally used for

THERMAL FATIGUE

thermal isolation.

THERMAL FLOWMETERS
THERMAL FRONT IN A POROUS
MEDIUM
THERMAL GRAVITATION
CONVECTION
THERMAL IMAGING
THERMAL INSULATION
THERMAL MASS FLOWMETER
THERMAL MICROWAVE RADIATION
OF DISPERSE SYSTEMS ON SEA
SURFACE

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THERMAL MODULATION OF
RALEIGH-BENARD CONVECTION
THERMAL PERFORMANCE OF TUBE
BANKS
THERMAL PHENOMENA
THERMAL PROCESSING
THERMAL PUMPING
THERMAL RADIATION FROM
NONISOTHERMAL PARTICLES IN
COMBINED HEAT TRANSFER
PROBLEMS
THERMAL RADIATION FROM
NONISOTHERMAL SPHERICAL
PARTICLES
THERMAL RADIATION FROM
SPHERICAL PARTICLES TO
ABSORBING MEDIUM THROUGH
NARROW CONCENTRIC GAP
THERMAL RADIATION IN
UNWANTED FIRES
THERMAL RADIATION OF A TWOPHASE EXHAUST JET
THERMAL REACTORS
THERMAL REGENERATORS

Figure 4. Contact resistance for selected interstitial materials for thermal enhancement or thermal isolation.
Surface treatments, or coatings and films, may also be used for thermal enhancement or thermal isolation. Metallic coatings
provide modest to significant thermal enhancement, depending upon the metal used and the method of application. Ceramic

THERMAL SHOCK

coatings provide modest to excellent thermal isolation depending upon the choice of material. Ceramic coatings may also

THERMAL STRATIFICATION

provide hard, corrosion resistant coatings that are not electrically conducting. Care must be taken to assure that galvanic

THERMAL TRANSPORT

corrosion will not occur with the choice of materials for some applications.

THERMALIZATION
THERMISTORS

References

THERMO-CAPILLARY CONVECTION

1. Fletcher, L. S. (1972) A review of thermal control materials for metallic junctions, A1AA Journal of Spacecraft and Rockets, 9,

IN ELECTRONIC DISCHARGE
MACHINING
THERMOCAPILLARY FLOW
THERMOCHEMICAL CALORIE
THERMOCLINE
THERMOCOUPLES
THERMODYNAMIC EQUILIBRIUM
THERMODYNAMIC
NONEQUILIBRIUM
THERMODYNAMIC OPTIMIZATION

12, 849850. DOI: 10.2514/3.61809

2. Fletcher, L. S. (1988) Recent developments in contact conductance heal transfer. ASME Journal of Heat Transfer, 110, 4B,
10591070.
3. Fletcher, L. S. (1991) Conduction in solidsImperfect metaltometal contacts: Thermal contact resistance, Section 502.5,
Heat Transfer and Fluid Mechanics Data Books, Genium Publishing Company, Schenectady, New York.
4. Lambert, M. A. and Fletcher, L. S. (1995) Thermal Contact Conductance of Spherical Rough Metals: Theory and
Comparison to Experiment, Proceedings of the ASME/JSME Thermal Engineering Joint Conference, Maui, Hawaii, March
1924.
5. Sridhar, M. R. and Yovanovich, M. M. (1993) Critical Review of Elastic and Plastic Contact Conductance Models and
Comparison with Experiment, AIAA Paper 932776, A1AA Thermophysics Conference, Orlando, Florida, July 69.

THERMODYNAMIC PROBABILITY
Number of views: 39541

Article added: 2 February 2011

Article last modified: 9 February 2011

Copyright 20102015

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THERMODYNAMIC PROPERTIES
THERMODYNAMIC PROPERTIES OF
AIR
THERMODYNAMIC TEMPERATURE
SCALE
THERMODYNAMIC WET BULB
TEMPERATURE
THERMODYNAMICS
THERMODYNAMICS FOR
MODELING SCALE-DEPENDENT
PLASTICITY
THERMOELECTRIC HEAT PUMPS
THERMOELECTRIC PHENOMENON
THERMOELECTRIC
REFRIGERATORS
THERMOEXCEL SURFACES
THERMOGRAPHIC CAMERAS
THERMOGRAPHY
THERMOLUMINESCENCE
THERMOMETER
THERMOMETRIC GROUPS
THERMONUCLEAR REACTORS
THERMOPHOTOVOLTAIC
APPLICATION
THERMOPHYSICAL PROPERTIES

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THERMOSORPTIVE COMPRESSOR
THERMOSYPHON
THERMOSYPHON REBOILERS
THERMOSYPHONING AIR PANEL,
TAP
THICKENERS
THICKENING
THIN CHANNEL
THIN FILM EVAPORATION
THIN FILM SUPERCONDUCTORS
THIN FLEXIBLE SHELLS
THIN LAY CHROMATOGRAPHY
THIN LIQUID FILMS
THIN VERTICAL CYLINDER
THIRD LAW OF THERMODYNAMICS
THIXOTROPIC FLUIDS
THIXOTROPY
THOMA COEFFICIENT
THOMPSON EFFECT
THOMPSON, BENJAMIN, COUNT
RUMFORD
THOMSON, WILLIAM, LORD KELVIN
THORIUM
THREE FLUIDS WITH VARIABLE
THERMOPHYSICAL PROPERTIES
THREE MILE ISLAND ACCIDENT
THREE-DIMENSIONAL COMPUTING
THREE-DIMENSIONAL MESH
REFINEMENT METHOD
THREE-DIMENSIONAL MODELING
OF ICP TORCHES
THREE-DIMENSIONAL PIV USING
INTENSITY GRADIENTS OF A TWOCOLOR LASER BEAM
THREE-PHASE, GAS-LIQUID-LIQUID
FLOWS
TIDAL ENERGY
TIDAL POWER
TIME LAPSE PHOTOGRAPHY
TIME STRETCH PHOTOGRAPHY
TITANIUM
TOLLMEIN-SCHLICHTING WAVES
TOMOGRAPHIC IMPEDANCE
METHOD
TOMOGRAPHY
TOP FLOODING
TOP HAT PROFILE, OPTICS
TORNADOS
TORR
TORTUOSITY FACTOR
TOTAL HEAD
TOTAL HEAD LINE
TOTAL PRESSURE TUBE
TOTAL SURFACE EFFECTIVENESS
TOWERS, COOLING
TOXIC WASTES
TRACER METHODS
TRACER PARTICLES
TRAILING VORTICES
TRAJECTORY AND MOMENTUM
COHERENCE
TRAJECTORY PROBLEM, OPTICS

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TRANSCENDENTAL EQUATION
TRANSCENDENTAL FUNCTIONS
TRANSFER PROCESSES IN AN
EVAPORATING DROPLET
TRANSIENT CONDUCTION
TRANSIENT HEAT TRANSFER
TRANSIENT HEAT TRANSFER IN
JACKETED VESSELS
TRANSIENT NON-DARCY
MAGNETOHYDRODYNAMIC
CONVECTION FLOW OF
MICROPOLAR FLUIDS
TRANSIENT PLUMES
TRANSIENT PROBLEMS
TRANSIENT SPRAY
TRANSITION BOILING
TRANSITION FLOW REGIME
TRANSITION FROM LAMINAR TO
TURBULENT FLOW
TRANSITION TO TURBULENT
BOUNDARY LAYER
TRANSMISSIVITY
TRANSONIC WIND TUNNELS
TRANSPIRATION COOLING
TRANSPORT APPROXIMATION
TRANSPORT DISENGAGING
HEIGHT IN FLUIDIZED BED
TRANSPORT PHENOMENA
TRANSPORT PROPERTIES OF
GASES
TRANSPORT THEOREM
TRANSVERSE ACOUSTIC
PERTURBATION
TRANSVERSE VORTEX ROLLS
TRAPEZOIDAL RULE
TRAYS, COLUMNS
TREATED SURFACES
TREVITHICK ENGINES
TRI-DRUM HEAT RECOVERY
BOILER
TRIANGULAR CAVITIES
TRIANGULAR DUCTS, FLOW AND
HEAT TRANSFER
TRIANGULAR ENCLOSURES
TRIANGULAR RELATIONSHIP IN
ANNULAR FLOW
TRIARYLMETHANE
TRIBLOCK COPOLYMERS
TRICHLOROETHYLENE
TRIGONOMETRIC FUNCTIONS
TRIGONOMETRIC POLYNOMIALS
TRIGONOMETRIC SERIES
TRIPLE INTERFACE
TRIPLE POINT
TRIPLE POSNT PRESSURE
TRIPLET STATE
TRITIUM
TROMBE WALLS
TROMBE-MICHEL WALLS
TROPOSPHERE
TRUE MASS FLOW METER
TSUNAMIS

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TUBE BANKS, CONDENSATION

HEAT TRANSFER IN
TUBE BANKS, CROSSFLOW OVER
TUBE BANKS, SINGLE-PHASE HEAT
TRANSFER IN
TUBE BUNDLES
TUBE BUNDLES, TWO-PHASE
CROSSFLOW
TUBE SHEETS
TUBE-FIN EXTENDED SURFACES
TUBES
TUBES AND TUBE BANKS, BOILING
HEAT TRANSFER ON
TUBES SINGLE-PHASE HEAT
TRANSFER TO, IN CROSS-FLOW
TUBES, CONDENSATION IN
TUBES, CONDENSATION ON
OUTSIDE IN CROSSFLOW
TUBES, CROSSFLOW OVER
TUBES, GAS-LIQUID FLOW IN
TUBES, SINGLE-PHASE FLOW IN
TUBES, SINGLE-PHASE HEAT
TRANSFER IN
TUBULAR BOWL CENTRIFUGE
TUBULAR EXCHANGER
MANUFACTURERS ASSOCIATION,
TEMA
TUNGSTEN
TUNGSTEN CATHODE
TUNNEL BURNERS
TUNNEL KILN
TURBINE
TURBINE BLADE
TURBINE EFFICIENCY
TURBINE FLOWMETERS
TURBOMOLECULAR PUMP
TURBOPHORETIC VELOCITY
TURBULENCE
TURBULENCE MODELING
TURBULENCE, IN WIND TUNNELS
TURBULENCE-CHEMISTRY
INTERACTION
TURBULENT BURSTS
TURBULENT DIFFUSION
TURBULENT ENERGY DISSIPATION
TURBULENT FLOW
TURBULENT FLOW, HEAT
TRANSFER
TURBULENT FLOW, TRANSITION TO
IN TUBES
TURBULENT FREE CONVECTION
TURBULENT KINETIC ENERGY
TURBULENT MASS TRANSFER
TURBULENT MIXED CONVECTION
TURBULENT PIPE CONTRACTOR
TURBULENT SPOTS
TURBULENT WALL FLOW
TWIN FLUID ATOMIZERS
TWISTED JETS
TWISTED TAPE INSERTS
TWISTED TUBES
TWO DISKS WITH NON-COINCIDENT
PARALLEL AXES OF ROTATION

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TWO-DIMENSIONAL MODEL OF
DECOHESION
TWO-DIMENSIONAL MODELING OF
LOW PRESSURE AIR PLASMA
REACTOR
TWO-FLUID MODELS
TWO-FLUX APPROXIMATION
TWO-LAYER POROUS BURNER
TWO-PHASE CRITICAL FLOW
TWO-PHASE FLOW COMBINING
TWO-PHASE FLOW CONSERVATION
EQUATIONS
TWO-PHASE FLOW DYNAMICS
TWO-PHASE FLOW IN POROUS
MEDIA
TWO-PHASE FLOW MULTIPLIER
FOR BENDS
TWO-PHASE FLOW SPLITTING
TWO-PHASE FLOWS
TWO-PHASE INSTABILITIES
TWO-PHASE STRATIFIED
TURBULENT DUCT FLOW
TWO-PHASE THERMAL-CONTROL
TWO-PHASE THERMOSYPHON
TWO-PHASE TURBULENT JETS
TWO-STROKE CYCLE
TYN AND CALUS METHOD
TYPICAL GLASS FOAMS
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