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Paper 6.2
Abstract
This paper reviews the history of solar power inverters and highlights aspects of power electronic packaging concerning
functional and packaging integration in solar inverter technology. The most important indicators to characterize the advances in inverter technology are efficiency and losses respectively, mean time between failure and inverter costs. A
high integration level is bounded up with high reliability and life time and less costs. The paper presents the state of the
art and trends in the inverter design towards higher functional and packaging integration. Several generations of medium
power inverter are analyzed concerning integration level which will be described by different indicators.
Introduction
1.1
The solar market has been booming over the last decade
and is forecasted to continue this trend in the coming
years. By the end of 2008 the global cumulative capacity
was approaching 15GW. Today Europe is the leading region with more than 9GW representing over 65% of the
global cumulative PV installed capacity. Japan (2,1GW)
and the US (1,2GW) are following behind, representing
15% and 8% respectively, of the global cumulative PV
power installed [1].
verters for all applications, all solar module types and in all
power ranges.
1.2
1.3
1.4
System Configurations
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1.6
Today inverters for medium power application are produced in the highest quantity. That way experiences and
advances in packaging and integration have been achieved
a high level. To give an overview about packaging in solar
inverters this paper focuses to medium power inverters.
1.5
halved. By decreasing the losses heat production is reduced and so the cooling efforts too. Important approaches
for further improvement in efficiency are improved semiconductors and magnetics in combination with new topologies. Assemblies in laboratories/prototypes has been
demonstrated an efficiency of 99% in 2008. This is caused
by using SiC semiconductors [3]. Development for series
devices is ongoing. Problems to be solved are reliability,
switching behavior and costs of SiC components.
(3) Reliability, Service
Functional and packaging integration gives approaches for
higher reliability and less cost respectively.
Less elements lead to less costs for material and manufacturing. Additional a reduced number of elements results in
less electrical and mechanical connections between elements, which results in a smaller failure ratio and increased reliability.
Simplified processes in inverter production due to higher
integration leads to shorter production times, smaller failure rates during test procedures and finally to less labor
costs.
Next, opportunities of functional and packaging integration
in solar inverters are presented more in detail.
Power Electronic Packaging (PEP) is the discipline of arranging and integrating electronic components and the
electromechanical design of power electronic appliances
like solar inverters. PEP covers many interdisciplinary
fields of expertise like design for manufacturability and
reliability, functional integration, thermal management,
interconnection technologies, EMC.
As known from other industries PEP is one of the dominating future areas of innovations and power electronics research. Power Electronic Packaging is the focus of R&D
activities when operational behavior of solar inverters like
efficiency especially in combination with extremely long
lifetimes > 20 years is pushed toward physical limits. Besides manufacturing processes and selection of high quality components PEP is the main factor for improvements of
solar inverter reliability [4].
2.1
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protection unit, pulse pattern generator, controlling, monitoring and interfacing unit. Dissipating components like
semiconductors and magnetics are connected thermally to
a cooling unit which is connected or integrated to the housing (12).
2.2
Power Electronic Packaging is confronted with continuously increasing of complexity of inverters. Additional
components for more user and grid benefit have to be integrate to the packaging. However the manufacturing should
be simple and fast. Examples for successful solution in inverter packaging are presented in the following chapters.
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rd
highest values in comparison to all other generations inclusive 3rd High Power generation, how shown in figure 15.
The reason can be found in the number of inverter stages.
Inverters of 3rd generations are based on a two-stage inverter topology. Additional components like choke and semiconductors in inverters of the 3rd generation lead to more
weight and consecutively to less specific outputs per
weight. On the other hand, especially High Power inverters of the 3rd generation are more complex in comparison
to all earlier inverter generations. The 3rd generation with
increased output power is characterized by several additional functions. Examples are the safety components on
DC side.
Figure 16 shows the specific output power per volume PV
in relation to nominal output power of SMA medium power inverters. Due to the use of one housing for one inverter
familiy a nearly linear increasing of specific output power
per volume PV in relation to nominal output power can be
realized. Here the result of an intelligent and consequent
high integrated design can be demonstrated. Reasons for
reduced specific output powers per volume PV for the
High Power version of the 3rd generation are similar like
above.
Generally smaller values of PW and PV respectively for
smaller nominal power per inverter device are based in the
fact, that the housing is similar for the complete inverter
generation.
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Literature