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J.K. Sheu a, G.C. Chi a,*, Y.K. Su b, C.C. Liu c, C.M. Chang c, W.C. Hung c,
M.J. Jou c
a
Optical Sciences Center, Department of Physics, National Central University, Chung-Li 32054, Taiwan, ROC
b
Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan 701, ROC
c
Epistar Corporation, Hsinchu 300, Taiwan, ROC
Received 17 September 1999; accepted 16 November 1999
Abstract
In GaN/GaN multiple quantum wells (MQW) and blue MQW light-emitting diodes (LEDs) were grown by metalorganic vapor phase epitaxy (MOVPE). Band-gap narrowing of the PL spectra for the InGaN/GaN MQW LEDs can
be observed at room temperature. In addition, the emission wavelength of EL and PL spectra for the MQW blue LEDs
exhibit a blue-shift phenomenon while increasing the injection current and laser power, respectively. This luminescence
behavior can tentatively be understood as a competition between a spectral red-shift mechanism of piezoelectricityinduced quantum-conned Stark eect (PQCSE) and a blue-shift mechanism of band-lling and charge screening effects. 2000 Elsevier Science Ltd. All rights reserved.
1. Introduction
In the past several years, the most widely studied of
wide band-gap semiconductors have been the III-nitrides. Among them, GaN and its alloys with InN and
AlN have attracted much attention as the successful
commercialization of bright blue/green light-emitting
diodes (LEDs) followed later by the demonstration of
injection lasers [13]. GaN-based nitride semiconductors
have several advantages over the other wide band-gap
semiconductors such as SiC and diamond. They can be
doped as both p- and n-type, have direct band gaps, and
can form heterostructures conducive to device applications. Blue/green laser diodes have also been achieved in
ZnSe and its related materials. However, their short
lifetime prevents ZnSe-based devices from commercialization at present. It is considered that the short lifetime
of these ZnSe-based devices is caused by crystal defects
at a density of 103 /cm2 , because one crystal defect would
2. Experiment
In GaN/GaN, double heterostructure (DH) LEDs
were grown by the MOVPE system using a high-speed
rotating disk in a vertical growth chamber. Briey,
trimethylgallium (TMGa) and ammonia (NH3 ) were
used as Ga and N precursors, respectively. Biscyclopentadienyl magnesium (CP2 Mg) and Si2 H6 were used
as the p- and n-type dopant, respectively. The trimethylindium (TMIn) was used as the In precursors. The
carrier gas was hydrogen, and the growth pressure was
maintained at 100 Torr for the growth of Si-doped GaN
lms. The carrier gas was nitrogen, and the growth
pressure was maintained at 300 Torr for the growth of
InGaN layers. The typical growth procedures are described as follows: Before growing IIIV nitride lms,
the substrates were treated by thermal baking at 1100C
0038-1101/00/$ - see front matter 2000 Elsevier Science Ltd. All rights reserved.
PII: S 0 0 3 8 - 1 1 0 1 ( 9 9 ) 0 0 3 1 9 - 6
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in hydrogen to remove surface contamination. A lowtemperature GaN nucleation layer, with a thickness of
was grown at 560C. After the growth of
about 300 A,
low-temperature GaN nucleation layer, the wafer temperature was raised to 1060C to grow the Si-doped
GaN buer layer. Fig. 1 shows the schematic structure
of the MQW blue LED which consists of 300 A-thick
GaN nucleation layer grown at a low temperature of
560C, a 3.5 lm-thick layer of Si-doped GaN, 9-period
of InGaN/GaN MQW structure consisting of 30 A-thick
In0:3 Ga0:7 N well layers and 70A-thick
GaN barrier layers grown at a temperature of 780C. Finally, 0.3 lmthick Mg-doped contact layers were grown. For the
fabrication of LED chips, the processing procedures
were described as follows: (a) Ni was deposited onto the
epi-wafer as the etching mask before ICP dry etching [4].
(b) The p-GaN layer was partially etched until the nGaN was exposed. (c) An ultrathin Ni/Au (2 nm/6 nm)
bi-layer was evaporated onto the p-GaN layer as the
transparent p-type electrode [5]. (d) A Ti/Al (50 nm/
2000 nm) bi-layer was deposited onto the n-GaN surface
as the n-type electrode. (e) Wafer lapping was performed
until the thickness becomes 80 lm. The wafer was then
polished to remove the stress which results from the
large roughness dierence between the lapped surface
and epitaxial surface. (f) The thin wafer was cut into a
square shape 350 lm 350 lm by a diamond scriber
and cutter.
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4. Conclusions
In summary, In0:3 Ga0:7 N/GaN multi-quantum well
LEDs, which consist of 9-period of InGaN/GaN MQW
were fabricated. The output power was higher than
1450 lW (bare chip), and the forward voltage was less
than 3.8 V at a forward current of 20 mA. The peak
wavelength and the FWHM of the typical EL spectra at
20 mA were about 465 and 30 nm, respectively. The blue
shifts and band-gap narrowing of the PL and EL spectra
for the InGaN/GaN MQW may tentatively be understood as a competition between a spectral red-shifting
mechanism of PQCSE and a blue-shifting mechanism of
band-lling and charge screening eects.
Acknowledgements
The authors would like to acknowledge the nancial
support from the National Science Council for their
research grant of NSC87-2811-E-006-001 and NSC872115-E-008-001.
References