Process FMEA DATA LIST-UP

SP Production II Team
Process
Plating

Chemical polishing

2001-04-18 Rev.0
Function

Requirements

- Prevent Oxidation

- Meet plating thickness spec.

- Make Wire bonding easier

- No visual defect

- Removing anti-oxidation layer

- Decreasing roughness for better Solder
Ball Attaching

- Meet Cu polishing spec.

- Applying Photo resist for

- No uncoated area

circuit developing before exposure

- Meet PR Coating thickness spec.

- Applying UV on PR coated area

- No foreign material on the pattern

- Meet Alignment Spec

Pattern of Defect
- Discoloration

Effect of Defect
- 2nd W/B failed

- unpolished

- Bad Solder Ball Attaching

- overpolished

- Cu thickness too thin

- Uncoating

- Open/pit after etching

- Pattern dimension changed after etching - Spec out after etching

- Common defect(Short, Lead protusion, et - O/S
- Bad P/T Alignment(Overlap Spec out)

Cause of Defect

Effect

occurrence

Defect

RPN

- Moisture on plating bar

75

- Moisture absorbed at storage

50

- Contamination of bake oven

- Unsuitable process

50

18

conditions(Speed,temp,concentration)

18

- Unsuitable coating condition&raw meterial

20

- Unsuitable coating condition

12

- Bad Artwork and storage

20

- Bad Tool&Punching accuracy

16

- Unsatisfied Artwork&Alignment control

16

PR Coating

Exposure

for circuit developing

Developing

- Removing UV exposed area

using chemical for etching
- Applying PR on back side of tape

- Fail on Molding process

- Meet exposure intensity spec.

- Wrong pattern dimension

- Fail in dimension spec after etching

- Unsuitable exposure condition

12

- No undeveloped area

- Short, Lead protusion

- O/S

- Unsuitable developing condition/rincing water contaminated

20

- Meet dimension spec after developing

- Wrong pattern dimension

- Pattern dimension changed after etching

- Unsuitable exposure intensity/developing condition

24

- No bubble

- PI side Half etched after etching

- Half Eg on Ball Land

- Unsuitable BC thickness and dry condition

36

- Meet B/Cthickness Spec

- PI side etched

- Fail in molding process

- Unsuitable B/C condition(viscosity,speed)

24

- PI side foreign material/unstripped

- Solder Ball Attch FAIL(Miss Ball)

- Unsuitable B/C condition(viscosity,speed)

24

- No uncoated area

- PI side etched

- Fail in molding process

- Unsuitable B/C condition(viscosity,speed)

24

- No bleed to Bonding area

- SR bleed out

- W/B Fail

- Poor Screen Mask design/making

24

- Unsuitable printing condition(Alignment)

32

- Poor Screen Mask design/making

24

- Unsuitable printing condition(Alignment)

18

Back Coating
to protect from etching chemical

SR Printing

- Making dam to prevent epoxy bleed to

bonding area at die
attach process

- Meet Width/Thick Spec

- SR Spec out

- Die Attach/Wire Bonding Fail

- Strong adhesion between Ink and Tape

- Plating chemical permeated

- Delamiantion(SR and Tape)

- Unsuitable printing condition

24

Tape Aging

- Restoring Tape temp(room temp)

- No dew on Tape surface

- Bad adhesion

- Bubble at Cu Laminating

- absorbing moisture

45

Punching

- Punch function hole on PI film

- Accurate punching dimension

- Defect at Soler Ball Attaching

- Hole dimension error

- Poor die manufacturing

30

Vacuum dry

- Dry moisture on tape

- Minimize moisture in tape

- Bad adhesion

- Bubble at Cu Laminating

- Poor vacuum

45

Cu Lamination

- Laminating Cu foil on tape

- Meet Alignment spec

- Circuit open/short

- Cu foil slanting to one side

- Poor process control

12

- Visual control

- No transformation
Cure

- For strong adhesion strength between ta - Securing adhesion

- Bad adhesion

- Delamination

- Unsuitable Cure condition

20

Elastomer Attach

- Attach elastomer tape for chip attach

- No unattached area

- Unattached

Chip Crack

- wrong attach condition(Temp.,Pressure,time)

10

Slitting

- Slit multi rows to single row

- Maintain dimention of Cutting width

- Cutting width Over

- Wrong dimension control

- Error in Gang Tool manufacuring

18

Adhesive Lami'

Laminationg adhesive for Heat Sinker atta - Meet spec by Adhesive materials

- Error in laminating process

- Delamination between Heat Sink & Circuit film

- Error attach condition(temp,pressure,time)

50

Tape Lamination

- Attaching carrier Frame for

- Meet Alignment Spec

Circuit&Carrier Frame Misalignment

Chip attach Position Error

- Die Setting Miss

15

package assembly

- No transformation

Warpage

Chip Crack

- Error attach condition(temp,pressure,time)

15

Busbar Punching/Singulation

- Minimize Burr

Burr Spec Over

Wire Bonding Error

- Bad punch die

36

Debussing

Center Alignment

Remark

Process FMEA Action Plan

Team : SP Production II
NO

Precess

Recorder : H.I. Lee

Pattern of Defect

FMEA NO

Start date

Completion date

Engineer

Control or not

1 Precess

Discoloration

01-PLAT-001

01.01.25

01.04.20

Y. K. Cho

Controlled

2 Inspection

Discoloration

01-CUIN-001

01.01.25

01.04.20

Y. K. Cho

Controlled

3 Back coating

Half EG on Back side(tape)

01-BKNT-001

01.05.01

01.05.24

J. M. Shim

Controlled

4 Printing

SR Bleed out

01-PRNT-001

01.05.01

01.05.24

J. M. Shim

Controlled

Rev. 0
Remark