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SAM3S-EK2

....................................................................................................................

User Guide

11140AATARM25-May-12

Section 1
Introduction .................................................................................................................1-1
1.1

SAM3S Evaluation Kit ........................................................................................................ 1-1

1.2

User Guide ......................................................................................................................... 1-1

1.3

References and Applicable Documents ............................................................................. 1-1

Section 2
Kit Contents ................................................................................................................2-1
2.1

Deliverables ....................................................................................................................... 2-1

2.2

Electrostatic Warning ......................................................................................................... 2-2

Section 3
Power Up ....................................................................................................................3-1
3.1

Power up the Board ........................................................................................................... 3-1

3.2

DevStart ............................................................................................................................. 3-1

3.3

Recovery Procedure .......................................................................................................... 3-1

3.4

Sample Code and Technical Support ................................................................................ 3-2

Section 4
Evaluation Kit Hardware .............................................................................................4-1
4.1

Board Overview.................................................................................................................. 4-1

4.2

Features List ...................................................................................................................... 4-2

4.3

Function Blocks.................................................................................................................. 4-2


4.3.1

Processor............................................................................................................. 4-2

4.3.2

Memory ................................................................................................................ 4-2

4.3.3

Clock Circuitry...................................................................................................... 4-3

4.3.4

Reset Circuitry ..................................................................................................... 4-4

4.3.5

Power Supply and Management.......................................................................... 4-4

4.3.6

UART ................................................................................................................... 4-5

4.3.7

USART................................................................................................................. 4-5

4.3.8

Display Interface .................................................................................................. 4-6

4.3.9

JTAG/ICE............................................................................................................. 4-8

4.3.10 Audio Interface..................................................................................................... 4-9


4.3.11 USB Device ....................................................................................................... 4-11
4.3.12 Analog Interface ................................................................................................ 4-11
4.3.13 QTouch Elements .............................................................................................. 4-12
4.3.14 User Buttons ...................................................................................................... 4-13
4.3.15 LEDs .................................................................................................................. 4-14
4.3.16 SD/MMC Card ................................................................................................... 4-14
4.3.17 ZigBEE............................................................................................................... 4-14
4.3.18 PIO Expansion ................................................................................................... 4-15

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11140AATARM25-May-12

4.4

4.5

Configuration.................................................................................................................... 4-16
4.4.1

PIO Usage ......................................................................................................... 4-16

4.4.2

Jumpers ............................................................................................................. 4-19

4.4.3

Test Points ......................................................................................................... 4-20

4.4.4

Solder Drops ...................................................................................................... 4-20

4.4.5

Assigned PIO Lines, Disconnection Possibility.................................................. 4-20

Connectors....................................................................................................................... 4-22
4.5.1

Power Supply Connector J9 .............................................................................. 4-22

4.5.2

USART Connector J5 With RTS/CTS Handshake Support ............................... 4-22

4.5.3

UART Connector J7 .......................................................................................... 4-23

4.5.4

USB Device Connector J15 ............................................................................... 4-23

4.5.5

TFT LCD Connector J8...................................................................................... 4-24

4.5.6

JTAG Debugging Connector J6 ......................................................................... 4-25

4.5.7

SD/MMC - MCI Connector J3 ............................................................................ 4-26

4.5.8

Analog Connector CN1 & CN2 .......................................................................... 4-27

4.5.9

RS485 Connector J14 ....................................................................................... 4-27

4.5.10 Headphone Connector J11 ................................................................................ 4-28


4.5.11 ZigBEE Connector J16 ...................................................................................... 4-28
4.5.12 PIO Expansion Port C Connector J12 ............................................................... 4-29
4.5.13 PIO Expansion Port A Connector J13 .............................................................. 4-30
4.5.14 PIO Expansion Port B Connector J14 ............................................................... 4-31

Section 5
Schematics .................................................................................................................5-1
5.1

Schematics......................................................................................................................... 5-1

Section 6
Troubleshooting ..........................................................................................................6-1
6.1

Self-Test............................................................................................................................. 6-1

6.2

Board Recovery ................................................................................................................. 6-1

Section 7
Revision History..........................................................................................................7-1
7.1

Revision History ................................................................................................................. 7-1

SAM3S-EK2 User Guide

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11140AATARM25-May-12

Introduction

Section 1
Introduction
1.1

SAM3S Evaluation Kit


The SAM3S Evaluation Kit (SAM3S-EK2) enables evaluation capabilities and code development of
applications running on a SAM3SD8 device.

1.2

User Guide
This guide focuses on the SAM3S-EK2 board as an evaluation platform. It is made up of 6 sections:

1.3

Section 1 includes references, applicable documents, acronyms and abbreviations.

Section 2 describes the kit contents, its main features and specifications.

Section 3 provides board specifications.

Section 4 describes the development environment.

Section 5 provides instructions to power up the SAM3S-EK2 and describes how to use it.

Section 6 describes the hardware resources, default jumper, switch settings and connectors.

Section 7 provides schematics.

Section 8 provides troubleshooting instructions.

References and Applicable Documents

Table 1-1. References and Applicable Documents


Title

Comment

SAM3SD8 Datasheet

www.atmel.com

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11140AATARM25-May-12

Section 2
Kit Contents
2.1

Deliverables
The Atmel SAM3S-EK2 toolkit contains the following items:

Board:
a SAM3S-EK2 board
a universal input AC/DC power supply with US, Europe and UK plug adapters

Cables:
one USB cable
one serial RS232 cable

A Welcome Letter

Figure 2-1.

Unpacked SAM3S-EK2

Unpack and inspect the kit carefully. Contact your local Atmel distributor, should you have issues concerning the contents of the kit.

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Kit Contents

2.2

Electrostatic Warning
The SAM3S-EK2 board is shipped in a protective anti-static bag. The board must not be subjected to
high electrostatic potentials. A grounding strap or similar protective device should be worn when handling the board. Avoid touching the components or any other metallic element of the board.

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Section 3
Power Up
3.1

Power up the Board


Unpack the board taking care to avoid electrostatic discharge. Unpack the power supply, select the right
power plug adapter corresponding to that of your country, and insert it into the power supply.
Connect the power supply DC connector to the board and plug the power supply to an AC power plug.
The board LCD should light up and display a welcome page. Then, click or touch the icons displayed on
the screen and enjoy the demo.

3.2

DevStart
The on-board NAND Flash contains the SAM3S-EK2 DevStart application.
It is stored in the SAM3S-EK2 DevStart folder on the USB Flash disk available when the SAM3S-EK2
is connected to a host computer - click on the Flash Disk icon belonging to the on-board demo.
Click the file welcome.html in this folder to launch SAM3S-EK2 DevStart.
SAM3S-EK2 DevStart guides you through installation processes of IAR EWARM, Keil MDK and GNU
toolkits. Then, it gives you step-by-step instructions on how to rebuild a single example project and how
to program it into the SAM3S-EK2. Optionally, if you have a SAM-ICE, instructions are also given
about how to debug the code.
We recommend that you backup the SAM3S-EK2 DevStart folder on your computer before launching
it.

3.3

Recovery Procedure
The DevStart ends by giving step-by-step instructions on how to recover the SAM3S-EK2 to the state as
it was when shipped by Atmel.
Follow the instructions if you deleted the contents of the embedded Flash or the NAND Flash and want
to recover from this situation.

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11140AATARM25-May-12

Power Up

3.4

Sample Code and Technical Support


After boot up, you can run some sample code or your own application on the development kit. You can
download sample code and get technical support from the Atmel web site: http://www.atmel.com

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11140AATARM25-May-12

Section 4
Evaluation Kit Hardware
4.1

Board Overview
This section introduces the Atmel SAM3S Evaluation Kit design. It introduces system-level concepts,
such as power distribution, memory, and interface assignments.
The SAM3S-EK2 board is based on the integration of an ARM Cortex-M3 processor with on-board
NAND Flash and a set of popular peripherals. It is designed to provide a high performance processor
evaluation solution with high flexibility for various kinds of applications.

Figure 4-1.

SAM3S-EK2 Block Diagram

Evaluation Kit Hardware

4.2

Features List
Here is the list of the main board components and interfaces:

SAM3SD8 chip LQFP100 package with optional socket footprint

12 MHz crystal

32.768 KHz crystal

Optional SMB connector for external system clock input

NAND Flash

2.8 inch TFT color LCD display with touch panel and backlight

UART port with level shifter circuit

USART port with level shifter circuit multiplexed with RS485 port with level shifter circuit

Microphone input and mono/stereo headphone jack output

SD/MMC interface

Reset button: NRST

User buttons: Left and Right

QTouch buttons: Up, Down, Left, Right, Valid and Slider

Full Speed USB device port

JTAG/ICE port

On-board power regulation

Two user LEDs

Power LED

BNC connector for ADC input

BNC connector for DAC output

User potentiometer connected to the ADC input

ZigBEE connector

2x32 bit PIO connection interfaces (PIOA, PIOC) and 1x16 bit PIO connection interface (PIOB)

4.3

Function Blocks

4.3.1

Processor
The SAM3S-EK2 is equipped with a SAM3SD8 device in LQFP100 package.

4.3.2

Memory
The SAM3SD8 chip embeds:

512 Kbytes of embedded Flash

64 Kbytes of embedded SRAM

16 Kbytes of ROM with embedded BootLoader routines (UART, USB) and In-Application Programming
functions (IAP) routines

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Evaluation Kit Hardware


The SAM3SD8 features an External Bus Interface (EBI) that permits interfacing to a broad range of
external memories and virtually to any parallel peripheral. The SAM3S-EK2 board is equipped with a
memory device connected to the SAM3 EBI:

One NAND Flash MT29F2G08ABAEA.

Figure 4-2.

NAND Flash
{3,5,7}

PC[0..31]
+3V3

+3V3

R15
47K

R16
47K

MN3
MT29F2G08ABAEA

16
17
8
18

PC17
PC16
PC9
PC10
JP9
JP

PC14
PC18

R19

7
19

0R

1
2
3
4
5
6
10
11
14
15
20
21
22
23
24
25
26

+3V3
R21

47K
R22
DNP

DGND

CLE
ALE
RE
WE

I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7

CE
R/B
WP

N.C28
N.C27
N.C26
N.C25
N.C24
N.C23
PRE
N.C22
N.C21
N.C20
N.C19
N.C18

N.C1
N.C2
N.C3
N.C4
N.C5
N.C6
N.C7
N.C8
N.C9
N.C10
N.C11
N.C12
N.C13
N.C14
N.C15
N.C16
N.C17

VCC
VCC
VSS
VSS

29
30
31
32
41
42
43
44

PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7

48
47
46
45
40
39
38
35
34
33
28
27
+3V3

37
12
C27
100nF

C28
100nF

C29
1uF

36
13
DGND

NCS0 chip select signal is used for NAND Flash chip selection. Furthermore, a dedicated jumper can
disconnect it from the on-board memories, thereby letting NCS0 free for other custom purposes.
4.3.3

Clock Circuitry
The clock generator of a SAM3SD8 microcontroller is composed of:

A Low Power 32.768 Hz Slow Clock Oscillator with bypass mode

A 3 to 20 MHz Crystal Oscillator, which can be bypassed (12 MHz needed in case of USB)

A factory programmed fast internal RC Oscillator. 3 output frequencies can be selected: 4 (default
value), 8 or 12 MHz.

A 60 to 130 MHz PLL (PLLB) providing a clock for the USB Full Speed Controller

A 60 to 130 MHz programmable PLL (PLLA), capable to provide the clock MCK to the processor and
to the peripherals. The input frequency of PLLA is from 7.5 and 20 MHz

The SAM3S-EK2 board is equipped with one 12 MHz crystal, optional Piezoelectric Ceramic Resonator
12 Mhz (Murata ref. CSTCE12M0G15L99-R0), one 32.768 Hz crystal and an external clock input connector (optional, not populated by default)
Figure 4-3.

External Clock Source

NOT POPULATED
J1

1
3
5

C3
20pF

DNP

R11
0R

XIN32

R1

R2
49.9R 1%

R3

DNP

Y3
32.768KHz

MN1
C1

DGND

20pF

R4

0R

XIN

2
4

XOUT32

DGND
DGND

Y1
DNP

Y2

DGND
DGND

SAM3S-EK2 User Guide

R7

DNP

12MHz
R5

C2

PB9

R6

PB8

R8

0R

DNP

97

_XIN

96

PB8_XOUT

PA7_RTS0_PWMH3
PA8_CTS0_AD12BTRG

R12
0R

C4
20pF

SAM3S
SAM3SD8

XOUT

20pF
DNP

PB9

49
48

XIN32
R9
XOUT32 R10

DNP
DNP

PA7
PA8

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Evaluation Kit Hardware


The SAM3SD8 chip internally generates the following clocks:

4.3.4

SLCK, the Slow Clock, which is the only permanent clock of the system

MAINCK, the output of the Main Clock Oscillator selection: either a Crystal Oscillator or a 4/8/12 MHz
Fast RC Oscillator

PLLACK, the output of the Divider and 60 to 130 MHz programmable PLL (PLLA)

PLLBCK, the output of the Divider and 60 to 130 MHz programmable PLL (PLLB)

Reset Circuitry
On-board NRST button BP1 provides an external reset control of the SAM3SD8.
The NRST pin is bidirectional. It is handled by the on-chip reset controller. It can be driven low to provide
a reset signal out to the external components. Conversely, it can be asserted low from the outside to
reset the microcontroller Core and the peripherals. The NRST pin integrates a permanent pull-up resistor
of 100 kOhm to VDDIO.
On the SAM3S-EK2 board, the NRST signal is connected to the LCD module and JTAG port.
Note:

4.3.5

At power-on, the NRST signal is asserted with a default duration of 2 clock cycles. That duration may not be
sufficient to correctly reset any other system or board devices connected to that signal. First, in your custom
application, you need to check for these devices' datasheets about reset duration requirements. Then, you
need to set an appropriate configuration in the NRST Manager. This is done through the ERSTL field in the
RSTC_MR register. The NRST duration is thereby configurable between 60 s and 2 s, whether it is subsequently activated by a software reset or a user reset. Refer to the SAM3SD8 datasheet for in-depth
information.

Power Supply and Management


The SAM3S-EK2 board is supplied with an external 5V DC block through input J9. It is protected by a
PolyZen diode (MN9) and an LC combinatory filter (MN10). The PolyZen is used in the event of an incorrect power supply connection.
The adjustable LDO regulator MN12 is used for the 3.3V rail main supply. It powers all the 3.3V components on the board.
Figure 4-4.

Power Block
MN10
BNX002-01

J9
MN9
MP179P 2.1mm
ZEN056V130A24LS
1
1
3
2

1
2

C64
100nF

+ C65
22uF

SV

CV

SG CG1
CG2
CG3

+5V

3
4
5
6

+ C66
22uF

DGND

MN12
MIC29152W U
Micrel's 1.5A LDO, TO263-5
+5V

+3V3

ADJ

GND2

SD

GND1

VOUT

VIN

4
5

R89
169K 1%
+ C75
100uF

C76
100nF

R92
102K 1%

The SAM3SD8 product has different types of power supply pins:

VDDIN pin:
Power for the internal voltage regulator, ADC, DAC, and analog comparator power supplies.
The voltage ranges from 1.8V to 3.6V.

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Evaluation Kit Hardware

VDDIO pins:
Power for the Peripherals I/O lines.
The voltage ranges from 1.62V to 3.6V.

VDDOUT pin:
Output of the internal voltage regulator.

VDDCORE pins:
Power for the core, including the processor, embedded memories and peripherals.
The voltage ranges from 1.62V to 1.95V.

VDDPLL pin:
Power for the PLL A, PLL B and 12 MHz oscillator.
The voltage ranges from 1.62V to 1.95V.
Note:

4.3.6

VDDPLL should be decoupled and filtered from VDDCORE.

UART
The Universal Asynchronous Receiver Transmitter features a two-pin UART that can be used for communication and trace purposes. It offers an ideal channel for in-situ programming solutions. This UART
is associated with two PDC channels to reduce the processor time on packet handling.
This two-pin UART (TXD and RXD only) is buffered through an RS232 Transceiver MN6 and brought to
the DB9 male connector J7.
Figure 4-5.

UART
MN6
MAX3232CSE
+3V3

16

R45
100K

PA10
PA9

TP5
SMD

+3V3

C40
100nF

C1+

V+

C1-

V-

C2+

1
C38
100nF

2
6

3
4

C41
100nF

R46
100K

15

R47

0R

R48

0R

TP6
SMD

J7

1
6
2
7
3
8
4
9
5

C42
100nF

11
12
10
9

GND
T1IN
R1OUT
T2IN
R2OUT

C2T1OUT
R1IN
T2OUT
R2IN

5
14
13
7
8

DGND
DGND

11

+3V3

VCC

10

C39
100nF

FGND

4.3.7

USART
The Universal Synchronous/Asynchronous Receiver Transmitter (USART) provides one full duplex universal synchronous/asynchronous serial link. The data frame format is extensively configurable (data
length, parity, number of stop bits) to support a broad range of serial communication standards. The
USART is also associated with PDC channels for TX/RX data access.
Note:

For design optimization purposes, both transmitters have been implemented on the same
PIO lines, that is PA21, 22, 23, 24 25.

To avoid any electrical conflict, the RS485 transceiver is isolated from the receiving line PA21.
Should you need to implement an RS485 channel in place of the RS232, follow the procedure below:
1. make sure your software will permanently set PA23 to a high level - this will permanently disable the
RS232 receiver.
2. solder a shunt resistor in place of R25 (a solder drop will do).

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Evaluation Kit Hardware


4.3.7.1

RS232
SAM3S-EK2 connects the USART1 bus (including TXD, RXD, RTS, CTS handshake signal controls and
EN command) to the DB9 male connector J5 through the RS232 Transceiver MN5.
USARTEvaluation Kit Hardware
MN5
ADM3312EARU

+3V3

3
C32
100nF

21

V+

C1C2+

23
19

PA23

R31

0R

PA22
PA21
PA24
PA25

R33
R34
R35
R36
R37

0R
0R
0R
0R
47K

7
10
8
11
9
12

+3V3

20
2

V-

C35
100nF

C36
100nF

R32
47K

+3V3

C1+

C34
100nF

DGND

VCC

C33
100nF

C2C3+

GND

4
24

J5

1
6
2
7
3
8
4
9
5

C37
100nF

SD
EN

C3-

T1IN
R1OUT
T2IN
R2OUT
T3IN
R3OUT

T1OUT
R1IN
T2OUT
R2IN
T3OUT
R3IN

22
18
15
17
14
16
13

R38

0R

DGND

11

C31
4.7uF

10

Figure 4-6.

DGND

FGND

4.3.7.2

RS485
As noticed above, the USART1 is shared with the RS485 port, connected to the transceiver MN4, connected to the 3-point connector J4. The design includes selectable jumpers for RS485 bus termination
resistors selection (JP10, JP11, JP12).
Figure 4-7.

RS485
+3V3

+3V3

R23
DNP

PA23
PA21

R25

DNP

PA25

R26

0R

PA24

R27

0R

PA22

R28

0R

R24
DNP

MN4
ADM3485ARZ

RO

VCC

RE

GND

+3V3

8
5

A
B

J4

DE
DI

JP10
C30
100nF

6
7

DGND

R29
120R

JP11

JP12
FGND
R30
DNP

DGND

4.3.8

Display Interface
The SAM3S-EK2 carries a TFT Transmissive LCD module with touch panel, FTM280C34D. Its integrated driver IC is ILI9325. The LCD display area is 2.8 inches diagonally measured, with a native
resolution of 240 x 320 dots.

4.3.8.1

LCD Module
The LCD module gets reset from the NRST signal. As explained, this NRST is shared with the JTAG port
and the push-button BP1. The LCD chip select signal is connected to NCS1; the jumper JP13 can disconnect it so that this PIO line is available for other custom usage.
The SAM3SD8 communicates with the LCD through PIOC where an 8-bit parallel 8080-like protocol
data bus has to be implemented in software.

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Evaluation Kit Hardware


Figure 4-8.

LCD Block
+3V3
+ C43
10uF

PC[0..31]

C44
100nF

C45
100nF

R49
47K

DGND
J8
FH26-39S-0.3SHW
PC13
PC22
PC23
PC24
PC25
PC26
PC27
PC28
PC29
PC30
PC31

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39

LCD_DB17
LCD_DB16
LCD_DB15
LCD_DB14
LCD_DB13
LCD_DB12
LCD_DB11
LCD_DB10
LCD_DB9
LCD_DB8
LCD_DB7
LCD_DB6
LCD_DB5
LCD_DB4
LCD_DB3
LCD_DB2
LCD_DB1
LCD_DB0

PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0

+3V3
PC11
PC8
PC19

R56
10K

PC15

JP13

NRST

NRST

LED_A

R59

0R
LED_K1
LED_K2
LED_K3
LED_K4
Y_UP
Y_DOW N
X_RIGHT
X_LEFT

R58
4.7K

DGND

VDD
DB17
DB16
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
VDD
RD
WR
RS
CS
RESET
IM0
IM1
GND
LED-A
LEDK1
LEDK2
LEDK3
LEDK4
Y+
YX+
XNC
GND

2.8" 320x240
TFT LCD DISPLAY

PIN 39

PINs
on
BOT

PIN 1
FTM280C34D-8bit

X_RIGHT
Y_UP
X_LEFT
Y_DOW N

LCD_DB0

R61

DNP

LCD_DB4
LCD_DB2
LCD_DB3
LCD_DB1
LCD_DB8
LCD_DB6
LCD_DB7
LCD_DB5

1
2
3
4
1
2
3
4

8
7
6
5
8
7
6
5

LCD_DB9

R63

DNP

RA2
DNP
RA3
DNP

DGND
DGND

D1
PACDN044Y5R
TVS, SOT23-5

NOT POPULATED

DGND

4.3.8.2

Backlight Control
The LCD backlight is made of four integrated white chip-LEDs arranged in parallel. These are driven by
an AAT3155 charge pump, MN8.The AAT3155 is controlled by the SAM3SD8 through a single PIO line
PC13 interface; the 0 Ohm resistor R68 is mounted in series on this line, which permits to use it for other
custom purposes. In that case, the pull-up resistor R64 maintains the charge pump permanently enabled
by default.
On the anode drive line, a 0 Ohm resistor R59 is implemented in series for an optional current limitation.
Figure 4-9.

Backlight Control
MN8
AAT3155ITP-T1

+3V3

10

PC13
+3V3

R68
0R

R64
47K

C1+

C2+

C1EN/SET

C2-

7
C55
1uF

C54
1uF

9
11
5

B1
BN03K314S300R

OUTCP
IN

C57
4.7uF

GND

D1
D2
D3
D4

6
8

LED_A

3
2
1
12

LED_K1
LED_K2
LED_K3
LED_K4

TP7
SMD

C56
1uF

DGND
DGND

SAM3S-EK2 User Guide

4-7
11140AATARM25-May-12

Evaluation Kit Hardware


4.3.8.3

Touch Screen Interface


The LCD module integrates a 4-wire touch panel controlled by MN7 (ADS7843) which is a slave device
on the SAM3SD8 SPI bus. The controller sends back the information about the X and Y positions, as
well as a measurement for the pressure applied to the touch panel. The touch panel can be used with
either a stylus or a finger.
The ADS7843 touch panel controller connects to the SPI0 interface via the NPCS0 control signal. Two
interrupt signals are connected and provide events information back to the microcontroller: PenIrq and
Busy.
Note:

PenIrq (PA16) is shared with ZigBEE signal IRQ0.


Busy (PA17) is shared with ZigBEE signal IRQ1.
Therefore, if using a ZigBEE interface in concurrence with the TouchScreen controller, take
care not to have both drivers enabled at the same time on either PA16 or PA17.

For that purpose, 0 Ohm resistors have been implemented on these PIO lines in order to disconnect
either end driver from the other:

On the touch panel controller side, R67 and R69.

On ZigBEE side, R117 and R120.

for further information, refer to the Schematics section.


Touch ADC auxiliary inputs IN3/IN4 of the ADS7843 are connected to test point (TP8, TP9) for optional
function extension.
Figure 4-10. Touch Panel Control
+3V3
R62
100K

MN7
ADS7843E
X_RIGHT
Y_UP
X_LEFT
Y_DOW N
TP8
SMD

2
3
4
5

TP9
SMD

R72
100K

AGND_TP

R73
100K

DCLK
DIN
DOUT
CS
BUSY
PENIRQ

7
8

4.3.9

XP
YP
XM
YM

IN3
IN4

VREF
VCC1
VCC2
GND

16
14
12
15

+3V3

PA14
PA13
PA12
R66

0R

PA11

13
11

R67

0R

PA17

9
1
10

R70

0R

R65
100K
R69

C58
100nF

C59
100nF

C60
100nF

R71
1R

PA16
+3V3

L2
10uH/100mA

C61
4.7uF

AGND_TP

0R

R74
0R

DGND

JTAG/ICE
A standard 20-pin JTAG/ICE connector is implemented on the SAM3S-EK2 for the connection of a compatible ARM JTAG emulator interface, such as the SAM-ICE from Segger.
Notes: 1. The NRST signal is connected to BP1 system button and is also used to reset the LCD
module. The 0 ohm resistor R44 may be removed in order to isolate the JTAG port from
this system reset signal.
2. The TDO pin is in input mode with the pull-up resistor disabled when the Cortex M3 is
not in debug mode. To avoid current consumption on VDDIO and/or VDDCORE due to
floating input, the internal pull-up resistor corresponding to this PIO line must be
enabled.

SAM3S-EK2 User Guide

4-8
11140AATARM25-May-12

Evaluation Kit Hardware


Figure 4-11. JTAG Interface
+3V3

R39
100K

R40
100K

R41
100K

R42
100K

R43
100K

PB4
PB6
PB7
PB5
NRST

R44

0R

J6

1
3
5
7
9
11
13
15
17
19

VTref
Vsupply
GND1
nTRST
GND2
TDI
GND3
TMS
GND4
TCK
GND5
RTCK
GND6
TDO
GND7
nSRST
DBGRQ GND8
DBGACK GND9

2
4
6
8
10
12
14
16
18
20
DGND

4.3.10

Audio Interface
The SAM3S-EK2 board supports both audio recording and playback.
The audio volume can be adjusted using the potentiometer RV1, and the microphone amplifier gain can
be adjusted via jumpers (fixed gain of 24 or 26 dB).

4.3.10.1 Microphone Input


The embedded microphone is connected to an audio pre-amplifier using the TS922 operational amplifier
(MN11). The gain is set by using JP14 and JP15 jumpers; both must be set or removed at the same
time.
By modifying the jumper positions, you can select each of the following gain values:

20 dB (default setting, both JP14 and JP15 are off)

26 dB (both JP14 and JP15 are on).


Note:
3. R83 is a default 0 Ohm resistor that enables the disconnection of PB0 from the audio
input path for custom usage.
4. The audio pre-amplifier MN11 is powered by a dedicated low dropout regulator
MIC5219-3.3 (MN14).

SAM3S-EK2 User Guide

4-9
11140AATARM25-May-12

Evaluation Kit Hardware


Figure 4-12. Microphone Input
C62
100pF

AVDD
R77
470R

C63
22uF

R78
1K

R79
1K

R80
1K

AGND

R82
1K

R84
1K

C68
1uF

R85
1K

C69
1nF

R86
100K

AGND

JP

R81
100R

IN11

R83
0R
PB0

{3,7}

C71
22nF

IN1+

R88
470R

AGND

R87
100K

AVDD

VCC
JP15
JP

AVDD

AGND

C74
100nF

R90
100K

6
5

R93
100K

C77
4.7uF

AGND

VCC33

8
B2

7
AGND

JP14

C72
1nF

AGND
C73
22uF

100K

OUT1

MIC1
BL-MP6027P

100K

R76

MN11
TS922

C67
1uF

R75

OUT2
GND

BN03K314S300R

R91
0R

IN2AGND

DGND

IN2+

JP14 and JP15 should


act at same phase

AGND

4.3.10.2 Headphone Output


The SAM3S-EK2 evaluation kit supports mono/stereo audio playback driven by a TPA0223 audio amplifier connected to two DAC channels of the microcontroller.
The TPA0223 is a 2W mono Bridge-Tied-Load (BTL) amplifier designed to drive speakers with as low as
4 Ohm impedance. The amplifier can be reconfigured on the fly to drive two stereo Single-Ended (SE)
signals into head phones.
Figure 4-13. Headphone Output
J10

1
2

MN13
TPA0223DGQ

B3
BN03K314S300R

+ C80
10uF

PB13

C84

DGND
0.47uF

AGND

JP17
TP12
SMD

0.47uF

C81

C82
100nF

R98

33K

R99

47K

C85

0.47uF R100

33K

JP19

R104

47K

R105

33K

LO/MO-

AGND

R95

1K

R97

1K

C83

220uF
AGND

ST/MN

MONO-IN

SHUTD0WN
9

10

220uF

RIN

BYPASS
LIN
GND

7
2
4

C86

R101

100K

R103

100K

0.47uF

R102

JP20

VDD_AMP
100K

C87
1uF

AGND

11

PAD

AUDIO_OUTL C88

RO/MO+

VDD

3
C79
1uF

J11
5 EARJACK
4
3
2
1

VDD_AMP

+5V

AGND

AGND

AGND
( to DAC output
connector )

PB14

{3,7}

SD1

1
SD2

AUDIO_OUTL

SAM3S-EK2 User Guide

4-10
11140AATARM25-May-12

Evaluation Kit Hardware


Using a readily available 1/8-in. (3,5 mm) stereo headphone jack, the control switch is closed when no
plug is inserted. When closed, a 100-kOhm/1-kOhm divider pulls the ST/MN input low. When a jack plug
is inserted, the 1-kOhm resistor is disconnected and the ST/MN input is pulled high. The mono speaker
(J10 connector) is also physically disconnected from the RO/MO+ output so that no sound is heard from
the speaker while the headphones are inserted.
4.3.11

USB Device
The SAM3SD8 UDP port is compliant with the Universal Serial Bus (USB) rev 2.0 Full Speed device
specification. J15 is a micro B-type receptacle for USB device.
Both 27-Ohm resistors R114 and R116 build up a 90-Ohm differential impedance together with the
(embedded) 6-Ohm output impedance of the SAM3SD8 full speed channel drivers.
R110 and R112 build up a divider bridge from VBUS +5V to implement plug-in detection (5V level gets
lowered to a PIO compatible 3.3V level) through PC21.
Figure 4-14. USB
J15
USB Micro B
G

7
6

ID

D+

RV2
V5.5MLA0603

D-

FGND

5V

8
9

RV1
V5.5MLA0603
PC21

R110

47K

R112

68K

C94
10pF
DGND

FGND

DGND

4.3.12

PB10

R114

27R

PB11

R116

27R

Analog Interface

4.3.12.1 Analog Reference


The 2V5 voltage reference is based on an LM4040 (Precision Micropower Shunt Voltage Reference).
This ADVREF level can be set as 2.5V or 3.3V via the jumper JP2.
Figure 4-15. Analog Vref
VCC33

ADVREF

C5
100nF

JP2

R13
2.2K

ADVREF

+5V

SAM3SD8

MN2
LM4040-2.5
DGND
DGND

SAM3S-EK2 User Guide

4-11
11140AATARM25-May-12

Evaluation Kit Hardware


4.3.12.2 Analog Input
The BNC connector CN1 is connected to the ADC port PB1 as an external analog input. An on-board 50Ohm resistor termination can be applied by closing jumper JP16. A low pass filter can be implemented
for the BNC connector CN1 by replacing R94 and C78 with custom resistor and capacitor values,
depending on your application requirements.
A 10-KOhm potentiometer (VR1) is also connected to this channel to implement an easy access to ADC
programming and debugging (or implement an analog user control like display brightness, volume, etc.).
Either of these two functions can be selected by jumper JP18.
Figure 4-16. ADC Input
CN1
BNC

R94
0R

5
JP16

1
2
3
4

C78
10nF

R96
49.9R 1%

AD12B5
3

DGND
VCC33

PB1

2
C89
10nF

VR1
10K

Potentiometer

JP18

ADC

DGND

4.3.12.3 Analog Output


The BNC connector CN2 is connected to the DAC port PB13 and provides an external analog output. An
on-board 50-Ohm resistor termination can be enabled by closing jumper JP21. A filter can be implemented on this output channel by replacing R106 and C90 with appropriate resistor and capacitor
values, depending on the application requirements.
Figure 4-17. DAC Output
CN2
BNC

R106 SOLDER DROP 2 pins open.Normal


0R
2
1

5
1
2
3
4

JP21

C90

PB14

SD1

2.2uF

1
SD2

R109
49.9R 1%
AUDIO_OUTL

DAC01
DGND

4.3.13

DAC

QTouch Elements
QTouch keys consist in a series of sensors formed by the association of a copper area and the capacitive effect of human fingers approaching it.

4.3.13.1 Keys
The SAM3S-EK2 implements five individual capacitive touch keys (UP, DOWN, RIGHT, LEFT and
VALID) using five pairs of PIO.

SAM3S-EK2 User Guide

4-12
11140AATARM25-May-12

Evaluation Kit Hardware


Figure 4-18. QST Keys
PC25

R51

1K

C47
22nF
PC24

PC31

R53

K1
DNP

1K

C49
22nF
PC30

PC29

R55

1K

C51
22nF
PC28

PC23

R57

1K

C52
22nF
PC22

PC27

R60

1K

C53
22nF
PC26

4.3.13.2 Slider
A group of channels forms a Slider. A Slider is composed of three channels for a QTouch acquisition
method using three pairs of PIO. Such a sensor is used to detect a linear finger displacement on a sensitive area. A typical implementation is volume control.
Figure 4-19. QT_Slider
S1
DNP

SR
PA1

R50

1K

C46
22nF

SL

PA0

PA3

R52

1K

SM

C48
22nF
PA2

SR
PA5

R54

1K

C50
22nF
PA4

4.3.14

User Buttons
There are two mechanical user buttons on the SAM3S-EK2, which are connected to PIO lines and
defined to be "left" and "right" buttons by default.
In addition, a mechanical button controls the system reset, signal NRST.
Figure 4-20. System Buttons
BP1

1
2

3
4
BP2

1
2

3
4
BP3

1
2

3
4

NRST
JP25
PB3

JP26
PC12

DGND

SAM3S-EK2 User Guide

4-13
11140AATARM25-May-12

Evaluation Kit Hardware


4.3.15

LEDs
There are three LEDs on the SAM3S-EK2 board:

A blue LED (D2) and a green LED (D3), which are user defined and controlled by the GPIO.

A red LED (D4), which is a power LED indicating that the 3.3V power rail is active. It is also controlled
by the GPIO and can be treated as a user LED as well. The only difference with the two others is that
it is controlled through a MOS transistor. By default, the PIO line is disabled; a pull-up resistor controls
the MOS to light the LED when the power is ON).

Figure 4-21. LEDs


+3V3

PA19

R111
220R

D2

Blue-led

PA20

R113
220R

D3

Green-led

PC20

R115

100K

1
Q1
IRLML2502
2

R117
220R

D4

Red-led

DGND

4.3.16

SD/MMC Card
The SAM3S-EK2 has a high-speed 4-bit multimedia MMC interface, which is connected to a 4-bit
SD/MMC micro card slot featuring a card detection switch.
Figure 4-22. SD Card

4
3
2
1

+3V3

R18
10K

RA1
68KX4
J3
TF01A

5
6
7
8

R17
10K

PA30
PA31

1
2
3
4
5
6
7
8

PA6

10
9

PA26
PA27
PA28
PA29

R20

0R

+ C25
10uF

DAT2
DAT3
CMD
VCC
CLK
VSS
DAT0
DAT1

Sh1
Sh2
Sh3

GND
CD

11
12
13

DGND

C26
100nF

DGND

4.3.17

ZigBEE
SAM3SD8 has a 10-pin male connector for the RZ600 ZigBEE module.
Note:

SAM3S-EK2 User Guide

0 Ohm resistors have been implemented in series with the PIO lines that are used elsewhere in the design, thereby enabling their individual disconnection, should a conflict occur
in your application.

4-14
11140AATARM25-May-12

Evaluation Kit Hardware


Figure 4-23. ZigBEE Interface
J16
ZB_RSTN
IRQ1_ZBEE
SPIO_NPCS2#
MISO

PA18 R118
PA17 R119
PB2
PA12

1
3
5
7
9

0R
0R

2
4
6
8
10

R120
R121

0R
0R

C95
18pF

IRQ0_ZBEE
SLP_TR
MOSI
SPCK

PA16
PA15
PA13
PA14
C96
2.2nF

JP27
+3V3

C97
2.2uF

DGND

4.3.18

PIO Expansion
The SAM3SD8 product features three PIO controllers, PIOA, PIOB and PIOC, which are multiplexed
with the I/O lines of the embedded peripherals. Each PIO Controller controls up to 32 lines (16 for PIOB).
Expansion ports J12, J13 and J14 provide PIO lines access for customer defined usage.

Figure 4-24. PIO Expansion


PB[0..14]
PA[0..31]
PC[0..31]

JP23

+5V

J12
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PC8
PC9
PC10
PC11
PC12
PC13
PC14
PC15
+3V3

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39

DGND

Note:

SAM3S-EK2 User Guide

JP24

+5V

+3V3
3

J13

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40

PC16
PC17
PC18
PC19
PC20
PC21
PA6
PA7
PA8
PA9
PA10
PA11
PA12
PA13
PA14
PA15
+3V3

DGND

+3V3

DGND

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39

+3V3
3

+3V3
3

JP22

+5V

J14

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40

PA16
PA17
PA18
PA19
PA20
PA21
PA22
PA23
PA24
PA25
PA26
PA27
PA28
PA29
PA30
PA31

1
3
5
7
9
11
13
15
17
19
21
23

PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
+3V3

DGND

2
4
6
8
10
12
14
16
18
20
22
24

PB8
PB9
PB10
PB11
PB12
PB13
PB14

+3V3

DGND

+3V3

DGND

All PIO lines are available on these expansion connectors, except those that are used for
the QTouch elements.

4-15
11140AATARM25-May-12

Evaluation Kit Hardware

4.4

Configuration
This section describes the PIO usage, the jumpers, the test points and the solder drops of a SAM3S-EK2
board.

4.4.1

PIO Usage

Table 4-1. PIO Port A Pin Assignments and Signal Descriptions


No

I/O
Line

Peripheral
A

Peripheral
B

Peripheral
C

Extra Function

System
Function

PA0

PWMH0

TIOA0

A17

WKUP0

QTouch slider (left) SNS

PA1

PWMH1

TIOB0

A18

WKUP1

QTouch slider (left) SNSK

PA2

PWMH2

SCK0

DATRG

WKUP2

QTouch slider (middle) SNS

PA3

TWD0

NPCS3

PA4

TWCK0

TCLK0

WKUP3

QTouch slider (right) SNS

PA5

RXD0

NPCS3

WKUP4

QTouch slider (right) SNSK

PA6

TXD0

PCK0

PA7

RTS0

PWMH3

PA8

CTS0

AD12BTR
G

10

PA9

URXD0

NPCS1

11

PA10

UTXD0

NPCS2

12

PA11

NPCS0

PWMH0

13

PA12

MISO

PWMH1

MISO_TSC

ZigBEE MISO

14

PA13

MOSI

PWMH2

MOSI_TSC

ZigBEE MOSI

15

PA14

SPCK

PWMH3

SPCK_TSC

ZigBEE CLK

16

PA15

TF

TIOA1

PWML3

WKUP14 / PIO_DCEN1

ZigBEE SLPTR

17

PA16

TK

TIOB1

PWML2

WKUP15 / PIO_DCEN2

IRQ_TSC

ZigBEE IRQ0

18

PA17

TD

PCK1

PWMH3

AD0

BUSY_TSC

ZigBEE IRQ1

19

PA18

RD

PCK2

A14

AD1

ZigBEE RSTN

20

PA19

RK

PWML0

A15

AD2/ WKUP9

Blue LED (UserLED1)

21

PA20

RF

PWML1

A16

AD3/ WKUP10

Green LED (UserLED2)

22

PA21

RXD1

PCK1

23

PA22

TXD1

NPCS3

24

PA23

SCK1

25

PA24

26

Comment

QTouch slider (middle) SNSK

MCI card detection

WKUP5
PWMFI0

WKUP6

XIN32

CLK32KHz

XOUT32

CLK32KHz
UART receive data
UART transmit data

WKUP7

WKUP8

NPCS0# (TSC)

AD8

USART RXD

NCS2

AD9

USART TXD

PWMH0

A19

POI_DCCLK

RTS1

PWMH1

A20

POI_DC0

USART RTS

PA25

CTS1

PWMH2

A23

POI_DC1

USART CTS

27

PA26

DCD1

TIOA2

MCDA2

POI_DC2

MCI data bit 2

28

PA27

DTR1

TIOB2

MCDA3

POI_DC3

MCI data bit 3

29

PA28

DSR1

TCLK1

MCCDA

POI_DC4

MCI command

SAM3S-EK2 User Guide

USART transceiver enable

4-16
11140AATARM25-May-12

Evaluation Kit Hardware


Table 4-1. PIO Port A Pin Assignments and Signal Descriptions (Continued)
No

I/O
Line

Peripheral
A

Peripheral
B

Peripheral
C

Extra Function

System
Function

30

PA29

RI1

TCLK2

MCCK

POI_DC5

31

PA30

PWML2

NPCS2

MCDA0

WKUP11 / POI_DC6

MCI data bit 0

32

PA31

NPCS1

PCK2

MCDA1

POI_DC7

MCI data bit 1

Comment
MCI clock

Table 4-2. PIO Port B Pin Assignments and Signal Descriptions


No

I/O
Line

Peripheral
A

Peripheral
B

Peripheral
C

PB0

PWMH0

AD4

Microphone input

PB1

PWMH1

AD5

Analog input

PB2

URXD1

NPCS2

AD6 / WKUP12

ZigBee chip select

PB3

UTXD1

PCK2

AD7

User push-button 1

PB4

TWD1

PWMH2

PB5

TWCK1

PWML0

Extra Function

System
Function

TDI

Comment

JTAG data in

TDO/
TRACESWO

JTAG data out

PB6

TMS/SWDIO

JTAG test mode select

PB7

TCK/SWCLK

JTAG clock

PB8

XOUT

CLK12MHz

10

PB9

XIN

CLK12MHz

11

PB10

DDM

USB DM

12

PB11

DDP

USB DP

13

PB12

PWML1

14

PB13

PWML2

PCK0

DAC0

Audio Output R

15

PB14

NPCS1

PWMH3

DAC1

Audio Output L

SAM3S-EK2 User Guide

WKUP13

ERASE

Flash erase selector

4-17
11140AATARM25-May-12

Evaluation Kit Hardware

Table 4-3. PIO Port C Pin Assignments and Signal Descriptions


No

I/O Line

Peripheral A

Peripheral
B

PC0

D0

PWML0

EBI D0

PC1

D1

PWML1

EBI D1

PC2

D2

PWML2

EBI D2

PC3

D3

PWML3

EBI D3

PC4

D4

NPCS1

EBI D4

PC5

D5

EBI D5

PC6

D6

EBI D6

PC7

D7

EBI D7

PC8

NWR0/NWE

10

PC9

NANDOE

NAND Flash output enable

11

PC10

NANDWE

NAND Flash write enable

12

PC11

NRD

13

PC12

NCS3

14

PC13

NWAIT

15

PC14

NCS0

16

PC15

NCS1

17

PC16

A21/NANDALE

NAND Flash ALE

18

PC17

A22/NANDCLE

NAND Flash CLE

19

PC18

A0/NBS0

PWMH0

20

PC19

A1

PWMH1

TFT LCD RegSel

21

PC20

A2

PWMH2

Red LED (Power)

22

PC21

A3

PWMH3

USB Vbus detection

23

PC22

A4

PWML3

QTouch valid button SNS

24

PC23

A5

TIOA3

QTouch valid button SNSK

25

PC24

A6

TIOB3

QTouch up button SNS

26

PC25

A7

TCLK3

QTouch up button SNSK

27

PC26

A8

TIOA4

QTouch down button SNS

28

PC27

A9

TIOB4

QTouch down button SNSK

29

PC28

A10

TCLK4

AD13

QTouch left button SNS

30

PC29

A11

TIOA5

AD14

QTouch left button SNSK

31

PC30

A12

TIOB5

QTouch right button SNS

32

PC31

A13

TCLK5

QTouch right button SNSK

SAM3S-EK2 User Guide

Peripheral
C

Extra
Function

System
Function

Comments

TFT LCD write enable

TFT LCD read enable

PWML0

AD12

User push-button 2

AD10

LCD backlight control


NAND Flash chip select

PWML1

AD11

TFT LCD chip select

RDYBSY

NAND Flash RDY/BSY

4-18
11140AATARM25-May-12

Evaluation Kit Hardware


4.4.2

Jumpers
The SAM3S-EK2 board jumpers are essentially used for two main purposes: functional selection or current measurement. Details are given below.

Table 4-4. Jumpers Setting


Designation

Label

Default Setting

JP1

JTAG

OPEN

JP2

ADVREF

1-2

Analog reference voltage selection between 3.3V (close 1-2) and


2.5V (close 2-3)

JP3

ERASE

OPEN

Close to reinitialize the Flash contents and some of its NVM bits.

JP4

TEST

Not populated
(OPEN)

JP5

VDDPLL

CLOSE

Access for current measurement on VDDPLL

JP6

VDDIO

CLOSE

Access for current measurement on VDDIO

JP7

VDDIN

CLOSE

Access for current measurement on VDDIN

JP8

VDDCORE

CLOSE

Access for current measurement on VDDCORE

JP9

CE FLASH

CLOSE

NCS0 enable NAND Flash chip select

JP10

RS485

OPEN

Maintain differential impedance for RS485 interface

JP11

RS485

CLOSE

Maintain impedance matching for RS485 interface

JP12

RS485

OPEN

Maintain differential impedance for RS485 interface

JP13

CS

CLOSE

NCS1 chip select LCD

JP14 - JP15

MIC GAIN0

CLOSE (both) 20db


OPEN (both) 26db

JP16

ADC input

OPEN

JP17 JP19

MIC Gain stage

JP18

SELECT ADC INP

1-2
2-3

JP20

MONO/STEREO

CLOSE

Close to fix in mono speaker, no matter the stereo plug state

JP21

DAC output

OPEN

Close for impedance matching on DAC BNC port

JP22

PIO expansion J12


voltage supply

2-3

Set to 3.3V (position 1-2 sets to 5V)

JP23

PIO expansion J13


voltage supply

2-3

Set to 3.3V (position 1-2 sets to 5V)

JP24

PIO expansion J14


voltage supply

2-3

Set to 3.3V (position 1-2 sets to 5V)

JP25

BP2

CLOSE

Open to disconnect and free PB3 for custom usage

JP26

BP3

CLOSE

Open to disconnect and free PC12 for custom usage

JP27

ZIGBEE

CLOSE

Power supply connection/disconnection for the ZigBEE module


May also be used as a current measurement point

SAM3S-EK2 User Guide

Feature
Close to select the JTAG boundary scan of the SAM3SD8

Close for manufacturing test or fast programming mode

Close both to lower gain stage on microphone input.


Close for impedance matching on ADC BNC port
Close to mux RIN/LIN into MONO-IN path within audio PA
ADC input potentiometer
ADC input BNC

4-19
11140AATARM25-May-12

Evaluation Kit Hardware

Table 4-5. Audio Input Configuration

4.4.3

JP17

JP19

MONO-STEREO INPUT

OFF

OFF

PIN test point (TP12)

OFF

ON

Left-in only

ON

OFF

Right-in only

ON

ON

Sum of Left-in and Right-in

Test Points
Some test points have been placed on the SAM3S-EK2 board for the verification of important signals.
Table 4-6. Test Points

4.4.4

Designation

Part

Description

TP1

Ring Hook

GND

TP2

Ring Hook

GND

TP3

Ring Hook

GND

TP4

Ring Hook

GND

TP5

Pad

UART TXD

TP6

Pad

UART RXD

TP7

Pad

LCD Backlight driver anode

TP8

Pad

Aux ADC input for Touch Screen controller

TP9

Pad

Aux ADC input for Touch Screen controller

TP10

Ring Hook

+5V

TP11

Ring Hook

+3V3

TP12

Pad

Optional Audio PA input

Solder Drops
There are two solder drops designed on the SAM3S-EK2 for isolation.
Table 4-7. Solder Drops

4.4.5

Designation

Default Setting

Feature

SD1

OPEN

Isolation of DAC output from shared channel (PB14)

SD2

CLOSE

Connects PB14 to the AUDIO_OUTL channel

Assigned PIO Lines, Disconnection Possibility


As pointed out in some previous interface description, 0 Ohm resistors have been inserted on the path of
the receiver PIO lines of the SAM3S-EK2. These are the PIO lines connected to an external driver on the
board. The 0 Ohm resistors allow disconnecting each of these for custom usage (through PIO expansion
connectors for example). This feature gives the user an added level of versatility for prototyping a system
of his own. See the table below.

SAM3S-EK2 User Guide

4-20
11140AATARM25-May-12

Evaluation Kit Hardware

Table 4-8. Disconnecting Possibility


Designation

Default Assignment

PIO

R19

0R

PC18, RDY/BSY on NAND Flash

R20

0R

PA29

R22

DNP

Optional write protection on NAND Flash

R25

0R

PA21

R26

0R

PA25

R27

0R

PA24

R28

0R

PA22

R31

0R

PA23

R33

0R

PA22

R34

0R

PA21

R35

0R

PA24

R36

0R

PA25

R44

0R

NRST

R47

0R

PA9

R48

0R

R2OUT/MN5

R59

0R

LCD backlight LED anode

R66

0R

PA11

R67

0R

PA5

R68

0R

PC13

R69

0R

PA4

R70

0R

Vref TSC

R118

0R

PA3 ZB_RSTN

R119

0R

PA5 IRQ1_ZBEE

R120

0R

PA4 IRQ0_ZBEE

R121

0R

PA6 SLP_TR

Table 4-9. Default Not Populated Parts


Reference
J1, R1
Y1, R3, R7

External clock resource input


Backup 12 MHz crystal

R6, R8

Isolation on 12 MHZ clock source and GPIO expansion

R9, R10

Isolation on 32 KHz clock source and GPIO expansion

R22

Optional write protection NAND Flash

R23

Optional pull-up for open drain output or equivalent device

R24, R30

SAM3S-EK2 User Guide

Function

Differential impedance matching for RS485 cable

4-21
11140AATARM25-May-12

Evaluation Kit Hardware


Table 4-9. Default Not Populated Parts
Reference

Function

D1

Optional ESD protection for LCD touch panel

R61, R63, RA2, RA3


JP4

Optional data bus termination for LCD controller


Test mode selection for the SAM chip

J2

Optional QFP socket for the SAM3 chip

K1

Virtual component for QTouch keys set - implemented as copper areas

S1

Virtual component for QTouch slider set - implemented as copper areas

TPxx

Surface-mounted test points (copper area)

4.5

Connectors

4.5.1

Power Supply Connector J9


The SAM3S-EK2 evaluation board can be powered from a 5VDC power supply connected to the external power supply jack J9. The positive pole is the center pin.

Figure 4-25. Power Supply Connector J9

Table 4-10. Power Supply Connector J9 Signal Descriptions

4.5.2

Pin

Mnemonic

Signal Description

Center

+5vcc

Gnd

Ground reference

USART Connector J5 With RTS/CTS Handshake Support


Figure 4-26. Male RS232/USART Connector J5

SAM3S-EK2 User Guide

4-22
11140AATARM25-May-12

Evaluation Kit Hardware

Table 4-11. Serial COM1 Connector J5 Signal Descriptions

4.5.3

Pin

Mnemonic

Signal Description

1, 4, 6, 9

NC

NO CONNECTION

TXD TRANSMITTED DATA

RS232 serial data output signal

RXD RECEIVED DATA

RS232 serial data input signal

GND

GROUND

RTS READY TO SEND

Active-positive RS232 input signal

CTS CLEAR TO SEND

Active-positive RS232 output signal

UART Connector J7
Male RS232/UART connector J7

Table 4-12. Male RS232/UART Connector J7 Signal Descriptions

4.5.4

Pin

Mnemonic

Signal Description

1, 4, 6, 7, 8, 9

NC

NO CONNECTION

TXD TRANSMITTED DATA

RS232 serial data output signal

RXD RECEIVED DATA

RS232 serial data input signal

GND

GROUND

USB Device Connector J15


Figure 4-27. Micro-B USB Connector J15

Table 4-13. Micro-B USB Connector J15 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

Signal Description

Vbus

5v power

DM

Data -

DP

Data +

Gnd

Ground

Shield

Shield

4-23
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.5

TFT LCD Connector J8


One 39-pin connector is available on the board to connect the LCD module, backlight and touch screen.
Figure 4-28. LCD Connector J8

Table 4-14. LCD Connector J8 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

Pin

Mnemonic

3V3

LCD_DB17 (PC7)

LCD_DB16 (PC6)

LCD_DB15 (PC5)

LCD_DB14 (PC4)

LCD_DB13 (PC3)

LCD_DB12 (PC2)

LCD_DB11 (PC1)

LCD_DB10 (PC0)

10

LCD_DB09 (NC)

11

LCD_DB08 (NC)

12

LCD_DB07

13

LCD_DB06 (NC)

14

LCD_DB05 (NC)

15

LCD_DB04 (NC)

16

LCD_DB03 (NC)

17

LCD_DB02 (NC)

18

LCD_DB01 (NC)

19

LCD_DB00 (NC)

20

3V3

21

RD (PC11)

22

WR (PC8)

23

RS (PC19)

24

CS (PC15)

25

RESET

26

IM0

27

IM1

28

GND

29

LED-A

30

LED-K1

31

LED-K2

32

LED-K3

33

LED-K4

34

Y UP

35

Y DOWN

36

X RIGHT

37

X LEFT

38

NC

39

GND

4-24
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.6

JTAG Debugging Connector J6


This JTAG connector is a 20-way Insulation Displacement Connector (IDC) keyed box header (2.54 mm
male) that mates with IDC sockets mounted on a ribbon cable. Its signal assignment is compatible with
the SAM-ICE or any similar third-party interface.
Figure 4-29. JTAG/ICE Connector J6

Table 4-15. JTAG/ICE Connector J13 Signal Descriptions


Pin

Mnemonic

Description
This is the target reference voltage. It is used to check if the target has power, to
create the logic-level reference for the input comparators and to control the output
logic levels to the target. It is normally fed from Vdd on the target board and must
not have a series resistor.

VTref. 3.3V power

Vsupply. 3.3V power

This pin is not connected in SAM-ICE. It is reserved for compatibility with other
equipment. Connect to Vdd or leave open in target system.

nTRST TARGET RESET Active-low


output signal that resets the target

JTAG Reset. Output from SAM-ICE to the Reset signal on the target JTAG port.
Typically connected to nTRST on the target CPU. This pin is normally pulled
HIGH on the target to avoid unintentional resets when there is no connection.

GND

TDI TEST DATA INPUT Serial data


output line, sampled on the rising edge
of the TCK signal

GND

TMS TEST MODE SELECT

GND

TCK TEST CLOCK Output timing


signal, for synchronizing test logic and
control register access

10

GND

11

RTCK
Input Return test clock signal from the
target

12

GND

13

TDO JTAG TEST DATA OUTPUT


Serial data input from the target

14

GND

SAM3S-EK2 User Guide

Common ground
JTAG data input of target CPU. It is recommended that this pin is pulled to a
defined state on the target board. Typically connected to TDI on target CPU.
Common ground
JTAG mode set input of target CPU. This pin should be pulled up on the target.
Typically connected to TMS on target CPU. Output signal that sequences the
targets JTAG state machine, sampled on the rising edge of the TCK signal.
Common ground
JTAG clock signal to target CPU. It is recommended that this pin is pulled to a
defined state on the target board. Typically connected to TCK on target CPU.
Common ground
Some targets must synchronize the JTAG inputs to internal clocks. To assist in
meeting this requirement, a returned and retimed TCK can be used to
dynamically control the TCK rate. SAM-ICE supports adaptive clocking which
waits for TCK changes to be echoed correctly before making further changes.
Connect to RTCK if available, otherwise to GND.
Common ground
JTAG data output from target CPU. Typically connected to TDO on target CPU.
Common ground

4-25
11140AATARM25-May-12

Evaluation Kit Hardware


Table 4-15. JTAG/ICE Connector J13 Signal Descriptions (Continued)
Pin

Mnemonic

15

nSRST RESET

16

GND

Common ground

17

RFU

This pin is not connected in SAM-ICE.

18

GND

Common ground

19

RFU

This pin is not connected in SAM-ICE.

20

GND

Common ground

4.5.7

Description
Active-low reset signal. Target CPU reset signal

SD/MMC - MCI Connector J3


Figure 4-30. SD/MMC Connector J3

Table 4-16. SD/MMC Connector J3 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

Pin

Mnemonic

RSV/DAT3

CDA

GND

VCC

CLK

GND

DAT0

DAT1

DAT2

10

Card Detect

11

GND

12

4-26
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.8

Analog Connector CN1 & CN2


Figure 4-31. Analog Input Connector CN1 and Analog Output CN2, Bottom View

Table 4-17. Analog Input, Output Connector CN1, CN2 Signal Descriptions

4.5.9

Pin

Mnemonic

1, 2, 3, 4

GND

Analog input PB1 for CN1 and analog output PB13 for CN2 respectively

RS485 Connector J14


Figure 4-32. RS485 Connector J14

Table 4-18. RS485 J14 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

A - non-inverted RS485 signal A

Frame ground

B - non-inverted RS485 signal B

4-27
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.10

Headphone Connector J11


Figure 4-33. Headphone J11

Table 4-19. Headphone J11 Signal Descriptions


Pin

Mnemonic

AGND

Out left

3
4
5

4.5.11

Out Right

ZigBEE Connector J16


Figure 4-34. ZigBee Connector J16

Table 4-20. Connector J16 Signal Descriptions


Function

Signal
Name

Port

Pin

Pin

Port

Signal
Name

Function

EEPROM for MAC address, CAP array


settings and serial number
TST: test mode activation
CLKM: RF chip clock output

Reset

/RST

Misc.

Interrupt
Request

IRQ

SLP_TR

SLP_TR

SPI chip
select

/SEL

MOSI

SPI MOSI

SPI MISO

MISO

SCLK

SPI CLK

Power
Supply

GND

10

VCC

VCC

SAM3S-EK2 User Guide

GND

VCC

Option on Misc. Port Set by


Zero Ohm Resistor or Solder Shunts

Voltage range: 1.8v to 5.5v, typically


regulated to 3.3v

4-28
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.12

PIO Expansion Port C Connector J12


Figure 4-35. PIO Expansion Connector J12

Table 4-21. Connector J12 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

Pin

Mnemonic

+5V or +3v3

+5V or +3v3

GND

GND

PC0

PC16

PC1

PC17

PC2

10

PC18

11

PC3

12

PC19

13

PC4

14

PC20

15

PC5

16

PC21

17

PC6

18

NC

19

PC7

20

NC

21

PC8

22

NC

23

PC9

24

NC

25

PC10

26

NC

27

PC11

28

NC

29

PC12

30

NC

31

PC13

32

NC

33

PC14

34

NC

35

PC15

36

NC

37

GND

38

GND

39

3V3

40

3V3

4-29
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.13

PIO Expansion Port A Connector J13


Figure 4-36. PIO Expansion Connector J13

Table 4-22. Connector J13 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

Pin

Mnemonic

+5V or +3v3

+5V or +3v3

GND

GND

NC

PA16

NC

PA17

NC

10

PA18

11

NC

12

PA19

13

NC

14

PA20

15

NC

16

PA21

17

PA6

18

PA22

19

PA7

20

PA23

21

PA8

22

PA24

23

PA9

24

PA25

25

PA10

26

PA26

27

PA11

28

PA27

29

PA12

30

PA28

31

PA13

32

PA29

33

PA14

34

PA30

35

PA15

36

PA31

37

GND

38

GND

39

3V3

40

3V3

4-30
11140AATARM25-May-12

Evaluation Kit Hardware


4.5.14

PIO Expansion Port B Connector J14


Figure 4-37. PIO Expansion Connector J14

Table 4-23. Connector J14 Signal Descriptions

SAM3S-EK2 User Guide

Pin

Mnemonic

Pin

Mnemonic

+5V or +3v3

+5V or +3v3

GND

GND

PB0

PB8

PB1

PB9

PB2

10

PB10

11

PB3

12

PB11

13

PB4

14

PB12

15

PB5

16

PB13

17

PB6

18

PB14

19

PB7

20

NC

21

GND

22

GND

23

3V3

24

3V3

4-31
11140AATARM25-May-12

Schematics

Section 5
Schematics
5.1

Schematics
This section contains the following schematics:

Block diagram

General information

Microcontroller

NAND Flash, serial interface

TFT LCD & Touch

Audio & Power Supply

USB, LEDs, push-buttons & ZigBEE

SAM3S-EK2 User Guide

5-1
11140AATARM25-May-12

SAM3S-EK2 RevA Block Diagram


D

ATMEL Cortex M3 Processor SAM3SD8 (LQFP100)

Reset,Debug Logic

Power Manage

Audio PA

2.8 Inch TFT-LCD

Microphone

MicroSD Card

USB FS Device

Nand Flash

RS232 & RS485

QTouch Input

AD/DA

ZIGBEE IF

User Interface (PIO PortA,B,C)

A
REV

SAM3S-EK2

INIT EDIT
MODIF.

SCALE

PP
DES.

XX-XXX-XX XXX XX-XXX-XX


DATE

1/1

DATE

REV.

SHEET

Block Diagram
This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

VER.

1
7

EXPLAIN OF SCHEMATICS

REVSIONHISTORY
D

REV

DATA

2009.07

NOTE
ORIGINAL RELEASED

PAGE

(1) Resistance Unit: "K" is "K", "R" is ""

(2) "DNP" means the component is not populated


by default

PAGE

PAGE

1
2
3
4
5
6
7

DESCRIPTION

3
4

Block Diagram
Describe
Microcontroller
NAND Flash, RS232, RS485, MCI, JTAG
LCD, QTouch
Audio, AD/DA, Power
IO Expansion, USB, ZigBEE, LED, Botton

DEFAULT

REFERENCE

FUNCTION

JP1

OPEN

Close to select JTAG boundary scan

JP2

1-2

Analog reference voltge selection from 3.3V and 2.5V

JP3

OPEN

Close to reinitialize the Flash content and some of its NVM bits

JP4

OPEN

Close for manufacturing test or fast programming mode

JP5, JP6, JP7, JP8

CLOSE

Access for current measurement on each power rail


Access to reconfigure NCS0

JP9

CLOSE

JP11

CLOSE

Differential impedance matching for RS485 cable

JP10, JP12

OPEN

Maintain differential for RS485 cable

JP13

CLOSE

Access to reconfigure NCS1

JP14, JP15

OPEN

Sync close to degrade gain stage on microphone input

JP17, JP19

OPEN

Close to mux RIN/LIN into MONO-IN path within audio PA

JP16, JP21

OPEN

Close for impedance matching on AD/DA BNC port

REFERENCE

JUMPER and SOLDERDROP

TEST POINT
TABLE OF CONTENTS

FUNCTION

TP1, TP2, TP3, TP4

GND

TP5

UART TXD

TP6

UART RXD

TP7

LCD BK driver anode

JP18

1-2

ADC input selection between BNC port and potentiometer

TP8, TP9

Aux ADC input for TSC

JP20

OPEN

Close to fix in mono speaker mode, no matter stereo plug state

SD1

OPEN

DAC path isolation on sharing channel

SD2

CLOSE

Lead PB14 as AUDIO_OUTL channel

JP22, JP23, JP24

1-2

DC voltage selection between 3.3V and 5V on PIO expansion ports

JP25

CLOSE

Access to reconfigure NCS2

JP26

CLOSE

Access to reconfigure NCS3

JP27

CLOSE

Power consumption measure for ZigBEE module

TP12

Optional audio PA input


7

PIO MUXING
PIOA

USAGE

PIOA

USAGE

PIOB

USAGE

PIOC

PIOC

USAGE

PA0

TSLIDR_SL_SNS

PA16

TSC_IRQ/ZB_IRQ0

PB0

MIC INPUT

PC0

D0

USAGE

PC16

NAND_ALE

PA1

TSLIDR_SL_SNSK

PA17

TSC_BUSY/ZB_IRQ1

PB1

ANA INPUT

PC1

D1

PC17

NAND_CLE

PA2

TSLIDR_SM_SNS

PA18

ZB_RSTN

PB2

ZB_NPCS2

PC2

D2

PC18

NAND_RDYBSY

PA3

TSLIDR_SM_SNSK

PA19

LED_BLUE

PB3

USER_PB1

PC3

D3

PC19

PA4

TSLIDR_SR_SNS

PA20

LED_GREEN

PB4

JTAG

PC4

D4

PC20

PA5

TSLIDR_SR_SNSK

PA21

RXD1

PB5

JTAG

PC5

D5

PC21

PA6

MCI_CD

PA22

TXD1

PB6

JTAG

PC6

D6

PC22

TVALID_SNS

PA7

CLK_32K

PA23

COM1EN

PB7

JTAG

PC7

D7

PC23

TVALID_SNSK

PA8

CLK_32K

PA24

RTS1

PB8

CLK_12M

PC8

WR_LCD

PC24

TUP_SNS

PA9

RX_UART0

PA25

CTS1

PB9

CLK_12M

PC9

NAND_OE

PC25

TUP_SNSK

PA10

TX_UART0

PA26

MCI

PB10

USB_DDM

PC10

NAND_WE

PC26

TDWN_SNS

PA11

TSC_CS

PA27

MCI

PB11

USB_DDP

PC11

RD_LCD

PC27

TDWN_SNSK

PA12

MISO

PA28

MCI

PB12

ERASE

PC12

USER_PB2

PC28

TLEFT_SNS

PA13

MOSI

PA29

MCI

PB13

AUDIO OUT R

PC13

EN_LCD

PC29

TLEFT_SNSK

PA14

SPCK

PA30

MCI

PB14

AUDIO OUT L

PC14

NAND_NCS0

PC30

TRIGHT_SNS

PA15

ZB_SLPTR

PA31

MCI

PC15

NSC1_LCD

PC31

TRIGHT_SNSK

DEFAULT NO POPULATE PARTS


PAGE
3

REFERENCE

FUNCTION
B

J1, R1

External clock resource input

REGSEL_LCD

Y1, R3, R7

Backup 12MHz crystal

LED_RED(POWER)

R6, R8

Isolation on 12MHz clock source and GPIO expansion

USB_CNX

R9, R10

Isolation on 32KHz clock source and GPIO expansion

R22

Optional write protection on NAND flash

R23

Optional pull up for open drain output on equivalent device

R24, R30

Differential impedance matching for RS485 cable

D1

Optional ESD protection for LCD touch panel

R61, R62, RA2, RA3

Optional databus termination for LCD controller

A
REV

SAM3S-EK2

PP

INIT EDIT
MODIF.

SCALE

XX-XXX-XX

XXX

DATE

VER.

DATE

REV.

SHEET

2
7

DES.

1/1

Describe
This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

XX-XXX-XX

J1

DNP

PB8_XOUT

XIN32

PB2

{7}

PB3

{7}

PB10

{7}

PB11

PB2

PB3

PB10

88

PB11

89

DNP JTAGSEL

77

PB4
PB6
PB7
PB5

51
79
83
76

NRST

60

R12
0R

PB3_UTXD1_PCK2_AD12B7

SAM3SD8-LQFP100

PB10_DDM
PB11_DDP

+3V3
JP1
{4,7}
{4,7}
{4,7}
{4,7}

PB4
PB6
PB7
PB5

{4,5,7}

NRST

{6,7}
{6,7}

PB0
PB1

PB0
PB1

3
5

JTAGSEL
PB4_TWD1_PWMH2_TDI
PB6_TMS_SWDIO
PB7_TCK_SWCLK
PB5_TWCK1_PWML0_TDO
NRST

ADVREF

PB0_PWMH0_AD12B4
PB1_PWMH1_AD12B5

PB13_PWML2_PCK0_DACO0

PA9
PC1
XOUT32
XIN32
VDDIO

PB14
XIN
XOUT

GND

GND
2

GND

GND

VDDPLL

GND

95

70

45

26

VDDCORE

VDDCORE

85

VDDCORE

56

99

PB14

VCC33

PB13

{6,7}

PB14

{6,7}

+5V

C5
100nF

JP2

R13
4.7K

MN2
LM4040-2.5
DGND
DGND

C14 100nF

DNP
C13

C12 100nF

C11 100nF

C9 100nF

C10 100nF

C8 2.2uF

DGND

PB[0..14]

VDDIO

VDDCORE

DGND

VDDPLL

DGND

PC23
PB11
PB10
PB12
PC22
PC21
PB7
PC20
PA31
PC19
PB6
PC18
JTAGSEL
PB5

DGND

VDDIO

VDDCORE

VDDPLL

JP5
JP

L1
10uH/100mA

C22
100nF

R14
1R

VDDOUT

VDDIO

JP6
JP

+3V3
TP1
GND

VDDIN

TP2
GND

TP3
GND

TP4
GND

JP7
JP

C23
4.7uF

DGND

+ C24
10uF

JP8
JP

DGND
DGND

DGND

REV

SAM3S-EK2

VDDIO

PP

INIT EDIT
MODIF.

SCALE

XX-XXX-XX

XXX

DATE

VER.

DATE

REV.

SHEET

3
7

DES.

1/1

Microcontroller
This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

{4,6,7}

PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PB8
PB9
PB10
PB11
PB12
PB13
PB14

VDDPLL

VDDCORE

PC14
PA1
PC16
PA0
PC17

PA27
PC8
PA28
NRST
TEST
PC9
PA29
PA30
PC10
PA3
PA2
PC11

PB13

PC25
PB13
PC24

51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
PB4
PA6
PA5
PC28
PA4

VDDCORE

C7 100nF

C6 100nF

J2

NOT POPULATED

ADVREF

93

DNP
DNP

VDDIO

100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76

SOCKET_THROUGHT_HOLE

VDDCORE

VDDIN

26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50

100

VDDOUT

36

TEST

10

61

PB12_PWML1_ERASE

16

DNP TEST

PB14_NPCS1_PWMH3_DACO1
VDDOUT

JP4

87

11

JP PB12

VDDIN

JP3

ADVREF

VDDOUT
VDDIN
PB3
PC31
PB2
PC30
PB1
PC29
PB0

PA21
PA18
PC26
PA17

25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

PC0
PA20
PC12
PA23
PC13
PA22
PC15
PA19
PC27

VDDCORE

+3V3

R9
R10

C21 4.7uF

C4
20pF

PB2_URXD1_NPCS2_AD12B6

C20 4.7uF

XOUT32

DGND

{7}

C19 100nF

Y3
32.768KHz

XIN32
XOUT32

PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PA8
PA9
PA10
PA11
PA12
PA13
PA14
PA15
PA16
PA17
PA18
PA19
PA20
PA21
PA22
PA23
PA24
PA25
PA26
PA27
PA28
PA29
PA30
PA31

96

VDDIO

DNP

VDDIO

R8

74
72
67
66
55
53
52
49
48
46
44
42
41
33
31
30
28
12
14
18
24
15
20
22
34
38
39
57
59
63
64
81

98

PB8

PA0_PWMH0_TIOA0_A17
PA1_PWMH1_TIOB0_A18
PA2_PWMH2_SCK0_DATRG
PA3_TWD0_NPCS3
PA4_TWCK0_TCLK0
PA5_RXD0_NPCS3
PA6_TXD0_PCKO
PA7_RTS0_PWMH3
PA8_CTS0_AD12BTRG
PA9_URXD0_NPCS1
PA10_UTXD0_NPCS2
PA11_NPCS0_PWMH0
PA12_MISO_PWMH1
PA13_MOSI_PWMH2
PA14_SPCK_PWMH3
PA15_TF_TIOA1_PWML3
PA16_TK_TIOB1_PWML2
PA17_TD_PCK1_PWMH3_AD12B0
PA18_RD_PCK2_A14_AD12B1
PA19_RK_PWML0_A15_AD12B2
PA20_RF_PWML1_A16_AD12B3
PA21_RXD1_PCK1_AD12B8
PA22_TXD1_NPCS3_NCS2_AD12B9
PA23_SCK1_PWMH0_A19
PA24_RTS1_PWMH1_A20
PA25_CTS1_PWMH2_A23
PA26_DCD1_TIOA2_MCDA2
PA27_DTR1_TIOB2_MCDA3
PA28_DSR1_TCLK1_MCCDA
PA29_RI1_TCLK2_MCCK
PA30_PWML2_NPCS2_MCDA0
PA31_NPCS1_PCK2_MCDA1

VDDIO

PC4
PA25
PA26
PC3
PA12
PA11
PC2
PA10

{4,5,7}

PB9_XIN

XOUT

91

0R

97

VDDIO

DNP

R11
0R

R6

20pF

DNP

C3
20pF

VDDCORE

PA[0..31]

MN1

C18 100nF

R7

DGND

PB9

12MHz
R5

C2

XIN

69

Y2
DGND

PA16
PC7
PA15
PA14
PC6
PA13
PA24
PC5

{4,5,7}

0R

C17 100nF

DGND

R4

VDDIO

20pF

Y1
12 MHz
DNP

50

C1

DGND

C16 100nF

27

R3

C15 100nF

R2
49.9R 1%

VDDIO

PC[0..31]

DNP

25
47
43
40
37
35
32
29
58
62
65
68
23
21
71
19
73
75
78
80
82
84
86
90
92
94
13
17
54
4
6
8

R1

PC0_D0_PWML0
PC1_D1_PWML1
PC2_D2_PWML2
PC3_D3_PWML3
PC4_D4_NPCS1
PC5_D5
PC6_D6
PC7_D7
PC8_NWR0_NWE
PC9_NANDOE
PC10_NANDWE
PC11_NRD
PC12_NCS3_AD12B12
PC13_NWAIT_PWML0_AD12B10
PC14_NCS0
PC15_NCS1PWML1_AD12B11
PC16_A21_NANDALE
PC17_A22_NANDCLE
PC18_A0_NBS0_PWMH0
PC19_A1_PWMH1
PC20_A2_PWMH2
PC21_A3_PWMH3
PC22_A4_PWML3
PC23_A5_TIOA3
PC24_A6_TIOB3
PC25_A7_TCLK3
PC26_A8_TIOA4
PC27_A9_TIOB4
PC28_A10_TCLK4
PC29_A11_TIOA5_AD12B13
PC30_A12_TIOB5_AD12B14
PC31_A13_TCLK5_AD12B15

1
3
5

2
4

PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PC8
PC9
PC10
PC11
PC12
PC13
PC14
PC15
PC16
PC17
PC18
PC19
PC20
PC21
PC22
PC23
PC24
PC25
PC26
PC27
PC28
PC29
PC30
PC31

NOT POPULATED

XX-XXX-XX

PC[0..31]
+3V3

R15
47K

+3V3

R16
47K

MN3
MT29F2G08ABAEA

16
17
8
18

PC17
PC16
PC9
PC10

CLE
ALE
RE
WE

JP9
JP

PC14
PC18

R19

R21

R/B
WP

1
2
3
4
5
6
10
11
14
15
20
21
22
23
24
25
26

+3V3
47K
R22
DNP

DGND

I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7

CE

7
19

0R

4
3
2
1

+3V3

N.C28
N.C27
N.C26
N.C25
N.C24
N.C23
PRE
N.C22
N.C21
N.C20
N.C19
N.C18

N.C1
N.C2
N.C3
N.C4
N.C5
N.C6
N.C7
N.C8
N.C9
N.C10
N.C11
N.C12
N.C13
N.C14
N.C15
N.C16
N.C17

VCC
VCC
VSS
VSS

29
30
31
32
41
42
43
44

PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7

R17
10K
{3,5,7}

R18
10K

RA1
68KX4

PA[0..31]

PA30
PA31

1
2
3
4
5
6
7
8

PA6

10
9

PA26
PA27
PA28

48
47
46
45
40
39
38
35
34
33
28
27

PA29

R20

J3
TF01A

5
6
7
8

{3,5,7}

0R

+ C25
10uF

DAT2
DAT3
CMD
VCC
CLK
VSS
DAT0
DAT1

Sh1
Sh2
Sh3

11
12
13

DGND

GND
CD

C26
100nF

+3V3

37
12
C27
100nF

C28
100nF

C29
1uF

DGND

36
13
+3V3

+3V3

DGND
C

R23
DNP

PA23

MN5
ADM3312EARU

+3V3

3
C33
100nF

C34
100nF

V+

21
C36
100nF

23

R32
47K

GND

19

PA23

R31

0R

PA22
PA21
PA24
PA25

R33
R34
R35
R36
R37

0R
0R
0R
0R
47K

7
10
8
11
9
12

+3V3

C1C2+

T1IN
R1OUT
T2IN
R2OUT
T3IN
R3OUT

0R

PA24

R27

0R

PA22

R28

0R

RO
RE

VCC
GND

+3V3

A
B

C2C3+

T1OUT
R1IN
T2OUT
R2IN
T3OUT
R3IN

3
JP11
JP

FGND
R30
DNP

1
6
2
7
3
8
4
9
5

R38

0R

DGND

+3V3
DGND

DGND

R39
100K

R40
100K

R41
100K

R42
100K

R43
100K

FGND
{3,7}
{3,7}
{3,7}

MN6
MAX3232CSE
+3V3

16

R45
100K

{3,7}
{3,7}

PA10
PA9

TP5
SMD

+3V3

C40
100nF

C1+

2
6

V+

C1-

V-

C2+

0R

R48

0R

TP6
SMD

R44

0R

GND

C2-

11
12
10
9

T1IN
R1OUT
T2IN
R2OUT

T1OUT
R1IN
T2OUT
R2IN

VTref
Vsupply
nTRST
GND1
TDI
GND2
TMS
GND3
TCK
GND4
RTCK
GND5
TDO
GND6
nSRST
GND7
DBGRQ GND8
DBGACK GND9

2
4
6
8
10
12
14
16
18
20

3
DGND

J7

1
6
2
7
3
8
4
9
5

C42
100nF

15

R47

PB5
NRST

C38
100nF

C41
100nF

R46
100K

{3,7}
{3,5,7}

PB4
PB6
PB7

J6

1
3
5
7
9
11
13
15
17
19

5
14
13
7
8

DGND
DGND

11

+3V3

VCC

10

C39
100nF

JP12
JP

J5

22
18
15
17
14
16
13

DGND

6
7

R29
120R

C37
100nF

C3-

J4

DE
DI

JP10
JP

C30
100nF

C35
100nF

4
24

SD
EN

0R

R26

20
2

V-

DGND

+3V3

R25

PA25

11

C32
100nF

C1+

10

C31
4.7uF

VCC

PA21

R24
DNP

MN4
ADM3485ARZ

A
REV

SAM3S-EK2
FGND

PP

INIT EDIT
MODIF.

SCALE

XX-XXX-XX

XXX

DATE

VER.

DATE

REV.

SHEET

4
7

DES.

1/1

NAND FLASH,SERIAL INTERFACE


This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

XX-XXX-XX

+3V3

{3,4,7}

+ C43
10uF

PC[0..31]

C44
100nF

C45
100nF

R49
47K
S1
DNP

DGND

SR

J8
FH26-39S-0.3SHW

+3V3
PC11
PC8
PC19

R56
10K

JP13

PC15
{3,4,7}

JP

NRST

NRST

LED_A

R59

0R
LED_K1
LED_K2
LED_K3
LED_K4
Y_UP
Y_DOWN
X_RIGHT
X_LEFT

R58
4.7K

C46
22nF

R51

PC25

1K

C47
22nF

SL

PA0

PC24

R52

PA3

1K

R53

PC31

SM

C48
22nF

K1
DNP

1K

C49
22nF

PA2

PC30

SR
PA5

R54

1K

PC29

R55

C50
22nF

1K

C51
22nF

PA4

PC28

R57

PC23

1K

C52
22nF

PC22
X_RIGHT
Y_UP
X_LEFT
Y_DOWN

The part is placed as


close as possible to J8

R60

PC27

1K

C53
22nF
D1
PACDN044Y5R
TVS, SOT23-5

DGND

VDD
DB17
DB16
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
VDD
RD
WR
RS
CS
RESET
IM0
IM1
GND
LED-A
LEDK1
LEDK2
LEDK3
LEDK4
Y+
YX+
XNC
GND

1K

LCD_DB17
LCD_DB16
LCD_DB15
LCD_DB14
LCD_DB13
LCD_DB12
LCD_DB11
LCD_DB10
LCD_DB9
LCD_DB8
LCD_DB7
LCD_DB6
LCD_DB5
LCD_DB4
LCD_DB3
LCD_DB2
LCD_DB1
LCD_DB0

R50

PA1

DGND

PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39

PC13
PC22
PC23
PC24
PC25
PC26
PC27
PC28
PC29
PC30
PC31

PC26

NOT POPULATED

DGND
DGND

LCD_DB0

R61

DNP

LCD_DB4
LCD_DB2
LCD_DB3
LCD_DB1
LCD_DB8
LCD_DB6
LCD_DB7
LCD_DB5

1
2
3
4
1
2
3
4

8
7
6
5
8
7
6
5

LCD_DB9

R63

RA2
DNP
+3V3
RA3
DNP

DNP

2
3
4
5

X_RIGHT
Y_UP
X_LEFT
Y_DOWN
DGND
TP8
SMD

PA[0..31]

R72
100K
PA0
PA1
PA2
PA3
PA4
PA5
PA11
PA12
PA13
PA14
PA16
PA17

XP
YP
XM
YM

TP9
SMD

DCLK
DIN
DOUT
CS
BUSY
PENIRQ

7
8
{3,4,7}

R62
100K

MN7
ADS7843E

R73
100K

IN3
IN4

VREF
VCC1
VCC2
GND

AGND_TP

16
14
12
15

+3V3

10

PA14
PA13
PA12
R66

0R

PA11

13
11

R67

0R

PA17

9
1
10

R70

MN8
AAT3155ITP-T1

+3V3

R65
100K
PC13
R69

0R

PA16
+3V3

0R

C58
100nF

C59
100nF

+3V3

C60
100nF

R71
1R

R68
0R

C1+

C2+

C1EN/SET

C2-

C54
1uF

R64
47K

C55
1uF

9
11
5

B1
BN03K314S300R

OUTCP
IN

C57
4.7uF

L2
10uH/100mA

GND

D1
D2
D3
D4

TP7
SMD

6
8

LED_A

3
2
1
12

LED_K1
LED_K2
LED_K3
LED_K4

C56
1uF

DGND
C61
4.7uF

R74
0R

AGND_TP

DGND

DGND

A
REV

SAM3S-EK2

PP

INIT EDIT
MODIF.

SCALE

XX-XXX-XX

XXX

DATE

VER.

DATE

REV.

SHEET

5
7

DES.

1/1

TFT-LCD & QTouch


This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

XX-XXX-XX

C62
100pF

AVDD
R77
470R

R75

100K

R76

100K

JP14

J9
MP179P 2.1mm

JP

MN9
ZEN056V130A24LS

1
2

MN10
BNX002-01

AGND

R84
1K

R85
1K

C68
1uF

C69
1nF

AGND
C73
22uF

R86
100K

AGND

PB0

{3,7}

MN12
MIC29152WU
Micrel's 1.5A LDO, TO263-5

AGND
VCC33

VCC

+5V
B2
C74
100nF

OUT2

GND

+3V3

BN03K314S300R

R91
0R

VIN

VOUT

SD

ADJ

R93
100K

C77
4.7uF

AGND

4
5

AGND

+ C75
100uF
R92
102K 1%

IN2+

JP14 and JP15 should


act at same phase

DGND
J10

1
2
CN1
BNC

C84

PB13

DGND
0.47uF

AGND

JP17

JP

RO/MO+

C82
100nF

R98

R99

12K

LO/MO-

10

C81
R95

1K

R97

1K

C83

220uF

JP16
JP

1
2
3
4

5 EARJACK
4
3
2
1

220uF

AGND

AD12B5

RIN

AGND

DGND

30K
VDD_AMP

C85

JP19

C88

0.47uF

JP

12K

R104

30K

R105

12K

MONO-IN

ST/MN
SHUTD0WN

BYPASS
LIN
PAD

AUDIO_OUTL

0.47uF R100

GND

R101

100K

R103

100K

C86

R102

VCC33

100K

JP18

PB1

{3,7}

TP12
SMD

C78
10nF

R96
49.9R 1%

{3,7}

VDD

0.47uF

JP20
JP

C87
1uF

VR1
10K

Potentiometer

11

AGND

AGND

C89
10nF

+ C80
10uF

C79
1uF

J11

VDD_AMP

R94
0R

MN13
TPA0223DGQ

+5V

C76
100nF

DGND

AGND

B3
BN03K314S300R

R89
169K 1%

IN23

+ C66
22uF

DGND

AVDD

R90
100K

4
5
6

C71
22nF

JP15
JP

AVDD

SG CG1
CG2
CG3

R83
0R

IN1+

R87
100K

7
AGND

C72
1nF

AGND

R88
470R

R81
100R

IN1OUT1

MIC1
BL-MP6027P

+ C65
22uF

C64
100nF

+5V

CV

R82
1K

MN11
TS922

R80
1K

GND2

R79
1K

GND1

C67
1uF

R78
1K

C63
22uF

SV

AGND

DGND
AGND
CN2
BNC

R106
0R

5
MN14
MIC5219-3.3YMM

+5V

2
1

C91
4.7uF

4
DGND
A

IN

OUT

EN

GND
GND
GND
GND

BYP

1
2
3
4

VCC33

3
5
6
7
8

JP21
JP

+ C92
10uF

C90

SOLDER DROP 2 pins open.Normal

PB14

{3,7}

SD1

2.2uF

2
SD2

R109
49.9R 1%
AUDIO_OUTL

DAC01
DGND

C93
470pF

DGND
A

DGND
DGND

A
REV

SAM3S-EK2

PP

INIT EDIT
MODIF.

SCALE

XX-XXX-XX

XXX

DATE

VER.

DATE

REV.

SHEET

6
7

DES.

1/1

Audio & Power Supply


This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

XX-XXX-XX

PB[0..14]

{3,4,5}

PA[0..31]

{3,4,5}

PC[0..31]

JP22

+5V

+3V3

JP23

+5V

+3V3

JP24

+5V

J12

J13

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39

PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PC8
PC9
PC10
PC11
PC12
PC13
PC14
PC15

+3V3

1
2

3
2

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40

DGND

PA6
PA7
PA8
PA9
PA10
PA11
PA12
PA13
PA14
PA15
+3V3

+3V3

DGND

J14

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39

PC16
PC17
PC18
PC19
PC20
PC21

+3V3

3
2

{3,4,6}

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40

PA16
PA17
PA18
PA19
PA20
PA21
PA22
PA23
PA24
PA25
PA26
PA27
PA28
PA29
PA30
PA31

1
3
5
7
9
11
13
15
17
19
21
23

PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
+3V3

2
4
6
8
10
12
14
16
18
20
22
24

DGND

PB8
PB9
PB10
PB11
PB12
PB13
PB14

+3V3

DGND
C

+3V3

DGND

DGND

J15
Micro USB B Connector
G

7
6

+3V3

R111
220R

PA19

ID

D+

RV2
V5.5MLA0603

D-

FGND

5V

8
9

D2

3
4
BP2

R113
220R

PA20

BP1

1
2

Blue-led

D3

1
2

Green-led

3
4

NRST

{3,4,5}

JP25
JP
PB3

RV1
V5.5MLA0603
B

BP3
PC21

R110

R112

47K

68K

PC20

R115

1
2

100K

C94
10pF
DGND

FGND

Q1
IRLML2502

R117
220R

D4

Red-led

3
4

JP26
JP

PC12

DGND

DGND
DGND
PB10

R114

27R

PB11

R116

27R

+3V3

J16
ZB_RSTN
IRQ1_ZBEE
SPIO_NPCS0#
MISO

PA18
PA17
PB2
PA12

R118
R119

0R
0R

+5V

DGND

1
3
5
7
9

2
4
6
8
10

R120
R121

0R
0R

C95
18pF

PA16
PA15
PA13
PA14
C96
2.2nF

IRQ0_ZBEE
SLP_TR
MOSI
SPCK

JP27
JP

+3V3

C97
2.2uF

DGND

A
REV

SAM3S-EK2

PP

INIT EDIT
MODIF.

SCALE

XX-XXX-XX

XXX

DATE

VER.

DATE

REV.

SHEET

7
7

DES.

1/1

POWER SUPPLY
This agreement is our property. Reproduction and publication without our written authorization shall expose offender to legal proceedings.

XX-XXX-XX

Section 6
Troubleshooting
6.1

Self-Test
A software test package is available to implement a functional test for each section of the board. Refer to
the SAM3S-EK2 page on www.atmel.com.

6.2

Board Recovery
Closing JP3 and powering the board will assert ERASE and clear GPNVM bit 1, and thereby selects the
boot from the ROM by default. The MCU will boot from the internal ROM to enable a SAM-BA connection
through the UART. Connect the SAM3S-EK2 UART port (J3) to a PC COM port through an RS232
crossover cable.
You can then run the SAM-BA application from that PC to program the internal Flash of the MCU as well
as the GPNVM bit 1.

SAM3S-EK2 User Guide

6-1
11140AATARM25-May-12

Section 7
Revision History
7.1

Revision History

Table 7-1.
Document

Comments

11140A

Initial version.

SAM3S-EK2 User Guide

Change Request
Ref.

7-1
11140AATARM25-May-12

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Atmel technical support

Sales Contacts
www.atmel.com/contacts/

Product Contact
Web Site
www.atmel.com
www.atmel.com/AT91SAM
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www.atmel.com/literature

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2012 Atmel Corporation. All rights reserved. Atmel, Atmel logo and combinations thereof, QTouch, DataFlash, SAM-BA and others
are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Windows and others, are registered trademarks or trademarks of Microsoft Corporation in the US and/or other countries. ARM, ARMPowered logo, Cortex, Thumb-2 and others are registered
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11140AATARM25-May-12

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