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Internal Use Only

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COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM 72A

MODEL:

CAUTION

W1752T(W1752T-PFT.K***A** )

) **Same model for Service

BEFORE SERVICING THE UNIT,


READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS
SPECIFICATIONS ................................................... 2

ADJUSTMENT ...................................................... 13

PRECAUTIONS ....................................................... 4

TROUBLESHOOTING GUIDE .............................. 15

TIMING CHART ....................................................... 8


DISASSEMBLY ........................................................ 9

EXPLODED VIEW...................................................19

BLOCK DIAGRAM ................................................. 10

REPLACEMENT PARTS LIST ...............................21

DESCRIPTION OF BLOCK DIAGRAM...................11

SCHEMATIC DIAGRAM ......................................... 23

SPECIFICATIONS
1. LCD CHARACTERISTICS
Type
: TFT Color LCD Module
Active Display Area : 17 inch diagonal
Pixel Pitch
: 0.255 (H) x 0.255 (V)
Size
: 389.2(H) x 254.5(V) x 11.5(D)
Color Depth
: 16.7M colors
Electrical Interface
: LVDS
Surface Treatment
: AG(Haze 25%), Hard Coating(3H)
Operating Mode
: Normally White
Backlight Unit
: 2 CCFL

4. MAX. RESOLUTION
Analog
Digital

: 1440 x 900@75Hz
: 1440 x 900@60Hz

5. POWER SUPPLY
5-1. Power Adaptor(Built-in Power)
Input : AC 100-240V~, 50/60Hz, 0.8A
5-2. Power Consumption
MODE

2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio 5

H/V SYNC VIDEO POWER CONSUMPTION LED COLOR

POWER ON (NORMAL) ON/ON ACTIVE

less than 39 W(max)


less than 36 W(typ)

BLUE

Left : +80 min., +88(Typ) Right : -80 min., -88(Typ)


Top : +80 min., +85(Typ) Bottom : -80 min., -85(Typ)

STAND BY

OFF/ON OFF

less than 1 W

AMBER

SUSPEND

ON/OFF OFF

less than 1 W

AMBER

2-2. Luminance

DPMS OFF

OFF/OFF OFF

less than 1 W

AMBER

less than 1 W

OFF

2-3. Contrast Ratio

: 170(Typ) (Typ. 30)-sRGB


: 175(min), 250(Typ)-6500K
: 110(min)-9300K
: 500(min), 800(Typ)
DFC -> 10000 : 1 (Typ)

POWER S/W OFF

3-3. Operating Frequency


Horizontal
Vertical

: R, G, B Analog
: 0~0.7 V
: 75

: 28 ~ 83kHz
: 56 ~ 75Hz

6-1. Operating Temperature : 10C~35C (50F~95F)


6-2. Relative Humidity
: 10%~80% (Non-condensing)
6-3. MTBF
: 50,000 HRS with 90%
Confidence level
Lamp Life
: 40,000 Hours (Min)
7. DIMENSIONS (with TILT/SWIVEL)
Width
Depth
Height

: 413 mm (16.26'')
: 361 mm (14.21'')
: 202 mm (7.95'')

8. WEIGHT (with TILT/SWIVEL)


Net. Weight
Gross Weight

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. ENVIRONMENT

3. SIGNAL (Refer to the Timing Chart)


3-1. Sync Signal
Type
: Separate Sync, SOG, Digital
3-2. Video Input Signal
1) Type
2) Voltage Level
3) Input Impedance

-2-

: 2.8 kg (6.17 lbs)


: 4.04 kg (8.91 lbs)

LGE Internal Use Only

Signal Connector Pin Assignment


DVI-D Connector (Digital)

1
9
17

Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

8
16
24

Signal (DVI-D)
T. M. D. S. Data2T. M. D. S. Data2+
T. M. D. S. Data2/4 Shield
T. M. D. S. Data4T. M. D. S. Data4+
DDC Clock
DDC Data
Analog Vertical Sync.
T. M. D. S. Data1T. M. D. S. Data1+
T. M. D. S. Data1/3 Shield
T. M. D. S. Data3T. M. D. S. Data3+
+5V Power
Ground (return for +5V,

Pin
16
17
18
19
20
21
22
23
24

Signal (DVI-D)
Hot Plug Detect
T. M. D. S. Data0T. M. D. S. Data0+
T. M. D. S. Data0/5 Shield
T. M. D. S. Data5T. M. D. S. Data5+
T. M. D. S. Clock Shield
T. M. D. S. Clock+
T. M. D. S. Clock-

H. Sync. and V. Sync.)

T. M. D. S. (Transition Minimized Differential Signaling)

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-3-

LGE Internal Use Only

PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.

WARNING

There are some special components used in LCD


monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturers
specified parts to prevent electric shock, fire or other
hazard.
Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.

BE CAREFUL ELECTRIC SHOCK !


If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.

Leakage Current Hot Check Circuit


AC Volt-meter

TAKE CARE DURING HANDLING THE LCD MODULE


WITH BACKLIGHT UNIT.
Must mount the module using mounting holes arranged
in four corners.
Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.

Good Earth Ground


such as WATER PIPE,
CONDUIT etc.

To Instrument's
exposed
METALLIC PARTS

1.5 Kohm/10W

Protect the module from the ESD as it may damage the


electronic circuit (C-MOS).
Make certain that treatment persons body are
grounded through wrist band.
Do not leave the module in high temperature and in
areas of high humidity for a long time.
The module not be exposed to the direct sunlight.
Avoid contact with water as it may a short circuit within
the module.
If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)

CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-4-

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. Use with this receiver only the test fixtures specified in


this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

-5-

LGE Internal Use Only

General Soldering Guidelines


1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

-6-

LGE Internal Use Only

Circuit Board Foil Repair


Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

-7-

LGE Internal Use Only

TIMING CHART
VIDEO

A
E
D

SYNC

mode
1
2
3
4
5
6
7

8
9
10
11
12
13
14
15
16

B
C

section

polarity

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

+/ -

V(Lin es)

+/ -

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

+/ -

V(Lines)

+/ -

H(Pixels)

+/ -

V(Lines)

+/ -

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

DOT
Frequency
CLOCK [MHz] [kHz]/[Hz]

25.175
28.321
25.175
31.5
40.0
49.5
57.283
65.0
78.75
100.0
92.978
108.0
135.0
88.750
106.500
136.750

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

31.469

Total
Display Front
Sync. Back
Porch(D) (C) Porch(B) Resolution
Period (E)
(A)

800

640

16

96

48

70.09

449

350

37

60

31.468

900

720

18

108

54

70.08

449

400

12

35

31.469

800

640

16

96

48

59.94

525

480

10

33

37.5

840

640

16

64

120

75

500

480

16

37.879

1056

800

40

128

88

60.317

628

600

23

46.875

1056

800

16

80

160

75.0

625

600

21

49.725

1152

832

32

64

224

74.55

667

624

39

48.363

1344

1024

24

136

160

60.0

806

768

29

60.123

1312

1024

16

96

176

75.029

800

768

28

68.681

1456

1152

32

128

144

75.062

915

870

39

61.805

1504

1152

18

134

200

65.96

937

900

31

63.981

1688

1280

48

112

248

60.02

1066

1024

38

79.976

1688

1280

16

144

248

75.035

1066

1024

38

55.5

1600

1440

48

32

80

59.90

926

900

17

55.935

1904

1440

80

152

232

59.887

934

900

25

70.635

1936

1440

96

152

248

74.984

942

900

33

-8-

640 x
350
720 x
400
640 x
480
640 x
480
800 x
600
800 x
600
832 x
624
1024
x 768
1024
x 768
1152
x 870
1152
x 900
1280
x 1024
1280
x 1024
1440
x 900
1440x
900
1440x
900
LGE Internal Use Only

DISASSEMBLY

1. Put a cushion or soft cloth on a flat surface.


2. Place the monitor face down on the cushion or soft cloth.

3. Slide the Cable Deco Cover out from the stand body.

4.

5. Please pull the stand body lightly to separate it from the hinge body.

Press the hook,Take off the stand base from stand body.

6. Remove the screws.

7. Pull the front cover upward,then separate all the latches.

8. Place the monitor face down,then disassemble back cover.

-9 -

D-Sub

DVI-D

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Fi l t e r

EEPROM
( EDI D)

- 10 -

15V
I n v er t e r ( 2 L a m p s )

L I PS

DVI ( TMDS)

EEPROM
( EDI D)

An a l o g I ( R/ G/ B)

15V

5V

1. 8V

3. 3V

5V

Re g u l a t o r

3. 3V

OSD

EEPROM
( Sy s t e m)

SDA
/ SCL

Du a l
I nt er f ac e
En g i n e

Di s p l a y
Pr o c e s s i n g
En g i n e

1. 8V

3. 3V

1 4 . 3 1 8 MHz

Cr y s t a l

Cl o c k
Ge n e r a t o r

DRAM

Re s p o n s e
Ti me
En h a n c e me n t

LVDS
Vc c
5V

3. 3V

Fl a s h ROM

MCU

L VDS
Pa n e l
I nt er f ac e

1440x900@60Hz
106.5 Mh z

Module
KEY

TSUMU58B

BLOCK DIAGRAM

LGE Internal Use Only

DESCRIPTION OF BLOCK DIAGRAM


1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is 136MHz In W1752T.
This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1440X900(W1752T)
resolution signal and outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
15V is provided for inverter in W1752T.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC 15V to AC 700Vrms and operates back-light lamps of module in W1752T.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC , control data, Reset IC and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -

LGE Internal Use Only

LIPS Board Block Diagram

12V
50 ~ 60Hz

LINE
100 ~ 240V

EMI
COMPONENTS

INPUT RECTIFIER
AND FILTER

HVDC

SWITCHING
TRANSFORMER

100KHz

OUTPUT RECTIFIER
AND FILTER

5V
GND

PWM CONTROL
CIRCUIT

PHOTO-COUPLER
ISOLATION

PRIMARY

12V

SIGNAL
COLLENTION

SECONDARY

INVERTER CIRCUIT

High Voltage

Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.

- 12 -

ADJUSTMENT
Windows EDID V1.0 User Manual

2. EDID Read & Write


1) Run WinEDID.exe

Operating System: MS Windows 98, 2000, XP


Port Setup: Windows 98 => Doesnt need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.
1. Port Setup
a) Copy UserPort.sys file to
c:\WINNT\system32\drivers folder
b) Run Userport.exe

2) Edit Week of Manufacture, Year of Manufacture,


Serial Number
a) Input User Info Data
b) Click Update button
c) Click Write button

c) Remove all default number


d) Add 300-3FF

e) Click Start button.


f) Click Exit button.

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 13 -

LGE Internal Use Only

SERVICE OSD
1) Turn off the power switch at the right side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) CLEAR ETI : To initialize using time.
c) Auto Color : W/B balance and Automatically sets the gain and offset value.
(press key for over 3 sec)
d) AGING : Select Aging mode(on/off).
b) Module : To select applied module.
d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec)
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

A
IBM
Compatible PC

Video Signal
Generator

9
15
10
5

13

25

RS
23

2C

tu
se

PARALLEL PORT

5V

LE
L

No

RA
L

OFF

14

ON

PA

Control Line

11
6
1

Power inlet (required)

5V
4.7K
4.7K

220

PO
WE
CS
T

TO

YN

MO
NI

ON

5V
4.7K

OFF

74LS06

V-S

Power Select Switch


(110V/220V)
Power LED

VG
S

74LS06

E ST Switch

B
F V-Sync On/Off Switch
(Switch must be ON.)

Figure 1. Cable Connection


Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 14 -

LGE Internal Use Only

TROUBLESHOOTING GUIDE
1. NO POWER

NO POWER
(POWER INDICATOR OFF)

CHECK J703 VOLTAGE


PIN5, PIN6 (5V)?

CHECK POWER BOARD,


AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE

NO

YES

2
3
1

IS U601 PIN2(3.3V)
U602 PIN2(1.8V)

CHECK U601(3.3V)
U602(1.8V) LINE

NO

YES

4
1

CHECK U501 PIN97


PULSE

NO

CHECK CRYSTAL(X501)

YES
CHECK U501

Waveforms
1

J703-#5,6

U601-#2

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 15 -

U602-#2

U501-#97

LGE Internal Use Only

2. NO RASTER (OSD IS NOT DISPLAYED) LIPS

NO RASTER
(OSD IS NOT DISPLAYED)

CHECK J703
VOLTAGE PIN5,6
(5V)?

NO

CHECK POWER BOARD


(LIPS)

YES

NO

J703 PIN9 3.3V?

CHECK U501 INVERTER


ON/OFF PORT

YES

1. CONFIRM BRIGHTNESS
OSD CONTRL STATUS
2. CHECK MICOM DIM-ADJ
PORT

NO

CHECK J703
PIN10
YES

CHECK
PULSE AS
CONTACTING PROBE
TO THE LAMP
WIRE OF THE
LCD MODULE

NO
POWER BOARD (LIPS)

Waveforms

YES
1

J703-#5,6

J703-#9

J703-#10 (Brightness 0)

LAMP CURRENT

REPLACE LCD MODULE

J703-#10 (Brightness 100)

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 16 -

LGE Internal Use Only

3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN

NO RASTER
(OSD IS NOT DISPLAYED)

CHECK U501
PIN32(3.3V)
PIN34(1.8V)

NO

CHECK U601(3.3V),
U602(1.8V)

YES

U501
PIN 96,97
14.3MHZ?

NO

1. CHECK PIN 96,97


SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U501

YES

CHECK U501
PIN27(H-SYNC) AND
PIN28(V-SYNC).
IS PULSE APPEARED AT
SIGNAL PINS?

NO

CHECK CONNECTION LINE


FROM D-SUB TO U501

YES
TROUBLE IN CABLE
OR LCD MODULE

Waveforms
1

U501-#96

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 17 -

LGE Internal Use Only

4. TROUBLE IN DPM

TROUBLE IN DPM

NO

CHECK R730 AND


R731, SYNC
APPEARED?

CHECK PC
PC IS GOING
INTO DPM MODE

YES

1
2

CHECK
U501 PIN 37,28
SYNC PULSE

NO
CHECK H/V SYNC LINE

YES

TROUBLE IN U501

Waveforms
1

H-SYNC

V-SYNC

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 18 -

LGE Internal Use Only

930

920
910
420

410

510

500

900

400

300

200

430
Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

EXPLODED VIEW PARTS LIST


Ref. No.

200

300

400

Part No.

EAJ38936201
EAJ39167201

Description

LM171WX3-TLA1 WXGA 17.1INCH 1280X720 250CD COLOR 60% 16/10 800:1 LPL 17"W
response time :8ms,P4,Color Depth:16.7M. Viewing Angle:160/160 LG PHILIPS LCD
HSD170MGW1-B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W ZBD,
2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. HANNSTAR DISPLAY CORPORATION

ABJ35701501

Cabinet Assembly,W1752T . 17" W1752T Cabinet Assy(BK)

ABJ35701502

Cabinet Assembly,W1752T . 17" W1752T Cabinet Assy(BK) CKD Assy

ACQ35701803 Cover Assembly,W1752T . 17" W1752T Back Cover Assy(White) CKD


ACQ35701804 Cover Assembly,W1752T . 17" W1752T Back Cover Assy ( Black ) CKD

410

AGF35751207 Package Assembly,MAIN W52 series Mstar AGF35751210 Package Assembly,MAIN W52 series Mstar -

420

430

MGJ41204401 Plate,Metal,PRESS SBHG 0.8 SUPPORTER EGI W1752T Support Metal


MGJ41204402 Plate,Metal,PRESS SBHG 0.8 SUPPORTER EGI W1752T Support Metal CKD
MGJ41204201 Plate,Shield,PRESS SPTE 0.3 SHIELD SPTE W1752T LampWire Shield(SPTE 0.3t)
MGJ41204202 Plate,Shield,PRESS SPTE 0.3 SHIELD SPTE W1752T LampWire Shield(SPTE 0.3t) CKD

500

EBR42021801

PCB Assembly,LED & P/SW T.T LM84 W52 series - -

510

EBR41684101

PCB Assembly,CONTROL T.T LM84A W52 series RD -

900

910

920

930

ACQ33707104 Cover Assembly,L177WS/WSB LM57B 19" Cover, Hinge Assy, Normal Stand, L177W ND Local
ACQ33707110 Cover Assembly,L177WS/WSB LM57B 19" Cover, Hinge Assy, Normal Stand, L177W ND Local
MCK41193001 Cover,MOLD ABS L1755/WX52 ABS HF 350, Stand Body(L1755/WX52)
MCK41193002 Cover,MOLD ABS L1755/WX52 ABS HF 350, Stand Body(L1755/WX52) ABS HF350 05941"01"CKD
MCK41193101 Cover,MOLD ABS L1755/WX52 ABS HF 350, Cover Cable
MCK41193102 Cover,MOLD ABS L1755/WX52 ABS HF 350, Cover Cable ABS HF350 05941 "01"CKD
ACQ35700801 Cover Assembly,L1755/W1752 . 17" L1755/W1752 Base Assy
ACQ35700802 Cover Assembly,L1755/W1752 . 17" L1755/W1752 Base Assy "01"-CKD

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 20 -

LGE Internal Use Only

REPLACEMENT PARTS LIST


DATE:2007.12.10
LOC NO.

CAPACITORs
C501
C502
C503
C504
C505
C506
C507
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
C518
C519
C520
C521
C522
C523
C524
C525
C526
C527
C601
C602
C603
C604
C605
C702
C703
C704
C705
C706
C707
C708
C709
C710
C711
C712
C713
C714
C715
C716
C718
C719
C720
C721
C722
C723

PART NO.

DESCRIPTION/SPECIFICATON

0CK104CK56A
0CK473CK56A
0CK473CK56A
0CK473CK56A
0CK473CK56A
0CC102CK41A
0CK473CK56A
0CK473CK56A
0CC270CK41A
0CC270CK41A
0CK104CK56A
0CE106CF638
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CE107EF610
0CK103CK51A
0CK475CC94A
0CE107EF610
0CE227EF638
0CK103CK51A
0CK103CK51A
0CK104CK56A
0CK105CD56A
0CC101CK41A
0CC101CK41A
0CC101CK41A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CC680CK41A
0CC680CK41A
0CC680CK41A
0CC680CK41A

Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608C0G1H102JT 1nF
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608C0G1H270JT 27pF
Capacitor,Ceramic,Chip,C1608C0G1H270JT 27pF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,AL,Radial,KMG16VB100M 100uF 20
Capacitor,Ceramic,Chip,0603B103K500CT 10nF
Capacitor,Ceramic,Chip,C1608Y5V0J475ZT 4.7u
Capacitor,AL,Radial,KMG16VB100M 100uF 20
Capacitor,AL,Radial,KMG5.0TP16VB220M 220
Capacitor,Ceramic,Chip,0603B103K500CT 10nF
Capacitor,Ceramic,Chip,0603B103K500CT 10nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,C1608X7R1A105KT 1uF
Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p
Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p
Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF
Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF
Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF
Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF

0DSIH00018A
0DSIH00018A
0DSIH00018A
0DSIH00018A
0DSIH00018A
0DSIH00018A
0DSIH00018A
0DSIH00018A
0DD184009AA
0DSIH00018A

Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode Assembly,KDS184 KDS184 TP KEC
Diode,Switching,ENKMC2837-T112 1.2V

DIODEs
D702
D703
D704
D705
D706
D707
D708
D709
D710
D711

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LOC NO.

D712
D713
D715
ZD10
ZD701
ZD702
ZD704
ZD705
ZD706
ZD707
ZD709
ZD710
ZD9

PART NO.

DESCRIPTION/SPECIFICATON

0DSIH00018A
0DSIH00018A
0DSON00138A
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB

Diode,Switching,ENKMC2837-T112 1.2V
Diode,Switching,ENKMC2837-T112 1.2V
Diode,Schottky,MMBD301LT1G 600MV 30
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V
Diode,Zener,BZT52C5V6S-(F) 5.6V

EAN39545901
EAN37157001
0IMMR00203A
0IPMGA0010A
0IPMG00049A
0IMMR00014A

IC,Protocol Controller,TSUMU58BWHL-LF -0.3T


IC,Serial Flash Memory,W25X20VSNIG 2MBIT 25
IC,EEPROM,FM24C08 8KBIT 1KX8BI
IC,LDO Voltage Regulator,AZ1117H-3.3 4.75TO10
IC,LDO Voltage Regulator,AZ1117H-1.8TR/E1[H13
IC,EEPROM,M24C02-RMN6TP 2KBIT

ICs
U501
U502
U503
U601
U602
U603

TRANSISTORs
Q501
Q601
Q602
Q701
Q702

0TRKE80046A
0TRKE80046A
EBK39150701
0TR390609DC
0TR390609DC

TR,Bipolar,2N3904S NPN 6V 60V 4


TR,Bipolar,2N3904S NPN 6V 60V 4
TR,Bipolar,KTA1241 PNP -8V -35V
TR,Bipolar,2N3906S-RTK PNP -5V
TR,Bipolar,2N3906S-RTK PNP -5V

0RJ1602D677
0RJ1602D677
0RJ1801D677
0RJ1801D677
0RJ2201D677
0RJ0562D677
0RJ0562D677
0RJ0562D677
0RJ0562D677
0RJ1001D677
0RJ0562D677
0RJ0562D677
0RJ1002D677
0RJ3900D677
0RJ4700D677
0RJ2002D677
0RJ1002D677
0RJ1002D677
0RJ1002D677
0RJ1002D677
0RJ4701D677
0RJ4701D677
0RJ1000D677
0RJ4701D677
0RJ0332D677
0RJ0332D677
0RJ4701D677
0RJ0000D677
0RJ0000D677
0RJ4700D677
0RJ4701D677
0RJ2201D677
0RJ3601D677
0RJ3900D677
0RJ3900D677
0RJ1002D677

Resistor,Chip,MCR03EZPJ163 16KOHM
Resistor,Chip,MCR03EZPJ163 16KOHM
Resistor,Chip,MCR03EZPJ182 1.8KOHM
Resistor,Chip,MCR03EZPJ182 1.8KOHM
Resistor,Chip,MCR03EZPJ222 2.2KOHM
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ102 1KOHM 5
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ391 390OHM
Resistor,Chip,MCR03EZPJ471 470OHM
Resistor,Chip,MCR03EZPJ203. 20KOHM
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ101 100OHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ330 33OHM 5
Resistor,Chip,MCR03EZPJ330 33OHM 5
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Chip,MCR03EZPJ471 470OHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ222 2.2KOHM
Resistor,Chip,MCR03EZPJ362 3.6KOHM
Resistor,Chip,MCR03EZPJ391 390OHM
Resistor,Chip,MCR03EZPJ391 390OHM
Resistor,Chip,MCR03EZPJ103 10KOHM

RESISTORs
R1
R2
R3
R4
R5
R501
R502
R503
R504
R505
R506
R507
R508
R509
R510
R511
R512
R513
R514
R515
R516
R517
R518
R519
R520
R521
R522
R524
R525
R527
R528
R6
R601
R602
R603
R604

- 21 -

LGE Internal Use Only

LOC NO.

R605
R606
R607
R608
R701
R702
R703
R704
R705
R706
R707
R708
R709
R710
R711
R712
R713
R714
R715
R716
R717
R718
R719
R720
R721
R722
R723
R724
R725
R726
R727
R728
R729
R730
R731
R732
R733
R734
R736
R738
R8

PART NO.

DESCRIPTION/SPECIFICATON

0RX0681K668
0RJ0000D677
0RH1002D622
0RJ1002D677
0RJ0000D677
0RJ4701D677
0RJ4701D677
0RJ0472D677
0RJ0752D677
0RJ1000D677
0RJ1000D677
0RJ1000D677
0RJ2001D677
0RJ4701D677
0RJ4701D677
0RJ0000D677
0RJ0122D677
0RJ0122D677
0RJ0122D677
0RJ0122D677
0RJ0122D677
0RJ0122D677
0RJ0222D677
0RJ0222D677
0RJ4700D677
0RJ4701D677
0RJ4701D677
0RJ0332D677
0RJ0332D677
0RJ4701D677
0RJ4701D677
0RJ0332D677
0RJ0000D677
0RJ0682D677
0RJ0682D677
0RJ0332D677
0RJ0752D677
0RJ0752D677
0RJ0752D677
0RJ4701D677
0RJ2701D677

Resistor,Metal Oxide Film,RSD02F36R80J 6.8OHM


Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Chip,MCR10EZHJ103 10KOHM
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ470 47OHM 5
Resistor,Chip,MCR03EZPJ750 75OHM 5
Resistor,Chip,MCR03EZPJ101 100OHM
Resistor,Chip,MCR03EZPJ101 100OHM
Resistor,Chip,MCR03EZPJ101 100OHM
Resistor,Chip,MCR03EZPJ202 2KOHM 5
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Chip,MCR03EZPJ120 12OHM 5
Resistor,Chip,MCR03EZPJ120 12OHM 5
Resistor,Chip,MCR03EZPJ120 12OHM 5
Resistor,Chip,MCR03EZPJ120 12OHM 5
Resistor,Chip,MCR03EZPJ120 12OHM 5
Resistor,Chip,MCR03EZPJ120 12OHM 5
Resistor,Chip,MCR03EZPJ220 22OHM 5
Resistor,Chip,MCR03EZPJ220 22OHM 5
Resistor,Chip,MCR03EZPJ471 470OHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ330 33OHM 5
Resistor,Chip,MCR03EZPJ330 33OHM 5
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ330 33OHM 5
Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Chip,MCR03EZPJ680 68OHM 5
Resistor,Chip,MCR03EZPJ680 68OHM 5
Resistor,Chip,MCR03EZPJ330 33OHM 5
Resistor,Chip,MCR03EZPJ750 75OHM 5
Resistor,Chip,MCR03EZPJ750 75OHM 5
Resistor,Chip,MCR03EZPJ750 75OHM 5
Resistor,Chip,MCR03EZPJ472 4.7KOHM
Resistor,Chip,MCR03EZPJ272 2.7KOHM

LOC NO.

PART NO.

DESCRIPTION/SPECIFICATON

CONNECTORs
J701
J703
J704
J706
J707
P1
P2
P3

6630G100316
6630V90220K
6630V90220E
6630TGA005B
EAG37060101
6602T12005E
6602T12005C
6602T12005C

Connector,DSUB,DZ11AA1-HVG-PF D-SUB
Connector,Wafer,TJC2004-11A 11P 2.0M
Connector,Wafer,TJC2004-6A 6P 2.0MM
Connector,DSUB,QH11121-DN0-D DVI 24
Connector,FFC/FPC/PIC,10031HR-30 30P 1.00M
Connector,Wafer,12505WR-06A00 6P 1.2
Connector,Wafer,12505WR-04A00 4P 1.2
Connector,Wafer,12505WR-04A00 4P 1.2

EBF37991701
EBF37991701
EBF37991701
EBF37991701
EBF37991701
EBF37991701
6600R000133

Switch,Tact,KMB-903/TMB-901 1C1P
Switch,Tact,KMB-903/TMB-901 1C1P
Switch,Tact,KMB-903/TMB-901 1C1P
Switch,Tact,KMB-903/TMB-901 1C1P
Switch,Tact,KMB-903/TMB-901 1C1P
Switch,Tact,KMB-903/TMB-901 1C1P
Switch,Tact,JTP1280A6 1C1P 12VDC

0DLGP0128AA
6212AA2001G

LED,Chip,GPTD1210YBC BLUE/YEL
Crystal,HLX-U-F-14.31818M-18

SWTICHs
SW1
SW2
SW3
SW4
SW5
SW6
SW7

OTHERs
LD2
X501

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 22 -

LGE Internal Use Only

SCHEMATIC DIAGRAM
1. SCALER

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 23 -

LGE Internal Use Only

2. POWER & WAFER

Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 24 -

LGE Internal Use Only

3. CONTROL

LED
Copyright
2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 25 -

LGE Internal Use Only

P/NO : MFL30290861

Nov. 2007
Printed in China

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