Professional Documents
Culture Documents
1. Product profile
1.1 General description
Ultrafast dual epitaxial rectifier diode in a SOT404 (D2PAK) surface-mountable plastic
package.
Surface-mountable package
1.3 Applications
Output rectifiers in high-frequency
switched-mode power supplies
Quick reference
Symbol
Parameter
VRRM
IO(AV)
IRRM
VESD
Conditions
Min
Typ
Max
Unit
200
20
0.2
kV
20
25
ns
IR = 1 A; IF = 0.5 A; Tj = 25 C; measured
at reverse current = 0.25 A; step
recovery; see Figure 6
10
20
ns
0.72
0.85
Dynamic characteristics
trr
Static characteristics
VF
forward voltage
BYV32EB-200
NXP Semiconductors
2. Pinning information
Table 2.
Pinning information
Pin
Symbol
Description
A1
anode 1
cathode
A2
anode 2
mb
Simplified outline
Graphic symbol
mb
[1]
A1
A2
K
sym125
2
1
SOT404
(D2PAK)
[1]
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
BYV32EB-200
D2PAK
plastic single-ended surface-mounted package (D2PAK); 3 leads (one
lead cropped)
BYV32EB-200_4
Version
SOT404
2 of 9
BYV32EB-200
NXP Semiconductors
4. Limiting values
Table 4.
Limiting values
Parameter
VRRM
Conditions
Min
Max
Unit
200
VRWM
200
VR
reverse voltage
DC
200
IO(AV)
20
IFRM
20
IFSM
non-repetitive peak
forward current
137
125
IRRM
= 0.001; tp = 2 s
0.2
IRSM
non-repetitive peak
reverse current
tp = 100 s
0.2
Tstg
storage temperature
-40
150
Tj
junction temperature
150
VESD
electrostatic discharge
voltage
kV
003aac978
12
=1
a = 1.57
Ptot
(W)
003aac979
15
Ptot
(W)
1.9
0.5
2.2
10
2.8
0.2
4.0
0.1
0
0
12
IF(AV) (A)
Fig 1.
Fig 2.
10
IF(AV) (A)
15
BYV32EB-200_4
3 of 9
BYV32EB-200
NXP Semiconductors
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-mb)
Rth(j-a)
Conditions
Min
Typ
Max
Unit
1.6
K/W
2.4
K/W
50
K/W
003aac980
10
Zth(j-mb)
(K/W)
1
101
tp
T
102
t
tp
103
106
Fig 3.
105
104
103
102
101
1
10
tp (s)
Transient thermal impedance from junction to mounting base as a function of pulse width
6. Characteristics
Table 6.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
0.72
0.85
IF = 20 A; Tj = 25 C
1.15
VR = 200 V; Tj = 25 C
30
VR = 200 V; Tj = 100 C
0.2
0.6
mA
Static characteristics
VF
IR
forward voltage
reverse current
Dynamic characteristics
Qr
recovered charge
IF = 2 A; VR = 30 V; dIF/dt = 20 A/s
12.5
nC
trr
20
25
ns
10
20
ns
VFR
forward recovery
voltage
BYV32EB-200_4
4 of 9
BYV32EB-200
NXP Semiconductors
003aac981
32
dlF
IF
dt
IF
(A)
24
trr
(1)
16
(2)
time
(3)
25 %
100 %
Qr
8
IRM
IR
003aac562
0
0
0.4
0.8
1.2
1.6
Fig 5.
VF (V)
Fig 4.
IF
IF
trr
time
time
0.25 x IR
VF
Qr
VFRM
IR
IR
VF
003aac563
time
Fig 6.
001aab912
Fig 7.
BYV32EB-200_4
5 of 9
BYV32EB-200
NXP Semiconductors
7. Package outline
SOT404
A
A1
mounting
base
D1
HD
2
Lp
3
c
b
e
2.5
5 mm
scale
A1
D
max.
D1
Lp
HD
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60
1.20
10.30
9.70
2.54
2.90
2.10
15.80
14.80
2.60
2.20
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
05-02-11
06-03-16
SOT404
Fig 8.
EUROPEAN
PROJECTION
BYV32EB-200_4
6 of 9
BYV32EB-200
NXP Semiconductors
8. Revision history
Table 7.
Revision history
Document ID
Release date
Change notice
Supersedes
BYV32EB-200_4
20090302
BYV32E_SERIES_3
Modifications:
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Package outline updated.
Type number BYV32EB-200 separated from data sheet BYV32E_SERIES_3
BYV32E_SERIES_3
20010301
Product specification
BYV32E_SERIES_2
BYV32E_SERIES_2
19980701
Product specification
BYV32EB_SERIES_1
BYV32EB_SERIES_1
19960801
Product specification
BYV32EB-200_4
7 of 9
BYV32EB-200
NXP Semiconductors
9. Legal information
9.1
Product status[3]
Definition
Development
This document contains data from the objective specification for product development.
Qualification
Production
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3
Disclaimers
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
BYV32EB-200_4
8 of 9
BYV32EB-200
NXP Semiconductors
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .7
Legal information. . . . . . . . . . . . . . . . . . . . . . . . .8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Contact information. . . . . . . . . . . . . . . . . . . . . . .8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.