Professional Documents
Culture Documents
DIGITAL TV TUNER IC
FEATURES
APPLICATIONS
Digital TVs
Digital CATVs
Set-Top Boxes
DBT PACKAGE
(TOP VIEW)
VLO OSC B
44
VLO OSC C
VHI OSC B
VHI OSC C
OSC GND
UHF OSC B1
UHF OSC C1
UHF OSC C2
UHF OSC B2
IF GND
IF OUT1
IF OUT2
CP
VTU
VCC
43
42
41
40
39
38
37
36
10
35
11
34
12
33
13
32
14
31
15
30
IF GCA IN1
IF GCA IN2
IF GCA CTRL
IF GCA GND
IF GCA OUT2
IF GCA OUT1
P5/ADC
16
29
17
28
18
27
19
26
20
25
21
24
22
23
BS4
UHF RF IN1
UHF RF IN2
VHI RF IN
VLO RF IN
RF GND
MIXOUT2
MIXOUT1
IF IN2
IF IN1
RF AGC OUT
RF AGC FIL
BS3
BS2
BS1
SDA
SCL
AS
BUS GND
XTAL OUT
XTAL2
XTAL1
DESCRIPTION
The SN761668 is a low-phase-noise synthesized tuner IC designed for digital TV tuning systems. The circuit
consists of a PLL synthesizer, three-band local oscillator and mixer, RF AGC detector circuit, and IF
gain-controlled amplifier. The SN761668 is available in a small-outline package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
VHF-L
Oscillator
VHF-H
Oscillator
IF IN2
IF IN1
MIX OUT1
MIX OUT2
UHF OSC C2
UHF OSC B2
UHF OSC B1
UHF OSC C1
VHI OSC C
VHI OSC B
OSC GND
VLO OSC C
VLO OSC B
IF
Amplifier
UHF
Oscillator
IF OUT1
IF OUT2
IF GND
VLO RF IN
VHF-L
Mixer
VHF-H
Mixer
UHF
Mixer
RF AGC FIL
RF
AGC
Detect
VHI RF IN
RF AGC OUT
UHF RF IN1
UHF RF IN2
CP
Programmable
Divider
RF GND
XTAL1
XTAL2
VTU
Operational
Amplifier
XTAL
Oscillator
128/80/64/50/
28/24 Div
Phase
Detector
Charge
Pump
VCC
XTAL OUT
NPN Band-Switch Port
SCL
SDA
I C Bus
Interface
IF
GCA
IF GCA OUT2
AS
IF GCA GND
IF GCA CTRL
IF GCA IN1
IF GCA IN2
BS1
BS2
BS3
BS4
5-Level
ADC
P5/ADC
BUS GND
IF GCA OUT1
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
TERMINAL FUNCTIONS
TERMINAL
NAME
DESCRIPTION
NO.
SCHEMATIC
AS
27
Figure 1
BS1
30
Band-switch 1 output
Figure 2
BS2
31
Band-switch 2 output
Figure 2
BS3
32
Band-switch 3 output
Figure 2
BS4
44
Band-switch 4 output
Figure 2
BUS GND
26
BUS ground
CP
13
Charge-pump output
Figure 3
IF GCA CTRL
18
Figure 4
IF GCA GND
19
IF GCA ground
IF GCA IN1
16
IF GCA input 1
Figure 5
IF GCA IN2
17
IF GCA input 2
Figure 5
IF GCA OUT1
21
IF GCA output 1
Figure 6
IF GCA OUT2
20
IF GCA output 2
Figure 6
IF GND
10
IF ground
IF IN1
35
IF amplifier input 1
Figure 7
IF IN2
36
IF amplifier input 2
Figure 7
IF OUT1
11
IF amplifier output 1
Figure 8
IF OUT2
12
IF amplifier output 2
Figure 8
MIXOUT1
37
Mixer output 1
Figure 9
MIXOUT2
38
Mixer output 2
Figure 9
OSC GND
Oscillator ground
P5/ADC
22
Figure 10
RF AGC FIL
33
Figure 11
RF AGC OUT
34
RF AGC output
Figure 12
RF GND
39
RF ground
SCL
28
Figure 13
SDA
29
Figure 14
UHF OSC B1
Figure 15
UHF OSC B2
Figure 15
UHF OSC C1
Figure 15
UHF OSC C2
Figure 15
UHF RF IN1
43
UHF RF input 1
Figure 16
UHF RF IN2
42
UHF RF input 2
Figure 16
VCC
15
VHI OSC B
Figure 17
VHI OSC C
Figure 17
VHI RF IN
41
VHF-H RF input
Figure 18
VLO OSC B
Figure 19
VLO OSC C
Figure 19
VLO RF IN
40
VHF-L RF input
Figure 20
VTU
14
Figure 3
XTAL1
23
Figure 21
XTAL2
24
Figure 21
XTALOUT
25
Figure 22
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
3 kW
27
30
10 W
31
32
50 kW
Figure 1. AS
44
14
4 kW
18
100 kW
13
Vbias
1 kW
1 kW
16
17
15 W
20
21
35
20 W
11
12
36
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
37
38
25 W
50 W
22
55 W
25 W
25 kW
34
33
20 pF
1 kW
25 W
28
42
8
6
3 kW
1 kW
29
43
3 kW
Figure 15. UHF OSC B1, UHF OSC B2, UHF OSC C1, and
UHF OSC C2
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
41
3 kW
3 kW
3 kW
40
3 kW
3 kW
3 kW
24
23
20 W
10 W
25 W
25
50 kW
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
MAX
VCC
(2)
VCC
0.4
6.5
VGND
(2)
0.4
0.4
VTU
(2)
VTU
0.4
35
VIN
(2)
Other pins
0.4
6.5
PD
TA
20
85
Tstg
65
150
TJ
150
tSC(max)
10
(1)
(2)
(3)
(3)
TA 25C
1438
UNIT
V
mW
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Voltage values are with respect to the IF GND of the circuit.
Derating factor is 11.5 mW/C for TA 25C.
Supply voltage
VTU
4.5
IBS
IP5
P5/ADC
TA
20
NOM
MAX
UNIT
5.5
30
33
10
mA
mA
85
xxx
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
IF IN1, IF IN2, MIXOUT1, and MIXOUT2 (pins 3538) withstand 1.5 kV, and all other pins withstand 2 kV, according to the
Human-Body Model (1.5 k, 100 pF).
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS
Total Device and Serial Interface
VCC = 4.5 V to 5.5 V, TA = 20C to 85C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
115
140
mA
125
150
mA
ICC1
Supply current 1
ICC2
Supply current 2
ICC-STBY
STBY = 1
VIH
VIL
1.35
IIH
10
IIL
10
VPOR
2.1
mA
2.5
A
2.8
3.5
I2C Interface
VASH
VCC = 5 V
4.5
VASM1
VCC = 5 V
VASM2
VCC = 5 V
1.5
VASL
VCC = 5 V
IASH
IASL
VADC
See Table 10
IADH
VADC = VCC
IADL
VADC = 0 V
VOL
VCC = 5 V, IOL = 3 mA
0.4
lSDAH
VSDA = 5.5 V
10
fSCL
400
kHz
tHD-DAT
0.9
tBUF
1.3
tHD-STA
0.6
tLOW
1.3
tHIGH
0.6
tSU-STA
0.6
tSU-DAT
0.1
tr
0.3
tf
0.3
tSU-STO
0.5
50
A
A
10
0
0.6
10
A
A
10
100
See Figure 23
VCC
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
TEST CONDITIONS
Divider ratio
fXTAL
RXTAL = 25 to 300
ZXTAL
VCC = 5 V, TA = 25C
VXLO
VVTUL
RL = 22 k, VTU = 33 V
IVTUOFF
MIN
TYP
512
4
1.6
0.2
0.4
Vp-p
0.3
CP[1:0] = 11
600
CP[1:0] = 10
350
CP[1:0] = 01
140
ICP00
CP[1:0] = 00
VCP
PLL locked
ICPOFF
VCP = 2 V, TA = 25C
IBS
VBS1
VBS2
IBSOFF
IP5
VP5ON
MHz
k
ICP10
ICP01
UNIT
2.4
ICP11
Charge-pump current
MAX
32767
0.46
10
70
1.95
15
IBS = 10 mA
V
15
nA
10
mA
3.5
3.7
8
mA
0.6
VBS = 0 V
RF AGC
VCC = 5 V, TA = 25C, measured in Figure 24 reference measurement circuit at 50- system, IF = 44 MHz,
IF filter characteristics: fpeak = 44 MHz (unless otherwise noted)
PARAMETER
IOAGC0
TEST CONDITIONS
TYP
UNIT
ATC = 0
300
nA
ATC = 1
15
ATC = 0
100
VAGCSP00
117
VAGCSP01
114
VAGCSP02
111
VAGCSP03
108
VAGCSP04
105
VAGCSP05
102
VAGCSP06
99
112
VAGCSP11
109
VAGCSP12
106
VAGCSP13
103
VAGCSP14
100
VAGCSP15
97
VAGCSP16
94
IOAGC1
IOAGCSINK
VAGCSP10
(1)
dBV
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
TEST CONDITIONS
Gc3
Gc4
Gc6
Gc7
Gc9
NF1
NF3
NF4
NF6
NF7
NF9
CM1
CM3
CM4
CM6
CM7
CM9
VIFO1
TYP
35
35
35
(1)
35
35
35
fin = 57 MHz
12
12
79
79
79
77
77
79
fin = 57 MHz
117
117
117
117
117
117
PLVL11
90
PLVL12
95
(5)
85
VIFO3
VIFO4
VIFO6
VIFO7
VIFO9
PLVL31
PLVL32
95
PLVL41
85
PLVL42
(4)
90
77
PLVL62
90
PLVL71
80
PLVL61
PLVL72
PLVL91
PLVL92
(1)
(2)
(3)
(4)
(5)
10
(4)
85
77
90
UNIT
dB
dB
dB
dB
dB
dB
dBV
dBV
dBV
dBV
dBV
dBV
dBc/Hz
dBc/Hz
dBc/Hz
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
TEST CONDITIONS
MIN
TYP
MAX
30
60
UNIT
A
2.5
VCC
0.4
53
57
dB
dB
IIFGCA
VIFGCA = 3 V
VIFGCAMAX
Gain maximum
VIFGCAMIN
Gain minimum
GIFGCAMAX
Maximum gain
VIFGCA = 3 V
49
GIFGCAMIN
Minimum gain
VIFGCA = 0 V
GCRIFGCA
VIFGCA = 0 V to 3 V
54
dB
VIFGCAOUT
Output voltage
Single-ended output
2.1
Vp-p
NFIFGCA
Noise figure
VIFGCA = 3 V
8.5
dB
IM3IFGCA
fIFGCAIN1 = 43 MHz,
fIFGCAIIN2 = 44 MHz,
VIFGCAOUT = 2 dBm,
VIFGCA = 3 V
50
dBc
IIP3IFGCA
VIFGCA = 0 V
11
dBm
RIFGCAIN
RIFGCAOUT
19
11
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
FUNCTIONAL DESCRIPTION
I2C Bus Mode
I2C Write Mode (R/W = 0)
Table 1. Write Data Format
MSB
LSB
(1)
MA1
MA0
R/W = 0
N14
N13
N12
N11
N10
N9
N8
N7
N6
N5
N4
N3
N2
N1
N0
ATP2
ATP1
ATP0
RS2
RS1
RS0
CP1
CP0
AISL
P5
BS4
BS3
BS2
BS1
ATC
STBY
T3
T2
T1/ATSS
T0/XLO
A: Acknowledge
DESCRIPTION
MA[1:0]
N[14:0]
14
DEFAULT
N14 = N13 = N12 = ... = N0 = 0
+ N13 2
13
+ ... + N1 2 + N0
ATP[2:0]
ATP[2:0] = 011
RS[2:0]
RS[2:0] = 111
CP[1:0]
CP[1:0] = 11
AISL
AISL = 0
AISL = 0: IF amplifier
AISL = 1: Mixer output
P5
P5 = 0
P5 = 0: ADC INPUT
P5 = 1: Tr = ON
BS[4:1]
BSn = 0
BSn = 0: Tr = OFF
BSn = 1: Tr = ON
Band selection by BS[1:2]
ATC
BS1
BS2
1
0
0
1
0
1
0
1
VHF-LO
VHF-HI
UHF
Reserved
ATC = 0
STBY = 0
TEST bits, RFAGC shift bit, XTALOUT control bit (see Table 7)
Don't care
12
T[3:0] = 0010
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
MA0
(1)
T1/ATSS
ATP2
ATP1
ATP0
117
114
111
108
105
102
99
Disabled
112
109
106
103
100
97
94
Disabled
When AISL = 1, RF AGC function is not available at VHF-L band (output level is undefined).
RS1
RS0
24
28
50
64
128
80
CP0
70
140
350
600
13
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
(1)
(1)
XTALOUT
4-MHz OUTPUT
T3
T2
T1/ATSS
T0/XLO
DEVICE OPERATION
Normal operation
Enabled
Normal operation
Disabled
Test mode
Not available
Test mode
Not available
LSB
MA1
MA0
R/W = 1
POR
FL
A2
A1
A0
DESCRIPTION
MA[1:0]
POR
Power-on-reset flag
DEFAULT
POR = 1
In-lock flag
A[2:0]
14
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
(1)
A2
A1
A0
0 V to 0.15 VCC
t(High)
tr
t(Low)
SCL
thd(STA)
tsu(DAT)
tf
tsu(STA)
thd(DAT )
tsu(STO)
SDA
t(BUF)
15
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
C4
R1
C1
VC1
C3
C37
R30
VLO OSC B
BS4
44
C2
L1
2
C5
R7
BS4
C35
VLO OSC C
UHF RF IN1
43
UHF RF IN1
C40
R31
VC2
VC4
C11
R2
VHI OSC B
UHF RF IN2
VHI OSC C
VHI RF IN
R16
42
41
C33
VHI RF IN
L2
C6
C34
C7
R32
VC3
L4
C15
R4
C8
VLO RF IN
UHF OSC B1
RF GND
UHF OSC C1
MIXOUT2
UHF OSC C2
MIXOUT1
UHF OSC B2
IF IN2
IF GND
IF IN1
40
C9
R33
R3
R18
VLO RF IN
R19
39
C31
38
L6
L3
C30
8
C12
R5
OSC GND
C32
37
L5
R14
36
C10
10
C36
(See Note A)
C13
R22
11
IF OUT1
IF OUT1
RF AGC OUT
C28
34
R15
RF AGC OUT
C29
C14
R21
12
C18
IF OUT2
RF AGC FIL
33
C17
13
R6
R8
35
14
VTU
CP
BS3
VTU
BS2
VCC
BS1
IF GCA IN1
SDA
IF GCA IN2
SCL
32
BS3
31
BS2
C20
C16
VCC
C19
15
30
C38
16
IF GCA IN1
C42
17
29
BS1
R13
C27
28
R12
C26
C43
18
IF GCA CTRL
IF GCA CTRL
AS
27
SDA
SCL
R11
AS
C25
C44
19
R24
C45 20
R25
C46 21
IF GCA OUT1
C21
P5/ADC
IF GCA GND
BUS GND
IF GCA OUT2
XTAL OUT
26
25
XTALOUT
C39
IF GCA OUT1
XTAL2
P5/ADC
XTAL1
R10
C24
C23
24
X1
22
23
C22
R9
A.
To prevent abnormal oscillation, connect C36, which does not affect a PLL.
B.
This application information is advisory, and a performance check is required for actual application circuits. TI
assumes no responsibility for the consequences of the use of this circuit, nor for any infringement of patent or patent
rights of third parties that may result from its use.
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
VALUE
PART NAME
VALUE
C1 (VLO OSC B)
1 pF
2.2 nF
C2 (VLO OSC C)
2 pF
2.2 nF
C3 (VLO OSC)
47 pF
2.2 nF
C4 (VLO OSC)
Open
2.2 nF
C5 (VHI OSC)
7 pF
L1 (VLO OSC)
C6 (VHI OSC C)
5 pF
L2 (VHI OSC)
1.5 pF
L3 (UHF OSC)
1 pF
L4 (UHF OSC)
1 pF
L5 (MIXOUT)
680 nH (LK1608R68K-T)
1.5 pF
L6 (MIXOUT)
680 nH (LK1608R68K-T)
51 pF
R1 (VLO OSC)
3.3 k
10 pF
R2 (VHI OSC)
3.3 k
2.2 nF
R3 (UHF OSC)
2.2 k
2.2 nF
R4 (UHF OSC)
1 k
100 pF
R5 (VTU)
3 k
C16 (VCC)
4.7 nF
R6 (CP)
47 k
C17 (CP)
0.01 F/50 V
R7 (VHI OSC)
3.3 k
C18 (CP)
22 pF/50 V
R8 (VTU)
20 k
C19 (VCC)
2.2 nF
R9 (P5/ADC)
Open
C20 (VTU)
2.2 nF/50 V
R10 (XTALOUT)
5.1 k
C21 (P5/ADC)
Open
R11 (AS)
330
C22 (XTAL)
27 pF
R12 (SCL)
330
C23 (XTAL)
27 pF
R13 (SDA)
330
C24 (XTALOUT)
10 pF
R14 (VCC)
C25 (AS)
22 pF
C26 (SCL)
Open
(50 )
C27 (SDA)
Open
(50 )
1 nF
(50 )
0.15 F
1 k
C30 (MIXOUT)
4 pF
1 k
C31 (MIXOUT)
2.2 nF
250
2.2 nF
200
2.2 nF
0.5 pF
4.7
2.2 nF
C36 (VTU)
22 pF
C37 (VTU)
2.2 nF/50 V
MA2S374
C38 (VCC)
0.1 F
MA2S374
C39 (XTALOUT)
2.2 nF
MA2S372
2.2 nF
MA2S372
2.2 nF
X1
4-MHz crystal
17
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
SG
50 W
50 W
VIN
IF OUT1
VLO RF IN1
(VHI RF IN)
Spectrum
Analyzer
VOUT Diff 1 kW
VOUT
IF OUT2
50 W
Gc = 20log(VOUT Diff/VIN)
= 20log(VOUT/VIN) + 6 + 26.4
1 kW
DUT
SG
UHF RF IN1
50 W
50 W
VIN
IF OUT1
UHF RF IN2
Spectrum
Analyzer
VOUT Diff 1 kW
VOUT
IF OUT2
50 W
Gc = 20log(VOUT Diff/VIN)
= 20log(VOUT/VIN) + 6 + 26.4
1 kW
NF
Meter
Noise
Source
DUT
Signal
Generator
fdes: P = 70 dBmV
Signal
Generator
Mix
Pad
fdes 6 MHz
AM 30%, 1 kHz
DUT
Modulation
Analyzer
18
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
TYPICAL CHARACTERISTICS
Band-Switch Driver Output Voltage (BS1BS4)
BS OUTPUT CURRENT
vs
OUTPUT VOLTAGE
5.0
4.5
VCC = 5.5 V
4.0
VCC = 5.0 V
3.5
VCC = 4.5 V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
10
12
14
16
18
20
S-Parameter
1
50 MHz
430 MHz
19
SN761668
SLES199E JANUARY 2007 REVISED APRIL 2008 ..................................................................................................................................................... www.ti.com
440 MHz
860 MHz
60 MHz
30 MHz
20
SN761668
www.ti.com ..................................................................................................................................................... SLES199E JANUARY 2007 REVISED APRIL 2008
70 MHz
20 MHz
Gain dB
50
VCC = 5.0 V
40
30
VCC = 4.5 V
VCC = 5.5 V
20
10
0
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
21
www.ti.com
26-Mar-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
SN761668DBTR
OBSOLETE
TSSOP
DBT
44
TBD
Call TI
Call TI
SN761668DBTR-M
OBSOLETE
TSSOP
DBT
44
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Op Temp (C)
Device Marking
(4/5)
-20 to 85
SN761668
SN761668
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
www.ti.com
26-Mar-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2014, Texas Instruments Incorporated