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DATA SHEET
BFQ19
NPN 5 GHz wideband transistor
Product specification
File under Discrete Semiconductors, SC14
September 1995
Philips Semiconductors
Product specification
BFQ19
PINNING
PIN
DESCRIPTION
Code: FB
emitter
collector
base
page
Bottom view
3
MBK514
Fig.1 SOT89.
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
open base
100
mA
up to Ts = 145 C (note 1)
fT
transition frequency
5.5
GHz
Cre
feedback capacitance
1.3
pF
noise figure
3.3
dB
VCEO
collector-emitter voltage
IC
DC collector current
Ptot
15
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
20
VCEO
collector-emitter voltage
open base
15
VEBO
emitter-base voltage
open collector
3.3
IC
DC collector current
100
mA
ICM
f > 1 MHz
150
mA
Ptot
up to Ts = 145 C (note 1)
Tstg
storage temperature
65
150
Tj
junction temperature
175
Note
1. Ts is the temperature at the soldering point of the collector tab.
September 1995
Philips Semiconductors
Product specification
BFQ19
THERMAL RESISTANCE
SYMBOL
Rth j-s
PARAMETER
CONDITIONS
THERMAL RESISTANCE
up to Ts = 145 C (note 1)
30 K/W
Note
1. Ts is the temperature at the soldering point of the collector tab.
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
100
UNIT
ICBO
hFE
DC current gain
IC = 70 mA; VCE = 10 V
25
80
Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz
1.6
pF
Ce
emitter capacitance
pF
Cre
feedback capacitance
1.3
pF
fT
transition frequency
4.4
5.5
GHz
GUM
IC = 50 mA; VCE = 10 V;
f = 500 MHz; Tamb = 25 C
11.5
dB
IC = 50 mA; VCE = 10 V;
f = 800 MHz; Tamb = 25 C
7.5
dB
3.3
dB
noise figure
IE = 0; VCB = 10 V
Note
1. GUM is the maximum unilateral power gain, assuming S12 is zero and
2
S 21
- dB.
G UM = 10 log ------------------------------------------------------------2
2
1 S 11 1 S 22
September 1995
nA
Philips Semiconductors
Product specification
BFQ19
MBB774
MBB830
120
handbook, halfpage
handbook, halfpage
Cc
(pF)
h FE
80
3
2
40
1
0
0
40
80
120
I C (mA)
IE = ie = 0; f = 1 MHz; Tj = 25 C.
Fig.2
Fig.3
MBB773
handbook, halfpage
fT
(GHz)
6
0
0
40
80
I C (mA)
120
Fig.4
September 1995
15
20
V CB (V)
VCE = 10 V; Tj = 25 C.
10
Philips Semiconductors
Product specification
BFQ19
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 3 leads
SOT89
b3
E
HE
3
c
b2
w M
b1
e1
e
4 mm
scale
b1
b2
b3
e1
HE
L
min.
mm
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.37
4.6
4.4
2.6
2.4
3.0
1.5
4.25
3.75
0.8
0.13
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
SOT89
September 1995
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Product specification
BFQ19
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1995