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Description
Typical Applications
Block Diagram
VDD
Package Types
MCP6S22
PDIP, SOIC, MSOP
VOUT 1
8 VDD
VOUT 1
8 VDD
CH0 2
7 SCK
CH0 2
7 SCK
VREF 3
6 SI
CH1 3
6 SI
VSS 4
5 CS
VSS 4
5 CS
MCP6S26
PDIP, SOIC, TSSOP
MCP6S28
PDIP, SOIC
VOUT 1
14 VDD
VOUT 1
16 VDD
CH0 2
13 SCK
CH0 2
15 SCK
CH1 3
12 SO
CH1 3
14 SO
CH2 4
11 SI
CH2 4
13 SI
CH3 5
10 CS
CH3 5
12 CS
CH4 6
9 VSS
CH4 6
CH5 7
8 VREF
CH5 7
11 VSS
10 VREF
CH6 8
9 CH7
MUX
CS
SI
SO
SCK
SPI
Logic
+
VOUT
RF
Gain
Switches
8
RG
MCP6S21
PDIP, SOIC, MSOP
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
POR
VSS
VREF
DS21117B-page 1
MCP6S21/2/6/8
1.0
ELECTRICAL
CHARACTERISTICS
Function
VOUT
Analog Output
CH0-CH7
Analog Inputs
VSS
VDD
SCK
SI
SO
CS
VREF
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, SI and SCK are tied low and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Amplifier Input
Input Offset Voltage
Input Offset Voltage Drift
Power Supply Rejection Ratio
VOS
-275
+275
VOS/TA
V/C
PSRR
70
85
dB
G = +1 (Note 1)
IB
pA
CHx = VDD/2
IB
250
pA
TA = -40 to +85C,
CHx = VDD/2
ZIN
1013||15
||pF
VIVR
VSS0.3
VDD+0.3
Input Impedance
Input Voltage Range
Amplifier Gain
Nominal Gains
1 to 32
V/V
gE
-0.1
+0.1
G +2
gE
-1.0
+1.0
G = +1
G/TA
0.0002
%/C
TA = -40 to +85C
G +2
G/TA
0.0004
%/C
TA = -40 to +85C
RLAD
3.4
4.9
6.4
RLAD/TA
+0.028
%/C
DC Output Non-linearity G = +1
VONL
0.003
G +2
VONL
0.001
VOH, VOL
VSS+20
VDD-100
VSS+60
VDD-60
30
DC Gain Error
DC Gain Drift
G = +1
Internal Resistance
Internal Resistance over
Temperature
(Note 1)
(Note 1)
TA = -40 to +85C
Amplifier Output
Short-Circuit Current
IO(SC)
mV
mA
Note 1: RLAD (RF + RG in Figure 4-1) connects VREF, VOUT and the inverting input of the internal amplifier. The MCP6S22 has
VREF tied internally to VSS, so VSS is coupled to the internal amplifier and the PSRR spec describes PSRR+ only. We
recommend the MCP6S22s VSS pin be tied directly to ground to avoid noise problems.
2: IQ includes current in RLAD (typically 60 A at VOUT = 0.3V). Both IQ and IQ_SHDN exclude digital switching currents.
3: The output goes Hi-Z and the registers reset to their defaults; see Section 5.4, Power-On Reset.
DS21117B-page 2
MCP6S21/2/6/8
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, SI and SCK are tied low and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD
2.5
5.5
IQ
0.5
1.0
1.35
mA
IO = 0 (Note 2)
IQ_SHDN
0.5
1.0
IO = 0 (Note 2)
VPOR
1.2
1.7
2.2
(Note 3)
VPOR/T
-3.0
mV/C
Power Supply
Supply Voltage
Quiescent Current
Quiescent Current, Shutdown
mode
Power-On Reset
POR Trip Voltage
POR Trip Voltage Drift
TA = -40C to+85C
Note 1: RLAD (RF + RG in Figure 4-1) connects VREF, VOUT and the inverting input of the internal amplifier. The MCP6S22 has
VREF tied internally to VSS, so VSS is coupled to the internal amplifier and the PSRR spec describes PSRR+ only. We
recommend the MCP6S22s VSS pin be tied directly to ground to avoid noise problems.
2: IQ includes current in RLAD (typically 60 A at VOUT = 0.3V). Both IQ and IQ_SHDN exclude digital switching currents.
3: The output goes Hi-Z and the registers reset to their defaults; see Section 5.4, Power-On Reset.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 =(0.3V)/G, CH1 to CH7=0.3V, RL = 10 kto VDD/2, CL = 60 pF, SI and SCK are tied low, and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Frequency Response
All gains; VOUT < 100 mVP-P (Note 1)
-3 dB Bandwidth
BW
2 to 12
MHz
Gain Peaking
GPK
dB
f = 1 kHz, G = +1 V/V
THD+N
0.0015
f = 1 kHz, G = +4 V/V
THD+N
0.0058
THD+N
0.023
f = 20 kHz, G = +1 V/V
THD+N
0.0035
f = 20 kHz, G = +4 V/V
THD+N
0.0093
THD+N
0.036
SR
4.0
V/s
G = 1, 2
11
V/s
G = 4, 5, 8, 10
22
V/s
G = 16, 32
3.2
VP-P
26
Step Response
Slew Rate
Noise
Input Noise Voltage
Eni
eni
10
ini
fA/Hz f = 10 kHz
DS21117B-page 3
MCP6S21/2/6/8
DIGITAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, CL = 60 pF, SI and SCK are tied low, and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VIL
0.3VDD
IIL
-1.0
+1.0
VIH
0.7VDD
VDD
-1.0
+1.0
In Shutdown mode
VOL
VSS
VSS+0.4
VOH
VDD-0.5
VDD
IOH = -400 A
Pin Capacitance
CPIN
10
pF
tRFI
Note 1
tRFO
ns
CS high time
tCSH
40
ns
tCS0
10
ns
tCSSC
40
ns
SCK Frequency
fSCK
10
MHz
tHI
40
ns
SPI Timing
VDD = 5V (Note 2)
tLO
40
ns
tSCCS
30
ns
tCS1
100
ns
SI set-up time
tSU
40
ns
SI hold time
tHD
10
ns
tDO
80
ns
tSOZ
80
ns
tCH
1.5
tG
tON
3.5
10
tOFF
1.5
tRPU
30
tRPD
10
POR Timing
DS21117B-page 4
MCP6S21/2/6/8
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.5V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
TA
-40
+85
TA
-40
+125
TA
-65
+150
JA
85
C/W
JA
163
C/W
JA
206
C/W
JA
70
C/W
JA
120
C/W
JA
100
C/W
JA
70
C/W
JA
90
C/W
Conditions
Temperature Ranges
(Note 1)
Note 1: The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced
performance. Operation in this range must not cause TJ to exceed the Maximum Junction Temperature
(150C).
CS
CS
tCH
VOUT
FIGURE 1-1:
Diagram.
tG
0.6V
CS
VOUT
VPOR - 0.1V
tOFF
Hi-Z
VPOR + 0.1V
VPOR - 0.1V
tRPU
Hi-Z
0.3V
1.0 mA (typ)
ISS
0.3V
FIGURE 1-3:
Diagram.
VDD
tON
1.5V
VOUT
0.3V
VOUT
ISS
tRPD
Hi-Z
Hi-Z
0.3V
1.0 mA (typ)
500 nA (typ)
500 nA (typ)
FIGURE 1-2:
PGA Shutdown timing
diagram (must enter correct commands before
CS goes high).
FIGURE 1-4:
POR power-up and powerdown timing diagram.
DS21117B-page 5
MCP6S21/2/6/8
tCSH
CS
tCSSC
tSCCS tCS1
tCS0
tLO tHI
SCK
tSU tHD
1/fSCK
SI
tDO
tSOZ
SO
(first 16 bits out are always zeros)
FIGURE 1-5:
CS
tCSSC
tSCCS tCS1
tHI
tCS0
tLO
SCK
tSU tHD
1/fSCK
SI
tDO
tSOZ
SO
(first 16 bits out are always zeros)
FIGURE 1-6:
DS21117B-page 6
MCP6S21/2/6/8
1.1
1.1.1
VOUT (V)
IDEAL MODEL
EQUATION
V2
VDD-0.3
VREF = V SS = 0V
O
UT
O
_l
in
V ear
O
_i
de
al
V O_ideal = GV IN
VDD
1.1.2
V1
0.3
0
VIN (V)
LINEAR MODEL
0.3
G
FIGURE 1-7:
Output Voltage Model with
the standard condition VREF = VSS = 0V.
EQUATION
1.1.3
EQUATION
V2 V 1
g E = 100% -------------------------------------G V DD 0.6V
V1
G = +1
V OS = -----------------------G 1 + gE
g
G T A = ---------ET A
OUTPUT NON-LINEARITY
EQUATION
INL = VOUT V O_linear
The output non-linearity specification in the electrical
specifications is related to Figure 1-8 by:
EQUATION
max V 4 V3
VONL = -------------------------------V DD 0.6V
INL (V)
V4
0
V3
0.3
G
VIN (V)
FIGURE 1-8:
Output Voltage INL with the
standard condition VREF = VSS = 0V.
DS21117B-page 7
MCP6S21/2/6/8
1.1.4
EQUATION
V O_ideal = VREF + G V IN VREF
V DD VREF VSS = 0V
The complete linear model is:
EQUATION
V O_linear = G 1 + g E V IN V IN_L + V OS + 0.3V
where the new VIN endpoints are:
EQUATION
0.3V VREF
V IN_L = ----------------------------G + V REF
VDD 0.3V VREF
VIN_R = ---------------------------------------------G + V REF
The equations for extracting the specifications do not
change.
DS21117B-page 8
MCP6S21/2/6/8
2.0
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
420 Samples
G = +1
TA = -40 to +125C
16%
14%
12%
10%
8%
6%
4%
2%
FIGURE 2-4:
18%
16%
0.0006
0.0005
0.0004
0.0003
0.0002
0.0020
0.0016
360 Samples
VDD = 4.0 V
G = +1
14%
12%
10%
8%
6%
4%
2%
240
200
160
120
80
40
-40
-80
-120
-160
-200
0%
-240
Percentage of Occurrences
0.031
0.030
0.029
0.028
0.027
0.026
0.025
0.024
0.0001
20%
FIGURE 2-3:
FIGURE 2-5:
420 Samples
TA = -40 to +125C
0.023
Percentage of Occurrences
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
0.0000
FIGURE 2-2:
0.0012
0.5
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
0%
0.0008
2%
0.0004
4%
0.0000
6%
-0.0004
8%
-0.0012
10%
420 Samples
G t +2
TA = -40 to +125C
-0.0016
12%
24%
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
-0.0020
Percentage of Occurrences
14%
-0.5
Percentage of Occurrences
420 Samples
G t +2
-0.0008
18%
16%
-0.0001
FIGURE 2-1:
-0.0002
-0.0003
-0.0004
-0.0005
0%
-0.0006
Percentage of Occurrences
18%
0.004
0.000
-0.004
-0.008
-0.012
-0.016
-0.020
-0.024
-0.028
-0.032
420 Samples
G = +1
-0.036
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
-0.040
Percentage of Occurrences
Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
FIGURE 2-6:
VDD = 4.0V.
DS21117B-page 9
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
22%
G = +1
Percentage of Occurrences
150
100
50
0
VDD = +2.5
-50
-100
VDD = +5.5
-150
20%
18%
420 Samples
TA = -40 to +125C
G = +1
16%
14%
12%
10%
8%
6%
4%
2%
5.0
5.5
FIGURE 2-7:
VREF Voltage.
FIGURE 2-10:
0.001
VONL/G, G = +2
VONL/G, G t +4
0.00001
0.0010%
VONL/G, G t +2
3.0
3.5
4.0
4.5
5.0
5.5
10
FIGURE 2-8:
Supply Voltage.
FIGURE 2-11:
Output Swing.
1000
VONL/G, G = +1
0.0001%
2.5
100
10
VDD = +5.5 V
VONL/G, G = +1
0.0001
0.0100%
DC Output Non-Linearity,
Input Referred (%)
DC Output Non-Linearity,
Input Referred (% of FSR)
0.01
16
4.5
14
4.0
12
3.5
10
3.0
-2
2.5
-4
2.0
-6
1.5
-8
1.0
-10
0.5
-12
0.0
-14
0%
-200
-16
200
0.1
0.1
10
10
100
100
1000
1k
10000
10k
12
11
10
9
8
7
6
5
4
3
2
1
0
f = 10 kHz
100000
100k
Frequency (Hz)
FIGURE 2-9:
vs. Frequency.
DS21117B-page 10
10
16
32
Gain (V/V)
FIGURE 2-12:
vs. Gain.
MCP6S21/2/6/8
100
120
Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
110
100
90
80
70
-50
-25
25
50
75
100
90
80
VDD = 2.5 V
70
60
50
40
125
Input Referred
VDD = 5.5 V
10
100
10
100
FIGURE 2-16:
CH0 = VDD
VDD = 5.5 V
10,000
1,000
100
100000
100k
10
VDD = 5.5 V
1,000
TA = +125C
100
TA = +85C
10
1
55
65
75
85
95
105
115
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
125
FIGURE 2-17:
Voltage.
FIGURE 2-14:
Input Bias Current vs.
Ambient Temperature.
100
G = +1
G = +4
G = +16
10
Bandwidth (MHz)
10000
10k
Frequency (Hz)
FIGURE 2-13:
Temperature.
1000
1k
G = +1
G = +4
G = +16
5
4
3
2
1
0
1
10
100
1000
10
FIGURE 2-15:
Load.
100
1000
FIGURE 2-18:
Load.
DS21117B-page 11
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
40
Gain (dB)
30
G = +32
G = +16
20
10
0
G = +10
G = +8
G = +5
G = +4
-10
-20
G = +2
G = +1
1.E+05
1.E+06
100k
1.E+07
1M
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
TA = +125C
TA = +85C
TA = +25C
TA = -40C
1.E+08
10M
100M
0.0
0.5
1.0
Frequency (Hz)
FIGURE 2-22:
Supply Voltage.
420 Samples
VDD = 5.0 V
80%
70%
60%
50%
40%
30%
20%
10%
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0%
0.0
Percentage of Occurrences
100%
90%
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
In Shutdown Mode
VDD = 5.0 V
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50
-25
25
50
75
100
125
FIGURE 2-20:
Histogram of Quiescent
Current in Shutdown Mode.
FIGURE 2-23:
Quiescent Current in
Shutdown Mode vs. Ambient Temperature.
100
40
2.0
FIGURE 2-19:
1.5
VDD = +5.5V
10
VDD = +2.5V
35
30
25
TA = +125C
TA = +85C
TA = +25C
TA = -40C
20
15
10
5
0
0.1
10
FIGURE 2-21:
Output Voltage Headroom
vs. Output Current.
DS21117B-page 12
2.5
3.0
3.5
4.0
4.5
5.0
5.5
FIGURE 2-24:
Output Short Circuit Current
vs. Supply Voltage.
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
1
Measurement BW = 80 kHz
VOUT = 2 VP-P
VDD = 5.0 V
0.1
G = +16
0.01
G = +4
Measurement BW = 80 kHz
VOUT = 4 VP-P
VDD = 5.0 V
0.1
G = +16
0.01
G = +4
G = +1
G = +1
0.001
100
0.001
100
1.E+02
1.E+02
1.E+03
1.E+04
1k
1.E+05
10k
100k
1.E+03
1.E+04
1k
10k
Frequency (Hz)
Frequency (Hz)
FIGURE 2-25:
THD plus Noise vs.
Frequency, VOUT = 2 VP-P.
FIGURE 2-28:
THD plus Noise vs.
Frequency, VOUT = 4 VP-P.
80
250
5.0
VDD = +5.0V
7.5
VDD = +5.0V
70
60
150
50
100
40
50
30
20
GVIN
10
-50
VOUT, G = +1
G = +5
G = +32
-10
-20
-100
-150
4.5
200
Output Voltage
(10 mV/div)
1.E+05
100k
6.5
4.0
5.5
3.5
4.5
3.0
3.5
2.5
2.5
2.0
1.5
GVIN
VOUT, G = +1
G = +5
G = +32
1.5
1.0
0.5
-0.5
0.5
-1.5
-200
-30
0.0
2.00E-07
4.00E-07
6.00E-07
8.00E-07
1.00E-06
1.20E-06
1.40E-06
1.60E-06
1.80E-06
-2.5
5.00E-07
1.00E-06
FIGURE 2-29:
Response.
15
3.00E-06
3.50E-06
4.00E-06
4.50E-06
5.00E-06
VOUT
(CH0 = 0.6V, G = +1)
10
CS
0.50
0.45
5
0
CS
VOUT
(CH1 = 0.3V, G = +1)
1.6
-5
20
1.4
20
0.60
0.40
2.50E-06
0.65
0.55
2.00E-06
-250
2.00E-06
FIGURE 2-26:
Response.
1.50E-06
1.2
15
VOUT
(CH0 = 0.3V, G = +5)
10
CS
1.0
0.8
0
0
CS
VOUT
(CH0 = 0.3V, G = +1)
0.6
-5
0.35
-10
0.4
-10
0.30
-15
0.2
-15
0.25
-20
0.0
0.00E+00
5.00E-07
1.00E-06
1.50E-06
2.00E-06
2.50E-06
3.00E-06
3.50E-06
4.00E-06
4.50E-06
5.00E-06
-20
0.00E+00
5.00E-07
FIGURE 2-27:
-40
0.00E+00
0.00E+00
1.00E-06
1.50E-06
2.00E-06
2.50E-06
3.00E-06
3.50E-06
4.00E-06
4.50E-06
5.00E-06
FIGURE 2-30:
DS21117B-page 13
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
1.0
20
0.8
15
0.7
10
0.6
CS
CS
0.5
5
0
0.4
-5
0.3
-10
0.2
-15
VOUT is "ON"
(CH0 = 0.3V, G = +1)
0.1
Shutdown
10
25
Shutdown
0.9
VDD = 5.5 V
VDD = 2.5 V
1
G = +1, +2
G = +4 to +10
G = +16, +32
-20
0.1
10k
1.E+04
0.0
-25
0.0E+00
1.0E-06
2.0E-06
3.0E-06
4.0E-06
5.0E-06
6.0E-06
7.0E-06
8.0E-06
9.0E-06
1.E+05
Time (1 s/div)
FIGURE 2-31:
Shutdown Mode.
18%
FIGURE 2-33:
Frequency.
14%
12%
10%
8%
6%
4%
2%
0%
1.68
1.72
1.76
1.80
FIGURE 2-32:
DS21117B-page 14
VDD = 5.0 V
G = +1 V/V
VIN
16%
1.64
10M
420 Samples
1.60
1.E+07
1M
Frequency (Hz)
Percentage of Occurrences
20%
1.E+06
100k
1.0E-05
1.84
1.88
5
VOUT
4
3
2
1
0
-1
0.0E+00
1.0E-03
2.0E-03
3.0E-03
4.0E-03
5.0E-03
6.0E-03
7.0E-03
8.0E-03
9.0E-03
1.0E-02
Time (1 ms/div)
FIGURE 2-34:
The MCP6S21/2/6/8 family
shows no phase reversal under overdrive.
MCP6S21/2/6/8
3.0
PIN DESCRIPTIONS
TABLE 3-1:
MCP6S21
MCP6S22
MCP6S26
MCP6S28
Symbol
VOUT
Analog Output
CH0
Analog Input
CH1
Analog Input
CH2
Analog Input
CH3
Analog Input
CH4
Analog Input
CH5
Analog Input
CH6
Analog Input
CH7
Analog Input
10
VREF
11
VSS
10
12
CS
3.1
11
13
SI
12
14
SO
13
15
SCK
14
16
VDD
Analog Output
3.2
3.3
Description
3.4
3.5
Digital Inputs
3.6
Digital Output
DS21117B-page 15
MCP6S21/2/6/8
4.0
ANALOG FUNCTIONS
4.1
MUX
CS
SI
SO
SCK
SPI
Logic
VOUT
RF
Gain
Switches
8
RG
POR
Input MUX
4.2
Internal Op Amp
4.2.1
VREF
VSS
COMPENSATION CAPACITORS
The internal op amp has three compensation capacitors connected to a switching network. They are
selected to give good small signal bandwidth at high
gains, and good slew rate (full power bandwidth) at low
gains. The change in bandwidth as gain changes is
between 2 MHz and 12 MHz. Refer to Table 4-1 for
more information.
FIGURE 4-1:
TABLE 4-1:
Gain
(V/V)
Typical GBWP
(MHz)
Typical SR
(V/s)
Typical FPBW
(MHz)
Typical BW
(MHz)
1
Large
12
4.0
0.30
2
Large
12
4.0
0.30
4
Medium
20
11
0.70
5
Medium
20
11
0.70
8
Medium
20
11
0.70
10
Medium
20
11
0.70
16
Small
64
22
1.6
32
Small
64
22
1.6
Note 1: FPBW is the Full Power Bandwidth. These numbers are based on VDD = 5.0V.
2: No changes in DC performance (e.g., VOS) accompany a change in compensation capacitor.
3: BW is the closed-loop, small signal -3 dB bandwidth.
DS21117B-page 16
12
6
10
7
2.4
2.0
5
2.0
MCP6S21/2/6/8
4.2.2
RAIL-TO-RAIL INPUT
4.3
The input stage of the internal op amp uses two differential input stages in parallel; one operates at low VIN
(input voltage), while the other operates at high VIN.
With this topology, the internal inputs can operate to
0.3V past either supply rail. The input offset voltage is
measured at both VIN = VSS - 0.3V and VDD + 0.3V to
ensure proper operation.
The transition between the two input stages occurs
when VIN VDD - 1.5V. For the best distortion and gain
linearity, avoid this region of operation.
4.2.3
RAIL-TO-RAIL OUTPUT
4.2.4
Resistor Ladder
4.4
Shutdown Mode
RIN CHX
VIN
MCP6S2X
VOUT
FIGURE 4-2:
into an input pin.
DS21117B-page 17
MCP6S21/2/6/8
5.0
DIGITAL FUNCTIONS
The MCP6S21/2/6/8 PGAs use a standard SPI compatible serial interface to receive instructions from a
controller. This interface is configured to allow daisy
chaining with other SPI devices. There is an internal
POR (Power On Reset) that resets the registers under
low power conditions.
5.1
SPI Timing
bit 7
bit 0
CS
10
11
12
13
14
15
16
SCK
bit 0
bit 7
SI
Instruction Byte
Data Byte
SO
(first 16 bits out are always zeros)
FIGURE 5-1:
Serial bus sequence for the PGA; SPI 0,0 mode (see Figure 1-5).
bit 7
bit 0
CS
10
11
12
13
14
15
16
SCK
Instruction Byte
bit 0
bit 7
SI
Data Byte
SO
(first 16 bits out are always zeros)
FIGURE 5-2:
DS21117B-page 18
Serial bus sequence for the PGA; SPI 1,1 mode (see Figure 1-6).
MCP6S21/2/6/8
5.2
Registers
REGISTER 5-1:
5.2.1
INSTRUCTION REGISTER
INSTRUCTION REGISTER
W-0
W-0
W-0
U-x
U-x
U-x
U-x
W-0
M2
M1
M0
A0
bit 7
bit 0
bit 7-5
bit 4-1
bit 0
W = Writable bit
-n = Value at POR
1 = Bit is set
0 = Bit is cleared
x = Bit is unknown
DS21117B-page 19
MCP6S21/2/6/8
5.2.2
REGISTER 5-2:
GAIN REGISTER
U-x
U-x
U-x
U-x
U-x
W-0
W-0
G2
G1
bit 7
W-0
G0
bit 0
bit 7-3
bit 2-0
DS21117B-page 20
R = Readable bit
W = Writable bit
-n = Value at POR
1 = Bit is set
0 = Bit is cleared
x = Bit is unknown
MCP6S21/2/6/8
5.2.3
REGISTER 5-3:
CHANNEL REGISTER
U-x
U-x
U-x
U-x
U-x
W-0
W-0
C2
C1
bit 7
C0
bit 0
bit 7-3
bit 2-0
W-0
MCP6S22
CH0 (Default)
CH1
CH0
CH1
CH0
CH1
CH0
CH1
MCP6S26
CH0 (Default)
CH1
CH2
CH3
CH4
CH5
CH0
CH0
MCP6S28
CH0 (Default)
CH1
CH2
CH3
CH4
CH5
CH6
CH7
Legend:
R = Readable bit
W = Writable bit
-n = Value at POR
1 = Bit is set
0 = Bit is cleared
x = Bit is unknown
DS21117B-page 21
MCP6S21/2/6/8
5.2.4
SHUTDOWN COMMAND
The example in Figure 5-3 shows a daisy chain configuration with two devices, although any number of
devices can be configured this way. The MCP6S21 and
MCP6S22 can only be used at the far end of the daisy
chain because they do not have a serial data out (SO)
pin. As shown in Figure 5-4 and Figure 5-5, both SI
and SO data are sent in 16-bit (2 byte) words. These
devices abort any command that is not a multiple of 16
bits.
When using the daisy chain configuration, the maximum clock speed possible is reduced to 5.8 MHz
because of the SO pins propagation delay (see
Electrical Specifications).
The internal SPI shift register is automatically loaded
with zeros whenever CS goes high (a command is executed). Thus, the first 16-bits out of the SO pin once CS
line goes low are always zeros. This means that the
first command loaded into the next device in the daisy
chain is a NOP. This feature makes it possible to send
shorter command and data byte strings when the farthest devices do not need to change. For example, if
there were three devices on the chain and only the middle device needed changing, only 32 bytes of data
need to be transmitted (for the first and middle
devices), and the last device on the chain would
receive a NOP when the CS pin is raised to execute the
command.
5.3
CS
SCK
SO
PIC
Microcontroller
CS
SCK
SI
SO
Device 1
1.
2.
3.
4.
5.
6.
Set CS low.
Clock out the instruction and data
for Device 2 (16 clocks) to Device 1.
Device 1 automatically clocks out all
zeros (first 16 clocks) to Device 2.
FIGURE 5-3:
DS21117B-page 22
CS
SCK
SI
SO
Device 2
Device 1
Device 2
00100000 00000000
00000000 00000000
Device 1
Device 2
01000001 00000111
00100000 00000000
MCP6S21/2/6/8
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10111213141516
bit 7
bit 7
CS
SCK
Instruction Byte
for Device 2
Instruction Byte
for Device 1
Data Byte
for Device 2
bit 0
bit 0
bit 7
bit 0
bit 0
bit 7
SI
Data Byte
for Device 1
Instruction Byte
for Device 2
FIGURE 5-4:
bit 0
bit 7
bit 0
bit 7
SO
Data Byte
for Device 2
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10111213141516
bit 7
bit 7
CS
SCK
Instruction Byte
for Device 2
Data Byte
for Device 2
Instruction Byte
for Device 1
bit 0
bit 0
bit 7
bit 0
bit 0
bit 7
SI
Data Byte
for Device 1
Instruction Byte
for Device 2
FIGURE 5-5:
bit 0
bit 0
bit 7
bit 7
SO
Data Byte
for Device 2
DS21117B-page 23
MCP6S21/2/6/8
5.4
Power-On Reset
DS21117B-page 24
MCP6S21/2/6/8
6.0
APPLICATIONS INFORMATION
6.1
VDD
VOUT
MCP6S21
VREF
6.3
Layout Considerations
6.3.1
COMPONENT PLACEMENT
2.5V
REF
MCP6021
6.3.2
1 F
FIGURE 6-1:
PGA with Different External
Reference Voltage.
6.2
Large capacitive loads can cause both stability problems and reduced bandwidth for the MCP6S21/2/6/8
family of PGAs (Figure 2-17 and Figure 2-18). This
happens because a large load capacitance decreases
the internal amplifiers phase margin and bandwidth.
If the PGA drives a large capacitive load, the circuit in
Figure 6-2 can be used. A small series resistor (RISO)
at the VOUT improves the phase margin by making the
load resistive at high frequencies. It will not, however,
improve the bandwidth.
The input pins of the MCP6S21/2/6/8 family of operational amplifiers (op amps) are high-impedance. This
makes them especially susceptible to capacitively-coupled noise. Using a ground plane helps reduce this
problem.
When noise is capacitively-coupled, the ground plane
provides additional shunt capacitance to ground. When
noise is magnetically coupled, the ground plane
reduces the mutual inductance between traces.
Increasing the separation between traces makes a
significant difference.
Changing the direction of one of the traces can also
reduce magnetic coupling. It may help to locate guard
traces next to the victim trace. They should be on both
sides of the victim trace and be as close as possible.
Connect the guard traces to the ground plane at both
ends, and in the middle, of long traces.
6.3.3
RISO
VIN
MCP6S2X
VOUT
CL
FIGURE 6-2:
Capacitive Loads.
SIGNAL COUPLING
DS21117B-page 25
MCP6S21/2/6/8
6.4
Typical Applications
6.4.1
VIN
GAIN RANGING
MCP6021
10.0 k
VOUT
MCP6S21
1.11 k
FIGURE 6-5:
MCP6S2X
IX
6.4.3
VOUT
FIGURE 6-3:
Wide Dynamic Range
Current Measurement Circuit.
SHIFTED GAIN RANGE PGA
VIN
RS
6.4.2
MCP6S21
VOUT
DS21117B-page 26
6.4.4
MCP6S21
VOUT
10.0 k
1.11 k
FIGURE 6-4:
Range.
MCP6S28
FIGURE 6-6:
Range.
MCP6021
VIN
Sensor # 0
Sensor # 1
MCP6S26
VOUT
Sensor # 5
FIGURE 6-7:
Inputs.
MCP6S21/2/6/8
6.4.5
6.4.7
ADC DRIVER
The family of PGAs is well suited for driving Analog-toDigital Converters (ADC). The binary gains (1, 2, 4, 8,
16 and 32) effectively add five more bits to the input
range (see Figure 6-10). This works well for applications needing relative accuracy more than absolute
accuracy (e.g., power monitoring).
Lowpass
Filter
Sensors
# 0-6
MCP6S28
Sensors
# 7-14
VOUT
VIN
12
MCP6S28
FIGURE 6-8:
VIN
OUT
MCP6S28
FIGURE 6-10:
6.4.6
MCP3201
MCP6S28
PIC
Microcontroller
SPI
FIGURE 6-9:
Microcontroller.
DS21117B-page 27
MCP6S21/2/6/8
7.0
PACKAGING INFORMATION
7.1
XXXXXXXX
XXXXXNNN
YYWW
MCP6S21
I/P256
0345
XXXXXXXX
XXXXYYWW
NNN
Note:
Example:
MCP6S21I
345256
XXXXX
YWWNNN
XX...X
YY
WW
NNN
Example:
MCP6S21
I/SN0345
256
Legend:
Example:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office.
DS21117B-page 28
MCP6S21/2/6/8
Package Marking Information (Cont)
14-Lead PDIP (300 mil) (MCP6S26)
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
XXXXXXXX
Example:
MCP6S26-I/P
XXXXXXXXXXXXXX
0345256
Example:
MCP6S26ISL
XXXXXXXXXXXXXXXXXXXXXXXXX
0345256
Example:
MCP6S26IST
YYWW
0345
NNN
256
DS21117B-page 29
MCP6S21/2/6/8
Package Marking Information (Cont)
16-Lead PDIP (300 mil) (MCP6S28)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXX
XXXXXXXXXXXXX
YYWWNNN
DS21117B-page 30
MCP6S28-I/P
XXXXXXXXXXXXXX
0345256
Example:
MCP6S28-I/SL
XXXXXXXXXXXXXXXXXXXXXXXX
0345256
MCP6S21/2/6/8
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
A2
A1
B1
p
eB
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B1
B
eB
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21117B-page 31
MCP6S21/2/6/8
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
D
2
B
h
45
c
A2
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21117B-page 32
MCP6S21/2/6/8
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
B
n
A2
A
c
A1
(F)
INCHES
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
MILLIMETERS*
NOM
MIN
MAX
NOM
MIN
.026
0.65
1.18
.044
0.86
0.97
4.67
4.90
.5.08
.122
2.90
3.00
3.10
.122
2.90
3.00
3.10
.022
.028
0.40
0.55
0.70
.037
.039
0.90
0.95
1.00
.006
.008
0.10
0.15
0.20
.012
.016
0.25
0.30
0.40
.038
0.76
.006
0.05
.193
.200
.114
.118
.114
.118
.016
.035
Foot Angle
Lead Thickness
.004
Lead Width
.010
A2
.030
Standoff
A1
.002
.184
E1
Overall Length
Foot Length
Footprint (Reference)
Overall Width
MAX
8
.034
0.15
*Controlling Parameter
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
DS21117B-page 33
MCP6S21/2/6/8
14-Lead Plastic Dual In-line (P) 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
2
n
E
A2
c
A1
B1
eB
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
14
.100
.155
.130
MAX
MILLIMETERS
NOM
14
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
eB
.310
.370
.430
DS21117B-page 34
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
MCP6S21/2/6/8
14-Lead Plastic Small Outline (SL) Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
2
B
h
45
c
A2
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
MIN
.053
.052
.004
.228
.150
.337
.010
.016
0
.008
.014
0
0
INCHES*
NOM
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.347
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
14
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
5.99
3.81
3.90
8.56
8.69
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.36
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
DS21117B-page 35
MCP6S21/2/6/8
14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
2
1
n
B
A
c
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
B1
MIN
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
INCHES
NOM
14
.026
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
A2
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
14
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
4.90
5.00
5.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005 (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21117B-page 36
MCP6S21/2/6/8
16-Lead Plastic Dual In-line (P) 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
2
n
1
E
A2
A1
B1
eB
B
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
16
.100
.155
.130
MAX
MILLIMETERS
NOM
16
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
.036
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
.015
A1
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
eB
.310
.370
.430
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
DS21117B-page 37
MCP6S21/2/6/8
16-Lead Plastic Small Outline (SL) Narrow 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
2
B
h
45
c
A2
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
INCHES*
NOM
16
.050
.053
.061
.052
.057
.004
.007
.228
.237
.150
.154
.386
.390
.010
.015
.016
.033
0
4
.008
.009
.013
.017
0
12
0
12
MIN
MAX
.069
.061
.010
.244
.157
.394
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
16
1.27
1.35
1.55
1.32
1.44
0.10
0.18
5.79
6.02
3.81
3.90
9.80
9.91
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
10.01
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
DS21117B-page 38
MCP6S21/2/6/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X
/XX
Device
Temperature
Range
Package
Device:
Examples:
a)
b)
c)
d)
e)
f)
g)
Temperature Range:
= -40C to +85C
h)
Package:
MS
P
SN
SL
ST
=
=
=
=
=
i)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS21117B-page 39
MCP6S21/2/6/8
NOTES:
DS21117B-page 40
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
2003-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767504
== ISO/TS 16949 ==
2003-2012 Microchip Technology Inc.
DS21117B-page 41
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 91-80-3090-4444
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Tel: 91-11-4160-8631
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
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Tel: 91-20-2566-1512
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Tel: 86-23-8980-9588
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Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
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Taiwan - Taipei
Tel: 886-2-2508-8600
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Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21117B-page 42
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
10/26/12