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IJECET
IAEME
Deepu M2,
Jyothi V3,
Ajay.M.N4
ABSTRACT
Memory arrays are an essential building block in any digital system. Static random-access
memory (SRAM or static RAM) is a type of semiconductor memory that uses bistable latching
circuitry to store each bit. The term static differentiates it from dynamic RAM (DRAM) which must
be periodically refreshed. SRAM exhibits data remanence, but it is still volatile in the conventional
sense that data is eventually lost when the memory is not powered. The aspects of designing an
SRAM are very vital to designing other digital circuits as well. The majority of space taken in an
integrated circuit is the memory. SRAM design consists of key considerations, such as increased
speed and reduced layout area. This paper is aimed at creating an efficient SRAM design using
Cadence. The focus was on developing simplified design by reducing the transistor count and
replacing some of the conventional circuit designs.
Keywords: Bistable Data Remanence, Volatile, Cadence.
I. INTRODUCTION
Static random-access memory (SRAM) is a type of semiconductor memory that uses
bistable latching circuitry to store each bit. The term static differentiates it from dynamic RAM
(DRAM) which must be periodically refreshed. SRAM exhibits data remanence. SRAM is designed
to provide an interface with CPU and to replace DRAMs in systems that require very low power
consumption. A SRAM cell must meet the requirements for the operation in submicron/nano ranges.
The scaling of CMOS technology has significant impacts on SRAM cell random fluctuation of
electrical characteristics and substantial leakage current.
II. SRAM ARRAY
The basic architecture of a SRAM consists of an array of memory cells with support circuitry
to decode addresses and implement the read and write operations. SRAM arrays are arranged in rows
and columns of memory cells called wordlines and bitlines, respectively. Typically, the wordlines are
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 19, July 2014, Mysore, Karnataka, India
made from poly silicon while the bitlines are metal. Each memory cell has a unique location or
address defined by the intersection of a row and a column.
2.1 6T SRAM cell
A typical SRAM cell comprises of two cross-coupled inverters forming a latch and two
accesses. Essentially, the data is latched at the cross-coupled inverters. The bit-lines are
complementary and are input to the I/O of the inverters. Thus, the value is latched during a write and
maintained as long as power is available.
2.2 Transistor sizing
An SRAM Cell has to provide non-destructive read and a quick write-the two opposing
requirements impose constraints on the cell transistor sizing. The 6-transistor (6T) SRAM core
shown in Fig 2.1 stores one bit of data. The size ATION of the transistors used is the primary factor
that determines the performance of the SRAM cell. Since power dissipation is a constraint, we
minimize the sizing as much as possible without compromising performance significantly.
Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 19, July 2014, Mysore, Karnataka, India
poly silicon (which has high resistivity), it is necessary to keep the two pass transistors (M5 and M6)
small. This improves signal integrity on the word lines and reduces power dissipation. Therefore, the
size is kept small.
During the read operation, it was concluded that transistor Q1 had to be stronger than
transistor Q5 to prevent accidental writing. Now in the write case, this feature actually prevents a
wanted write operation. Even when transistor Q5 is turned on and current is flowing from BL to the
storage node, the state of the node will not change. As soon as the node is raised transistor Q1 will
sink current to ground, and the node is prevented from reaching even close to the switching point. So
instead of writing a 1 to the node, a 0 will be written to the inverse node. Looking at the right side
of the cell we have the constellation Q4-Q6. In this case BLB is held at gnd. When the wordline is
raised Q6 is turned on and current is drawn from the inverse storage node to BLB.
At the same time, however, Q4 is turned on and, as soon as the potential at the inverse
storage node starts to decrease, current will flow from VDD to the node. In this case Q6 has to be
stronger than Q4 for the inverse node to change its state. The transistor Q4 is a PMOS Transistor and
inherently weaker than the NMOS transistor Q6 (the mobility is lower in PMOS than in NMOS).
The Sram array is functionally divided into four blocks
I/O section
Decoder Section
Control section
Pre-charge
Sense Amplifier
Write Amplifier
Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 19, July 2014, Mysore, Karnataka, India
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
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VIII. ACKNOWLEDGEMENT
First and foremost we pay our due regards to our renowned institution Vidyavardhaka
College of Engineering, which provided us a platform and an opportunity for carrying out this work
and our guide Sunil Kumar H V, layout team lead manager, Sankalp Semiconductors, Bangalore.
IX. REFERENCES
[1] Bhavya Daya, Shu Jiang, Piotr Nowak, Jaffer Sharief Synchronous 16x8 SRAM Design,
Electrical Engineering Department, University of Florida.
[2] Mehdi Alipour, Mostafa E. Salehi1, Hesamodin shojaei baghini, Design Space Exploration to
Find the Optimum Cache and Register File Size for Embedded Applications Islamic Azad
University.
[3] Meenatchi Jagasivamani Development of a Low-Power SRAM Compiler Virginia Polytechnic
Institute and State University.
[4] Andrei Pavlov and Manoj Sachdev CMOS SRAM Circuit Design and Parametric Test in
Nano-Scaled Technologies, Process-Aware SRAM Design and Test.
[5] Andrei S Pavlov Design and test of embedded SRAMSs University of Waterloo.
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