Overview

ElectroFlo is designed exclusively

for challenging electronics cooling
and design issues. It is a CFD based
package capable of solving problems
involving conduction, natural and
forced convection, radiation and
conjugate heat transfer, yet it is easy
enough to use for a non-CFD expert.
Information Technology Solutions
Powerful and Accurate
ElectroFlo is equipped with a
complete list of features allowing
modeling details and accuracy to be
determined by the analyst, not dictated
by the software.
TES I NTERNATI ONAL
TES has been serving the
automotive and aerospace
industries for 16 years. TES
has worked on projects for a
wide variety of companies
including: Delphi, General
Electric, General Motors, Ford,
Chrysler, Bosch, Hamilton
Sundstrand, Boeing, United
Technologies and the US Army
TARDEC.
EXPERT ENGI NEERS
TES engineers specialize in
heat transfer and structural
analysis with years of
experience in aerospace,
automotive and electronics
applications.
THERMAL
CONSULTI NG
TES International offers
thermal engineering
consulting to help you avoid
any thermal problems with
your products. Using our own
software allows us to provide
you with great value for your
analysis needs.
ElectroFlo
Electronics Cooling Software
Coupled Electrical / Thermal /
CFD to Analyze Self-Heating
Effects
Embedded Liquid Cooling
Channels
User-Defined Functions or
Tables
Nonlinear Boundary Conditions
Flexibility
Easy To Use
The graphical user interface and technical
features are focused on Electronics
applications, so ElectroFlo achieves an
unprecedented ease of use.
Copy, Move, Rotate, Translate and
Mirror PCBs and Assemblies
Model Management using Listview
Object Oriented Modeling Approach
Component, Materials Modeling
Approach
Component, Material and Convention
Libraries
Fully Automated Meshing

ADVANTAGES OF
USI NG THERMAL
MANGEMENT
SOFTWARE
Thermal Management is
becoming more critical, as it
impacts safety, reliability,
performance, comfort and
energy use. This is due to
An increasing number of
heat sensitive electronics
components.
Electronic systems
requiring active thermal
management.
Ever-shirking space
allocation.
Higher electronic
densities.
Features and Benefits


Full CFD, Non-CFD or Frozen
Field Solution Modes
Extensive Error-Checking
Embedded Thermal and
Electrical Network
Patented Radiation Solver with
Automatic Viewfactor
Calculation
Multisystem Modeling allows
Co-Simulation of Existing
Models

Makes it possible to perform thermal/CFD/electrical analysis of extremely
complex models within hours.
Relieves the analyst of very tedious and
time consuming task of model clean-up and
simplification.
Significantly Reduce Modeling Time.
Low expertise needed to operate.
Makes it possible to provide customized
Turn-Key solutions for complex problems.
Multi-system analysis feature allows
combining existing models of boards and
electronic boxes.
Easy analysis of computer racks involving
thermal interaction of several electronic
boxes.
info@tesint.com
1711A Larchwood Dr.
Troy, MI 48083
+1(248)716-4837
www.tesint.com
Efficient
Fast and Stable Solver