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1. Introduction

Mobiles, computers and etc. devices are the modern eras necessary items. These things are
evolving because of the developments in the field of microelectronic systems. In electronics
manufacturing, integrated circuit packaging is the final stage of device fabrication, in which the
small block of semiconducting material is covered with the case that prevents physical damage and
corrosion. The case, known as a "package", supports the electrical contacts which connect the device to
a circuit board [3].
The Integrated Circuits (IC chips) are the heart of these systems. It is made up of high purity single
crystal silicon as a substrate on top of it thousands of circuit elements were imprinted. The chips are small
in size, largest chip sized 6 x 6 mm on side and thickness is approximately 0.4 mm [1]. These chips are
very fragile and imprinted materials such as GaAs is more fragile than substrate. This IC is mounted in
some type of package. This packaged IC is then bonded to the Printed Circuit Board. In this article we
discuss about the materials requirements for these package and the materials used for these packages.

2. Approaches

There are two major considerations in electronic packaging:

i) Selection of proper materials
ii) Physical Design of the equipment

2.1. Selection of Material

The process of materials selection includes the following steps [2]:

a) Identify the desired or dominate material properties for the design application under
consideration.
b) Define considerations: materials availability, manufacturing process limitations, customer
directives, design legacy, and like issues.
c) Review typical application similar to the design under consideration.
d) Compile a list of the most likely of candidate materials considering Section 2.3.
e) Select one or more materials that appear to offer the most likely solution.
f) Verify suitability by physically testing the resulting design.

2.2. Physical Design

The process of physical design includes the following steps [2]:

a) Develop a list of design requirements and restrictions.
b) Using constrains and prior experience, select the most probable design approach.
c) Apply the selected design approach.
d) Verify the suitability of the resultant design.
e) Identify and solve the next lower level of design problems.
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f) Review the net effect of the combination of solutions considering the interaction between the
problem solutions.
g) Iterate until all design requirements and restrictions have been satisfied.

Our aim is to discuss the various materials used in the IC packages, so we will focus on the materials
which are selected and used for IC Packages.

3. Functions of IC Package

Some important functions of IC packages [1]:

a) To permit electrical contact between the devices on the chip and the macroscopic world.
b) To dissipate excess heat. In operation, many of the electronic devices generate heat, which must
be dissipated away from the chip.
c) To protect delicate electrical connections on the chip from failure. (Degradation & contamination)
d) To provide mechanical support so that the small and fragile chip may be handled.
e) To provide a sufficient electrical boundary such that the performance of the IC itself is not
degraded by the package.

4. Materials Properties for IC Package

Some of the necessary materials properties for IC packaging are listed given below [2]:

1. Electrical Conductivity 11. Thermal Conductivity
2. Thermal Emissivity 12. Thermal expansion
3. Chemical Inertness 13. Corrosion
4. Temperature Range 14. Strength
5. Density 15. Electromagnetic and electrostatic shielding
6. Magnetic shielding property 16. Fatigue Resistance
7. Hardness 17. Ductility
8. Wear Resistance 18. Sublimation
9. Combustibility 19. Creep
10. Moisture Absorption

5. Contestant Materials

One of the important material selection consideration is conductivity of the material, that is, whether
the material is a conductor or an insulator of electrical signals and currents. Conductivity is an important
characteristic (printed circuit traces, wires, etc.) and is often the reason that metals are the materials of
choice. Other important characteristics of metals include strength, durability, thermal conductivity, and
ability to work over a wide temperature range.

Nonmetallic elements may exhibit many of the characteristics of metals; however, they are used to
provide electrical and thermal insulation. Other properties such as inertness to chemicals, dielectric
strength, appearance, low cost, and east of fabrication may lead to the use of nonmetallic elements.

Semiconductor materials may be employed to achieve, when properly formulated as in transistor
junctions, the ability to become either an electrical conductor or an electrical insulator depending on the
conditions of use. Some of the case materials used by intel corporation for packaging is given in the
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Table.1 Depending on designers requirements he has to choose specific materials after detailed review
and selection.

Table.1. Typical Case Materials Properties [4]


IC Packaging does not deal with only one type of metal or alloy, packaging of IC chips dealing with
various materials and it doesnt end here other than this lot of specific wires and frames are used to make
the entire package. Other than materials, there are distinct fabrication process involved to assemble the
package, such as wire bonding, adhesive bonding and soldering etc.

6. Summary

An IC chip is bonded to the lead frame plate using either a solder or an epoxy resin. The lead frame
material must be both electrically and thermally conductive, and, have a coefficient of thermal expansion;
copper alloys are commonly used frame materials. However we were discussed only case materials,
addition to that very thin wires gold or copper or aluminum is used to make electrical connections from the
microscopic IC chip. Ultrasonic micro joining welding/brazing techniques are used for connection to join
either a ball or wedge. The final step is package encapsulation, wherein this frame wire chip assembly
is encased in a protective enclosure. Ceramic glasses and polymeric resins are the most common
encapsulation materials. Resins are less expensive than glasses and require lower encapsulation
temperatures; however glasses are used to give high level of protection.

7. References:

1. William D. Callister, Jr. Materials Science and Engineering An Introduction, 7
th
Edi.
2. Mechanical Engineers Handbook: Materials and Mechanical Design,Volume1,ThirdEdition
3. http://en.wikipedia.org/wiki/Integrated_circuit_packaging
4. http://www.intel.in/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-05-
databook.pdf