Description of Test Circuits and Test Methods

[Test Circuit 1]
Note : * STB 'OFF' means 5V.
MUTE 'OFF' means 0V.
8 6 9 12 7 2 5 4
AN17831A
1
OFF
RL 4
STB
ON
5V
Vin1
Vout1
20k
MUTE
20k
Vin2
Vout2
OFF
+ 33
ON
RL 4
3V
10
+
2200
Vcc
3 11
8.2k
51k
+ 10
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17831A
Ref No.
Total Page
Page No.
C-1
9
3
18-FEB-2002
Circuit Function Block Diagram
9
Pin No. Pin Descriptions
1
2
3
4
6
5
Pin Descriptions
Pin No. Pin Descriptions
1
8 6 12
3
7
2
5
4
10 11
Vcc
Ch1 +ve Phase Output
Ch1 Output GND
Ch1 -ve Phase Output
Ch1 Input
Standby
7
8
9
10
12
11
Pre GND
Ch2 Input
Mute
Ch2 -ve Phase Output
Ch2 +ve Phase Output
Ch2 Output GND
+
-
+
-
Standby
Circuit
MUTE
+
-
REF
+
-
+
--
+
Protection Circuit
Thermal Shutdown
Load Short
Vcc Short
Ground Short
ASO Protect
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17831A
Ref No.
Total Page
Page No.
D-1
9
4
18-FEB-2002
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17831A
Ref No.
Total Page
Page No.
E
9
5
Package Name
Unit : mm
FP-12S
2
9
.
9
6

0
.
3
2
8
.
0

0
.
3
2
0
.
0

0
.
1
0
.
6
6.4 0.3
3.6
7.7 0.3 7.8 0.3
0
.
6

0
.
1
2
.
5
4
3
.
5

0
.
3
0
.
2
5
+
0
.
1
-
0
.
0
5
1
.
2

0
.
1
R
1
.
8
1
1
2
Company
insignia
Date
Code
Name
of item
2
9
.
6

0
.
3
18-FEB-2002
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
Ref No.
Total Page
Page No.
F-1
9
6
(Structure Description)
Package FP-12S
AN17831A
6
5
1
4
2
3
Chip surface passivation
Lead frame material
Inner lead surface process
Outer lead surface process
Chip mounting method
Wire bonding method
Mold material
Molding method
Fin material
SiN,
Fe group,
Ag plating,
Solder plating,
Ag paste,
Thermalsonic bonding,
Epoxy,
Transfer mold,
Cu Group
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
Others ( )
1
2 , 6
PSG,
Cu group,
Au plating,
Solder dip,
Au-Si alloy, Solder,
Multiplunger mold,
2
6
3
4
4
5
5
18-FEB-2002
STB
51k
10
Application Circuit
10
12
5
9
OUT1
3
11
7 1
VCC
2200
VCC
12V
2
4
IN 1
8
IN 2
6
Input
GND
Output2
GND
RL
4
OUT2
RL
4
Output1
GND
OUT2
OUT1
40dB
40dB
40dB
40dB
Vref
MUTE
STB
STB 'OFF'
Mute 'ON'
Mute 'OFF'
STB 'ON'
5V
0V
0V
3V
MUTE
8.2k
33
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev.1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17831A
Ref No.
Total Page
Page No.
G-1
9
7
18-FEB-2002
PD - Ta Curves
(1) Tc = Ta, 62.5W ( j-c = 2 C/W )
(2) 20.83W ( f = 4.0 C/W )
With a 100cm X 3mm Al heat sink (black colour coated)
or a 200cm X 2mm Al heat sink (not lacquered)
2
2
(3) 15.63W ( f = 6.0 C/W )
With a 100cm X 2mm Al heat sink (not lacquered)
(4) 3.0W at Ta = 25C ( j-a = 42C/W )
Without heat sink
2
P
o
w
e
r

D
i
s
s
i
p
a
t
i
o
n

P
D

(

W

)
Ambient Temperature Ta ( C )
80
70
60
10
0
50
40
30
20
0 25 50 75 100 125 150
20.8W
15.6W
3.0W
(1)
(3)
62.5W
(4)
(2)
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev. 1
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17831A
Ref No.
Total Page
Page No.
G-2
9
8
18-FEB-2002
(Precautions for use)
1) Be sure to attach a heat sink to the IC before use. Make sure that the heat sink is secured to
the chassis.
2) Ground the radiation fin so that there will be no difference in electric potential between the
radiation fin and ground.
3) The thermal protection circuit operates at a Tj of approximately 150C. The thermal
protection circuit is reset automatically when the temperature drops.
4) The overvoltage protection circuit operates at a Vcc of approximately 28V.
5) Use a stabilised power supply with a 3V or higher standby voltage.
Product Specifications
Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 Rev1.
Prepared
Checked
Approved
Eff. Date Eff. Date Eff. Date Eff. Date
AN17831A
Ref No.
Total Page
Page No.
H-1
9
9
18-FEB-2002