Chip Design Hierarchy- IC Layers Photolithography and Pattern Transfers- Basic MOS Transistors-CMOS Fabrication Submicron CMOS Process Masks and Layout CMOS Design Rules: Lambda based layout- Types of rules- SCMOS Design Rule set II-
UNIT II MOSFET TRANSISTOR 9
MOSFET operation - MOSFET switch model and square law model MOSFET parasitic- MOSFET SPICE Modeling-CMOS Inverter: Voltage Transfer curve- LayoutBody Effect-Latch up problem in CMOS circuits-Latch up prevention-
UNIT III CMOS LOGIC GATES DESIGN AND LAYOUT 9
NAND and NOR Gates Complex Logic Gates Tri state circuits Large FETs- Transmission Gate and Pass Transistor Logic-Standard Cell design: Cell hierarchy- Cell libraries-
UNIT IV STORAGE ELEMENTS AND DYNAMIC LOGIC CIRCUITS 9
SR Latch- Bit Level Register D Type Flip Flop Dynamic D Flip Flop The Static RAM Cell Dynamic Logic Domino Logic SR Logic Dynamic Memories
UNIT V VHDL 9
VHDL Program Structure- concurrent code sequential code - Variables- signals and Constants-VHDL Operators - VHDL Description of Combinational Networks: Adders Modeling Flip Flop using VHDL Processes VHDL Model for Multiplexer Modeling a sequential Machine-
TEXT BOOKS: 1- John P Uyemura- Chip Design for Submicron VLSI:CMOS layout and simulation Thomson India Edition- 2006(unit I to IV) 2- Charles H Roth-Digital System Design Using VHDL- Thomson business Information India Pvt Ltd-2006 (Unit V)
REFERENCES
3- Kamran Eshraghian- Douglas A Pucknell Sholeh Eshraghian Essentials of VLSI Circuits and Systems- Prentice Hall of India Pvt Ltd- 2006 4- Volnei A Pedroni-Circuit design with VHDL- Prentice Hall of India Pvt Ltd- 2005 5- Wayne Wolf, Modern VLSI Design System On Chip, PHI 2006, 3e, New Delhi
EMBEDDED SYSTEMS
UNIT I ARCHITECTURE OF EMBEDDED SYSTEMS 9
Categories of Embedded Systems-Specifications of Embedded systemsResent trends in Embedded Systems- Hardware Architecture-Software Architecture-Communication software-Process of generation of executable image- development/testing tools.
UNIT II PROGRAMMING FOR EMBEDDED SYSTEMS 9
Getting the most of C-data types-manipulating bits in memory and I/O ports-accessing memory mapped I/O devices structures-variant access-mixing C to assembly-register usage-use of addressing options-instruction sequencing procedure call and return-parameter passing retrieving parameters memory management-scope- automatic allocation-static allocation-dynamic allocationshared memory-recognizing shared objects-reentrant functions-accessing shared memory device drivers- productivity tools.
Architecture of the Kernel-task and task scheduler-Interrupt Service RoutinesSemaphores-Mutex-Mailboxes-Message Queues-Event Registers-Pipes-SignalsTimers-Memory Management Priority Inversion Problem
UNIT V REAL-TIME OPERATING SYSTEM TOOLS AND CASE STUDIES 9
Use of C/OS-II- Case study of coding for an Automatic Chocolate Vending Machine using MUCOS RTOS- Case study of an Embedded system for an Adaptive Cruise Control Systems in a Car- Case study of an Embedded Systems for a Smart Card.
TEXT BOOKS: 1.K.V.K.K.Prasad Embedded /Real-Time Systems:Concepts,Design and ProgrammingDream tech,Wiley 2003. 2. Ajay V Deshmukh Microcontroller Theory and Applications Tata McGraw Hill 2005
REFERENCES:
3. Raj Kamal Embedded Systems Architecture Programming and Design 2 nd
Edition TMH,2008 4.David E Simon An Embedded Software Primer Pearson Education 2003 5.Daniel 5.W Lewis, Fundamentals of Embedded Software Pearson Education2001 6. Peatman Designing with PIC Micro Controller,Pearson 2003
MICROWAVE ENGINEERING
UNIT I MICROWAVE NETWORK CHARACTERIZATION AND PASSIVE COMPONENTS 9 Circuit and S parameter representation of N ports- Reciprocity Theorem- Lossless networks and unitary conditions- ABCD parameters-Cascaded networks-Relations between S- Y and ABCD parameters- Effect of changing the reference planes in the S matrix- S Matrix of a Directional Coupler- waveguide tees and rat race coupler- Qualitative discussion on: Waveguide Corners- Bends- Twists- Matched loads and movable shorts.
UNIT II MICROWAVE TUBES 9 Transit time effect- Velocity modulation current modulation-bunching-Two cavity Klystron amplifier- Reflex Klystron- Slow-Wave structures -Helix Traveling-Wave Tubes- Convection Current- Axial Electric Field- Wave Modes- Bandwidth, Power and Gain Considerations cross field device Magnetron-power and frequency considerations
UNIT III MICROWAVE MEASUREMENTS 9 Slotted line VSWR measurement- impedance measurement- insertion loss and attenuation measurements- measurement of scattering parameters - Return loss measurement using directional coupler-Introduction to vector network analyzer and its uses- return loss and insertion loss
UNIT IV Microwave semiconductor devices 9 Gunn-Effect Gunn Diode- Differential Negative Resistance- Modes of Operation- Amplification- Microwave Generation- Read Diode- Physical Description- Avalanche Multiplication- IMPATT Diodes- TRAPATT Diode- BARITT Diode- Principles of Operation- Physical Structures- Parametric Amplifiers -Nonlinear Reactance and Manley Rowe Power Relations.
UNIT V STRIP LINES 9 Introduction- Microstrip Lines- Derivation of Characteristic Impedance of Microstrip Lines using Quasi Static analysis- Losses in Microstrip Lines- Quality Factor Q of Microstrip Lines- Substrate materials-surface wave excitation- Parallel Strip Lines- Characteristic Impedance- Attenuation Losses- Coplanar Strip Lines- Shielded Strip Lines- Problems- Microstrip based broadband matching networks
TEXT BOOKS: 1. Samuel Y-LIAO : Microwave Devices and Circuits Pearson/Prentice Hall of India 3 rd Edition (2003) . 2. Annapurna Das and Sisir K-Das: Microwave Engineering Tata McGraw-Hill (2000).
REFERENCES: 3. R-E- Collin : Foundations for Microwave Engg- IEEE Press Second Edition (2002) . 4. David M-POZAR : Microwave Engg- John Wiley & Sons 2 nd Edition (2003) . 5. Rizzi microwave engineering-passive circuits PHI 2007