74HC4851; 74HCT4851

8-channel analog multiplexer/demultiplexer with injection-current effect control

Rev. 02 2 September 2008 Product data sheet

1. General description
The 74HC4851; 74HCT4851 are high-speed Si-gate CMOS devices and are specied in compliance with JEDEC standard no. 7A. The 74HC4851; 74HCT4851 are 8-channel analog multiplexers/demultiplexers with three digital select inputs (S0 to S2), an active-LOW enable input (E), eight independent inputs/outputs (Y0 to Y7) and a common input/output (Z). The devices feature injection-current effect control, which has excellent value in automotive applications where voltages in excess of the supply voltage are common. With E LOW, one of the eight switches is selected (low impedance ON-state) by S0 to S2. With E HIGH, all switches are in the high-impedance OFF-state, independent of S0 to S2. The injection-current effect control allows signals at disabled analog input channels to exceed the supply voltage without affecting the signal of the enabled analog channel. This eliminates the need for external diode/resistor networks typically used to keep the analog channel signals within the supply-voltage range.

2. Features
I Injection-current cross coupling < 1 mV/mA I Wide supply voltage range from 2.0 V to 6.0 V for 74HC4851 I ESD protection: N HBM JESD22-A114E exceeds 2000 V N CDM JESD22-C101C exceeds 1000 V I Latch-up performance exceeds 100 mA per JESD 78 Class II level A I Low ON-state resistance: N 400 (typical) at VCC = 2.0 V N 215 (typical) at VCC = 3.0 V N 120 (typical) at VCC = 3.3 V N 76 (typical) at VCC = 4.5 V N 59 (typical) at VCC = 6.0 V

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

3. Applications
I I I I Analog multiplexing and demultiplexing Digital multiplexing and demultiplexing Signal gating Automotive application

4. Ordering information
Table 1. Ordering information Package Temperature range Name 74HC4851D 74HC4851PW 74HC4851BQ 40 C to +125 C 40 C to +125 C 40 C to +125 C SO16 TSSOP16 Description plastic small outline package; 16 leads; body width 3.9 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT109-1 SOT403-1 SOT763-1 Type number

DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm SO16 TSSOP16 plastic small outline package; 16 leads; body width 3.9 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm

74HCT4851D

40 C to +125 C

SOT109-1 SOT403-1 SOT763-1

74HCT4851PW 40 C to +125 C 74HCT4851BQ 40 C to +125 C

DHVQFN16 plastic dual in-line compatible thermal enhanced very thin quad at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm

5. Functional diagram
11 10 9 6

0 8X 2 G8

0 7

13 S0 S1 S2 11 10 9 14 15 12 1 5 2 E 6 3 Z 4

Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 3 MUX/DMUX 0 1 2 3 4 5 6 7

13 14 15 12 1 5 2 4

001aad541

001aad542

Fig 1. Logic symbol

74HC_HCT4851_2

Fig 2. IEC logic symbol

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

2 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

VCC

16 INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL INJECTION CURRENT CONTROL 8
001aaf875

13

Y0

S0

11

14

Y1

15

Y2

S1

10

12

Y3

1-OF-8 DECODER

Y4

S2

Y5

Y6

Y7

GND

Fig 3. Functional diagram

74HC_HCT4851_2

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

3 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

6. Pinning information
6.1 Pinning
74HC4851 74HCT4851
Y4 Y6 Z Y7 Y5 E n.c. GND 1 2 3 4 5 6 7 8
001aaf876

74HC4851 74HCT4851
16 VCC 15 Y2 Y6 14 Y1 13 Y0 12 Y3 11 S0 10 S1 9 S2 Z Y7 Y5 E n.c. 2 3 4 5 6 7 8 GND S2 9 GND(1) terminal 1 index area 16 VCC 15 Y2 14 Y1 13 Y0 12 Y3 11 S0 10 S1 Y4 1

001aaf877

Transparent top view

(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.

Fig 4. Pin conguration SO16 and TSSOP16

Fig 5. Pin conguration DHVQFN16

6.2 Pin description

Table 2. Symbol Y4 Y6 Z Y7 Y5 E n.c. GND S2 S1 S0 Y3 Y0 Y1 Y2 VCC Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description independent input/output independent input/output common input/output independent input/output independent input/output enable input (active LOW) not connected ground (0 V) select input select input select input independent input/output independent input/output independent input/output independent input/output supply voltage

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

4 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

7. Functional description
Table 3. Input E L L L L L L L L H
[1]

Function table[1] Channel ON S2 L L L L H H H H X S1 L L H H L L H H X S0 L H L H L H L H X Y0 to Z Y1 to Z Y2 to Z Y3 to Z Y4 to Z Y5 to Z Y6 to Z Y7 to Z -

H = HIGH voltage level; L = LOW voltage level; X = dont care.

8. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC VI VSW IIK ISK ISW ICC IGND Tstg Ptot
[1] [2] [3]

Parameter supply voltage input voltage switch voltage input clamping current switch clamping current switch current supply current ground current storage temperature total power dissipation

Conditions
[1] [2]

Min 0.5 0.5 0.5 50 65

Max +7.0 VCC + 0.5 VCC + 0.5 20 20 25 50 +150 500

Unit V V V mA mA mA mA mA C mW

VI < 0.5 V or VI > VCC + 0.5 V VSW < 0.5 V or VSW > VCC + 0.5 V VSW > 0.5 V or VSW < VCC + 0.5 V

Tamb = 40 C to +125 C

[3]

The minimum and maximum input voltage rating may be exceeded if the input clamping current rating is observed. The minimum and maximum switch voltage rating may be exceeded if the switch clamping current rating is observed. For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. For TSSOP16 package: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN16 packages: Ptot derates linearly with 4.5 mW/K above 60 C.

74HC_HCT4851_2

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

5 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

9. Recommended operating conditions

Table 5. Symbol VCC VI VSW Tamb t/V Recommended operating conditions Parameter supply voltage input voltage switch voltage ambient temperature input transition rise and fall rate VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V Conditions Min 2.0 0 0 40 74HC4851 Typ 6.0 6.0 6.0 6.0 6.0 Max 6.0 VCC VCC +125 1000 800 800 500 400 Min 4.5 0 0 40 74HCT4851 Typ 5.0 6.0 Max 5.5 VCC VCC +125 500 V V V C ns/V ns/V ns/V ns/V ns/V Unit

10. Static characteristics

Table 6. RON resistance At recommended operating conditions; voltages are referenced to GND (ground 0 V); For test circuit see Figure 8. Symbol Parameter Conditions Min 74HC4851 RON(peak) ON resistance VI = VCC to GND; E = VIL (peak) VCC = 2.0 V; ISW = 2 mA VCC = 3.0 V; ISW 2 mA VCC = 3.3 V; ISW 2 mA VCC = 4.5 V; ISW 2 mA VCC = 6.0 V; ISW 2 mA RON ON resistance VI = 0.5 VCC; E = VIL mismatch VCC = 2.0 V; ISW = 2 mA between VCC = 3.0 V; ISW 2 mA channels VCC = 3.3 V; ISW 2 mA VCC = 4.5 V; ISW 2 mA VCC = 6.0 V; ISW 2 mA 74HCT4851 RON(peak) ON resistance VI = VCC to GND; E = VIL (peak) VCC = 4.5 V; ISW 2 mA RON ON resistance VI = 0.5 VCC; E = VIL mismatch VCC = 4.5 V; ISW 2 mA between channels 76 2 210 8 240 12 270 16 400 215 120 76 59 4 2 2 2 3 650 330 270 210 195 10 8 8 8 9 670 360 305 240 220 15 12 12 12 13 700 380 345 270 250 20 16 16 16 18 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

6 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

Table 7. Injection current coupling At recommended operating conditions; voltages are referenced to GND (ground 0 V); For test circuit see Figure 9. Symbol Parameter Conditions Min Tamb = 40 C to +125 C VO output voltage variation |ISW| 1 mA; RS 3.9 k VCC = 3.3 V VCC = 5.0 V |ISW| 10 mA; RS 3.9 k VCC = 3.3 V VCC = 5.0 V |ISW| 1 mA; RS 20 k VCC = 3.3 V VCC = 5.0 V |ISW| 10 mA; RS 20 k VCC = 3.3 V VCC = 5.0 V
[1] [2] [3] Typical values are measured at Tamb = 25 C. VO here is the maximum variation of output voltage of an enabled analog channel when current is injected into any disabled channel. ISW = total current injected into all disabled channels.
[2][3]

74HC4851 Typ[1] Max Min

74HCT4851 Typ[1] Max

Unit

0.05 0.03 0.55 0.27 0.04 0.03 0.56 0.48

1 1 5 5 2 2 20 20

0.03 0.27 0.03 0.48

1 5 2 20

mV mV mV mV mV mV mV mV

Table 8. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V); 25 C Symbol Parameter 74HC4851 VIH HIGH-level input voltage control inputs VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage control inputs VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V II input leakage current control inputs; VI = GND or VCC VCC = 6.0 V 0.1 0.1 1.0 A 0.5 0.9 1.0 1.35 1.8 0.5 0.9 1.0 1.35 1.8 0.5 0.9 1.0 1.35 1.8 V V V V V 1.5 2.1 2.3 3.15 4.2 1.5 2.1 2.3 3.15 4.2 1.5 2.1 2.3 3.15 4.2 V V V V V Conditions Min Typ Max 40 C to +85 C 40 C to +125 C Min Max Min Max Unit

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

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NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

Table 8. Static characteristics continued At recommended operating conditions; voltages are referenced to GND (ground 0 V); 25 C Symbol Parameter IS(OFF) OFF-state leakage current Conditions E = VIH; VI = GND or VCC; VO = VCC or GND; VCC = 6.0 V; see Figure 6 per channel all channels IS(ON) ON-state leakage current supply current E = VIL; VI = GND or VCC; VO = VCC or GND; VCC = 6.0 V; see Figure 7 VI = GND or VCC;VCC = 6.0 V 0.1 0.2 0.1 0.5 2.0 0.5 1.0 4.0 1.0 A A A Min Typ Max 40 C to +85 C 40 C to +125 C Min Max Min Max Unit

ICC CI Csw

2 15 3

2.0 10 40 15

5.0 10 40 15

20.0 10 40 15

A pF pF pF

input S0, S1, S2 and E capacitance switch Z; OFF-state capacitance Yn; OFF-state HIGH-level input voltage LOW-level input voltage input leakage current OFF-state leakage current control inputs VCC = 4.5 V to 5.5 V control inputs VCC = 4.5 V to 5.5 V control inputs; VI = GND or VCC VCC = 5.5 V E = VIH; VI = GND or VCC; VO = VCC or GND; VCC = 5.5 V; see Figure 6 per channel all channels

74HCT4851 VIH 2.0 2.0 2.0 V

VIL

0.8

0.8

0.8

II

0.1

0.1

1.0

IS(OFF)

0.1 0.2 0.1

0.5 2.0 0.5

1.0 4.0 1.0

A A A

IS(ON)

ON-state leakage current supply current additional supply current

E = VIL; VI = GND or VCC; VO = VCC or GND; VCC = 5.5 V; see Figure 7 VI = GND or VCC VCC = 5.5 V control inputs; VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A

ICC ICC

2.0 300

5.0 370

20.0 370

A A

CI Csw

input S0, S1, S2 and E capacitance switch Z; OFF-state capacitance Yn; OFF-state

2 15 3

10 40 15

10 40 15

10 40 15

pF pF pF

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

8 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

VCC selected channel(1)

IS VI

Yn

Z VCC VIH
IS VI

n.c.

VIL

Yn Yn GND Z
IS VO VO

any disabled channel GND

001aaf878

001aaf879

(1) Channel is selected by S0, S1 and S2.

Fig 6. Test circuit for measuring OFF-state leakage current

Fig 7. Test circuit for measuring ON-state leakage current

VCC any disabled channel

VI(1)
VSW ISW

Yn

V VCC VIL E VI(2) Yn

VI

Z VIL E

Yn
RS

Z GND
ISW

selected channel(1) GND

VO

VI

001aaf880

001aaf881

RON = VSW / ISW.

(1) Channel is selected by S0, S1 and S2. VI(1) < GND or VI(1) > VCC. GND < VI(2) < VCC.

Fig 8. Test circuit for measuring ON resistance

Fig 9. Test circuit for injection current coupling

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

9 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

11. Dynamic characteristics

Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V); for load circuit see Figure 14. Symbol Parameter 74HC4851 tpd propagation delay Z, Yn to Yn, Z; see Figure 10 VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V Sn to Z, Yn; see Figure 11 VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V ten enable time E to Z, Yn; see Figure 12 VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V tdis disable time E to Z, Yn; see Figure 12 VCC = 2.0 V VCC = 3.0 V VCC = 3.3 V VCC = 4.5 V VCC = 6.0 V CPD power dissipation capacitance per channel; see Figure 12 VCC = 3.3 V VCC = 5.0 V
[4] [3] [2] [1] [1]

Conditions Min

25 C Typ Max

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

10.0 6.0 5.0 4.0 3.0

25 15.5 14.5 11.5 10

29 17.5 16.5 12.5 11

32 19.5 18.5 13.5 12

ns ns ns ns ns

18.0 9.5 8.5 6.5 5.0

32 17.5 16.5 13 12.5

35 20 19 15 14.5

40 23 22 17 16.5

ns ns ns ns ns

95 90 85 80 78

105 100 95 90 80

115 110 105 100 80

ns ns ns ns ns

99 90 85 80 78

105 100 95 90 80

115 110 105 100 80

ns ns ns ns ns

28 33

pF pF

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

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NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

Table 9. Dynamic characteristics continued At recommended operating conditions; voltages are referenced to GND (ground 0 V); for load circuit see Figure 14. Symbol Parameter 74HCT4851 tpd propagation delay Z, Yn to Yn, Z; see Figure 10 VCC = 4.5 V Sn to Z, Yn; see Figure 11 VCC = 4.5 V ten enable time E to Z, Yn; see Figure 12 VCC = 4.5 V tdis disable time E to Z, Yn; see Figure 12 VCC = 4.5 V CPD power dissipation capacitance per channel; see Figure 13 VCC = 5.0 V
[1] [2] [3] [4] tpd is the same as tPLH and tPHL. ten is the same as tPZH and tPZL. tdis is the same as tPLZ and tPHZ. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi + {(CL + Csw) VCC2 fo} where: fi = input frequency in MHz; fo = output frequency in MHz; {(CL + Csw) VCC2 fo} = sum of outputs; CL = output load capacitance in pF; Csw = switch capacitance in pF; VCC = supply voltage in V.
[4] [3] [2] [1] [1]

Conditions Min

25 C Typ Max

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

1.6

3.7

11.5

1.1

12.5

1.1

13.5

ns

3.2

8.0

13

2.3

15

2.3

17

ns

4.2

8.6

25

3.0

30

3.0

35

ns

28.5

64.7

80

28.2

90

28

100

ns

30

pF

12. Waveforms
VCC Z or Yn input GND tPLH VCC Yn or Z output GND
001aah574

0.5VCC

tPHL

0.5VCC

Fig 10. Input (Z, Yn) to output (Yn, Z) propagation delays

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

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NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

VI Sn input GND tPLH VCC Yn or Z output GND VM

001aah575

VM tPHL

Measurement points are given in Table 10.

Fig 11. Input (Sn) to output (Yn, Z) propagation delays

VI E input 0V tPLZ VCC Z or Yn output VOL tPHZ VOH Z or Yn output GND switch ON switch OFF switch ON
001aah576

VM

VM

tPZL

VM VX tPZH VY VM

Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.

Fig 12. Enable and disable times Table 10. Type 74HC4851 74HCT4851 Measurement points Input VM 0.5VCC 1.3 V VI VCC 3.0 V Output VM 0.5VCC 0.5VCC VX VOL + 0.1(VCC VOL) VOL + 0.1(VCC VOL) VY 0.9VOH 0.9VOH

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

12 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

VCC

A selected channel

Yn G Sn

Z E Yn disabled channel GND

n.c.

001aah577

Fig 13. Test circuit for measuring power dissipation capacitance

74HC_HCT4851_2

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

13 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

VI negative pulse 0V

tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW
001aac221

90 % VM

VI positive pulse 0V

VM 10 %

a. Input pulse denition

switch

VCC
RL VI VO

VCC open

DUT
RT CL

GND
001aaf883

Denitions for test circuit: RL = load resistance. CL = load capacitance including jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator.

b. Load circuit
Test data is given in Table 11.

Fig 14. Input pulse denition and load circuit Table 11. Test Test data Input Control E, Sn VI[1] tPHL, tPLH tPHZ, tPZH tPLZ, tPZL CPD
[1]

Output Switch Yn (Z) VI VCC VCC VCC VCC 6 ns 6 ns 6 ns 6 ns tr, tf Switch Z (Yn) CL 50 pF 50 pF 50 pF 0 pF RL 10 k 10 k -

S1 position

VCC VCC VCC VCC

open GND VCC open

For 74HCT4851: input voltage VI = 3.0 V.

74HC_HCT4851_2

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

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NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

13. Package outline

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

A X

c y HE v M A

Z 16 9

Q A2 pin 1 index Lp 1 e bp 8 w M L detail X A1 (A 3) A

2.5 scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3

0.010 0.057 0.069 0.004 0.049

0.019 0.0100 0.39 0.014 0.0075 0.38

0.244 0.041 0.228

0.028 0.004 0.012

8 o 0

ISSUE DATE 99-12-27 03-02-19

Fig 15. Package outline SOT109-1 (SO16)

74HC_HCT4851_2 NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

15 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

c y HE v M A

16

Q A2 pin 1 index A1 Lp L (A 3) A

1
e bp

8
w M detail X

2.5 scale

5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18

Fig 16. Package outline SOT403-1 (TSSOP16)

74HC_HCT4851_2 NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

16 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm

A A1 E c

terminal 1 index area

detail X

terminal 1 index area e 2 L

e1 b 7 v M C A B w M C y1 C

C y

1 Eh 16

8 e 9

15 Dh

10 X 2.5 scale 5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.6 3.4 Dh 2.15 1.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1

Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT763-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27

Fig 17. Package outline SOT763-1 (DHVQFN16)

74HC_HCT4851_2 NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

17 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

14. Abbreviations
Table 12. Acronym CDM CMOS DUT ESD HBM MM Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model

15. Revision history

Table 13. Revision history Release date 20080902 Data sheet status Product data sheet Product data sheet Change notice Supersedes 74HC4851_1 Document ID 74HC_HCT4851_2 Modications: 74HC4851_1

74HCT4851 device added.

20070309

74HC_HCT4851_2

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Product data sheet

Rev. 02 2 September 2008

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NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

16. Legal information

16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualication Production

Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.

Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

16.3 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com For sales ofce addresses, please send an email to: salesaddresses@nxp.com

74HC_HCT4851_2

NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 2 September 2008

19 of 20

NXP Semiconductors

74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control

18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

NXP B.V. 2008.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 September 2008 Document identifier: 74HC_HCT4851_2